2011 IEEE 61st Electronic

Components

and

Technology

Conference

(ECTC 2011)

Lake Buena

31

May-3

Vista, Florida, USA

June 2011

Pages 1459-2196

4 IEEE 3/3

IEEE ISBN:

Catalog

Number:

CFPllECT-PRT

978-1-61284-497-8

Fracture-Mechanical Interface Characterisation for Thermo-Mechanical Co-Design—an Efficient and Comprehensive Method for Critical Mixed-Mode Data Extraction B. Wunderle

1459

Chemnitz University of Technology, Fraunhofer ENAS, Fraunhofer IZM; M Schulz- Chemnitz University of Technology, Angewandte Micro-Messtechnik GmbH; J. Keller Angewandte Micro-Messtechnik GmbH; G. Schlottig -

-

-

-

and H. Pape Infineon Technologies AG; I Maus Infineon Technologies AG, Fraunhofer ENAS; D. May and O. HolckChemnitz University of Technology, Fraunhofer IZM; B. Michel- Fraunhofer ENAS Characterization and

Reliability Assessment of Solder Microbumps and Assembly for 3D IC Integration Ching Kuan Lee, Tao-Chih Chang, Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, John H. Lau, Industrial Cheng-Ta Ko, Ren-Shin Cheng, Pei-Chen Chang, Kuo-Shu Kao, Yu-Lan Lu, Robert Lo, and M.J. Kao Technology Research Institute (ITRI) -

1468

Temperature-Dependent Thermal Stress Technique with Finite Element Analysis

Determination for

Through-Silicon-Vias (TSVs) by Combining Bending

Beam

1475

Kuan H. Lu, Suk-Kyu Ryu, Qiu Zhao, Klaus Hummler siXis Inc.

Rui Huang, and Paul S. Ho

Jay Im,

-

of

University

Texas, Austin;

-

33:

Advanced Wirebonds ASE-US, Inc.;

-

Chairs: William Chen

Growth of CuAl Intermetallic

Compounds

Y.H. Lu, Y.W. Wang, and C.R. Kao

Wire

Palaniappan

-

Texas Instruments, Inc.

in Cu and Cu{Pd) Wire Bonding University; B.K. Appelt and Y.S. Lai

National Taiwan

-

Inc.

Bonding of Cu and Pd Coated Cu Wire: Bondability, Reliability, and Ivy Qin, Horst Clauberg, Ray Cathcart, Bob Chylak, and Cuong Huynh

-

Viola L. Acoff

1481

-

IMC Formation....

High Temperature Interconnections

149(5

S. Qu, S. Athavale, A. Prabhu, A. Xu, L. Nguyen, A. Poddar, C.S. Lee, Y.C. How, and K.C. Ooi Die to Die Copper Wire Bonding Enabling Low Cost 3D Packaging Flynn Carson, Hun Teak Lee, Jae Hak Yee, Jeffrey Punzalan, and Edward Fontanilla Wire

Bonding

Low-k/Copper

on

1489

Kulicke and Soffa Industries, Inc.; Hui Xu and

of Alabama

University

Over Pad Metallization for

Copper

Advanced Semiconductor

-

Wafers with Bond Over Active

Free-Air Ball Formation and

Deformability

-

National Semiconductor

1501! -

STATS

(BOA) Structures

Tu Anh Tran, Chu-Chung (Stephen) Lee, Varughese Mathew, and Leo Higgins

-

Engineering,

and Prema

ChipPAC

for Automotive Customers

with Pd Coated Cu Wire

A. Rezvani, M. Mayer, A. Shah, and N. Zhou J.T. Moon MK Electron Company, Limited

-

1508

Freescale Semiconductor Inc.

151ft

of Waterloo; S.J. Hong and

University

-

Effect of Heat Affected Zone on the Mechanical

Dong Liu,

Haibin

Chen,

Kan Lee, and Ivan Shiu

34:

Novel

and -

Jingshen

Wu

-

Package-Die Co-Optimization

NXP Semiconductors

-

Copper Bonding

-

Georgia Institute

Si MicroChannel Cooler

-

IBM Corporation

-

Intel India

Transport Properties of Vertically Aligned Carbon Chinese University of Hong Kong Technology; CP. Wong

of

1529

-

Nanotube

Arrays

1536

-

Integrated with High Power Amplifiers for Base Station of Mobile Communication Systems Soga, Shinichi Hirose, Osamu Tsuboi, and Taisuke Iwai Fujitsu Laboratories, Ltd.

