iD9302 600mA LDO Regulator Features General Description



Wide 2.5V to 7V Operating Range

The iD9302 is a 600mA fixed /adjustable output



Quick Start-Up

voltage, low dropout linear regulator with high ripple



Current Limiting Protection

rejection ratio and fast turn-on time.



Thermal Shutdown Protection

It includes a reference voltage source, an error



Low Dropout : 110mV @ 300mA; VOUT = 5V

amplifier, driver transistors and an internal current



High Ripple Rejection 55dB@10Hz

limiter. The current limiter’s holdback circuit operates



Standby Current Less Than 0.1μA

as a short protection.



Auto Discharge

The iD9302 works well with low ESR ceramic capacitors, suitable for wireless battery-powered applications with stringent space requirements and

Applications

demanding performance. It also offers low quiescent



Battery-Powered Equipment

current.



Portable Instruments



Slim DVDs



Digital Camera



WLAN Communication



Hand-Held Instruments

Ordering Information

Marking Information For marking information, please contact our sales representative directly or through an iDesyn distributor around your location.

Oct. 2013

1

Rev 1.3

iD9302 Typical Application Circuit V IN

+

V IN

C 1=1μF

V OUT

+

iD9302

V OUT C 2=1μF

GND

Figure1. Fixed Operation V IN

V IN

C 1=1μF

V OUT R1

iD9302 EN

Enable 100K

GND

V OUT

C 2=1μF

ADJ R2

R1   VOUT  1.175  1   Volts  R2 

Figure2. Adjustable Operation

Recommended Operating Conditions

Absolute Maximum Ratings (Note 1) Supply Voltage VIN

8V

Power Dissipation, PD @ TA=25°C

Input Voltage VIN

2.5V to 7V

EN Input Voltage

0V to 7V

SOP-08

625mW

Junction Temperature

(T)SOT-23-3 & SOT-23-5

400mW

Ambient Operating Temperature

SOT-89-3

570mW

SOT-223

1050mW

TDFN-6L

606mW

-40°C to 125°C -40°C to 85°C

Thermal Resistance, ja SOP-08

160°C/W

(T)SOT-23-3 & SOT-23-5

250°C/W

SOT-89-3

175°C/W

SOT-223

95°C/W

TDFN-6L

165°C/W

Lead Temperature Storage Temperature ESD Susceptibility HBM (Human Body Mode) MM (Machine Mode) Oct. 2013

260 °C -65°C to 150°C

2kV 200V 2

Rev 1.3

iD9302 Electrical Characteristics (Unless otherwise specified VIN=VOUT+1V, TA=25°C) Parameters

Symbol

Operating Voltage Range Shutdown Supply Current Supply Current Limit Quiescent Current

VIN ISBY ILIMIT IQ

Dropout Voltage (Note 3)

VDROP

EN input Bias Current

IIBSD

Line regulation

ΔVLINE

Load Regulation Fast Discharge N-MOSFET Turn On Resistance

ΔVLOAD

Output Noise Voltage

eNO

Thermal Shutdown Temperature Thermal Shutdown Temperature Hysteresis Output Voltage Accuracy Logic-Low V EN Threshold Logic-High V

Power Supply Rejection Rate

f = 10Hz

RDISCHARGE

Condition

Min

VEN = GND,Shutdown RLOAD = 1Ω VEN ≧ 1.2V, IOUT = 0mA Vout = 1.5V Vout = 1.8V Vout = 2.5V IOUT= 600mA Vout = 2.8V Vout = 3.3V Vout = 5.0V IOUT= 300mA Vout = 5.0V VEN = GND or VIN VIN = (VOUT +1V) to 6V, IOUT = 1mA 1mA < IOUT < 600mA

Max

0.01 800 90 1000 800 600 350 250 230 110 0

VIN = 4V, VEN = 0V 10Hz to 100KHz, IOUT =200mA COUT= 1F

ΔVOUT

IOUT =1mA

VIL VIH

VIN = 2.5V to 6V,Shutdown

V

150 1500 1000 750 450 400 350 200 100

mA μA mV mV mV mV mV mV mV nA

6

mV/V

55

mV Ω

VRMS

165

°C

30

°C

-2

VIN = 2.5V to 6V,Start-Up

μA

100

ΔTSD

Units

7 1

35

TSD

PSRR

Typ

2.5

+2 0.4

%

V

1.6

COUT = 1F, IOUT = 10mA

-55

dB

Note 1: Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability.

