Optical Imaging Profiler

PLµ 2300

Who

In recent years, interferometers and confocal imaging profilers have been competing fiercely to conquer the non-contact surface metrology market. They are both capable of accurately and reliably measuring surface topographies on the scale of millimeters to nanometers. Today, Sensofar is offering a breakthrough in non-contact optical profiling, the PLµ 2300: a new dual-technology sensor head combining both confocal and interferometry techniques, which outperforms all existing systems due to its unique combination of techniques. In addition to its compact and robust design, the PLµ 2300 is a complete tool that is ideal for obtaining a fast, non-invasive assessment of the micro- and nano-geometry of technical surfaces, in multiple configurations: from the standard setup for R&D and quality inspection laboratories to the manipulator or robotdriven system for online process controls.

0.0 µm

2.0 µm

3.0 µm

Bump on laser irradiated silicon

Confocal Profiling

Interferometry

Confocal profilers have been developed to measure the surface height of smooth to very rough surfaces. The sample is scanned vertically in steps so that every point on the surface passes through the focus. The height of the surface at each pixel location is found by detecting the peak of the narrow axial response. Because only one or a few points of the surface are illuminated at the same time, in-plane raster scanning is also required in order to build up the axial response (i.e. the confocal image) at each vertical step.

In an interferometer, a light beam passes through a beam splitter, which directs the light to both the surface of the sample and a built-in reference mirror. The light reflected from these surfaces recombines and a fringe interference pattern is formed.

Confocal profiling provides the highest lateral resolution that may be achieved by an optical profiler. This makes it possible to reduce the spatial sampling to 0.10 µm, which is ideal for critical dimension measurements. High NA (0.95) and magnification (100X and 150X) objectives are available to measure smooth surfaces with steep local slopes (over 70o). The PLµ 2300 profiler has extremely high light efficiency and an unlimited intrinsic measurement range. The proprietary confocal algorithms provide vertical repeatability on the nanometer scale. Super Long Working Distance (SLWD) objectives are also available to measure high aspect ratio features, large steps and steeply sloping samples. Step height measurements can also be made in structured or stratified samples containing dissimilar materials.

Dent on a hard disk surface

PSI Profiling Phase Shift Interferometers have been developed to measure the surface height of very smooth and continuous surfaces with sub-nanometer resolution. The sample, which must be in focus, is scanned vertically in a few steps, which are a very precise fraction of the wavelength. The profiling algorithms produce a phase map of the surface, which is converted to the corresponding height map by means of a suitable unwrapping procedure.

0.00 µm

0.06 µm

PSI profiling provides subnanometer vertical resolution for all NA. Very low magnifications (2.5X) can be employed to measure large fields of view with the same height resolution. However, the measurement range is limited by the coherence length to a few micrometers. PSI algorithms enable the PLµ 2300 to profile shape features on the nanometer scale, as well as to assess texture parameters of super smooth surfaces on the sub-nanometer scale.

0.12 µm

VSI Profiling White-light vertical scanning interferometers have been developed to measure the surface height of smooth to moderately rough surfaces. Maximum fringe contrast occurs at the best focus position for each point on the surface of the sample. The sample is scanned vertically in steps so that every point on the surface passes through the focus. The height of the surface at each pixel location is found by detecting the peak of the narrow fringe envelopes. VSI profiling provides nanometer vertical resolution for all NA. The VSI algorithms enable the PLµ 2300 to use all the available magnifications to profile shape features with the same height resolution. The measurement range is intrinsically unlimited although in practice it is limited to 1 mm. Scan speeds and data acquisition rates can be very fast (up to 100 µm/s), although this leads to a significant loss of vertical resolution.

0.0 µm

2.5 µm

5.0 µm

MEM device

What The Plµ 2300 head

Modularity

The PLµ 2300 is a noncontact optical imaging profiler that has been developed by Sensofar using proprietary technology. The extremely high light efficiency of the illumination hardware and the high contrast algorithms are the main advantages of Sensofar’s confocal arrangement, which make the system ideal for measuring steep slopes, rough and low reflective surfaces and samples containing dissimilar materials. Combined with the interference techniques for very smooth surfaces, the PLµ 2300 provides a unique spectrum of applications. With the Dual Technology PLµ 2300 sensor head, it is now possible to choose between standard microscope imaging, confocal imaging, confocal profiling, PSI and VSI on a single instrument. The robust and compact design, which is based on microdisplay technology and has no moving parts, also makes this sensor head suitable for OEM applications. The extremely simple and ergonomic software interface enables the user to obtain the requested measurement very rapidly, by simply choosing the right objective and focusing and selecting the appropriate acquisition technique.

The PLµ 2300 has been designed as a modular system and many different configurations can be supplied, from the single sensor head for OEM applications to the most complete and sophisticated arrangement. The basic operative setup comprises the sensor head and the open-loop Z-scan device, which are mounted on a standard breadboard. This configuration provides the user with all the available imaging options (standard microscope, confocal and interferometry), as well as the highest resolution surface profiling techniques (confocal,

PSI and VSI). Measuring thin films and thick layers is also possible. The highest quality EPI, ELWD, SLWD, DI and TI Nikon objectives can be selected, with magnifications from 2,5X to 150X. To operate the PLµ 2300 using PSI and VSI algorithms, upgrading the hardware setup with a leveling tip-tilt stage and a vibration-isolation system is strongly recommended. The system can also be upgraded with manual or motor X-Y stages, which are very useful for handling the sample and positioning the features to be

measured within the field of view. Using the X-Y motor stage option, the user can operate the PLµ 2300 as a fully automated coordinate measurement system. Also, extended profile and extended topography measurements can easily be acquired using the stitching algorithms included in the software. A closed-loop PZT is also available as a high-accuracy z-scan option. By means of this device, the PLµ 2300 achieves sub-nanometer vertical resolution and calibration to traceable standards.

