DYNALOY,
Telecommunications Avionics Injection Molding Computers Automotive Electronic Components Aerospace Audio/Video Plastics Processing Medical Fiber Optics Converting/Laminating
INC
INDUSTRIAL MATERIAL TYPE
SOLVENT SELECTION GUIDE PROPYLENE GLYCOL ETHER BASE P9
P1,P2, P3, P7,P9
P5,P9
P7, P9
P9
P5
P11
P9
PI, P2, P3, P7,P9
P5,P9
P7, P9
P9
P5
Pll
DYNASOLVE MP-AL-GR
P9
PI, P2, P3, P7,P9
P5,P9
P7,P9
P5
DYNASOLVE MP-500
P9
P1,P2,P3, P7,P9
P5,P9
P7,P9
P5
DYNASOLVE MP-710 DYNASOLVE MP-750 ETHYLENE GLYCOL ETHER BASE
METHYLENE CHLORIDE BASE DYNASOLVE 165
P9, P11
P11
DYNASOLVE 200
P8
DYNASOLVE 210
P9
P6
P11
N-METHYL PYRROLIDONE BASE NMP
P7, P9, P11
P7,P9
P11
DYNASOLVE 180
P7, P9, P11
P7,P9
P11
DYNASOLVE 185
P7, P9, P11
P7,P9
P6
P11
HYDROCARBON BASE DYNASOLVE 220
P5. P9
P5
DYNASOLVE 225
P5.P9
P5
DYNASOLVE 230
P5.P9
P5
DYNASOLVE M-10
P5
P9
P5
SPECIAL SOLVENTS DECAP
P9
DYNASOLVE 100
P9
P9
DYNASOLVE 699
P9
P9
DYNASOLVE M-30
P10
P9
P10
P10
DYNAFLUSH
P9
P6
P9
P6
P11
P10
P1,P2, P3.P4
P4
P4
DYNASOLVE CU-5
P1,P2, P3,
P1,P2, P3,P4
P1,P2, P3,P4
P1.P2,
DYNASOLVE CU-6
PI, P2, P3,
P1,P2, P3,P4
P1.P2, P3, P4
P1.P2,
P3, P4
DYNASOLVE CU-9 URESOLVE
P3, P4
P5 P1,P2
FREE LAB SERVICE
MATERIAL EVALUATION KITS
If uncertain of the correct solvent for your application, we offer free analysis in our laboratory. Our highly qualified technical staff will then recommend the proper solvent for your application.
Several standard material evaluation kits are available for your own in-house testing; or, you may make up a kit of your own by selecting any 6 of our solvents (1 pint of each).
ELECTRONIC
SOLVENT APPLICATIONS TABLE
MATERIAL TYPE
SOLVENT SELECTION GUIDE
ELECTRONIC
METHANOL BASE URESOLVE BLUE
EI.E2, E3,E4
DYNASOLVE190
El, E2, E3,E4
E1.B4
El
URESOLVE 411
E1.E2, E3.E4
E1.B4
El
El
PROPYLENE GLYCOL ETHER BASE
j
DYNASOLVE 700
E4,E6
DYNASOLVE710
E4, E6, E8
E4, E6, E8,E9
E4,E6
DYNASOLVE 711
E4, E6, E8
E4, E6, E8,E9
E4,E6
DYNASOLVE 750
E4, E6, E8
E4, E6, E8,E9
E4,E6
E9.E10
El E2 E3 E4 E5 E6 E7 E8 E9 E10
URESOLVE HF
Electrical Connector Repair Depotting Deflashing Decapsulation Removal of RTV's from CRT Tubes De-inking Surface Preparation Photo Resist Stripping
P1 Cleaning Residues from Mixing &
E4,E6
URESOLVE PLUS
E4, E6, E8
E4, E6, E8,E9
E4,E6
URESOLVE PLUS SG
E4, E6, E8
E4, E6, E8,E9
E4,E6
URESOLVE PLUS 500
E4, E6, E8
E4, E6, E8,E9
E4.E6
P2 E9,E10
P3 P4
DYNASOLVE 611
E9,E10
P5
METHYLENE CHLORIDE BASE E1.E4, E5,E6
DYNASOLVE 165
El E1,E4, E6, E7
DYNASOLVE 210
P6
El
P7
N-METHYL PYRROLIDONE BASE
NMP
E4, E5, E6, E8
E9,E10
DYNASOLVE 180
E4, E5, E6, E8
E9.E10
DYNASOLVE 185
E4, E5, E6, E8
E9,ElO
DYNASOLVE 185-SG
E4, E5, E6, E8
E9.E10
