AT&S Advanced Packaging ECP® “The Leading Chip-Embedding Technology”

www.ats.net

Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | E-mail [email protected]

AT&S – A global electronics company     

Manufacturing: Employees: Turnover 12/13: Design: Sales:

Klagenfurt Single-sided PWB ~110 people

6 plants ~8000 542Mio EUR Austria and Germany 16 offices worldwide

Fehring Flex and PTH ~380 people

Advanced Packaging at AT&S

Leoben-Hinterberg HDI PCB and ECP® ~755 people

Nanjangud, India Volume PTH ~1.040 people

Shanghai, China High End HDI ~4.900 people

Ansan, S.Korea Flex and Rigid Flex ~235 people 1

Why embedding? Trends and challenges in electronics

More functions

Supply-chain complexity

Smaller devices Aerospace

Industrial

Short cycles for design-to-market

Automotive

Lower power Mobile

Increased component population

Fragile components

Advanced Packaging at AT&S

Increased cost of high-end IC design

Military

Medical

Increased clock frequency

Thermal management

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Why embedding? Advantages of embedding

More functions

Supply chain complexity

Smaller devices Aerospace

Industrial

Miniaturisation Short cycles for design-to-market

Fragile components

Advanced Packaging at AT&S

Reliability

Automotive

Lower power Mobile

Increased component population

Increased cost of high-end IC design

Ease-of-useMedical

Military

Performance

Increased clock frequency

Thermal management

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How is it done?

Removing components from the surface by putting them inside the PCB substrate

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1 Die Placement

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3 Lamination

Structuring

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Market & application field Estimation for embedding market of US$ 500M in 2015 Mio. US$ 600,0

500,0 Power Mgmt 400,0

Control

Sensor &

Units

300,0

MEMS 200,0 Wireless Modules

100,0

0,0 2010 ASP [$/Unit] embedding die

0,11

2011

0,13

2012

0,15

2013

0,17

2014

2015

0,19

0,22

Source: Yole (2010) Advanced Packaging at AT&S

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HERMES AT&S consortium leader

Largest EU funded project focussed on INDUSTRIALISATION 11 partners driving Embedded Component Packaging technology Images HERMES consortium

Advanced Packaging at AT&S

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Volume production experience March 2009

May 2009

Sept 2009

April 2010

Sept 2010

April 2011

May 2011

Now

First Contact

Prototyping

Reliability Testing

Production Ramp Up

Customer Audits

Dedicated Organisation

Volume Production

Millions of Shipped Units

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“We are audited and approved to the highest standards. ECP® is ready for your requirements today”  Units shipped:  AT&S Yield:  Field returns: Advanced Packaging at AT&S

>60Mio >99.5% 0 7

Production facility Total Manufacturing

Clean room Class 100K

Clean room Class 10K

• 3.000 m²

• 1.200 m²

• 200 m²

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Rapid Prototyping thanks to NPI team

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Dedicated ECP® design center in Germany

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Supply chain management

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Prototype lead time 1-3 month thanks to Product and NPI Management

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Dedicated production facility in Leoben, Austria

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Production area 100-% ESD-protected

“We create more than 60 new prototypes per year with lead times of 1-3 months. Clean products through excellence in design for manufacturing!” Advanced Packaging at AT&S

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Process Component Pre - process Laser- Drilling of fiducials + overlay Dielectric Printing

Component

Assembly

Metallization

Imaging Layup & Pressing

Copper plating

Laser Drilling Stripping + Etching

Mechanical Drilling Automatic Inspection

Desmearing

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Onward Processing Organic Substrate

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Design guidelines Attribute

Stack Up

Board structure

Component

Advanced

Single ECP® core with sequential build up 250µm – 450µm

200µm – 450µm

2–8

2 – 12

Line / space

50 / 50µm

25 / 25µm

Laser via land size (build up)

min 200µm

min 150µm

ECP® core thickness (over Cu) Number of layers

Terminal metallization Component size Component pad size / pitch Component connection

Advanced Packaging at AT&S

Series

Copper (minimum 4µm) 0,4mm < X, Y < 4,0mm

0,4mm < X, Y < 8,0mm

200µm / 250µm

150µm / 175µm

Single side

Double side

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Design automation Release for mainline PCB-design platforms

 Cadence Allegro 16.5 with direct support of PCB layout with embedded components  Mentor Expedition – high-profile launch at DAC 2012 in San Francisco on 20120606  BENEFITS – design automation, integrated design rules, thermal modelling, other simulation benefits

c Contact AT&S to line up information from your system provider

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Component requirements Wafer-based embeddables  Pad finishembeddables needing Cu plating to contact Wafer-based with microvias (existing process for WLP components)

Passive discrete embeddables  Use of thin components with copper Passive discrete embeddables terminations  Availability of capacitors and resistors

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Pad pitch adaptation to organicsubstrate design rules through RDL

 Other discretes (inductors) also in development

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Wafer thinning to 100-150µm

 Component thickness of 100µm – 220µm  Case sizes of 0201, 0402 and above

Images AT&S

Advanced Packaging at AT&S

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Supply chain

Incoming Wafer

SMT assembly Passives

Cu-Bumping or RDL

Overmoulding

Wafer Thinning

Testing

Wafer Dicing

Solderballing

Chip Tape & Reel

Customer or outsourced Advanced Packaging at AT&S

ECP® - Technology

Singulation and Packaging

Customer or outsourced 13

ECP® Technology Advantages Footprint Reduction 

X-Y-Z real-estate reduction (higher sensitivity)

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Shorter electrical paths (lower noise)

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Cu-Cu contacts (lower inductance)

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System in package (mechanical stability)

Shielding 

EMI protection

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Physical access prevention (passive)

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Data deletion (active)

Cosmetic Integration Power Management

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Cu-Cu contacts

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Higher current

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Better thermal dissipation

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Vision „No Mobility without ECP®“

We will improve mobility in all segments by providing the best electronic packaging solutions

Advanced Packaging at AT&S

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Ramping applications Feature

Application

X,Y Reduction

Voltage convertor

40%

Smallest footprint with integrated module in fully-tested solution

Charge management

40%

Stacked package for advanced Li-ion-battery charge management

Media codec

30%

Integrated module with discrete passives stacked on WLP

Mobile TV

50%

Single-device solution for mobile TV tuner

NFC module

40%

Stacked package for smallest footprint solution

MEMS sensor

50%

Superior-performance MEMS micropphone / pressure sensor with smallest form factor

Identification

New feature

Position sensor

50%

High-accuracy Hall-effect sensor for advanced microjoystick application

Sensitive devices

50%

Implementation of shielding using the laminate package instead of metal can

Embedded Component advantage

Power

Media & Wireless

MEMS & Sensor

Shielding

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Integrated biometric sensing

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Summing up ECP® – the leading chip-embedding technology from AT&S Key benefits

 Miniaturization  Reliability  Performance  Integration ECP® is in volume production  production-ready  High yield (>99.5%)  NPI for rapid prototyping and supply-chain management Large number of projects with industry leaders  Mobile devices  Industrial

 Automotive Advanced Packaging at AT&S

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