Note 2: VIN(MIN)=VOUT+VDROPOUT Note 3: The dropout voltage is defined as (VIN-VOUT) when VOUT is 100Mv below the target value of VOUT.

Pin Configurations (Top View)

Oct. 2013

3

Rev 1.3

iD9302

Pin Description Pin Name EN

Pin Function Chip Enable (Active High). Note that this pin is high impedance. There should be a pull low 100k resistor connected to GND when the control signal is floating.

GND

Ground

VOUT

Output Voltage

VIN

Input Voltage

ADJ

Adjust Output Voltage

NC

No Internal Connection (Floating or Connecting to GND).

Function Block Diagram

Oct. 2013

4

Rev 1.3

iD9302 Typical Operating Characteristics (Unless otherwise specified, VIN= VOUT + 1V, TA = 25°C, CIN = COUT = 1F) Load Regulation

Quiescent Current vs. Temperature 140

VIN=5V, VOUT=3.3V

130

Quiescent Current (μA)

Output Voltage (V)

3.4

3.3

3.2

3.1

3

110 100 90 80 70

VOUT=3.3V

60

0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6

-40 -25 -10

20 35

50 65 80 95 110 125

Temperature (℃)

Line Regulation

Dropout Voltage vs. Output Current 400

Dropout Voltage (mV)

3.35

3.3

3.25

VOUT=3.3V 3.2 3.5

5

Output Current (A)

3.4

Output Voltage (V)

120

4

4.5

5

5.5

VOUT=3.3V

300

200

100

(25℃) (-40℃) (125℃)

0

6

0

Input Voltage (V)

100

200

300

400

500

Output Current (mA) Enable Threshold vs. Input Voltage

Enable Threshold vs. Temperature

1.00

EN-ON EN-OFF

1.1 1

EN Voltage (V)

EN Voltage (V)

0.90

0.9 0.8 0.7 0.6

0.80 0.70 0.60 0.50

0.5 -50

-25

0

25

50

75

100

125

0.40

150

3.5

Temperature (℃) Oct. 2013

600

4

4.5

5

5.5

Input Voltage (V) 5

Rev 1.3

iD9302

Start Up Response

EN Pin Shutdown Response

VOUT

VOUT EN

EN

VIN = EN=5V, No Load

VIN = EN=5V, No Load

Line Transient Response

Line Transient Response

VOUT

VOUT

5V

VIN

5V

VIN

4V

4V

ILOAD=10mA

ILOAD=100mA

Load Transient Response

PSRR 70 65

VOUT

60

PSRR (dB)

55 50 45 40 35 30

ILOAD

VIN =4.3V+0.5VP-PAC VOUT=3.3V, IOUT=10mA CIN=COUT=1uF

25

VIN = 5V, ILOAD=1 to 600mA

20 10

100

1000

10000

100000

Frequency (Hz)

Oct. 2013

6

Rev 1.3

iD9302 Application Information

drive the EN pin must be able to swing above and

Capacitor Selection and Regulator Stability

below the specified turn-on/off voltage thresholds listed

Input Capacitor

ON/OFF signal may come from either CMOS output, or

An input capacitance of 1μF is required between the

an open-collector output with pull-up resistor to the

device input pin and ground directly (the amount of the

device input voltage or another logic supply. The high-

capacitance may be increased without limit). The input

level voltage may exceed the device input voltage, but

capacitor MUST be located less than 1 cm from the

must remain within the absolute maximum ratings for

device to assure input stability. A lower ESR capacitor

the EN pin.

allows the use of less capacitance, while higher ESR

Thermal Considerations

type (like aluminum electrolytic) requires more

For continuous operation, do not exceed the maximum

capacitance. Capacitor types (aluminum, ceramic and

operation junction temperature 125C. The maximum

tantalum) can be mixed in parallel, but the total

power dissipation depends on the thermal resistance of

equivalent input capacitance/ESR must be defined as

IC package, PCB layout, the rate of surroundings

above for stable operation. There are no requirements

airflow and temperature difference between junctions

for the ESR on the input capacitor, but tolerance and

to ambient. The maximum power dissipation can be

temperature coefficient must be considered when

calculated by following formula:

selecting the capacitor to ensure the capacitance is 1

PD  MAX  

in the “Electrical Characteristics” under VIH and VIL. The

μF over the entire operating range.

