Hsiao-Lung H i L Chan Ch Dept Electrical Engineering Chang Gung University Taiwan
Middleware within the embedded systems y model
Reasons to be separate from application software
Reusability with other applications Decrease development p costs or time byy purchasing p g it from a third party vendor Application Software Layer Application Software Layer System Software Layer Middleware D i Drivers Device D i
Hardware Layer
System Software Layer Middleware Operating System Device Drivers Hardware Layer
2
Networking g middleware example p OSI (Open System Interconnection) Model
Application Layer Presentation Layer
Application Software Layer
Session Layer
Transport Layer
Networking Middleware
Network Layer D t -Link DataData Li k Layer L
Physical Layer
System Software Layer
Hardware Layer
3
OSI model data flow diagram g
Layer 7
Application Layer
Application Layer
Presentation Layer
Presentation Layer
Layer 7
Header 1 Session Layer
Session Layer
Transport Layer
Transport Layer
Network L Layer
Network L Layer
Data Link Layer
Data Link Layer
Physical Layer
Physical Layer
Header 2 Header 3
Layer 1
Transmission media
Data
Header 4
Data
Header 5
Data Data
Data
Data
Application
Data
Presentation Session Transport Network Data Link Physical
Layer 1
4
OSI model layer y 1: Physical y layer y Define the networking hardware
Device 1
Data Link Layer
10011101 101110
Layer 2
Device 2
Layer 1
Physical Layer
Data Link Layer
Transmission Medium
Layer 2
01110101 111001
Physical Layer
Layer 1
5
OSI model layer y 2: Data-link layer y Format bits into data-link frame,, containing g data,, media access control (MAC) address, etc. Layer 3
Dattagra m
Network Layer
Data Link Layer [data] Data-link Headers Stripped Data-link Frame
Point-to-point p communication: establish and dissolve communication between two specific devices TCP (Transmission Control Protocol): Sent an acknowledge when receiving packet Layer 5
OSI model layer y 5: Session layer y Connection of two network applications Layer 6
Message
Presentation Layer
Session Layer [data]
Layer 5
L2CAP Packet
Session Header Appended to Data Field 1101101100110111000110000110 [Length][Destination Channel ID][Data]
Packet P
Session Headers Stripped
Message/ M
Transport Layer
Layer 4
9
OSI model layer y 6: Presentation layer y Translate data into formats,, e.g. g data compression/decompression, p p , data encryption/decryption, and data protocol/character conversions Layer 7
M Message
Application Layer
Presentation Layer Message conversion Bluetooth Message
[data] Presentation Header Appended to Data Field
Layer 6
1101101100110111000110000110 [Length][Destination Channel ID][Data] M Message
Session Layer
Layer 5
10
OSI model layer y 7: Application pp layer y
Network applications by end end-users users or protocols Application Software Layer MIME POP3
SMTP IMAP4
Finger
FTP
Telnet HTTP
NCP Bootp
APPC SNMP
BT--SDP BT RLOGIN
NFS …
Presentation Layer Session Layer
System y Software Layer y Transport Layer Network Layer Data-link Layer
Hardware Layer Physical Layer 11
TCP/IP, OSI model
TCP/IP Model
OSI Model
Application Layer Application Layer
Presentation Layer
Application Software Layer
Session Layer
Transport Layer Internet Layer
Transport p Layer y
System Software Layer
Network Layer Data--Link Layer Data
Network Access Layer Physical Layer
Hardware Layer
12
Bluetooth, OSI model
Bluetooth Model
OSI Model Application Layer
Application Protocol Group
Application Software Layer Presentation Layer
WAP Session Layer
Middleware Protocol Group TCP/IP
Transport Layer
System y Software Layer y
Network Layer Data--Link Layer Data T Transport t Protocol P t l Group G
Physical Layer
Hardware Layer
13
References
T. Noergaard, Embedded Systems Architecture, Elsevier 2005.