HYDROCARBON BASE DYNASOLVE 220
E1.E4, E6,E7
El
DYNASOLVE 225
E1.E4, E6,E7
El
DYNASOLVE 230
E1.E4, E6,E7
El
SPECIAL SOLVENTS E4, E5, E6
DECAP E4,E6
E4, E6
DYNASOLVE 150 DYNASOLVE 699
Cable Assembly Repair
INDUSTRIAL
ETHYLENE GLYCOL ETHER BASE
DYNASOLVE 100
Conformal Coating Removal
E4,E6
El B1.E4
El
El El
P8 P9 P10 Pll
Metering Equipment Cleaning Residues from Nozzles, Spray Guns, etc. Cleaning Residues from Injection & RIM Molds Flushing of Feed Lines, Mixing Heads, Molds, & Pumps Removal of Mold Releases and Parting Agents Removal of Buffer Coatings from Optical Fibers Removal of Adhesives & Inks from Laminating & Engraved Rollers Polysulfide Removal from Aircraft Fuel Tanks General Adhesive & Polymer Removal General Cleaning & Degreasing Paint Stripping
HOW TO USE THE SOLVENT SELECTION GUIDES 1• Locate your application & its appropriate code in the Solvent Applications Table, (eg Conformal Coating Removal - E1) 2« Refer to the appropriate Selection Guide (Industrial or Electronic). 3» Locate the column containing the Material Type you want to remove, (eg - Acrylics, Epoxies, Urethanes, etc.) 4« Follow that column down to whichever box(es) contain your applications code. Follow this row(s) to the far left column to find the recommended solvent(s).
BEFORE
AFTER
INDUSTRIAL Removal of a compressionmolded silicone from an aluminum core using Dynasolve 210.
Removal of a cured urethane from a dispensing equipment mixer using Dynasolve MP-AL Grade.
Removal of an epoxy powder coating from a motor armature using Dynasolve MP-750.
ELECTRONIC Removal of a silicone conformal coating from a PC board using Dynasolve 225.
Decapsulation of epoxy-molded ceramic capacitors using Dynasolve 180.
Removal of residual photoresist from a ceramic substrate using Uresolve Plus SG.
SOLVENT DESCRIPTIONS Dynasolve 100
Dimethylformamide-based. Not selective.
Dynasolve 150
Flammable. Tetrahydrofuran-based. Room temperature use only.
Dynasolve 165
Corrosive. Room temperature use only. Very powerful but not selective.
Dynasolve 180
Use hot (105-175°C). Not selective.
Dynasolve 185
Modified version of Dynasolve 1 80. Use hot (1 05°C).
Dynasolve 1 85 SG
Electronic grade.
Dynasolve 190
Flammable. Room temperature use only. Stronger than Uresolve Blue but less selective.
Dynasolve 200
Effective at room temperature. Selective.
Dynasolve 210
Corrosive. Room temperature use only. Fastest solvent for silicone removal.
Dynasolve 220
Corrosive. Alternative to methylene chloride-based Dynasolve 210. Most selective.
Dynasolve 225
Flammable and corrosive. Room temperature use only. Stronger than Dynasolve 220, but has lower flash point and is less selective.