Yoshihiro Mizuno, Ikuo

on an

Fei Wong,

Hong Kong Ltd.

Reliable Measurement of Thermal

Wei Lin

Study

1523

Technology (HKUST);

for Improved Performance and Lower Cost: A 32nm 10-Core Xeon CPU Case Study Ayers Intel Corporation; Arun Chandrasekhar, Surya Prekke, Bhunesh Kshatri,

and Srikrishnan Venkataraman

A

Wire

Science &

Microsoft Corporation; and Paul M. Harvey

Srikanth Balasubramanian and David

Highly

of

Packaging Technologies

Chairs: Raj N. Master

A

Properties

Hong Kong University of

1541

-

Ultra Thin PoP Using Through Mold Via

Technology Technology,

Akito Yoshida, Shengmin Wen, and Wei Lin Amkor Kazuo Ishibashi Nokia Japan Company, Ltd. -

1547 Inc.; Jae Yun Kim

-

Amkor

Technology, Korea;

-

Novel Low

Temperature

Sealing

Hermetic

Thomas F. Marinis and

Joseph

W.

of

Soucy

1552

Micropackages -

Charles Stark

Draper Laboratory a

Laminated Ceramic and Organic Substrate

1562

-

Millimeter-Wave Multichip BGA Package for InP Circuits Utilizing Donald Schott Agilent Technologies, Inc.

Through

Silicone Vias:

Multilayer

Interconnects for Stretchable Electronics

Joshua C. Agar, Jessica Durden, Rongwei Zhang, Daniela Staiculescu, and CP. Wong

1567 -

Georgia

institute of

Technology

35:

Microfluidics and MEMs Chairs: James Jian Zhang

-

Numonyx Corporation;

and

Nancy Stoffel

-

Infotonics

Technology

Polymer Opto-Electronic-Fluidic Detection Module on Plastic Film Substrates Anna Ohlander, Markus Burghart, Christof Strohhofer, Dieter Bollmann, Christof Landesberger, Fraunhofer EMFT, University of Berlin Fraunhofer EMFT; Karlheinz Bock

Center

1572 and Gerhard Klink

-

-

1576

Microfluidic Printed Circuit Boards

Liang

Li Wu, Sarkis Babikian, Guann-Pyng Li, and Mark Bachman

-

University

of California, Irvine

Stretchable Microfluidic Electric Circuit Applied for Radio Frequency Antenna NEC Corporation; Xiaofeng Li, Choongik Kim, Michinao Hashimoto, Benjamin J. Wiley, Donhee Ham, Masahiro Kubo

1582

-

and George M. Whitesides

-

Harvard

University

Zero-Level Packaging for (RF-)MEMS Implementing TSVs and Metal Bonding Nga P. Pham, Vladimir Cherman, Bart Vandevelde, Paresh Limaye, Nina Tutunjyan, Roelof Jansen, Nele Van Hoovels, IMEC Deniz S. Tezcan, Philippe Soussan, Eric Beyne, and Harrie A.C Tilmans

1588

-

Applications on MEMS Packaging and Micro-Reactors Using Wafer-Level Glass Cavities by a Low-Cost Glass Blowing Method Jintang Shang, Boyin Chen, Di Zhang, and Chao Xu Southeast University; Wei Lin and Ching-Ping Wong Georgia -

1596

-

Institute of Technology

A New Wafer-Level Packaging Technology for MEMS with Hermetic Micro-Environment Rajen Chanchani, Christopher D. Nordquist, Roy H. Olsson III, Tracy Peterson, Randy Shul, Catalina Ahlers, Sandia National Labs Thomas A. Plut, and Gary A. Patrizi

1604

Gold-Tin Bonding for 200mm Wafer Level Hermetic MEMS Packaging A. Gamier, E. Lagoutte, X. Baillin, C. Gillot, and N. Sillon CEA-LETI-MINATEC

1610

-

-

36:

High Power LEDs and Lasers Chairs: Fuad

Doany- IBM Corporation; and Kannan Raj

-

Sun Labs, Oracle

LED Packaging Using Silicon Substrate with Cavities for Phosphor Printing and Copper-filled TSVs for 3D Interconnection Science and

Hong Kong University of Science & Technology (HKUST); S.W. Ricky Lee Hong Kong University Advanced Photoelectronic Packaging Technology (HKUST); David Guowei Xiao and Haiying Chen -

-

-

Rong Zhang

Silicon-Based, Wafer-Level Packaging for Cost Reduction Thomas Uhrmann, Thorsten Matthias, and Paul Lindner

High Humidity

High Brightness LEDs

Cheng

Ltd.

