AMD PRODUCT AND TECHNOLOGY ROADMAPS

CAUTIONARY STATEMENT 

This Press Release contains forward-looking statements concerning Advanced Micro Devices, Inc. (“AMD” or the “Company”) including, among other things, timing, availability, features and functionality of the AMD “Kaveri” APU, AMD “Kaveri”-based notebooks, the AMD “Mullins” APU and AMD’s R9, R7 and R5 M200 Series AMD mobile discrete GPUs, and AMD’s mobile discrete GPU roadmap which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that that Intel Corporation’s pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities may negatively impact the Company’s plans; that the Company will require additional funding and may be unable to raise sufficient capital on favorable terms, or at all; that customers stop buying the Company’s products or materially reduce their operations or demand for its products; that the Company may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that the company’s third-party foundry suppliers will be unable to transition the Company’s products to advanced manufacturing process technologies in a timely and effective way or to manufacture the Company’s products on a timely basis in sufficient quantities and using competitive process technologies; that the Company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize the Company’s projected manufacturing capacity needs at GLOBALFOUNDRIES Inc. (GF) microprocessor manufacturing facilities; that the Company’s requirements for wafers will be less than the fixed number of wafers that the Company agreed to purchase from GF or GF encounters problems that significantly reduce the number of functional die the Company receives from each wafer; that the Company is unable to successfully implement its long-term business strategy; that the Company inaccurately estimates the quantity or type of products that its customers will want in the future or will ultimately end up purchasing, resulting in excess or obsolete inventory; that the Company is unable to manage the risks related to the use of its third-party distributors and add-in-board (AIB) partners or offer the appropriate incentives to focus them on the sale of the Company’s products; that the Company may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be unexpected variations in market growth and demand for the Company’s products and technologies in light of the product mix that it may have available at any particular time; that global business and economic conditions, including consumer PC market conditions, will not improve or will worsen; and the effect of political or economic instability, domestically or internationally, on our sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the Company's Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended Sept. 28, 2013.

2 | AMD 2013-2014 ROADMAPS | JANUARY 2014 UPDATE

AMD 2013-2014 DESKTOP GRAPHICS ROADMAP 2013: AMD RADEON™ HD 8000 SERIES

2014: AMD RADEON™ 200 SERIES

AMD Radeon™ HD 8990 Series GPU

AMD Radeon™ R9 290X GPU

AMD Radeon™ HD 8900 Series GPU

AMD Radeon™ R9 290 GPU

AMD Radeon™ HD 8800 Series GPU

AMD Radeon™ R9 280X GPU

AMD Radeon™ HD 8700 Series GPU

AMD Radeon™ R9 270X GPU

AMD Radeon™ HD 8600 Series GPU

AMD Radeon™ R7 260X GPU

AMD Radeon™ HD 8500 Series GPU

AMD Radeon™ R7 250 GPU

AMD Radeon™ HD 8400 Series GPU

AMD Radeon™ R7 240 GPU

Enthusiast

Performance

Mainstream

Value

3 | AMD 2013-2014 ROADMAPS | JANUARY 2014 UPDATE

AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments.

AMD 2013-2014 MOBILE GRAPHICS ROADMAP 2013: AMD RADEON™ HD 8000M SERIES

2014: AMD RADEON™ R9, R7, and R5 M200 SERIES

AMD Radeon™ HD 8970M Series GPU

AMD Radeon™ R9 M290X Series GPU

AMD Radeon™ HD 8800M Series GPU

Coming Soon

AMD Radeon™ HD 8700M Series GPU

AMD Radeon™ R7 M265 Series GPU

AMD Radeon™ HD 8600M Series GPU

Coming Soon

AMD Radeon™ HD 8500M Series GPU

Coming Soon

AMD Radeon™ HD 8400M Series GPU

AMD Radeon™ R5 M230 Series GPU

Enthusiast

Performance

Mainstream

4 | AMD 2013-2014 ROADMAPS | JANUARY 2014 UPDATE

AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments.

