NI FlexRIO FPGA Module Specifications This document lists the specifications of the National Instruments FlexRIO FPGA modules (NI PXI-7951R, NI PXI-7952R, NI PXI-7953R, NI PXI-7954R, NI PXIe-7961R, NI PXIe-7962R, and NI PXIe-7965R) devices. Typical values are representative of an average unit operating at room temperature. These specifications are typical at 25 °C unless otherwise noted.

Reconfigurable FPGA LUTs/Flip-Flops

DSP48 Slices (25  18 Multiplier)

Embedded Block RAM (kbits)

Virtex-5 LX30

19,200

32

1,152

NI PXI-7952R

Virtex-5 LX50

28,800

48

1,728

NI PXI-7953R

Virtex-5 LX85

51,840

48

3,456

NI PXI-7954R

Virtex-5 LX110

69,120

64

4,608

NI PXIe-7961R

Virtex-5 SX50T

32,640

288

4,752

NI PXIe-7962R

Virtex-5 SX50T

32,640

288

4,752

NI PXIe-7965R

Virtex-5 SX95T

58,880

640

8,784

Device

FPGA

NI PXI-7951R

Default timebase ............................. 40 MHz Timebase reference sources NI PXI-795xR............................. PXI 10 MHz NI PXIe-796xR........................... PXIe 100 MHz Timebase accuracy NI PXI-795xR............................. ±100 ppm, 250 ps peak-to-peak jitter NI PXIe-796xR........................... ±50 ppm, 250 ps peak-to-peak jitter Data transfers .................................. DMA, interrupts, programmed I/O Number of DMA channels NI PXI-795xR............................. 3 NI PXIe-796xR........................... 16

FPGA Digital Input/Output Number of general-purpose channels ...........................................132, configurable as 132 single-ended, 66 differential, or a combination of both1 Channels per bank Bank 0/Bank 2 ............................32, single-ended per bank Bank 1/Bank 3 ............................34, single-ended per bank Compatibility...................................Configured via FPGA, 1.2 V to 3.3 V I/O standards (refer to www.xilinx.com) Protection.........................................Refer to www.xilinx.com

Current.............................................Refer to www.xilinx.com

Maximum I/O data rates Single-ended ...............................400 Mb/s for LVDCI25 Differential..................................1 Gb/s for LVDS Global clock inputs..........................1 LVTTL, 1 LVDS Connection resources NI PXI-795xR .............................PXI triggers, Clk10, and PXI star trigger NI PXIe-796xR ...........................PXI triggers, Clk10, PXI star trigger, DStarA, DStarB, DStarC, and Sync100

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The 132 channels span across four FPGA banks. Refer to the Device Signals section for more information.

NI FlexRIO FPGA Module Specifications

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Device Signals

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NI PXI-795x R FlexRIO

RSVD_B2 on the NI PXI-795xR

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GND GClk_LVDS_n GClk_LVDS GND GPIO_30 GPIO_30_n GND GPIO_31 GPIO_31_n GND GPIO_32 GPIO_32_n GND GPIO_33 GPIO_33_n GND GPIO_34 GPIO_34_n GND GPIO_35 GPIO_35_n GND GPIO_36 GPIO_36_n GND GPIO_37_CC GPIO_37_n_CC GND GPIO_38_CC GPIO_38_n_CC GND GPIO_39_CC GPIO_39_n_CC GND GPIO_40_CC GPIO_40_n_CC GND GPIO_41 GPIO_41_n GND GPIO_42 GPIO_42_n GND GPIO_43 GPIO_43_n GND GPIO_44 GPIO_44_n GND GPIO_45 GPIO_45_n GND GPIO_46 GPIO_46_n GND GPIO_47 GPIO_47_n GND GPIO_48 GPIO_48_n GND

G21 S40 S39 G20 S38 S37 G19 S36 S35 G18 S34 S33 G17 S32 S31 G16 S30 S29 G15 S28 S27 G14 S26 S25 G13 S24 S23 G12 S22 S21 G11 S20 S19 G10 S18 S17 G9 S16 S15 G8 S14 S13 G7 S12 S11 G6 S10 S9 G5 S8 S7 G4 S6 S5 G3 S4 S3 G2 S2 S1 G1

G21 S114 S113 G20 S112 S111 G19 S110 S109 G18 S108 S107 G17 S106 S105 G16 S104 S103 G15 S102 S101 G14 S100 S99 G13 S98 S97 G12 S96 S95 G11 S94 S93 G10 S92 S91 G9 S90 S89 G8 S88 S87 G7 S86 S85 G6 S84 S83 G5 S82 S81 G4 S80 S79 G3 S78 S77 G2 S76 S75 G1

