M

TC962

High Current Charge Pump DC-to-DC Converter

Features

General Description

• • • • • • • •

The TC962 is an advanced version of the industry standard TC7662 high voltage DC-to-DC converter. Using improved design techniques and CMOS construction, the TC962 can source as much as 80mA versus the 7662’s 20mA capability.

Pin Compatible With TC7662/ICL7662/SI7661 High Output Current 80mA No External Diodes Required Wide Operating Range 3V to 18V Low Output Impedance 28Ω Typ. No Low Voltage Terminal Required Application Zener On-Chip OSC Frequency Doubling Pin Option for Smaller Output Capacitors

Applications • • • •

Laptop Computers Disk Drives Process Instrumentation µP-Based Controllers

Device Selection Table Part Number

Package

Operating Temp. Range

TC962COE

16-Pin SOIC Wide

0°C to +70°C

TC962CPA

8-Pin Plastic DIP

0°C to +70°C

TC962EPA

8-Pin Plastic DIP

-40°C to +85°C

TC962IJA

8-Pin CERDIP

-25°C to +85°C

TC962MJA

8-Pin CERDIP

-55°C to +125°C

As an inverter, the TC962 can put out voltages as high as 18V and as low as 3V without the need for external diodes. The output impedance of the device is a low 28Ω (with the proper capacitors), voltage conversion efficiency is 99.9%, and power conversion efficiency is 97%. The low voltage terminal (pin 6) required in some TC7662 applications has been eliminated. Grounding this terminal will double the oscillator frequency from 12kHz to 24kHz. This will allow the use of smaller capacitors for the same output current and ripple, in most applications. Only two external capacitors are required for inverter applications. In the event an external clock is needed to drive the TC962 (such as paralleling), driving this pin directly will cause the internal oscillator to sync to the external clock. Pin 1, which is used as a test pin on the 7662, is a voltage reference zener on the TC962. This zener (6.4V at 5mA) has a dynamic impedance of 12Ω and is intended for use where the TC962 is supplying current to external regulator circuitry and a reference is needed for the regulator circuit. (See Section 3.0 Applications Information). The TC962 is compatible with the LTC1044, SI7661 and ICL7662. It should be used in designs that require greater power and/or less input to output voltage drop. It offers superior performance over the ICL7660S.

Package Type 16-Pin SOIC Wide 8-Pin DIP 8-Pin CERDIP Zener 8 VDD Cathode 1 • C+ 2 TC962CPA 7 COSC

TC962EPA

6 FREQ x 2 GND 3 TC962IJA – C 4 TC962MJA 5 VOUT

 2002 Microchip Technology Inc.

Zener Cathode 1

16 VDD

NC 2 C+ 3

15 NC 14 COSC

NC 4 GND 5

13 NC

TC962COE

12 FREQ x 2

NC 6

11 NC

C– 7

10 VOUT

NC 8

9 NC

DS21484B-page 1

TC962 Functional Block Diagram 8 FREQ x 2 – OSC/C Timing

6

I

VDD

I

TC962

7 Level Shift

Q + –

P SW1 2

F/F C Q

Level Shift

Comparator with Hysteresis

N SW4

CAP +

+ CP External 3

Zener Cathode

GND

1 6.4V

VREF + Level Shift

N SW2 4

Level Shift

CR EXT

OUT

CAP –

RL

N SW3 5 VOUT

DS21484B-page 2

 2002 Microchip Technology Inc.

TC962 1.0

ELECTRICAL CHARACTERISTICS

*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

Absolute Maximum Ratings* Supply Voltage (VDD to GND) ..............................+18V Input Voltage Any Pin ......................... (VDD +0.3) to (VSS -0.3) (Note 1) Current Into Any Pin............................................ 10mA ESD Protection ................................................ ±2000V Output Short Circuit ........... Continuous (at 5.5V Input) Package Power Dissipation (TA ≤ 70°C) SOIC ....................................................... 760 mW PDIP........................................................ 730 mW CERDIP .................................................. 800 mW Package Thermal Resistance CERDIP, RθJ-A ......................................... 90°C/W PDIP, RθJ-A ............................................ 140°C/W Operating Temperature Range CPA, COE ....................................... 0°C to +70°C IJA ................................................ -25°C to +85°C EPA .............................................. -40°C to +85°C MJA ............................................ -55°C to +125°C Storage Temperature Range ............. -65°C to +150°C

TC962 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VDD = 15V, TA = 25°C (See Figure 3-1) unless otherwise noted. Min

Typ

Max

Units

VDD

Symbol

Supply Voltage

Parameter

3

—

18

V

IS

Supply Current VDD = 15V

— — — — — — —

— 510 560 650 190 210 210

— 700 — — — — —

µA

RL = ∞ TA = +25°C 0 ≤ TA ≤ +70°C -55°C ≤ TA ≤ +125°C TA = +25°C 0 ≤ TA ≤ +70°C -55°C ≤ TA ≤ +125°C IL = 20mA, VDD = 15V IL = 80mA, VDD = 15V IL = 3mA, VDD = 5V

