Bright Future of Photonics

MICRONOVA Bright Future of Photonics Seppo Honkanen Photonics Group Micro and Nanosciences Laboratory Helsinki University of Technology MICRONOVA ...
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MICRONOVA

Bright Future of Photonics Seppo Honkanen Photonics Group Micro and Nanosciences Laboratory Helsinki University of Technology

MICRONOVA

Outline

• Photonics (?) • Activities at Micronova • Photonics Group • Conclusion

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Photonics (?)

• Photonics was coined in analogy with Electronics - Electronics: The generation and control of electrons - Photonics: The generation and control of photons

• Compared with “Optics”, photonics has more emphasis on guided waves and optoelectronic devices • Photonics has much in common with optical communications technology

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Optical Communications

- Wavelength Division Multiplexing - Multiple wavelength channels in single optical fiber - Data rate today: 10 Gbit/s; soon: 40 and 100 Gbit/s OPTICAL LASER MODULATOR

PHOTODIODE

λ1

λ1 λ1, λ2 … λn

λ2

λ2 FIBER POWER AMP

IN-LINE AMP

PREAMP

λm λn MULTIPLEXER

DE-MULTIPLEXER

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Silicon Photonics: Introduction

- Hybrid laser on Silicon (Intel / UC Santa Barbara) - Electrically pumped (September 2006) Schematics

Future goal: - 1 Tbit/s source on a Si-chip!

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Photonics at Micronova (TKK)

Gallium nitride technology (Groups of Lipsanen and Sopanen) • Fabrication by MOVPE: Visible and UV LEDs • Funding: TEKES, OptoGaN Oy, Beneq Oy • Applications now in solid state lighting and new generation DVD’s; many emerging applications!

MOVPE

• Our target: Custom UV LEDs for bioanalytical measurements LED wafer

LED chip 6

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Photonics at Micronova (TKK)

Photonic Crystal Fibers (Funding: Academy of Finland) (Hanne Ludvigsen’s group) - Supercontinuum generation in photonic crystal fibers: pump

nonlinear interaction

frequency Intensity [dBm]

short pump pulse

0 -10 -20 -30 400

600

800

1000

1200

1400

Wavelength [nm] 7

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Photonics Group

Photonic Integrated Circuits by Heterogeneous Integration for Telecommunication and Sensor Applications (PICHITS) - FiDiPro Research Project for years 2007 – 2011 - Funded by Tekes, TKK, VTT - Project Director: Prof. Harri Lipsanen - FiDi-Professor: Seppo Honkanen

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PICHITS - Objectives

- Build a world-class research program on Photonic Integrated Circuits (PICs) at Micronova - Develop novel integration schemes for PICs using multiple material systems (e.g. III-V semiconductors on a Si-Photonics platform) - Develop new devices by integrating semiconductor based components with glass based PICs and optical fibers - Train several graduate students - Further strengthen the collaboration between TKK and VTT - Form strong partnerships with Finnish companies and foreign universities and research institutes 9

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PICHITS - All-optical Signal Processing for Telecommunications

Schematics of an Optical Data Router (ODR)

Clock Recovery

Arrival Detection

Packet Header Recognition/ Optical Correlator

Buffering and λ Conversion

Routing Decision

Optical Switch Matrix Blocking and Switching Control

WDM Output

MUX

WDM Input

DEMUX

Regeneration

Optical Electrical

• All-optical packet header recognition is one of the most critical issues in realizing Optical Data Routing • Several schemes have been demonstrated - Fiber Bragg grating based approach most promising but not viable - The proposed chip-scale approach has true potential to attack this key issue in eliminating the “electronic bottleneck”

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PICHITS - All-optical Signal Processing for Telecommunications

All-Optical 3R regeneration (re-timing, re-shaping, re-amplification) - Eliminates the need for Optical-to-Electronic-to-Optical (O-E-O) conversion, the so-called “electronic bottleneck” - Expected to become important at 40 Gbit/s and beyond

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SOI-Waveguide Fabrication Process

- State-of-the-art process at VTT (Timo Aalto’s team)

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SOI-nanowaveguides - VTT

Integration with polymer materials; e.g. with magnetooptic polymers Integrated optical isolator ! Waveguide bridge Photonic Crystal waveguide

Courtesy of Mikael Mulot 13

PICHITS - Biosensor Chips by Guided-Wave Spectroscopy

MICRONOVA

Sideview:

Analyte to be sensed (e.g. in liquid solution)

Pin

Sensor waveguide layer (ns > ncore)

Pout

nclad Cladding (nclad