GND GND GClk_SE GND GPIO_14 GPIO_14_n GND GPIO_15 GPIO_15_n GND GPIO_49 GPIO_49_n GND GPIO_50 GPIO_50_n GND GPIO_51 GPIO_51_n GND GPIO_52 GPIO_52_n GND GPIO_53 GPIO_53_n GND GPIO_54 GPIO_54_n GND GPIO_55 GPIO_55_n GND GPIO_56_CC GPIO_56_n_CC GND GPIO_57_CC GPIO_57_n_CC GND GPIO_58_CC GPIO_58_n_CC GND GPIO_59_CC GPIO_59_n_CC GND GPIO_60 GPIO_60_n GND GPIO_61 GPIO_61_n GND GPIO_62 GPIO_62_n GND GPIO_63 GPIO_63_n GND GPIO_64 GPIO_64_n GND GPIO_65 GPIO_65_n GND

Bank 0

+3.3V SCL TB_Present_n +12V VccoA RSVD GND IoModSyncClk_n1 IoModSyncClk2 GND GPIO_0 GPIO_0_n GND GPIO_1 GPIO_1_n GND GPIO_2 GPIO_2_n GND GPIO_3 GPIO_3_n GND GPIO_4_CC GPIO_4_n_CC GND GPIO_5_CC GPIO_5_n_CC GND GPIO_6_CC GPIO_6_n_CC GND GPIO_7_CC GPIO_7_n_CC GND GPIO_8 GPIO_8_n GND GPIO_9 GPIO_9_n GND GPIO_10 GPIO_10_n GND GPIO_11 GPIO_11_n GND GPIO_12 GPIO_12_n GND GPIO_13 GPIO_13_n GND

PCB Primary Side

Bank 3

P1 S148 S147 P2 S146 S145 G37 S144 S143 G36 S142 S141 G35 S140 S139 G34 S138 S137 G33 S136 S135 G32 S134 S133 G31 S132 S131 G30 S130 S129 G29 S128 S127 G28 S126 S125 G27 S124 S123 G26 S122 S121 G25 S120 S119 G24 S118 S117 G23 S116 S115 G22

Bank 1

P1 S74 S73 P2 S72 S71 G37 S70 S69 G36 S68 S67 G35 S66 S65 G34 S64 S63 G33 S62 S61 G32 S60 S59 G31 S58 S57 G30 S56 S55 G29 S54 S53 G28 S52 S51 G27 S50 S49 G26 S48 S47 G25 S46 S45 G24 S44 S43 G23 S42 S41 G22

PCB Secondary Side

Bank 2

+3.3V SDA TB_Power_Good +12V VccoB Veeprom GND RSVD_A2 RSVD_A1 GND GPIO_16 GPIO_16_n GND GPIO_17 GPIO_17_n GND GPIO_18 GPIO_18_n GND GPIO_19 GPIO_19_n GND GPIO_20 GPIO_20_n GND GPIO_21 GPIO_21_n GND GPIO_22 GPIO_22_n GND GPIO_23_CC GPIO_23_n_CC GND GPIO_24_CC GPIO_24_n_CC GND GPIO_25_CC GPIO_25_n_CC GND GPIO_26_CC GPIO_26_n_CC GND GPIO_27 GPIO_27_n GND GPIO_28 GPIO_28_n GND GPIO_29 GPIO_29_n GND

PCB Primary Side

Bank 0

Bank 1

PCB Secondary Side

RSVD_B1 on the NI PXI-795xR

Figure 1. NI FlexRIO FPGA Module Front Connector Pin Assignments and Locations

© National Instruments Corporation

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NI FlexRIO FPGA Module Specifications

Onboard DRAM1

Maximum Working Voltage3

Memory size

Maximum working voltage refers to the signal voltage plus the common-mode voltage.

NI PXI-795xR .............................2 banks; 64 MB per bank NI PXIe-796xR ...........................2 banks; 256 MB per bank

Channel-to-earth ............................. 0 V to 3.3 V, Measurement Category I

Maximum theoretical data rate

Channel-to-channel ......................... 0 V to 3.3 V, Measurement Category I

NI PXI-795xR .............................800 MB/s per bank NI PXIe-796xR ...........................1.6 GB/s per bank

Caution Do not use this device for connection to signals in Measurement Categories II, III, or IV.

Bus Interface PXI...................................................Master, slave

Environmental

PXI Express

This device is intended for indoor use only.

Form factor .................................x4 PXI Express, specification v1.0 compliant

Operating environment ................... 0 C to 55 C, tested in accordance with IEC-60068-2-1 and IEC-60068-2-2.

