Smart Card Market Overview Samsung Smart Card IC Business Smart Card IC & Process Technologies Common Criteria Certification and Security Conclusion
Contents Smart Card Market Overview Samsung Smart Card IC Business Smart Card IC & Process Technologies Common Criteria Certification and Sec...
Contents Smart Card Market Overview Samsung Smart Card IC Business Smart Card IC & Process Technologies Common Criteria Certification and Security Conclusion
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Samsung Smart Card IC Business Business Performance by Year (2005~2008)
First Shipping 42%
in SIM IC
Launching Launching st st Flash Type World 1 High-end S/C IC TM S-SIMTM
WW M/S No.1 in S/C Market
35% 32% 16%
1999
2002
Take-off (Source: (Source: Samsung Samsung Marketing Marketing Group Group ))
3
2004
Fast Growth
2007* ~ Market Leader
Schematics of Smart Card IC Chip Layout and Block diagram
Tornado Security Detectors
Timer
MPU
NVM NVM
AES
APB BUS
T-DES
RAM
RAM
Non-Volatile Memory
Power Management ARM Clock Management
RNG
Interrupt Controller
CPU CPU & & Security Security Logic Logic ROM ROM RAM RAM
APB Bridge
AMBA AHB BUS
ISO 7816-3 SIM/USB/RF Interface
USB 2.0 RF
FIFO
RAM for FTL & XIP
Encryption Engine DMA
Nand Flash Interface
Flash Interface
• Red boxes are security related blocks 4
Smart Card IC Applications
Transport Transport (RF (RF USIM) USIM) Transport Transport
USIM USIM
ATCS ATCS
Samsung Smart Card
National National -ID -ID
e-Passport e-Passport
5
Payment Payment
IP IP TV TV
Samsung Makes the Difference ! Advanced Process Technology Leading Advanced Product Development Develop New Product Concept Leading on Security Engineering
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Smart Card IC Technologies Fastest moving IC Supplier toward technology migration Design Design Rule Rule [um] [um]
Flash
0.35um
EEPROM Cell
Flash Cell
EEPROM
Unit Cell
Unit Cell
BL
BL
Floating Gate
BL
BL Sense Line
0.35 0.35 Word Line
Word Line
Floating Gate Word Line Source
Source
Drain
Drain
Drain
Drain
Tunnel Oxide
0.18um
0.18 0.18
2T-FN Unit Cell
0.15 0.15
BL
BL
0.15um
0.13 0.13
Floating Gate
0.13um
Source
Drain
0.09 0.09 0.09um
0.06 0.06 0.04 0.04
Process Process Technology Technology Roadmap Roadmap 2002
2004
2006
0.06um 2008
0.04um 2010
7
Word Line
Word Line
2012
Floating Gate Drain
Samsung Lead High-End Smart Card A higher value-added business Innovative Innovative technology technology such such as as S-SIM S-SIM will will lead lead SIM SIM industry industry in in near near future. future. (High (High Density Density SIM, SIM, SWP SWP & & NFC) NFC) S-SIM S-SIM (S3FS9CI) (S3FS9CI) –– the the First First CC CC certified certified product product in in High High Density Density SIM SIM
S-SIM
SIM Multimedia
Carrier Service
+
NFC SRAM FLASH
FLASH
Mobile TV
High-Speed & Mass Storage Authentication FLASH
ARM + Crypto Engine + LOGIC et al
USB
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Samsung Makes the Difference ! One chip S-SIM Embedded NAND Reduce PKG cost • Legacy COB compatible • No external capacitor for NAND flash memory • No extra wire bonding
High Security
• Fully Embedded Memory • No external memory interface
Better Functionality • Fast Read Cycle • Easy to Use
Cost Effective • Large density memory to use code execution • Low packaging cost
One Chip S-SIM takes both advantages from high-speed data read function of NOR flash and the advanced data storage function of NAND flash 9
Common Criteria in the Market
Standard security measure in Smartcard Strong needs in FS & ID market e-Passport requires CC EAL4+ or higher
Cumulated Cumulated Number Number of of Certificates Certificates
s s k k c c a a t ttt a a l l e e vv e e l l hhiigghh
Benefits from Common Criteria
Test Improvements
Quality Improvements
Design Improvements
Gives a trust Make more business chances Revenue increasing 13
Security Improvements
Conclusion Samsung has developed many new and advanced security features while performing Common Criteria evaluation, which has improved the product security level. As Samsung has got more Common Criteria certification, customer’s trust in Samsung smart card. Samsung smartcard business will be enhanced numerously through Common Criteria.
