IMP-Telecommunications, Ltd. Embedded Systems Design House

Company Profile

Business Model Presentation

http://www.imptelecom.com March, 2015

About Us • Prominent Serbian embedded systems design house • Spin-off company of Michael Pupin Institute (IMP), established in 1997 • 42 employees (27 in core development team) • Proven know-how to develop prototypes based on customer’s idea • Experienced embedded systems design team

• Focus on quality and manufacturability • ISO 9001 and CMMI Level 2 company

Business Offering • Contract R&D • Consulting • Conceptual designs and evaluation boards/proofs of concept

• Original Design Manufacturer (ODM) business model • Licensing of proprietary IP • Southeastern European R&D offshore destination • Outstanding quality/cost ratio (value for money)

“Perfection in Embedded Design” Concept • One stop shop (turnkey design)

• Electronic products development know-how • Providing COMPLETE, ready for manufacturing solutions to customer • Industrial design and design for EMC

• Automated test systems development • Full competence in each phase of device design • Fast prototyping • Network of partner development companies (ICT-Net cluster) • Cooperation with University

“Perfection in Embedded Design” Concept

Commitment to Quality • Certified ISO 9001 quality management system • IT Mark quality assurance certificate • CMMI for development level 2 • Agile development methodology (scrum-like) • Proprietary, well-developed design verification check lists • Strict data management and backup procedures • Own state-of-the-art laboratory equipment • Pre-compliance EMC lab

Project Management & QA •

Detailed WBS

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Milestone status meetings

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Transparent procedures

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Risk management

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Weekly reporting

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Requirements management

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Costs tracking

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Configuration management

Customer

Project Manager

System Design Team

HW Design Team

Embedded Software Team

FPGA Design Team

Mechanical Design Team

QA Manager

Test & Verification Team

Design for Manufacturing Team

Manufacturing

Technologies • Real-time systems design • High-speed hardware design • DSP algorithms development • Multirate DSP, software-defined radio

• Embedded operating systems (Linux) • High-speed/high-density PCB Design • Microwave circuits design • Power supplies & power management • Industrial control systems • Video and multimedia systems

Open-Source Software Linux kernel • Bootloader for custom boards (U-boot) • Porting Linux kernel for custom boards • Linux drivers developing, maintaining and modifying for exotic peripherals

• Full support for our own Linux BSPs Android • Java middleware libraries for accessing board peripherals directly from Android

• Full Java API, no need for low level NDK programming and cross-compilation • Full support and documentation

Design for EMC • Seven years of experience in the company

• Cooperation with Microwave Group at the University of Belgrade • Recognized international experts with more than 30 years of experience • World-class 3D EM field simulation experts (developed Wipl-D, Artech House) • Extensive list of international references (DEC, Bosch, Motorola, Philips, DuPont) • Consulting in design phase

• Debugging EMC problems • EMC hardening • Product certification and CE marking

Audio and Acoustics • Cooperation with Acoustics Laboratory at the University of Belgrade • Development of high-end audio electronics (preamps, amplifiers, power amplifiers, filters) • Design of loudspeakers • Audio software development (signal processing, filtering, measurement, modeling, calculations) • Room acoustic design (studios, opera halls, theatres, chruches) • Research projects (partial discharge in transformers)

• Audio/acoustics lab (small anechoic chamber, reverberation chamber, instruments, software)

Industrial design service • Functional, ergonomic and aesthetic aspects of the product • Conceptual ideas, selection of materials, visualization, 3D & physical modeling, mechanical design, prototyping • Cooperation with award-winning Nikola Knezevic Industrial Design studio • Listed as one of the best 40 European designers under 40 for the year 2010 • Awards: IF Design, Braun Design Competition, LG Electronic Design Competition • Client list: HP, Toshiba, Polaroid, B&W

Automated Test Systems • Five years of experience

• Reference - own manufacturing line with capacity of 2500 devices/month • Strategic partnership with National Instruments

• Know-how of test methodologies (in-circuit, boundary scan, self-test) • Design for Manufacturing consultancy • Development of test jigs

Tools & environments • Altium Designer • Cadence • Mentor Graphics, HyperLynx • Xilinx ISE, Sysgen • Matlab • Labview • TI’s Code Composer Studio • IAR Workbench, MPLAB IDE, Eclipse • SolidWorks 3D mechanical design

Networks & Associations • Texas Instruments DSP Third Party Developers` Network member since November 2008 • TI EMEA Design House Network Member since March 2011 • Serbian ICT Network Cluster (Board Chairman position) Currently 14 embedded design companies in the network

Notable Projects • STOS 3XGA Ethernet thin-client enabling three independent video outputs • PEC State-of-the-art real-time multichannel DSP controller • uSFP Sub-miniature 10 Gbps Fibre Channel/Ethernet transceiver • TZ-600 Mission critical communication device improving safety and security of teleprotection applications in electric power transmission systems • OpCard Add-on card for expanding capabilities of Motorola GP/GM300 radio • CTU-300 Crypto telephone set and data transmission device

STOS 3XGA

Complete system designed in-house for Finsoft Ltd., UK.