Dynasolve 230
Flammable and corrosive. Room temperature use only. Stronger than Dynasolve 225, but has lower flash point and is less selective.
Dynasolve 699
Butyrolactone-based. Use at room temperature for thin acrylic coatings. Use hot (120-150°C) for acrylic adhesives and epoxy powder coatings.
Dynasolve 700
Flammable. Room temperature use only. Similar in strength to Uresolve HF.
Dynasolve 710
Stronger than Dynasolve 700, but less selective. Similar in strength to Uresolve Plus. Slow at room temperature. More effective at 65-110°C.
Dynasolve 711
Similar to Uresolve Plus SG. Can be used in contact with aluminum.
Dynasolve 750
Stronger than Dynasolve 710, but less selective. Similar in strength to Uresolve Plus 500. Slow at room temperature. More effective at 65-110°C.
Dynasolve M-10
Effective on silicone oils and parting agents at room temperature. For quicker removal, heat to 65°C.
Dynasolve M-30
Low toxicity. Non-flammable. Non-corrosive. Effective at room temperature for general cleaning of uncured polymers. For quicker removal, can be used hot (60-75°C).
Individual data sheets and material safety data sheets (MSDS's) for all of the Dynaloy solvents listed in this guide are available upon request. All ingredients used in Dynaloy products are listed in the TSCA Chemical Substances Inventory (Public Law 94-469). Dynaloy, Inc. takes every precaution in the manufacture of its products. The information in this sheet is based upon our own research and is considered accurate. However, no warranty is expressed or implied regarding accuracy and results to be obtained, since operating conditions in your plant are beyond our control. Review material safety data sheets (MSDS's) before use.
Dynasolve MP-AL GR Slow at room temperature. More effective at 65-110°C. Can be used in contact with aluminum. Dynasolve MP-500
Stronger than Dynasolve MP-AL GR, but less selective. Slow at room temperature. More effective at 65-110°C.
Dynasolve MP-710
Similar in strength to Dynasolve MP-AL GR. Slow at room temperature. More effective at 65-110°C.
Dynasolve MP-750
Stronger than Dynasolve MP-710, but less selective. Similar in strength to Dynasolve MP-500. Slow at room temperature. More effective at 65-110°C.
Dynasolve CU-5
Similar to Dynaflush, but more effective for cleaning urethane residues and crystallized isocyanates.
Dynasolve CU-6
Higher flash point version of CU-5. Non-gelling in the presence of fluid isocyanates.
Dynasolve CU-9
Very high flash point (129°C) solvent system designed to remove cured silicone release agents from molds and pans. Also removes RTV silicones.
Uresolve Blue
Flammable. Room temperature use only. Most selective.
Uresolve 411
Flammable. Room temperature use only. Stronger than Dynasolve 190 but less selective.
Uresolve HF
Stronger than Uresolve 411, but less selective. Can be heated (to 37°C) for faster action.
Uresolve Plus
Stronger than Uresolve 411, but less selective. Slow at room temperature. More effective at 65-110°C.
Uresolve Plus SG
Semiconductor grade. Can be used in contact with aluminum.
Uresolve Plus 500
Stronger than Uresolve Plus, but less selective. Slow at room temperature. More effective at 65-110°C.
Decap
DMSO-based. Use hot (150°C). Not selective.
Dynaflush
Non-flammable. Non-corrosive. Non-carcinogenic. Non-ozone depleting. Very effective for flushing and cleaning residues from urethane. processing equipment at room temperature. Can be used hot (95°C) for faster results.
NMP
Electronic grade. Use hot (105-175°C). Not selective. Available filtered through 0.2 micron filter.
Uresolve
Glycol-base. Use hot (175-205°C) for removing heavily encrusted urethanes.
THE CHEMICAL SOLUTIONS
Distributed By:
DYNALOY,
INC.
