Location of SEMI Member India 1%
1’926 Members
Japan 22%
Europe 14%
As of June 2012 Korea 10%
China 14%
Americas 26%
Taiwan 11% Singapore 2%
Total Members by Size $5M - $25M 22% $25M - $100M 6%
Under $5 M 67%
$100M - $500M 3% $500M - $1B 1% $1B - $2B 1% Over $2.5B >1%
Global presence: Offices in Silicon Valley, Washington D.C., Belgium, China, France, Germany, India, Japan, Korea, Russia, Singapore and Taiwan
SEMI Europe Advisory Board
Alain Astier Group VP STMi
Heinz M. Esser CEO R&R Ortner
Mike Allison André Auberton Frank Averdung Volker Braetsch Managing Dir CEO, CEO VP Marketing Edwards Soitec Suss MicroTec Siltronic
Rob Hartman VP, ASML
Michael Hummel Paul Hyland General Manager CEO, Texas Instruments Aixtron
Alain Jarre CEO Recive Techn.
Gabriel Crean VP CEA / Letî
Eric Maiser Sector Head VDMA
Gilbert Declerck Andreas Dill Board Member CEO, Oerlikon IMEC Advanced Tech.
Steenkamp COO Centrotherm
Eicke Weber President ISE
150 SEMI Europe Experts European Advisory Board
Semiconductor Technology Conferences
ISS Conference
• • • • • • • • • • • • • •
• • • • • • • • • • • • • • • • • • • •
• • • • • • • • • • •
Mike Allison, Edwards Alain Astier, STMicroelectronics André-Jacques Auberton-Hervé, Soitec Harald Binder Volker Braetsch, Siltronic Gilbert Declerck, IMEC Heinz-Martin Esser, Roth&Rau Rob Hartman, ASML Michael Hummel, Texas Instruments Eric Maiser, VDMA Productronic Gerhard Rauter Franz Richter, Thin Materials Andreas Dill, Oerlikon Eicke Weber, FhG ISE
Russian Advisory Committee • • • • • • • • • • • • • • • • •
Alain Astier, ST Microelectronics Martin Beigl, M+W Group Jacques Berg, Tokyo Electron Alois Brandner, Applied Materials Jarek Dolak, SVCS Valery Dshkhunyan, Angstrem Andrey Golushko, Mikron Andrey Kotenko, NITOL Solar Igor Kucheryavy, Tronic Pte. (chairman) Alexander Kurliandsky, Electronintorg SP Michael Lev, Camtek Elena Lysyak, Centrotherm SiTec GmbH Hermann Marsch, Maicom Quartz Anatoly Sukhoparov, Angstrem T Manfred Schroeder, EBARA Torsten Thieme, Memsfab Dagmar Vogt, Vogt Group SE
SEMI PV Group Europe Committee • • • • • • • • • • • • • • •
Harald Binder Jim Thompson, Executive Vice President Sales & Marketing, Oerlikon Solar Andreas Guenther, President, Linde Nippon Sanso Europe Dagmar Vogt, Managing Director, ibVogt Group Dieter Manz, CEO, Manz Automation Horst Reichardt, CEO & President, DAS Jürgen Gutekunst, CEO, Rena Lutz Redmann, Jonas & Redmann Prof. Eicke Weber, Fraunhofer ISE Louis Shaffer, Edwards Vacuum Karl Hesse, Director Process Design, Wacker Manfred Schröder, President, Ebara Europe Mr. Roth, Founders, Roth & Rau Peter Abel, CEO, PVA TePla Peter Pauli, CEO, Meyer Burger
Wolfgang Arden, Infineon Michael Arnold, PEER Group Livio Baldi, Numonyx Prof. J.W. BarthaJohann Bartha, Technical University Dresden Tom Beens, Umicore Jacques Berg, Tokyo Electron Alain Brochet, STMicroelectronics Roger de Keersmaecker, IMEC Guy Dubois Bruno Ghyselen, Soitec Mart Graef, TU Delft (chairman) Martin Heerschop, GE Capital Didier Louis, CEA-Leti Martin McCallum, Nikon Richard Oechsner, Fraunhofer IISB Lothar Pfitzner, Fraunhofer IISB Ivo Raaijmakers, ASM International Peter Schaeffler, Texas Instruments Karsten Schneider, Applied Materials Francis Taroni, Altis Semiconductor