PLµ 2300

Basic System

1 Microscopy imaging Real-time conventional image of both conventional and interferential objectives (MEM structure)

2 Confocal imaging High-depth discrimination confocal imaging using conventional objectives (MEM structure)

3 Topography Fast 3D data acquisition within the field of view of the objective (MEM structure)

4 Thickness Thickness measurement of transparent materials

+ XY Stage

5 Extended profile Profiles up to 100 mm in length (spherical lens of 20 mm)

6 Coordinate Single point non-connected measurement (progressive ophthalmic lens)

7 Extended topography Topographies up to several mm2 (bumps on laserirradiated silicon)

Powered by OpenGL ®

C3 Roughness Standard

Profile Display

Measurement and Analysis PLµ software provides an interface with which any measurement can easily be taken, as well a complete set of tools for displaying and analyzing data.

Statistical parameters

Interactive 2D and 3D display options allow one to switch between isometric, contour, profile, histogram, bearing area and FFT, and to configure scale, zoom and color scale. Profiles from topographies can be defined as X, Y and skew cuts.

The 3D surfaces measured by PLµ can be observed from different viewpoints. OpenGL® three-dimensional graphics allow navigation through the acquired topography, and the surface can be rotated, moved and scaled by just dragging the mouse. The combination of lighting effects and the different color scales offers a quasi-photographic impression. Axes can be disabled to increase the effective visible area.

Analyses include advanced filtering, term removal, volume assessment and calculation of height, width and slope of surface features. Cursor information and statistical parameters are always on the screen.

3D view

PLµ 2300

A profile’s roughness and waviness parameters can be calculated. By way of example (left), the roughness parameters of DIN standard are calculated for a profile obtained from the topography of a calibration standard.

Data export An export tool allows one to save measurement data as a text or binary file. The display area can also be saved as an image file (.jpeg or .bmp). The PLµ file format is compatible with DigitalSurf MountainsMap and Mark III softwares.

20 mm

Coining Large area measurement (1 euro coin)

0.5 mm

112 µm

20 mm

Soft

MEMs High-aspect ratio and steep samples (micro-accelerometer)

9.4 µm

3.8 mm

150 µm

Paper Low reflective and rough surface (conventional paper)

Acquisition • Measurement technique selection by clicking the objective (confocal or interferometry) • Real-time XYZ position • Easy to find and focus the area of interest • Macro function for repetitive measurements • Remote control for OEM applications

81 µm

Data Analysis 10 0µ m

3.8 mm

Semiconductor

215 nm

3.2 mm

140 µm

Nano-roughness and nano features measurements in dissimilar materials (layout, SiO2 structure on Si substrate)

Biotechnology High local slopes in smooth, rough and very rough surfaces (leather)

94 um

3.2 mm

Display

1.3 m m

Micro-optics Very high local slope in optically smooth and low reflective surfaces (array of glass microlenses)

22.4 µm

1.2 mm

Material testing Tribology, hardness tests, fatigue, etc. (volume evaluation of a tribology test)

15.3 µm

13.8 mm

2.3 m m

ICs Statistical height characterization (IC – soldering tool)

450 µm

0

18.5 mm

• Surface leveling • Term removal • Height, width and slope calculation • Volume assessment • Data filtering (Median, Harsh, Sobel, Prewitt, FFT, Low Pass and High Pass) • Roughness and waviness filtering (2RC and Gaussian) • Roughness and waviness parameters (ASME and DIN standards) • Data interpolation for unmeasured points • Data export as text and binary files • Printable reports

• Isometric, contour and profile display. • X, Y and skew profiles from images and topographies • Histogram and bearing area • FFT • DIC simulation • Display export as image files (.jpeg and .bmp)

SPECIFICATIONS Confocal Objectives

5XEPI

10XEPI

20XEPI

50XEPI

100XEPI

150XEPI

20XSLWD / ELWD

50XSLWD / ELWD

100XSLWD / ELWD

Working Distance (mm)

23.5

17.3

4.5

1.0

1.0

0.3

24.0 / 13.0

17.0 / 10.1

6.5 / 3.5

Numerical Aperture

0.15

0.3

0.45

0.8

0.9

0.95

0.35 / 0.40

0.45 / 0.55

0.70 / 0.80

Field of View (µm2)

2546x1909

1273x955

637x477

253x190

123x92

84x63

621x466

268x201

123x92

Spatial Sampling (µm)

3.32

1.66

0.83

0.33

0.17

0.11

0.81

0.35

0.16

8.5

14

21

42

51

71

16 / 19

Maximum Slope

2)

Repeatability Rms 1) (nm)

0

0

0

0

0

0

0

0

21 / 27 0

0

350 / 420