VDD = 5V

Test Conditions

RO

Output Source Resistance

— — —

32 35 —

37 40 50

Ω

FOSC

Oscillator Frequency

— —

12 24

— —

kHz

PEFF

Power Efficiency

93 —

97 —

— —

%

RL = 2kΩ

VDEF

Voltage Efficiency

99 — 96

99.9 — —

— — —

%

RL = ∞ Over temperature range

VZ

Zener Voltage

6.0

6.2

6.4

V

IZ = 5mA

ZZT

Zener Impedance

—

12

—

Ω

IL = 2.5mA to 7.5mA

Note

1:

Pin 6 Open Pin 6 GND

Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no inputs from sources operating from external supplies be applied prior to "power up" of the TC962.

 2002 Microchip Technology Inc.

DS21484B-page 3

TC962 2.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1:

PIN FUNCTION TABLE

Pin No. (8-Pin DIP) (8-Pin CERDIP)

Symbol

1

Zener Cathode

2

C+

3

GND

4

C-

5

VOUT

6

FREQ x 2

7

COSC

8

VDD

Pin No. (16-Pin SOIC)

Symbol

1

Zener Cathode

2

NC +

3

C

4

NC

5

GND

6

NC

7

C

-

8

NC

9

NC

10

VOUT

11

NC

12

FREQ x 2

13

NC

14

COSC

Description Cathode of internal zener diode. Positive side of external CP capacitor (pump cap). Ground terminal. Negative side of external CP capacitor (pump cap). Output voltage. If grounded, frequency doubles. Capacitor to GND will decrease frequency. Input voltage.

Description Cathode of internal zener diode. No connect. Positive side of external CP capacitor (pump cap). No connect. Ground terminal. No connect. Negative side of external CP capacitor (pump cap). No connect. No connect. Output voltage. No connect. If grounded, frequency doubles. No connect. Capacitor to GND will decrease frequency.

15

NC

No connect.

16

VDD

Input voltage.

DS21484B-page 4

 2002 Microchip Technology Inc.

TC962 3.0

APPLICATIONS INFORMATION

3.1

Theory of Operation

internal to the TC962. Grounding pin 6 will turn on a current source and double the frequency. This will double the charge current going into the internal capacitor, as well as any capacitor added to pin 7.

The TC962 is a capacitive pump (sometimes called a switched capacitor circuit), where four MOSFET switches control the charge and discharge of a capacitor.

A zener diode has been added to the TC962 for use as a reference in building external regulators. This zener runs from pin 1 to ground.

3.2

The functional block diagram shows how the switching action works. SW1 and SW2 are turned on simultaneously, charging CP to the supply voltage, VIN. This assumes that the on resistance of the MOSFETs in series with the capacitor results in a charging time (3 time constants) that is less than the on time provided by the oscillator frequency as shown:

Latch Up

All CMOS structures contain a parasitic SCR. Care must be taken to prevent any input from going above or below the supply rail, or latch up will occur. The result of latch up is an effective short between VDD and VSS. Unless the power supply input has a current limit, this latch up phenomena will result in damage to the device. (See AN763 Latch-up Protection of CMOS ICs.)

3 (RDS(ON) CP) < CP/(0.5 fOSC) In the next cycle, SW1 and SW2 are turned off and after a very short interval of all switches being off (this prevents large currents from occurring due to cross conduction), SW3 and SW4 are turned on. The charge in CP is then transferred to CR, but with the polarity inverted. In this way, a negative voltage is now derived.

FIGURE 3-1:

TEST CIRCUIT 690 IS

NC

An oscillator supplies pulses to a flip-flop that is then fed to a set of level shifters. These level shifters then drive each set of switches at one-half the oscillator frequency.

+ 10µF CP

1

8

2

7

3

IL

TC962

4

COSC

RL VOUT (–5V)

5

The oscillator has two pins that control the frequency of oscillation. Pin 7 can have a capacitor added that is returned to ground. This will lower the frequency of the oscillator by adding capacitance to the timing capacitor

FIGURE 3-2:

V+ (+5V)

CR

+

10µF

TYPICAL APPLICATIONS

Combined Negative Converter and Positive Multiplier

Split V+ In Half

V+ 1

8

2

7

+ 10µF 3 CP2

TC962

6 5

4

+

CP1 +

V+ VD1 VD2

VOUT = –V + C R1

VOUT = 2V + –2V

+

CP D

+

10µF

1

8

2

7

3

TC962

4

6 5

10µF

10µF CR

Lowering Output Resistance by Paralleling Devices

VOUT =

+

V+ 2

10µF

Positive Voltage Multiplier

V+ V+

CP1

+ 10µF

1

8

1

8

1

8

2

7

2

7

2

7

6

3

5

4

3 4

TC962

6 5

CP2

+ 10µF

3 4

TC962

TC962

VD1 VD2

6 5

CP

+ 10µF

CP

VOUT = 2V +–2V +

D

10µF

VOUT CR +

 2002 Microchip Technology Inc.

10µF

DS21484B-page 5

TC962 4.0

TYPICAL CHARACTERISTICS

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Circuit of Figure 3-1, CP = CR = 10µF, CPESR ≈ CRESR ≈ 1Ω.