Manufacturing Test Conference • • • • • • • • • •
Davide Appello, STMicroelectronics Roger Barth, Numonyx Stefan Eichenberger, NXP Stefan Gasteiger, Advantest Michael Goldbach, LTX Klaus-Detlef Paesch, GlobalFoundries Chris Portelli-Hale, STMicroelectronics (co-chair) Ulrich Schoettmer, Verigy Martin Stadler, Teradyne (co-chair) René Segers
MEMS Conference • • •
Jérémie Bouchaud, iSuppli Jean-Christophe Eloy, Yole Développement Markus Gabriel, Suss MicroTec
• • • • • • •
Erik Jung, Fraunhofer IMZ Gerhard Lammel, Bosch (chairman) Paul Lindner, EVG Mikko Montonen, Okmetic Felix Rudolf, Colibrys Christian Schaefer, PVA Tepla Uwe Schwarz, X-Fab
Alain Astier, STMicroelectronics Paul Boudre, Soitec David Brough, Tokyo Electron Cor Claeys, IMEC (chairman) Peter Connock, memstar® Technology Horst Gant, Infineon Maurice Geraets, NXP Bernd Haeuser, Bosch Leonard Hobbs, Intel Hans Richter, IHP Gerd Teepe, GlobalFoundries
SEMI International Standards Program • • • • • • • • • • • • • •
Werner Bergholz, University of Bremen (chairman) Roland Bindemann, Freiberger Compound Materials Massimo Carrubba, Numonyx Jean-Marie Collard, Solvay (chairman) Gummaar De Vos, FFEM Gordon Ferrier, Air Products Alfred Honold, InReCon Wolfgang Jantz, SemiMap Andy Longford, PandA Europe Frank Petzold, Trustsec IT Solution Lothar Pfitzner, Fraunhofer IISB Bert Planting, ASML Peter Wagner Arnd-Dietrich Weber, SiCrystal
IP Committee • • • • • • • • • • • • • • • • •
Brandon Clark, Air Liquide Menso Hendriks, ASM Erik Johannesson, Micronic Laser Systems Gerhard Kontrus, LAM Cees Lanting, CSEM Michael Lev, Camtek Jan Halbe Lunshof, MAPPER Thomas Renner, Siltronic Vincent Ryckaert, IMEC Gerd Strauch, Aixtron Thierry Sueur, Air Liquide Dieter Franke, SCHOTT Solar Geert Defieuw, Umicore Véronique Robert-Dussouillez, CEA Joerg Baur, Oerlikon Robert Harrison, 24 IP Law Group Ton van Hoef, ASML
Advanced Packaging Conference
SEMI European Award
• • • • • • • • • • • • • •
• • • • • • • • • •
Rolf Aschenbrenner, Fraunhofer IZM Eef Bagerman, NXP Eric Beyne, IMEC Andreas Dill, Oerlikon Andreas Fischer, Bosch Philip Homami, F+K Delvotec Andy Longford, PandA Europe (chairman) Jens Mueller, IMAPS Europe Chapter Graham Jones, Henkel Steffen Kroehnert, Nanium Thomas Oppert, PAC TECH Klaus Pressel, Infineon Mark Shaw, STMicroelectronics Ignas van Dommelen, Sencio
Brendan Bold, X-Fab Michel Brillouet, CEA-LETI Elmar Cullmann, Suss MicroTec Giorgio De Santi, Numonyx Mart Graef, TU Delft (chairman) Jean-Pierre Joly, INES Peter Kuecher, Fraunhofer CNT Klaus-Dieter Lang, Fraunhofer IZM Lode Lauwers, IMEC Heiner Ryssel, Fraunhofer IISB
Sales Trend by Unit
Installed Capacity by Region
Source: SEMI World Fab Forecast, August 2012 10
SEMI Equipment Forecast
US$ Billions
Wafer Process $50 $45 $40 $35 $30 $25 $20 $15 $10 $5 $0
Assembly & Pack.