AVI PRECISION ENGINEERING PTE LTD 1, KALLANG SECTOR #04-03, SINGAPORE 349276. TEL: 65-6748 3866 FAX: 65-6748 4810 Email:
[email protected] Internet: http://www.avipre.com.sg
DYNALOY. INC. CONFORMAL COATING REMOVAL hroughout the electronics industry, most elecare protected by a plastic or resin. In many cases, ease of removal of these plastics will determine the best system to be used. Dynaloy has 25 years of experience in the safe and efficient chemical removal of plastic compounds, coatings, and adhesives from electronic products for rework, repair, or failure analysis. This bulletin will address one aspect of this specialty, the chemical removal of conformal coatings. Conformal coatings are thin layers of synthetic resins or plastics that are applied to electronic devices for protection against a variety of environmental, mechanical, electrical and chemical problems such as:
T tronic devices
Originally developed for military, aerospace, and marine applications, conformal coatings are now finding widespread use in telecommunications, industrial controls and instrumentation, consumer electronics, and the automotive industries, all applications in which product reliability is of primary importance. Currently, there exists 6 major types of conformal coating chemistries: epoxies, acrylics, urethanes, silicones, parylenes, and UV-cured materials. The military specification for coating printed circuit assemblies, MIL-l-46058, recognizes 5 types of conformal coatings: Type AR (acrylics), Type ER (epoxies), Type SR (silicones), Type UR(urethanes), and Type XY(paraxylylenes or parylenes). UV-cured materials are also recognized, but are not listed as a separate group; they are included within the above 5 categories. While each of these coating types exhibits properties that makes it the best choice for a particular application, special attention should be paid to the techniques used for removal of the conformal coating. These techniques include mechanical, thermal, and chemical methods.
humidity and moisture fungus and mildew dust and dirt alpha particles stress mechanical shock and vibration thermal cycling corrosion process solvents, fuels, and hydraulic fluids While the majority of conformal coatings are used on printed circuit boards (RGBs), they are also used to protect discrete components, such as transistors, diodes, rectifiers, resistors, and LED's; integrated circuits (ICs); and hybrid circuits, including multi-chip modules (MCM) and chipon board (COB).
Before and after removal of conformal coating from a partially coated circuit board. AVI PRECISION ENGINEERING PTE LTD
DYNALOY, INC.
1, KALLANG SECTOR #04-03, SINGAPORE 349276. TEL: 65-6748 3866 FAX: 65-6748 4810 Email:
[email protected] Internet: http://www.avipre.com.sg
Mechanical removal methods include cutting, abrading, sanding, or blasting the area of coating to be removed. However, most of the conformal coatings are very tough and abrasion-resistant, making the probability of damage to the board high. Thermal removal methods (including burnthrough techniques) are somewhat more effective than mechanical methods, but in many cases require very high temperatures and/or long exposure times. These, in turn, can cause discoloration, leave residues, and adversely affect solders and/
or other materials used in the construction of the board or its components. Also, temperaturesensitive components or devices may be damaged. Chemical removal methods offer the highest probability for complete coating removal without adversely affecting the board or its components. However, there is no one perfect solvent for all applications, and in some cases no chemical solvent will be suitable. The following sections discuss the removal methods for each of the above mentioned conformal coating types.
Offering good dielectric properties, with excellent humidity, abrasion, and chemical resistance, polyurethane conformal coatings are the most cost-effective and widely used coatings. Currently available for removal of polyurethane coatings are several solvents which provide a wide range of speed and selectivity that can be matched to a specific application. These solvents include: Uresolve Blue, which is the slowest and most selective; Dynasolve 190 and Uresolve 411, the most popular; Uresolve HF; and Uresolve Plus, the fastest and least selective. Three of these solvents are recognized by U.S. military designations:
Complete removal of the coating is accomplished by immersion of the board into the solvent at room temperature. The amount of time required for coating removal will vary with the solvent being used, the particular coating used, and coating thickness. Typically, most polyurethane coatings of .004" thickness can be removed in 1 to 3 hours.