Slot compatibility........................x4, x8, and x16 PXI Express or PXI Express hybrid slots

Maximum Power

Relative humidity range.................. 10% to 90%, noncondensing, tested in accordance with IEC-60068-2-56.

Requirement2

NI PXI-795xR +5 VDC (±5%)............................2 A

Altitude ........................................... 2,000 m at 25 C ambient temperature

+3.3 VDC (±5%).........................2 A +12 V ..........................................0.5 A

Pollution Degree ............................. 2

–12 V...........................................0 A

Storage environment

NI PXIe-796xR

Ambient temperature range ........ –40 C to 70 C, tested in accordance with IEC-60068-2-1 and IEC-60068-2-2.

+3.3 VDC (±5%).........................3 A +12 V ..........................................2 A

Physical

Relative humidity range ............. 5% to 95%, noncondensing, tested in accordance with IEC-60068-2-56.

Dimensions (not including connectors) NI PXI-795xR .............................18.8 cm × 12.9 cm (7.4 in. × 5.1 in.) NI PXIe-796xR ...........................16.1 cm × 10.8 cm (6.3 in. × 4.3 in.)

Note Clean the device with a soft, non-metallic brush. Make sure that the device is completely dry and free from contaminants before returning it to service.

Weight NI PXI-795xR .............................190 g (6.7 oz) NI PXIe-796xR ...........................213 g (7.5 oz) I/O connector ...................................High-density card edge

1 2 3

The NI PXI-7951R/NI PXIe-7961R does not have onboard DRAM. Power requirements are dependent on the adapter module and contents of the LabVIEW FPGA VI used in your application. Voltage ranges are dependent on the I/O standards available for your application. For more information on available I/O standards, refer to Xilinx documentation, available at www.xilinx.com.

NI FlexRIO FPGA Module Specifications

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Shock and Vibration

CE Compliance

Operational shock ........................... 30 g peak, half-sine, 11 ms pulse, tested in accordance with IEC-60068-2-27. Test profile developed in accordance with MIL-PRF-28800F.

This product meets the essential requirements of applicable European Directives as follows:

Nonoperating .............................. 5 Hz to 500 Hz, 2.4 grms, tested in accordance with IEC-60068-2-64. Nonoperating test profile exceeds the requirements of MIL-PRF-28800F, Class 3.

Environmental Management National Instruments is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial not only to the environment but also to NI customers.

Safety This product meets the requirements of the following standards of safety for electrical equipment for measurement, control, and laboratory use: •

UL 61010-1, CSA 61010-1

For additional environmental information, refer to the NI and the Environment Web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

Note For UL and other safety certifications, refer to the product label or the Online Product Certification section.

Waste Electrical and Electronic Equipment (WEEE) EU Customers At the end of the product life cycle, all products must be sent to a WEEE recycling center. For more information about WEEE recycling centers, National Instruments WEEE initiatives, and compliance with WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment, visit ni.com/environment/weee.

Electromagnetic Compatibility This product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use: •

EN 61326 (IEC 61326): Class A emissions; Basic immunity

•

EN 55011 (CISPR 11): Group 1, Class A emissions

•

AS/NZS CISPR 11: Group 1, Class A emissions

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FCC 47 CFR Part 15B: Class A emissions

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ICES-001: Class A emissions

2004/108/EC; Electromagnetic Compatibility Directive (EMC)

Refer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for this product, visit ni.com/certification, search by model number or product line, and click the appropriate link in the Certification column.

Operating .................................... 5 Hz to 500 Hz, 0.3 grms

IEC 61010-1, EN 61010-1

2006/95/EC; Low-Voltage Directive (safety)

•

Online Product Certification

Random vibration

•

•

⬉ᄤֵᙃѻક∵ᶧ᥻ࠊㅵ⧚ࡲ⊩ ˄Ё೑ RoHS˅ National Instruments ヺড়Ё೑⬉ᄤֵ ᙃѻકЁ䰤ࠊՓ⫼ᶤѯ᳝ᆇ⠽䋼ᣛҸ (RoHS)DŽ݇Ѣ National Instruments Ё೑ RoHS ড়㾘ᗻֵᙃˈ 䇋ⱏᔩ ni.com/environment/rohs_chinaDŽ Ё೑ᅶ᠋

(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)

Note For the standards applied to assess the EMC of this product, refer to the Online Product Certification section. Note EMC compliance evaluated with a wrapback adapter module and general purpose I/O (GPIO) signals configured to LVTTL I/O standard, slew rate set to slow, and drive strength set to 6 mA. EMC compliance of other I/O standards, faster slew rates, and greater drive strength is not guaranteed.

© National Instruments Corporation

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NI FlexRIO FPGA Module Specifications

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