Fine Cutting with Solid-State Lasers. David Locke TRUMPF Laser Plymouth Twp., MI June 21, 2012

Fine Cutting with Solid-State Lasers David Locke TRUMPF Laser Plymouth Twp., MI June 21, 2012 TRUMPF Disk Laser Applications TLS 251bn - 20.07.2009...
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Fine Cutting with Solid-State Lasers

David Locke TRUMPF Laser Plymouth Twp., MI June 21, 2012

TRUMPF Disk Laser Applications

TLS 251bn - 20.07.2009

Characteristics of Fine Cutting 

Thinner materials



Smaller geometries



Sharper contours and features



Lower laser powers



Finer focusing



Modulation and pulsing

TRUMPF Disk Laser Applications

TLS 251bn - 20.07.2009

Challenges of Fine Cutting 

Motion system acceleration and deceleration



Controling laser power in sharp corners



Accomodating smaller focused beams



Assist gas delivery



Part holding

TRUMPF Disk Laser Applications

TLS 251bn - 20.07.2009

Cutting thin sheet with 1 µm wavelength

source: Fraunhofer ILT, Aachen / Germany TRUMPF Disk Laser Applications

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Cut quality – Roughness

Roughness Rz [µm]

100 Stainless steel 1.0 mm

80 Range 3 60 40

Range 2

Aluminum Mild steel Stainless steel Mild steel 1.0 mm

20 Range 1 0 0,8

1

1,2

1,5

2

2,5

3

Sheet thickness [mm] Aluminum 0.8 mm TRUMPF TruFiber sales Disk training Laser Applications

TLS 251bn--2012-03-12 TLD272so 20.07.2009

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Cutting with TruDisk 1000 24 Mild Steel (St37)

22

Stainless Steel (1.4301)

Cutting Speed in m/min

20

Aluminum (AlMg3)

18

Cutting Gas and Spot Size Adapted to Application Focusing Optics: HSL D50

16 14 12

TW562ho 11.12.2006

10 8 6 4 2 0 0

1

2

3

4

5

6

Material Thickness in mm TRUMPF Disk Laser Applications

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Cutting of Stainless Steel with TruDisk 1000

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Cutting with Disklaser Production speed  Cutting quality  Free of burrs  Cutting of free contours

Production speed [m/min] Schneidgeschwindigkeit [m/min]

30

25

Maximum Cutting Speed

Production Speed

20

2 mm*mrad.

single mode Source: IFSW Stuttgart

15

10

5

0 0

1

2

3

[mm] SheetBlechdicke thickness [mm] TRUMPF Disk Laser Applications

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4

5

back 8

Cutting with TruFiber 200/300/400 120

Cutting Speed in m/min

TruFiber 400 TruFiber 300

100

TruFiber 200 Stainless Steel Dross Free 1D Fusion Cutting: Nitrogen Spot Size: div

80

60

40

TLS259kr 09.10.2009

20

0 0

0,1

0,2

0,3

0,4

0,5

0,6

0,7

0,8

0,9

1

1,1

1,2

1,3

1,4

1,5

Material Thickness in mm TRUMPF TruFiber sales Disk training Laser Applications

TLS 251bn--2012-03-12 TLD272so 20.07.2009

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Cutting with TruFiber 400 – Different materials

TRUMPFsales TruFiber Disk training Laser Applications

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Cutting with TruFiber  Good cut quality up to a sheet thickness of < 1.2 mm (stainless steel)  Especially in thin sheets high cutting speeds are possible (v > 20 m/min)  Big process windows in regard to focus position (in z) and travel speed  Cutting kerf width typically < 100 µm

TRUMPFsales TruFiber Disk training Laser Applications

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Cutting – Stator and rotor sheets  fc = 80 mm, f = 150 mm  ITEC  Gas N2, Nozzle 1.5 mm, 16 bar  0.2 mm - 100 W cw with 6 m/min  0.35 mm - 100 W cw with 6 m/min  0.5 mm - 200 W cw with 6 m/min Better quality with pulsing - 250 W, 0.4 ms, 2450 Hz with 6 m/min

 Cutassist adapts laser power for small contours automatically TRUMPFsales TruFiber Disk training Laser Applications