The use of ultrasonics or any agitation of the solvent will help to reduce the time required. The board should be removed from the solvent periodically; if it has a milky-white appearance, coating removal is not yet complete, and it should be returned to the solvent. Occasionally, light brushing or wiping may be required to remove any last traces of coating. To be certain that no residue remains from either the coating or the solvent, it is extremely important that the board be thoroughly washed in alcohol (isopropanol or methanol) immediately after coating removal is complete. The board may then be rinsed with Dl water and dried. Since all of the above-mentioned solvents contain small amounts of ionic materials, it is advisable to test the rinse water for ionic contamination with a conductivity meter. Spot removal of polyurethane conformal coatings may be accomplished by application of the solvents with a brush, cotton pad, or a Q-tip. All of the above solvents are also available in a gel (higher viscosity) form for spot removal. A P.C. Board Report, "Evaluation On Marine Instrumentation Printed Wire Assemblies" done by Gould Ocean Systems (Lab Report No. L-78-344), is available and provides a detailed study and procedure for the removal of Conap CE-1155 using Dynasolve 190.
Silicone conformal coatings exhibit high humidity, corrosion, and thermal resistance, which make them the preferred choice for high temperature applications. Over the past several years, Dynaloy has developed several solvents that have had excellent success in removing silicone conformal coatings. Of these, the fastest and most popular is Dynasolve 210, a methylene chloride-
based system. Dynasolve 220,225, and 230, all hydrocarbon-based, are alternatives to the methylene chloride-based Dynasolve 210. While not quite as fast as the 210, Dynasolve 220,225, and 230 are more selective, and when not contaminated by water, will not attack epoxyglass PCB's, their components, metals, and most plastics. As in the case of the polyurethanes, the
Uresolve 411 Uresolve HF Uresolve Plus
NSN (National Supply Number) 4935-LL-M01-1009 Bureau of Naval Weapons Specification 2621905 NSN 6850-01-311-1180
coated board is immersed in the solvent at room temperature and allowed to stand until the silicone has dissolved or can be easily brushed off. The time required will vary with the solvent used, the type of silicone coating, the coating thickness, and the amount of surface area exposed. Typically, most coatings of .010" or less will be removed in 15 minutes to 1 hour. Certain chemically-resistant silicones may require extended immersion for several hours. The use of agitation or ultrasonics will reduce dissolving time. After coating removal is complete, it is very important that the board be thoroughly washed in alcohol (isopropanol or methanol), then rinsed in Dl water and dried. A saturated cloth or Q-tip may be used for spot removal. Repeated applications, and the use of a brush may be necessary.
Before (top) and after removal of CONAP CE-1181 from PCB using DYNASOLVE 225 for 30 minutes.
Acrylic conformal coatings have good humidity resistance, long pot life, and are relatively easy to apply. However, they have poor abrasion and chemical resistance. In the past, chemical removal of acrylic coatings was done with highly volatile or flammable solvents such as methylene chloride, trichloroethane, aromatics, or ketones. As many of these chemicals are no longer acceptable due to
physical hazards, toxicity, or environmental regulations, Dynaloy has developed a relatively safe alternative, Dynasolve 699, for removal of acrylic conformal coatings. Most typical acrylic coatings will be removed within one hour after soaking in Dynasolve 699. After removal is complete, the PCB should be rinsed with alcohol or Dl water and then dried.
Epoxy conformal coatings provide good humidity, chemical, and abrasive resistance. Completecoating removal for repair is nearly impossible by chemical means (except in the case of hermetically sealed hybrids), as the solvent cannot discriminate between the epoxy coating, the
epoxy-glass printed circuit board, and any epoxycoated or potted components. However, if done carefully, spot removal of the coating may be accomplished by the application of Dynasolve 165 with a Q-tip.