AMD 2013-2014 MOBILITY ROADMAP 2013 Performance

Mainstream

Low-Power Essential

2014 “Richland” APU

“Kaveri” APU

2-4 “Piledriver” CPU Cores 2nd Generation DX®11 GPU Cores 17W-35W

2-4 “Steamroller” CPU Cores GCN Graphics Compute Units HSA Features AMD TrueAudio 15W-35W 28nm

32nm

28nm

“Beema ” APU

2-4 “Jaguar” CPU Cores GCN Graphics Compute Units 15W-25W

2-4 “Puma” CPU Cores GCN Graphics Compute Units AMD Security Processor 10W-25W

28nm

SoC

Ultra-Low Power 28nm

“Kabini” APU

SoC

5 | AMD 2013-2014 ROADMAPS | JANUARY 2014 UPDATE

SoC

“Temash” APU

“Mullins ” APU

2-4 “Jaguar” CPU Cores GCN Graphics Compute Units 3W-4W SDP

2-4 “Puma” CPU Cores GCN Graphics Compute Units AMD Security Processor ~2W SDP

28nm

SoC

AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments.

AMD 2013-2014 DESKTOP ROADMAP 2013

2014 2nd Generation FX CPU

Performance

4-8 “Piledriver” CPU Cores AM3+

32nm

Mainstream Desktop

“Richland” APU

“Kaveri” APU

2-4 “Piledriver” CPU Cores 2nd Generation DX®11 GPU Cores FM2 µPGA

2-4 “Steamroller” CPU Cores GCN Graphics Compute Units HSA Features AMD TrueAudio FM2+ µPGA

Performance All-in-Ones 32nm

Essential

Small Form Factor

28nm

“Brazos 2.0” APU

“Kabini” APU

“Beema” APU

2 “Bobcat” CPU Cores DX®11-Capable GPU Cores

2-4 “Jaguar” CPU Cores GCN Graphics Compute Units FT3 BGA & FS1b µPGA

2-4 “Puma” CPU Cores GCN Graphics Compute Units AMD Security Processor FT3 BGA

40nm

6 | AMD 2013-2014 ROADMAPS | JANUARY 2014 UPDATE

28nm

SoC

28nm

SoC

AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments.

AMD 2013-2014 SERVER ROADMAP 2013

2P and 4P Enterprise, Mainstream Platforms

2014

AMD Opteron™ 6300 and 4300 Series

“Warsaw” CPU

4, 6, 8, 12 or 16 “Piledriver” CPU Cores 35W-140W

12 or 16 “Piledriver” CPU Cores

32nm

32nm

AMD Opteron™ 3300 Series

“Berlin” CPU/APU

4 or 8 “Piledriver” CPU Cores 25W-65W TDP

4 “Steamroller” CPU Cores GCN Graphics Compute Units (APU) HSA Features (APU)

32nm

28nm

1P Web/Enterprise Services Clusters

28nm

SoC

7 | AMD 2013-2014 ROADMAPS | JANUARY 2014 UPDATE

AMD Opteron™ X1150 CPU and X2150 APU

“Seattle” CPU

4 “Jaguar” CPU Cores GCN Graphics Compute Units (APU) 9W-22W

ARM “A57” CPU Cores

28nm

SoC

AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments.

AMD 2013-2014 EMBEDDED SOLUTIONS ROADMAP 2013

2014

AMD Embedded R-Series APU/CPU

“Bald Eagle” APU/CPU

2 or 4 “Piledriver” Cores AMD Radeon™ HD 7000 Series GPU 17W-35W

2 or 4 “Steamroller” CPU Cores GCN Graphics Compute Units (APU) HSA Features (APU) 17W-35W

28nm

High-performance

“Hierofalcon” CPU 32nm

Low-power 28nm

Discrete Graphics 40nm

8 | AMD 2013-2014 ROADMAPS | JANUARY 2014 UPDATE

28nm

SoC

4 or 8 ARM “A57” CPU cores 10 Gig Ethernet 15W-30W

AMD Embedded G-Series APU SOC

“Steppe Eagle” APU

2 or 4 “Jaguar” CPU Cores AMD Radeon™ HD 8000 Series GPU Cores 6W-25W

2 or 4 Enhanced “Jaguar” CPU Cores GCN Graphics Compute Units 5W-25W

28nm

SoC

AMD Radeon™ E6460 / E6760 GPU

“Adelaar” GPU

512MB 1GB GDDR5

GCN Graphics Compute Units 2GB GDDR5 72GB/s Memory Throughput

28nm

AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments.

DISCLAIMER & ATTRIBUTION

The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

ATTRIBUTION © 2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and/or other jurisdictions. 9 | AMD 2013-2014 ROADMAPS | JANUARY 2014 UPDATE