Basic Facts • Ethernet thin-client for digital signage applications • Triple-channel VESA video output (up to WXGA resolution) • Public screen systems, video walls, transportation, control centers, expos, advertising, entertainment • Low power consumption • Compact form factor • Cost-efficient solution • Image decoding and processing • Receiving up to three compressed video streams in overlay via UDP and background images via TCP with active resize and rotate algorithms

STOS 3XGA

Challenges • High-speed video hardware design • Optimization of image processing algorithms on DM64x platform • Design of application software to assure maximum utilization of resources • Assuring robust EMC performance • 24/7 work cycle • Cost optimization • Design for manufacturing • Establishing of production line and automated test procedures • Specialized test jig design • Mechanical design

PEC System

Basic Facts

• Power Electronic Controller • Multi-board configuration • CPU board, Digital IO board, Analog IO board and Power Board • High processing power (4800 MIPS floating-point DSP) • 16 optical IO channels (10 Mbps each) on Digital IO board • 16 analog channels (100 kSps) System concept, design and prototyping on Analog IO board done fully in-house under custom • 256 digital channels, development contract. 128 analog channels total • 1500 pages of documentation • Full design verification and manufacturing procedures

PEC System

Basic Facts 2 • • • •

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Packet-based data transfer in the system 10 us processing cycle 6.4 Gbps LVDS communication backbone FPGA-based communication switches and interfaces High reliability hardware with automatic hardware malfunction detection and protection mechanisms Completely separated real-time DSP and system control/management Fully redundant industrial 150 W power supply Management and monitoring subsystem Industrial temperature and EMC environment

uSFP 10 Gbps Transceiver • Goal: To develop industry’s smallest 10 Gbps LC optical transceiver

• Challenge 1: Fit electronic and electro-optical components in such small space

• Challenge 2: Design hardware for 10 Gbps performance

• Challenge 3: Find suitable high-speed interconnection solution

• Challenge 4: Devise robust mechanical design

• Challenge 5: Cost optimization An ODM project done in cooperation with TagOn, UK.

uSFP Transceiver - Solution • Compact design: 13 x 10.5 x 27 mm

• Fully SFP compatible on the electrical interface • Six-layer rigid-flex board • Microwave design – signal integrity simulation • The smallest components available

(0201 passive, 3x2 mm controller, uBGA)

• Thin PCB interposer used as connector solution • 10 Gbps test and evaluation boards developed

uSFP - Casing Prototype • Made according to 3D STEP model • Electro-mechanical co-design applied during entire development cycle • Die-cast metal body • Lid and cage made from 0.25 mm tin plate • Precise manufacturing – 20 um tolerance • Electrical connection via 0.5 mm pitch interposer

TZ-600

Basic Facts • Communication solution for teleprotection applications in power transmission systems • Hard real-time system • Designed for 24/7 operation

• Fast, reliable, and secure • Modular and programmable interfaces including long-range optical • DSP technology

• Extremely short command transmission time • Versatile power supply Own design, manufacturing and sales.

TZ-600

CPU control unit • Processing board based on TMS320C5471 dual-core processor • Embedded Linux ported on ARM7 core • DSP/BIOS on C54x core • Separate graphical user interface board based on MSP430 • File system and RDBMS • Web server for monitoring and maintenance • Event log function

CTU-300

Basic Facts • Provides ciphered full-duplex voice and data transmission over analogue telephone lines • Telephone functions: caller ID, call list, phonebook, country settings, ringer settings etc. • Simple and intuitive graphical user interface

• Speakerphone option • Power supplies: mains, 9V DC and built-in Ni-MH battery Developed and manufactured for Serbian government.