Paraxylylene conformal coatings, or parylenes, are applied by a vacuum deposition process. They offer excellent resistance to humidity, moisture, abrasion, high temperatures, and chemicals. However, while they cannot be dissolved, they can be
removed. The coated board should be immersed in Dynasolve 150 for a period of 2 to 4 hours. The parylene coating will then separate from the board. Rinse the board in alcohol and let dry; then physically remove the coating with tweezers.
The passage of strict environmental laws drastically reducing volatile organic compound (VOC) emission levels created a widespread need for a solventless conformal coating. Consequently, the early 1980's saw the development of ultraviolet light (UV) curable conformal coatings as a way to eliminate air pollution, significantly reduce processing time, and reduce energy costs as compared to solvent-based, thermally cured coatings. These coatings were successfully developed by creating acrylated oligomers: epoxy acrylates, urethane acrylates, polyester acrylates, or combinations of several of them. Epoxy acrylates provide improved chemical resistance. Acrylated urethanes exhibit flexibility and toughness. However, due to the "hybrid" chemical structure of these UV cured conformal coatings, chemical removal can be a little more complicated. While two different manufacturer's coatings can be of the same type of oligomer, ie. acrylated urethanes, two completely
different solvents may be required to remove them. In some cases, a combination of two solvents used in succession may be required; in some cases, such as Loctite's Shadowcure 361, no solvent was found to be suitable. Table #2 provides a guide for proper solvent selection for removal of UV cured conformal coatings. Generally, the removal procedure is the same as that for other coating types: the PCB should be immersed in the appropriate solvent; when coating removal is complete, the board should be thoroughly washed in alcohol, rinsed in Dl water, and dried. Removal times can vary anywhere from 15 minutes to 24 hours, depending on the coating, coating thickness, and the solvent used. Agitation or the use of ultrasonics will speed up the procedure. Spot removal may be done by application of the solvent with a brush, cotton pad, or Q-tip; alternatively, some of the solvents may be available in a gel form.
When choosing a solvent for the removal of a particular conformal coating, one should examine the following criteria:
Dynaloy would like to thank the following conformal coating manufacturers for their assistance in the preparation of this bulletin:
• does it quickly and completely remove the coating? • does it selectively remove the coating while not damaging or adversely affecting the substrate and/or other components or devices? • is it safe to work with? and • is it environmentally acceptable? Since regulations vary not only from state to state, but also from company to company, the answer to some of these questions can only be determined by the individual company. However, to aid in your selection of a solvent for any of the standard (non-UV) type conformal coatings, we have prepared a solvent selection guide for removal of conformal coatings (see Table #1). A number of coatings are listed in this guide; it is expected that the recommended solvents will effectively remove similar coatings from the same or from different manufacturers."
Chemtronics, Inc. Conap, Inc. Dow Corning Corp. DuPont Electronics Dymax Corp. GE Silicones Loctite Corp. Novatran Corp. Para Tech Coating Co. W.R. Grace & Co.
Solvent Selection Guide For Removal of Conformal Coatings CONFORMAL COATING TYPE
T H I C K N E S S
RECOMMENDED SOLVENTS AND APPROXIMATE TIME FOR REMOVAL
EPOXY All Types
For Spot Removal Only
ACRYLIC ConapCE-1170 ConapCE-1171 Furane Acrylane 5730 HumiseaMB31 HumiseaMB31-66 Humiseal1B31-FR Humiseal 1 B73 Hysol PC20M Hysol PC20-35M
1 hour 1 hour
.007" .007"
POLYURETHANE Conap CE-1155 Conap CE-1155-35 Conap CE-1164 Conap CE-1165 Conap CE-1166 Conap CE-1175 Furane 5750-A/B(LV) Furane 5751 -A/B Humiseal 1A20 Humiseal 1A33
.004" .004" .004"
2.5 hrs. 2.5 hrs. 2.5 hrs.