T 

 TA 

J MAX 

 JA

Output Capacitor

Where TJ(MAX) is the maximum operation junction

The iD9302 is designed specifically to work with very

temperature 125C, TA is the ambient temperature and

small ceramic output capacitors. The minimum

theθJA is the junction to ambient thermal resistance.

capacitance recommended (temperature

For recommended operating conditions specification of

characteristics of X7R, X5R, Z5U or Y5V) is within the

iD9302 where TJ(MAX) is the maximum junction

1μF to 10μF range with 5mΩ to 50mΩ ESR range

temperature of the die (125C) and TA is the maximum

ceramic capacitor between LDO output and GND for

ambient temperature. The junction to ambient thermal

transient stability, but it may be increased without limit.

resistance θ

Higher capacitance values help to improve transient

packages, the thermal resistance θJA is 160C/W on

response. The output capacitor's ESR is critical

the standard JEDEC 51-7 four-layers thermal test

because it forms a zero to provide phase lead which is

board. The maximum power dissipation at TA = 25C

required for loop stability.

can be calculated by following formula:

Enable Function

PD(MAX) = (125C 25C ) / (160C/W) = 0.625W

The iD9302 is shut down by pulling the EN pin low, and

for SOP8 packages. The maximum power dissipation

turned on by driving the input high. If the shutdown

depends on operating ambient temperature for fixed

feature is not required, the EN pin should be tied to

TJ(MAX) and thermal resistance JA. For iD9302

VIN to keep the regulator on at all times (the EN pin

packages, the Figure 3 of de-rating curves allows the

MUST NOT be left floating).

designer to see the effect of rising ambient

To assure proper operation, the signal source used to

temperature on the maximum power allowed.

Oct. 2013

7

JA

is layout dependent. For SOP8

Rev 1.3

iD9302

Maximum Power Dissipation (W)

Figure3: Maximum Power dissipation 1.2

SOT-223

1

SOP-08

0.8

SOT-89

0.6

SOT-23

0.4 0.2 0 -50

-25

0

25

50

75

100

125

Ambient Temperature (℃)

Adjustable Operation The adjustable version of the iD9302 has an output voltage ranging from 1.2V to 5V. The output voltage of the iD9302 adjustable regulator is programmed using an external resistor divider as shown in Figure4. The output voltage can be calculated using:

R1   VOUT  Vref 1   R2  

Where: Vref= 1.175V typ. (the internal reference voltage) To enable default output voltage (pre-set), connect ADJ pin to ground. There is no external component needed to decide voltage.

Oct. 2013

8

Rev 1.3

iD9302

Packaging SOT-23-3

SYMBOLS A A1 A2 b C D E e H L Θ1

Oct. 2013

DIMENSIONS IN MILLIMETERS MIN NOM MAX 1.00 1.10 1.30 0.00 --0.10 0.70 0.80 0.90 0.35 0.40 0.50 0.10 0.15 0.25 2.70 2.90 3.10 1.40 1.60 1.80 --1.90(TYP) --2.60 2.80 3.00 0.370 ----1° 5° 9°

9

DIMENSIONS IN INCH MIN NOM MAX 0.039 0.043 0.051 0.000 --0.004 0.027 0.031 0.035 0.013 0.016 0.020 0.004 0.006 0.001 0.106 0.114 0.122 0.055 0.063 0.071 --0.075 --0.102 0.110 0.118 0.015 ----1° 5° 9°

Rev 1.3

iD9302

TSOT-23-3

SYMBOLS A A1 A2 b C D E e H L Θ1

Oct. 2013

DIMENSIONS IN MILLIMETERS MIN NOM MAX 0.75 --0.90 0.00 --0.10 0.70 0.80 0.90 0.35 0.40 0.50 0.10 0.15 0.25 2.70 2.90 3.10 1.40 1.60 1.80 --1.90(TYP) --2.60 2.80 3.00 0.370 ----1° 5° 9°

10

DIMENSIONS IN INCH MIN NOM MAX 0.030 --0.035 0.000 --0.004 0.027 0.031 0.035 0.013 0.016 0.020 0.004 0.006 0.001 0.106 0.114 0.122 0.055 0.063 0.071 --0.075 --0.102 0.110 0.118 0.015 ----1° 5° 9°

Rev 1.3

iD9302

SOT-23-5

SYMBOLS A A1 A2 b C D E e H L Θ1 e1

Oct. 2013

DIMENSIONS IN MILLIMETERS MIN 1.00 0.00 0.70 0.35 0.10 2.70 1.50 --2.60 0.370 1° ---

NOM 1.10 --0.80 0.40 0.15 2.90 1.60 1.90(TYP) 2.80 --5° 0.95(TYP)

