Market Outlook for Semiconductor Semiconductor for Smartphone, Display, Image Sensor, Navigation, Lithium ion battery can forecast sustainable growth...
Market Outlook for Semiconductor Semiconductor for Smartphone, Display, Image Sensor, Navigation, Lithium ion battery can forecast sustainable growth as increase demand.
Market Outlook for Semiconductor
Demand Outlook for Probe Pin/Socket Socket & Probe Pin for semiconductor test, which forecast demand can increase as sustainable growth for semiconductor
Roadmap of Semiconductor Technology Fine Pitch-based Socket & Probe Pin development ongoing follow as semiconductor fine pitch. Ball Size
Socket module Pitch (mm)
0.10mm
0.2
0.15 ~ 0.2mm
0.3~0.35 0.4 0.5~0.65 0.75~0.8 1.0 1.27~1.5
fcCSP BOC 0.4 ~ 0.5mm
0.25mm WLCSP 0.3 ~ 0.35mm
Future Market Present Market
0.5mm
Past Market
FBGA 0.76mm FCBGA
(2013)
Semiconductor 180 ㎛ Pitch Lithography KrF
70 ㎛ KrF/K2
40 ㎛ 30 ㎛ 50 ㎛ EUV/X-선 K2/EUV
2000
2005
2010
Year
2012
2013
Roadmap of Semiconductor Technology Probe Pin of Mass product by press type rapidly increase demand because impossible the fine pitch under 0.4㎜ by finger pin type in the burn-in test market follow as gradually fine pitch for lead pitch of semiconductor.
Tweezers point
Semiconductor
Touch point
Semiconductor Min 0.2~0.4 Pitch
Up to Min 0.5 Pitch
Old type : Finger pin / Tweezers point
Press Type : Probe pin / Touch point
Development for New item (Monolithic probe pin) Burn-in socket assembling with monolithic probe pin can use for semiconductor final test (Function, Unfavorable conditions, Often/Short Test). It is essential parts for semiconductor processing which play an important role between semiconductor to test equipment.
Semiconductor Touch Plunger Main Body Spring
Probe Pin
Development for New item (Monolithic probe pin) The cost of probe pin & socket is being demand for reduce the cost of semiconductor manufacture processing(Wafer Sawing, Lead Frame, Gold Wire, Mold Compound, Final Test). Retrenchment of cost
Old type Assembling after separate making for contact plunger, main body spring.
Cost(Present) : 100
New item (press type) Monolithic making by one touch press for contact plunger, main body spring
Rising quality
Improvement : 50%
Future newtechnology - Applied newproduct with graphene - Ceramic - Other
Development for New item (Monolithic probe pin) We can mass produce for monolithic probe pin through 1~2rd stamping process and plating process on the sheet of ultra lamina material (Be_Cu).
Mould
Front press First : Press/Blanking
Flat on plating Equipment of Au plating Au-plating
Mould
Front Press
Auto Test Second : Press/Forming
Development for New item (Monolithic probe pin) Monolithic probe pin will advance into market by outstanding quality and competitive price. Section
Method of assembly
Monolithic method
Method of manufacture
Manual operation/Semi-auto
Progressive mould
NC processing/ Inequality of Au plating
Flat on Au plating
Quality
Dominant of Electric character Cost
High cost
Low cost
Limited assembly
Up to Ф 0.1mm
Below Ф 0.1mm
Manufacture method of socket
Manual operation
Auto operation(Reel type)
Mixture type
Remark Mass produce and standardization Low heat in the high voltage current by low resistant(20mΩ) Low dust generate on the Crown part epoch-making manufacture cost Ф0.1mm is No Barrel type Sharp cut manufacture cost of Socket
Monolithic type
Outstanding quality for customer needs The customer are very satisfy for spring strength and contact resistance.
max
min
ave
Force (ave.) gf
25.22
24.83
25.04
Cres(ave.) mOhm
53.60
43.93
48.33
Outstanding quality for customer needs Life Cycle is also satisfaction for specification of customer needs.
Vision for monolithic Probe Pin Manufacture technology of ultra-precision mould based, expand global market for monolithic probe pin as the world’s first. Technology of Ultra-precision mould The most low cost of Probe Card in the global The most low cost of Test Socket in the global The most small size of monolithic Probe Pin in the global
Global standardization Probe Pin
The world’s first for monolithic Probe Pin Strength : L3 (Low Cost, Long Life, Low Impedance)
Production for New product (Memory test Socket) Probe pin of memory test socket use the interim and final test for Semiconductor, Display Module, Camera Module, Image Sensor, Battery, LCD test equipment etc..
BGA Socket
T-sop Socket
Production for New product (Logic test Socket) Logic test socket inserted probe pin : Test for final finished device
Lead of Finished device with Probe Pin 1:1 contact(The number of Device Lead = The number of Probe Pin )
Production for New product (Burn in test Socket) Burn-in test socket inserted probe pin use to the final test for finished device.
Production for New product (Probe Card) Probe card(Socket inserted probe pin) can test for semiconductor wafer level
Ø100㎛
Possible change by Probe Pin
50㎛ Width Probe pin of Old type
Development plan for new product Advance and lead into market by progressive development of Fine pitch. Year
Ø0.3 Pin Ø0.25 Pin 0.4P Test Socket Burn in Socket
Ø0.2 Pin 0.35 Test Socket Burn in Socket
Probe Card
Ø0.1 Pin 0.3P Test Socket Burn in Socket 0.15~0.2P Card
Pitch(Mass)
Growth strategic for new product Sustainable growth for Semiconductor Test parts by specialization..
The time of entry
The time of growth
The time of jump Global standardization of monolithic Probe Pin
Expand market of monolithic Probe Pin
Entry market of Monolithic Probe Pin
Customer • Samsung Electric • Hynix • Micron
Global standardization Mass production Manage patent Participate semiconductor exhibition Sustainable expand the Customer Cost competitive Sustainable development for parts