Frequency vs. Temperature

Oscillator Frequency vs. C OSC

Supply Current vs. Temperature

20

700

V + = 15V

400 300 200

V + = 15V

COSC = FREQ x 2 = OPEN 18

FREQUENCY (kHz)

500

FREQUENCY (Hz)

1k

100

0 -60 -40 -20

10

12 10

6 10

1

0 20 40 60 80 100 120 140

100

1000

10,000

Output Resistance vs. Temperature

Current vs. Zener Voltage

Power Conversion Efficiency vs. I LOAD

CURRENT (mA)

60 V+ = 5V IL = 3mA

40

POWER CONVERSION EFFICIENCY (%)

50

70

TA = +25°C

40

30

20

V+ = 15V IL = 20mA 10

20 10 -60 -40 -20

0 20 40 60 80 100 120 140 TEMPERATURE (°C)

0 4.5

0 20 40 60 80 100 120 140 TEMPERATURE (°C)

80

30

-60 -40 -20

CAPACITANCE (pF)

TEMPERATURE (°C)

OUTPUT RESISTANCE ( Ω)

14

8

100

50

16

TA = +25°C

100

150 135

90 80

EFFICIENCY

120 105

70 SUPPLY CURRENT

60

90 75

50 40

60

30

45

20

30

10

15 0

0 4.0

5.5

6.0

ZENER VOLTAGE (V)

6.5

7.0

SUPPLY CURRENT (mA)

SUPPLY CURRENT (µA)

TA = +25°C

10k

600

8

16 24 32 40 48 56

64 72

80

LOAD CURRENT (mA)

Output Resistance vs. Input Voltage 110 TA = +25°C

OUTPUT RESISTANCE (Ω)

100 90 80 70 3mA

60

20mA

50 40 30 20 10 0

2

4

6 8 10 12 14 16 18 INPUT VOLTAGE (V)

DS21484B-page 6

20

 2002 Microchip Technology Inc.

TC962 5.0

PACKAGING INFORMATION

5.1

Package Marking Information

Package marking data not available at this time.

5.2

Package Dimensions 8-Pin CDIP (Narrow) .110 (2.79) .090 (2.29)

PIN 1

.300 (7.62) .230 (5.84)

.020 (0.51) MIN.

.055 (1.40) MAX.

.320 (8.13) .290 (7.37)

.400 (10.16) .370 (9.40) .040 (1.02) .020 (0.51)

.200 (5.08) .160 (4.06)

.150 (3.81) MIN.

.200 (5.08) .125 (3.18)

.015 (0.38) .008 (0.20)

3° MIN.

.400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) Dimensions: inches (mm)

8-Pin Plastic DIP PIN 1

.260 (6.60) .240 (6.10)

.045 (1.14) .030 (0.76)

.070 (1.78) .040 (1.02)

.310 (7.87) .290 (7.37)

.400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56)

.040 (1.02) .020 (0.51)

.150 (3.81) .115 (2.92)

.110 (2.79) .090 (2.29)

.022 (0.56) .015 (0.38)

.015 (0.38) .008 (0.20)

3° MIN.

.400 (10.16) .310 (7.87)

Dimensions: inches (mm)

 2002 Microchip Technology Inc.

DS21484B-page 7

TC962 Package Dimensions (Continued) 16-Pin SOIC (Wide) PIN 1

.299 (7.59) .419 (10.65) .291 (7.40) .398 (10.10)

.413 (10.49) .398 (10.10) .104 (2.64) .097 (2.46) .050 (1.27) TYP. .019 (0.48) .014 (0.36)

.012 (0.30) .004 (0.10)

8° MAX.

.013 (0.33) .009 (0.23) .050 (1.27) .016 (0.40) Dimensions: inches (mm)

DS21484B-page 8

 2002 Microchip Technology Inc.

TC962 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3.

Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2002 Microchip Technology Inc.

DS21484B-page9

TC962 NOTES:

DS21484B-page10

 2002 Microchip Technology Inc.

TC962

Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.

Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.

Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.

 2002 Microchip Technology Inc.

DS21484B-page 11

M WORLDWIDE SALES AND SERVICE AMERICAS

ASIA/PACIFIC

Japan

Corporate Office

Australia

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'!%!' DS21484B-page 12

 2002 Microchip Technology Inc.

Mouser Electronics Authorized Distributor

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