AO4807 30V Dual P-Channel MOSFET
General Description
Product Summary
The AO4807 uses advanced trench technology to provide excellent RDS(ON), and ultra-low low gate charge. This device is suitable for use as a load switch or in PWM applications.
ID (at VGS=-10V)
-30V -6A
RDS(ON) (at VGS=-10V)
< 35mΩ
RDS(ON) (at VGS = -4.5V)
< 58mΩ
VDS
100% UIS Tested 100% Rg Tested
SOIC-8 Top View
D1
Bottom
D2
Top View S2 G2 S1 G1
1 2 3 4
8 7 6 5
D2 D2 D1 D1
G1
G2 S1
S2
Pin1
Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage
VGS TA=25°C
Continuous Drain Current C
Units V
±20
V
-6
ID
TA=70°C
Maximum -30
-5
A
IDM
-30
Avalanche Current C
IAS, IAR
23
A
Avalanche energy L=0.1mH C TA=25°C
EAS, EAR
26
mJ
Pulsed Drain Current
Power Dissipation B
Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A D Maximum Junction-to-Lead
Rev 6: Nov 2011
2
PD
TA=70°C
TJ, TSTG
Symbol t ≤ 10s Steady-State Steady-State
W
1.3
RθJA RθJL
-55 to 150
Typ 48 74 32
www.aosmd.com
°C
Max 62.5 90 40
Units °C/W °C/W °C/W
Page 1 of 6
AO4807
Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol
Parameter
STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS
Zero Gate Voltage Drain Current
Conditions
Min
ID=-250µA, VGS=0V
-30 -1 TJ=55°C
-5
Gate-Body leakage current
VDS=0V, VGS= ±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=-250µA
-1.3
ID(ON)
On state drain current
VGS=-10V, VDS=-5V
-30
nA
-2.4
V
21
35
31.5
45
VGS=-4.5V, ID=-5A
33
58
19
TJ=125°C
gFS
Forward Transconductance
VDS=-5V, ID=-6A
VSD
Diode Forward Voltage
IS=-1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
Crss
Reverse Transfer Capacitance Gate resistance
A
-0.8
DYNAMIC PARAMETERS Input Capacitance Ciss
Rg
µA
±100
Static Drain-Source On-Resistance
Output Capacitance
Units
-1.85
VGS=-10V, ID=-6A
Coss
Max
V
VDS=-30V, VGS=0V
IGSS
RDS(ON)
Typ
VGS=0V, VDS=-15V, f=1MHz
mΩ mΩ S
-1
V
-3.5
A
760
pF
140
pF
95
pF
3.2
5.0
Ω
SWITCHING PARAMETERS Qg(10V) Total Gate Charge
13.6
16
nC
Qg(4.5V) Total Gate Charge
6.7
8
nC
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
VGS=0V, VDS=0V, f=1MHz
VGS=-10V, VDS=-15V, ID=-6A
VGS=-10V, VDS=-15V, RL=2.7Ω, RGEN=3Ω
1.5
2.5
nC
3.2
nC
8
ns
6
ns
17
ns
tf
Turn-Off Fall Time
5
ns
trr
Body Diode Reverse Recovery Time
IF=-6A, dI/dt=100A/µs
15
Qrr
Body Diode Reverse Recovery Charge IF=-6A, dI/dt=100A/µs
9.7
ns nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The value in any given application depends on the user's specific board design. B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initialTJ=25°C. D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. E. The static characteristics in Figures 1 to 6 are obtained using