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Cutting – Electrical parts  fc = 100 mm, f = 100 mm  Gas O2, Nozzle 0.8 mm, 16 bar  0.3 mm Copper - 250 W, 0.062 ms @ 10 kHz with 0.8 m/min Video of copper cutting Top side

Bottom side

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Cutting – Baking tray  fc = 100 mm, f = 100 mm  Gas N2, Nozzle 1.2 mm, 20 bar  0.7 mm black steel - 300 W, 0.3 ms @ 1250 Hz with 4 m/min

TRUMPFsales TruFiber Disk training Laser Applications

TLD272so TLS 251bn--2012-03-12 20.07.2009

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Cutting – Lead frame  fc = 100 mm, f = 100 mm  Gas O2, Nozzle 1.2 mm, 3 bar  0.4 mm copper - 250 W cw with 1 m/min

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TLD272so TLS 251bn--2012-03-12 20.07.2009

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Cutting video – Mobile phone housings  CrNi 0.4 mm  TruLaser Cell 3010 fc = 100 mm, f = 150 mm Gas N2, Nozzle 1.4 mm, ≤ 16 bar  Big contours: 400 W cw with up to 16 m/min  Fine contours: Modulated output according to laser technology table in TruLaser Cell 3010 TRUMPFsales TruFiber Disk training Laser Applications

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TruControl Module Cutassist Cutting of Corners and Small Contours       

Properties of the Cutassist Cause of fault in small contours The input signal Eleven laser parameters Modulation and pulsing Database Examples

TRUMPF Disk Laser Applications

TLS 251bn - 20.07.2009

Cutting without Module Cutassist  When approaching corners, edges and reversal points of a contour to be cut, the velocity must be reduced, but the laser power stays constant  A high distance energy causes an increased heat production and more molten material  If the contours to be cut are located at a small distance from each other, the heat dissipation is blocked  Results: - Melting loss on the edges - Big heat affected zone - Burrs TRUMPF Disk Laser Applications

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Cutting with Module Cutassist  Module Cutassist adapts the laser parameters to the reduced velocity when processing corners, edges or reversal points Cutting without Module Cutassist

 The velocity signal from the CNC control is processed and transformed into a laser power default  This will result in an optimum adaptation of the laser parameters (CW power and/or pulsed mode)  Benefits: - Constant energy input per unit length - Optimum cutting quality - Minimum cutting time TRUMPF Disk Laser Applications

TLS 251bn - 20.07.2009

Cutting with Module Cutassist

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Module Cutassist - Operating mode Velocity signal

CNC www.itec-online.de

Laser power signal

TruControl

Laser source

Synchronity Signal of axis

Laser beam Cutting process

TRUMPF Disk Laser Applications

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Module Cutassist - Adaption of laser parameters Velocity signal

1 Fixed CW power 2 Readjusted CW poser

Cutassist

0

4

vu

4 1

2

3

vu

4

3 Readjusted pulsed mode 4 Fixed pulsed mode

3

vm 2

v0

3

Laser power

vm

1 2

vprocess

v0 1

vprocess

v0

vm

TRUMPF Disk Laser Applications

vu

0

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Module Cutassist - Laser parameters in detail Po

vprocess

Pmo

v0

Pmu P^m Fm

vm

Pu P^u Fu

vu

0

Range vprocess to v0  The laser uses default values  Constant laser power

Range vm to vu  The pulse power, pulse duration and frequency are constantly adapted to the speed  The laser is working in the pulsed mode  The pulse power, frequency and average power change

Range v0 to vm  The laser power is continuously reduced  The laser works in the CW mode

Range vu to 0  The parameters use the values programmed in vu  The laser is working in the pulsed mode

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Cut editor and Cut database Cut editor

Cut database

 In the cut editor, the parameter sets for the cutting of contours, small contours and punctures are created and saved

 Optional part of Module Cutassist

 The parameter sets can be called in the laser porgram

 In this database are cutting parameters for all common materials in different thicknesses included by TRUMPF  Cut database automatically creates all necessary technology parameters and  Outputs the default values to set the machine

TRUMPF Disk Laser Applications

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Cut editor - User inferface 1

2

3

 In the tab Piercing (3), the parameter set which produces the start hole for a cutting process is created.  The tab Cutting (1) can be used to create a parameter set to cut a mixture of big and small geometries.  In the bab Cutting of small contours (2) the laser works exclusively in the pulsed mode for an optimum cutting quality for very small geometries. Due to long pulse breaks, the material can cool down.

