Advanced Packaging related Lithography Challenges by Philippe Cochet, Director, Technical Account Management, Lithography System Group Klaus Ruhmer, Director of Sales, Lithography System Group

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Agenda • Introduction: Advanced packaging different technologies & related processes • Lithography Challenges – Minimum resolution – Sidewall angle / CD control – Depth of Focus – Exposure field size – Overlay & Alignment – Warped wafers & substrates – Throughput (Impact on COO)

– Yield ( Total Photolithography Solution)

• Summary & Conclusions • Acknowledgements

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Advanced Packaging Lithography Advanced Packaging

WLCSP