MAX 1.30 0.10 0.90 0.50 0.25 3.10 1.80 --3.00 --9° ---

11

DIMENSIONS IN INCH MIN 0.039 0.000 0.027 0.013 0.004 0.106 0.059 --0.102 0.015 1° ---

NOM 0.043 --0.031 0.016 0.006 0.114 0.063 0.075 0.110 --5° 0.037

MAX 0.051 0.004 0.035 0.020 0.001 0.122 0.071 --0.118 --9° ---

Rev 1.3

iD9302

SOT-89

SYMBOLS A A1 b b1 C D D1 HE E e H S e1

Oct. 2013

DIMENSIONS IN MILLIMETERS MIN NOM MAX 1.40 1.50 1.60 0.80 1.04--0.36 0.42 0.48 0.41 0.47 0.53 0.38 0.40 0.43 4.40 4.50 4.600 1.40 1.60 1.75 ----4.25 2.40 2.50 2.60 2.90 3.00 3.10 0.35 0.40 0.45 0.65 0.75 0.85 1.40 1.50 1.60

12

DIMENSIONS IN INCH MIN 0.055 0.031 0.014 0.016 0.014 0.173 0.055 --0.094 0.114 0.014 0.026 0.054

NOM 0.059 0.041 0.016 0.18 0.015 0.177 0.062 --0.098 0.118 0.016 0.030 0.059

MAX 0.063 --0.018 0.020 0.017 0.181 0.069 0.167 0.102 0.122 0.018 0.034 0.063

Rev 1.3

iD9302

SOT-223

SYMBOLS A A1 B B1 C D E e e1 H L L2

Oct. 2013

DIMENSIONS IN MILLIMETERS MIN NOM MAX 1.52 --1.80 0.02 --0.10 0. 60 --0.8 2.90 --3.10 0.24 --0.32 6.30 --6.80 3.30 --3.70 2.30 BSC 4.60 BSC 6.70 7.30 0.90 MIN 0.06 BSC

13

DIMENSIONS IN INCH MIN 0.061 0.0008 0.024 0.114 0.009 0.248 0.13

NOM --------------0.090 BSC 0.181 BSC

0.264

MAX 0.071 0.004 0.031 0.122 0.013 0.268 0.146 0.287

0.036 MIN 0.0024 BSC

Rev 1.3

iD9302

SOP-8

SYMBOLS A A1 A2 B C D E e H L y θ Oct. 2013

DIMENSIONS IN MILLIMETERS MIN NOM MAX 1.35 1.60 1.75 0.10 --0.25 --1.45 --0.33 --0.51 0.19 --0.25 4.80 --5.00 3.80 --4.00 --1.27 --5.80 --6.20 0.40 --1.27 ----0.10 0° --8° 14

DIMENSIONS IN INCH MIN 0.053 0.004 --0.013 0.007 0.189 0.150 --0.228 0.016 --0°

NOM 0.063 --0.057 --------0.050 ---------

MAX 0.069 0.010 --0.020 0.010 0.197 0.157 --0.244 0.050 0.004 8° Rev 1.3

iD9302

SYMBOLS A A1 A2 B C D E E2 D2 L P S

Oct. 2013

DIMENSIONS IN MILLIMETERS MIN 0.7 0.005 0.15 0.225 --1.95 1.95 0.62 1.176 0.30 0.60 0.21

NOM 0.75 0.03 0.2 0.275 0.25REF 2.00 2.00 ----0.35 0.65 ---

MAX 0.8 0.06 0.25 0.325 --2.05 2.05 ----0.40 0.70 ---

15

DIMENSIONS IN INCH MIN 0.028 0.0002 0.006 0.009 --0.077 0.077 0.024 0.046 0.012 0.024 0.008

NOM 0.03 0.0011 0.008 0.01 0.01REF 0.079 0.079 ----0.014 0.026 ---

MAX 0.031 0.0024 0.010 0.013 --0.08 0.08 ----0.016 0.028 ---

Rev 1.3

iD9302

Footprints (T)SOT-23-3

Footprint Dimension (mm)

Package

Number of PIN

P1

P2

A

B

C

D

M

SOT-23-3

3

0.95

1.90

3.60

1.60

1.00

0.80

2.70

Tolerance ±0.10

SOT-23-5

Oct. 2013

16

Rev 1.3

iD9302

SOT-89-3

SOT-223

Oct. 2013

17

Rev 1.3

iD9302

SOP-8

TDFN-6L (2mm × 2mm) Pitch = 0.65

Oct. 2013

18

Rev 1.3