1.5 hrs. 1.5 hrs. 1.75 hrs.
.004"
2 hrs.
1 hour
Humiseal 1A34
Humiseal 2A64 Hysol PC18M Hysol PC29M Products Research PR1568
SILICONE Chemtronics Konform Conap CE-1181 Dow Corning 31 40 RTV Dow Corning 31 45 RTV Dow Corning 1-2577 Dow Corning 1 -2577 UVI Dow Corning Hipec 3-6550 Dow Corning Hipec 648 Dow Corning Hipec Q1-4939 Dow Coming Q1-2620 Dow Corning Q1 -2620 UVI Dow Corning Q3-6614 Dow Corning Q3-661 4 UVI Dow Corning R4-31 17 GE SR900 GE ECC 440 GE ECC 450 McGhan Nusil R-1075 SWS T-81 W.R. Grace & Co. AmiconSC-120-4 W.R. Grace & Co. Amicon SC-3613 W.R. Grace & Co. Amicon SC-930
30 min. 15 min. 30 min. 30 min. • • • 1.5 hrs. 1 hour • • 30 min. 45 min. 24 hrs. 5 hrs. 15 min. 15 min.
15 min. 30 min. • * 1 hour * 15 min. 3 hrs. 15 min.
.005" ,002" .005"
15min. 15 min. • • 15 min. • 15 min. 15 min. 15 min.
.004"
30 min. 30 min. 30 min. 30 min.
.003" .006" .008"
•
•
•
•
•
•
•
•
•
•
•
•
PARYLENE Novatran Parylene C Para Tech Parylene C
.001" 2-4 hrs. .001" 2-4 hrs.
NOTE: • means solvent is recommended but time data is not available.
DYNALOY, INC.
AVI PRECISION ENGINEERING PTE LTD 1, KALLANG SECTOR #04-03, SINGAPORE 349276. TEL: 65-6748 3866 FAX: 65-6748 4810 Email:
[email protected] Internet: http://www.avipre.com.sg
The
C h e m i c a l
S o l u t i o n
Electrically Conductive Adhesives Dynaloy's conductive adhesives are all two component epoxy-based systems that, when combined, produce a manageable product ideal for many applications. All of Dynaloy's adhesives are silver filled or silver coated because silver is a highly conductive metal imparting excellent corrosion resistance. These adhesives are recommended for connecting heat sensitive components to printed circuit boards and connecting ground wires to components. Dynaloy adhesives are excellent replacements for metallic solder where lead usage is prohibited or temperature constraints are present. These products are also recommended for shielding, bonding wave guide plumbing in hybrid circuit assembly, and as a plating base. These adhesives are used extensively in the repair of printed circuits.
Electrically Conductive Coatings Recent advancements in the plastics industry include several types of engineering plastics that have replaced certain metals in the manufacture of enclosures, cabinets and housings. These materials along with structural foam are all transparent to radio frequency and need to be treated to make them conductive. Uncontrolled interference can cause memory erasure, navigational errors in marine and aircraft equipment, jammed radio reception and failures in medical equipment. There is a greater need now for conductive paints and coatings for EMI/RFI shielding than in the past, and use should increase in the future. Most of Dynaloy's coatings are silver-filled. Silver is a highly conductive metal with excellent corrosion resistance. While the cost is high, EMI/RFI shielding attenuation is outstanding. Silver coatings are specified for military applications where electromagnetic protection and radio frequency interference protection is required. Realizing the need for lower cost shielding products, Dynaloy is now developing conductive coatings based on copper and nickel. Dynaloy is researching ways to overcome copper's tendency to oxidize in coatings, which limits its effectiveness as a reliable conductor. Nickel, although not quite as good a conductor as copper or silver, absorbs more electromagnetic interference because of its magnetic permeability. Nickel conductive paints would offer the most economic shielding for the majority of plastics. Dynaloy's conductive coatings can be used for electroplating base, component grounding, printed circuit repair, capacitor coating and lead termination. The most popular use for these coatings is in EMI/RFI shielding.