TRUMPF Disk Laser Applications

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Creation of cutting parameters without Cut database  In the Cut editor the user assigns the necessary laser parameters to every velocity point on the cutting path and by doing this he creates his own material data bank. These default values must be observed: - Diameter and type of laser light cable (LLK) - Reproduction ratio of the focusing optics (focal lengths of collimation and cutting lens) - Cutting gas (type and pressure) - Cutting gas nozzle (diameter and distance to the workpiece) - Process velocity - Focal position

TRUMPF Disk Laser Applications

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Creation of cutting parameter sets with Cut database  In the existing material data bank Cut database the user chooses type of material, thickness, collimation and lens in the Wizard

 Further steps: - Check the settings on the machine and on the optics - Create laser program  Processing can be started

TRUMPF Disk Laser Applications

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Module Cutassist - Example: quality improvement Material: Mild steel 2mm

Laser: TruDisk 1000

5mm

Velocity: 54 m/min

Without Module Cutassist TRUMPF Disk Laser Applications

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With Module Cutassist 30

How to get Module Cutassist  Module Cutassist can be used with all CW-lasers using the TruControl 1000 control unit, e.g. TruDisk and TruFiber  You can either order Module Cutassist directly with your new laser device or easily upgrade it at a later date

TRUMPF Disk Laser Applications

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Example (1) medical tweezer; stainless steel 0.5 mm

 No cutassist, only pulsing  With cutassist, cw and pulsing

 11 s  7,4 s

110 mm

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Example (2) latch of a cabinet; mild steel 2 mm

 Pulsing with cutassist: corner intact  CW with power control : corner damaged

10 mm

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Cutting with picosecond pulses  Pulses short enough to vaporize material  Free space beam guidance  Scanner for fast beam steering

 Cutting = repeated scribing (or scribe + break)

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Cutting with picosecond pulses Cutting of Nitinol  Small cutting kerf (< 10-20 µm)  Negligible HAZ  High quality of cutting edge  No electro polishing!  High yield  High productivity due to high average power  Application: Cutting of Stents, endoscopes TruMicro TRUMPF 5000 Disk Laser © TRUMPF Applications - CONFIDENTIAL

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Cutting with picosecond pulses Cutting of Silicon Wafers  Small cutting kerf (< 20 µm)  Negligible HAZ  High quality of cutting edge  High productivity due to high average power  Applications: Waferdicing

TruMicro TRUMPF 5000 Disk Laser © TRUMPF Applications - CONFIDENTIAL

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Cutting with picosecond pulses Cutting of Silicon Wafers  Small cutting kerf (< 20 µm)  Negligible HAZ  High quality of cutting edge  High productivity due to high average power  Applications: Waferdicing

TruMicro TRUMPF 5000 Disk Laser © TRUMPF Applications - CONFIDENTIAL

TUS260sw TLS 251bn - 20.07.2009

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Cutting with picosecond pulses Scribing and cutting of Ceramics  Small kerf width (< 20 µm)  Negligible HAZ  High quality of cutting edge  High productivity due to high average power  Applications: Scribing / cutting of ceramic PCBs

TRUMPF Disk Laser Applications

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Cutting with picosecond pulses Scribing and cutting of Ceramics  Small kerf width (< 20 µm)  Negligible HAZ  High quality of cutting edge  High productivity due to high average power  Applications: Scribing / cutting of ceramic PCBs

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Cutting with picosecond pulses Scribing and cutting of thin glass  Small kerf width (< 20 µm)  Negligible HAZ  High quality of cutting edge  High productivity due to high average power  Application: Scribing/cutting of thin glass for Flat-Panel-Displays

TRUMPF Disk Laser Applications

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Cutting with picosecond pulses Cutting of thicker glass

Glass Cutting

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Thank you for your attention!

David Locke TRUMPF Laser Technology Center 47711 Clipper Street Plymouth Twp., MI 48170 [email protected]

TRUMPF Disk Laser Applications

TLS 251bn - 20.07.2009