Test
Other
2008 (A)
2009 (A)
2010 (A)
2011 (A)
2012 (F)
2013 (F)
Other
2.00
1.11
1.98
2.07
2.19
3.03
Test
3.45
1.55
4.14
3.77
3.78
3.99
Assembly & Pack.
2.04
1.41
3.88
3.34
3.37
3.48
Wafer Process
22.03
11.84
29.91
34.34
33.04
36.21
Totals may not add due to rounding
Source: SEMI, July 2012
SEMI 2012 Equipm. Forecast US$ Billions
N. America
$50 $45 $40 $35 $30 $25 $20 $15 $10 $5 $0
Japan
Taiwan
Europe
S.Korea
China
ROW
2008 (A)
2009 (A)
2010 (A)
2011 (A)
2012 (F)
2013 (F)
ROW
2.61
1.44
3.84
3.41
2.43
3.04
China
1.89
0.94
3.68
3.65
3.10
3.92
S.Korea
4.89
2.60
8.63
8.66
11.48
12.14
Europe
2.45
0.97
2.33
4.22
3.20
3.29
Taiwan
5.01
4.35
11.25
8.52
9.26
9.16
Japan
7.04
2.23
4.44
5.81
4.35
5.03
N. America
5.63
3.39
5.75
9.26
8.56
10.13
Totals may not add due to rounding
Source: SEMI, July 2012
6'000 5'500 5'000 4'500 4'000 3'500 3'000 2'500 2'000 1'500 1'000 500 0
300 mm 200 mm
100 mm
150 mm
125 mm
75 mm
1978 1979 1980 1981 1982 1983 1984 1985 1986 1987 1988 1989 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012F 2013F
Millions of Square Inches
Wafer Diameter Trend
Includes polished and epi wafers. Excludes reclaim, non polished, and SOI.
Source: Rose Associates 1978 to 1995; SEMI SMG 1995 to 2011; SEMI
World LED Capacity Trend LED Epitaxy capacity (4” equivalent per month)
Source: SEMI Opto/LED Fab Forecast, August 2012
Material Market
Regional Materials Markets Region
ROW 17% China 10%
Taiwan 21%
Europe 7% Japan 20% North America 10% Korea 15%
2011 = $47.9 Billion Source: SEMI Materials Market Data Subscription, July 2012
2011 $B
2012F % $B Change
Europe
3.38
3.46
2%
China
4.87
5.17
6%
North America
4.92
5.01
2%
South Korea
7.15
7.46
4%
Southeast Asia
8.17
8.39
3%
Japan
9.34
9.50
2%
Taiwan
10.04
10.27
2%
Total Regions
47.86
49.26
3%
Totals may not add due to rounding
50
Source: SEMI Silicon Manufacturers Group, July 2012 May-12
Jan-12
Sep-11
May-11
Jan-11
Sep-10
May-10
Jan-10
Sep-09
May-09
Jan-09
Sep-08
May-08
Jan-08
Sep-07
May-07
Jan-07
Sep-06
May-06
Jan-06
Sep-05
May-05
Jan-05
Sep-04
May-04
Jan-04
Sep-03
May-03
Jan-03
Silicon Area Shipment Index Worldwide Wafer Area Shipment Index (Three-month moving average)
250
230
210
190
170
150
130
110
90
70
TSV Materials Forecast
Source: LINX-Consulting (www.linx-consulting.com)
• •
• •
• •