Electrically Conductive Lubricants Dynaloy has developed high quality, silver alloy filled electrically conductive lubricants for a wide variety of applications, including lubricating hinge joint switches and air blast breakers. Dynalubes will eliminate hot spots and help prevent overheating of knife blade switches. In addition, they can be used for making non-permanent electrical connections and as a caulking compound for shielding. Dynalubes can be applied in the same manner as a conventional lubricant.
Product Table Electrically Conductive Adhesives Dynaloy 325 thermal conductivity of pure silver. Easy 1:1 mixing ratio. Up to two-hour pot life after mixing.This product is approved by NASA, and has been used on Apollo moon missions. Dynaloy 336
Low-cost two component silver filled epoxy that has strong adhesive properties together with excellent electrical conductivity. Dynaloy 336 contains neither copper nor carbon extended conductive epoxies, which can cause drift, migration or galvanic attack when in contact with electrolytes. Easy 1:1 mixing ratio.
Dynaloy 536
Low-cost two component silver coated copper filled epoxy with excellent adhesive properties and good conductivity. The passivated copper is not reactive in the organic vehicle and thereby exhibits good storage stability. It is highly stable in the applied film ensuring that the good conductivity of the coating is maintained during service.
Dynaloy 1931 This product meets the requirements for Federal Specification MMM-A-1931 Type 1 and Type II.
Electrically Conductive Coatings Dynaloy 340
A pure silver filled electrically conductive acrylic paint. Dynaloy 340 sets by solvent evaporation.
Dynaloy 342
Same as Dynaloy 340, but with a safer solvent system.
Dynaloy 350
Solderable, conductive polymer alloy coating. May be soldered to with tin/lead solders containing 1-2% silver. Provides excellent adhesion, conductivity and heat resistance.
Dynaloy 352
Same as Dynaloy 350, but with a safer solvent system.
Dynaloy 370
A pure silver filled electrically conductive urethane paint, which produces an extremely flexible coating. Dynaloy 370 meets Naval Sea Command Drawing 5335279.
Dynaloy 372
Same as Dynaloy 370, but with a safer solvent system.
Dynaloy 375-1
A silver based product formulated using a unique system of polymer alloys. This coating will crosslink at 200° C forming a tough, mar resistant film exhibiting excellent adhesion.
Dynaloy 377-1
Same as Dynaloy 375-1, but with a safer solvent system.
Dynaloy 479
Solderable low-cost conductive silver alloy polymer coating. Dynaloy 479 achieves optimum results when the coating is baked. A lower cost silver alloy is used in place of pure silver.
Dynaloy 482
Same as Dynaloy 479, but with a safer solvent.
Dynaloy 489
An air drying, low-cost silver filled electrically conductive epoxy coating. A lower cost silver alloy is used in place of pure silver.
Dynaloy 499
Same as Dynaloy 489, but with a safer solvent.
Dynaloy 810
Aqueous-based, nickel filled, air drying conductive coating formulated primarily for use in RFI shielding applications and other uses where a low cost finish with good electrical conductivity is required.
Dynaloy 850
Solvent-based, nickel filled, air drying conductive coating under development. Similar to Dynaloy 852, but formulated with a different solvent system.
Dynaloy 852
Solvent-based, nickel filled, air drying conductive coating. When baked at 125° C, the polymer alloy system produces a tough film with good heat resistance. Similar to Dynaloy 352, but nickel-based.
Electrically Conductive Lubricants Dynaloy 495
A silver alloy silicone lubricant. Non-volatile, non-drying, no mixing required. Stable from -65°C to 225°C.
Dynaloy 495-1
Similar to 495, but made with a solvent base, creating a thinner version.