• USB computer interface for programming and data communication • Fast erasure of crypto algorithm • Full protection against tampering • Based on TMS320C5410A DSP

CTU-300

Challenges • Providing real-time ciphered voice service over dial-up connection (custom data protocol, synchronization) • Short time required for initialization of crypto connection

• Voice coding technology • Acoustic and line echo canceling • Advanced encryption algorithms • Implementing GUI on MSP430 • Advanced power management • Mechanical design

OpCard

Basic Facts • Add-on card for expanding capabilities of Motorola GP/GM300 two-way radios (voice scrambler and VHF/UHF radio modem) • Card controls properties of radio channel, transmitter and receiver, audio signal, and user interface (keyboard and display) • Excellent EMC immunity and sound quality • Downloadable firmware (over the air)

• Design based on TMS320F206 DSP

Own development, manufacturing and distribution.

OpCard

Challenges • Offensive RF environment • Mechanical design • Robustness • Voice scrambling algorithms • Real-time operating software • PCB requirements: – Six-layered printed circuit board with buried vias – High level of integration

Current Development - Qseven board Why Qseven standard?

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To enable the features of latest 45nm mobile chipsets and processors.

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To provide the ability to use the successful ComputerOn- Module concept for mobile embedded applications.

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To support the latest graphic standards such as DisplayPort and HDMI.

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Small form factor for easy integration (70 mm x 70 mm).

What is special about Qseven? •

Legacy free – only new serial buses are defined

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Flexibile graphics – current graphic standards are supported

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Embbeded API – Software interface for easy Interchangeability

Our First Qseven board Features: • High-performance TI ARM/DSP solutions • High level of peripherals integration • High-speed DDR3 SDRAM memory • Cutting-edge Sitara/Integra/DaVinci processor

Texas Instruments’ Netra processors deliver: • Dramatic BOM cost reduction trough integration • Increase overall system performance • DSP can more efficiently handle complex tasks • ARM is free to process applications

Qseven - Features and Interfaces Qseven module – based on Netra TI SoC

Interfaces:

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ARM Cortex-A8 core (up to 1.5 GHz) C674x DSP (fixed/floating point @ 1.5 GHz) Rich set of peripherals 1 GB dual-port DDR3 SDRAM memory Gbit Ethernet PCIe 2 x SATA 3.0 5 x USB 2.0 3D graphics engine (SGX530, 27 Mpoly/sec) 1080p HD video output Up to 8 GB NAND Flash 9 W maximum power consumption on board

5 x USB 2.0 host ports 1 x USB 2.0 client port 1 x PCIe 1.1 1 x Gbit Ethernet port HDMI video output LVDS display connection (Open LDI) Camera port (feature connector) High definition audio Dual SATA 2.0 interface SD/MMC card interface SPI interface ACPI power management signals

Qseven - Software •

Android 2.3 – IMP-Telecommunications – FREE

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Linux, Open Source – IMP-Telecommunications – FREE • •

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BSP available from March 2012 GA available from June 2011

Windows Embedded 7.0 – TI – FREE • •

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Full BSP available from March 2012 SysLink (Link between DSP and ARM) availability

Beta BSM available from March 2011 (ARM only) SysLink (Link between DSP and ARM) availability

C6EZAccel and C6EZRun – TI – FREE •

Includes pre-optimized DSP libraries for digital filtering, complex math and image enhancement and analysis

Qseven – End Applications • High-end Test and Measurement (Signal/Waveform Generation and Analyses) • Machine/Industrial Vision (Automated Inspection, Identification) • Biological Vision (e.g. Cell-sorting and Analysis) • Tracking and Control (Avionics/Guidance, Radar/Sonar, Solar Tracking) • Multi-channel full HD Video Encode/Decode, Transcode/Transrate (DaVinci)

Android with wires The goal of the project:

Features:

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Implement and sell specific hardware/software development platform for Android community

• ARM Cortex A8 @ 1.5 GHz

Optimized for use in home automation, machine control and similar applications

• 7” Touchscreen display

Enabling Android applications to use standard/legacy interfaces like RS232, RS485, CAN, digital I/Os and other.

• 4xUSB, SD card

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• 1 GB RAM memory • Ethernet, Wi-Fi, Bluetooth, GSM

• Camera, audio • RS232, RS485 • CAN • Digital I/Os • Analog inputs • PWM outputs

Why Android? • Open source

• Rich and innovate user interface • Easy applications development • Internet access, communications

• More than 80.000 available applications • Market share: 40 % • Expansion of Android OS on new vertical markets • Multimedia, smart houses, automotive industry, white goods, …

The End

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