1622

EV Group

High-Power, White-Light-Emitting Diode Modules Employing Ce:YAG Doped Glass Liou, Wei-Chih Cheng, Cheng-Hsun Chung, Ming-Hung Chen, Jimmy Wang, and National Sun Yat-Sen University

Resistance of

Chun-Chin Tsai, Wood-Hi

of -

1616 of

1626

Jyun-Sian -

Performance of High-Brightness LEDs with VACNT-TIM on Aluminum Heat Spreaders Zhaoli Gao, Kai Zhang, and M.M.F. Yuen Hong Kong University of Science and Technology (HKUST)

1631

Thermal Improvements for High Power UV LED Clusters Marc Schneider, Benjamin Leyrer, Christian Herbold, Klaus Trampert, and Jurgen J. Brandner Karlsruhe Institute of Technology

1636

Wafer-Level

1642

-

-

Glass-Caps for Advanced Optical Applications Juergen Leib, Oliver Gyenge, Ulli Hansen, and Simon Maus Michael Toepper

-

-

MSG Lithoglas AG; Karin Hauck, Kai Zoschke, and

Fraunhofer IZM

Inline Thermal Transient Testing of High Power LED Modules for Solder Joint Quality Control Gordon Elger, Reinhard Lauterbach, Kurt Dankwart, and Christopher Zilkens Philips Technology GmbH -

1649

Chairs: Nam Pham

IBM

Corporation; and Mark Eblen

-

Posters 1 -

37:

Kyocera America, Inc.

Effect of Blind Hoie Depth and Shape of Solder Joint on the Reliability of Through Silicon Via (TSV) Zhimin Wan, Xiaobing Luo, and Sheng Liu Huazhong University of Science & Technology (HUST)

1657

-

Compact Thermal Model for MicroChannel Substrate with High Temperature Uniformity Subjected

to

Multiple

Heat Sources

1662

Zhangming Mao, Xiaobing Luo, Pitfalls and Solutions of Lei-Jun

-

-

Huazhong University of Science & Technology (HUST)

Gold Wire with Palladium Coated -

Institute of

Industrial

Corporation

Thermal Behaviours of Silicone Based Cai and A.

Optical Neyer-TU Dortmund

Interconnects with Mirror

-

Manufacturing

Process for Solderless PCB

Anisotropic Conductive

Assembly Using

1679

Optical Coupling

Stress Analysis During Assembly and Packaging Thomas Schreier-Alt and Frank Ansorge Fraunhofer IZM; Katrin Unterhofer Fraunhofer Institute IZM

Green

1673

-

-

NiChing

Dengke

-

Copper Wire in IC Wire Bonding Microelectronics, A'STAR; Hong-Meng Ho Semicon Fine Wire Pte. Ltd.; Powertech Technology Inc.; Kay-Soon Goh Semicon Fine Wire Pte Ltd.; Chun-Shu Huang and Yung-Tsan Replacing

Tang and Yue-Jia Zhang

Wei Koh Yu

and Sheng Liu

168*; -

TU Berlin; Klaus-Dieter

Lang

-

Uniform Pressure Surface Interconnector and

Film

1691

Kyung-Woon Jang, Chang-Kyu Chung, Jiyoung Jang, Samsung Electronics Co., Ltd.; Seungbae

Park

-

Soon-Min

State

Hong, Min-Young Park, and Youngjun University of New York, Binghamton

Moon

-

Correlation between Electrical and Mechanical

Properties of Polymer Composite Afanasjev, I.M. Sokolova, and D.A. Chigirev St. Petersburg Electrotechnical University; R.A. Castro Russian State Pedagogical University; K.M.B. Jansen and L.J. Ernst Delft University of Technology; P. Timmermans Philips Applied Technologies I.B. Vendik, O.G. Vendik, VP.

169/

-

-

-

-

1703

-

Modeling and Optimization of Energy Harvesting-Systems under Non-Ideal Operating Temperatures with Regard to Availability of Power-Supply and Reduction of Environmental Impacts TU Berlin; Nils F. Nissen Fraunhofer IZM Stephan Benecke, Andreas Middendorf, and Klaus-Dieter Lang -

Ultra Low Cost Wafer Level Via Filling and Interconnection Using Conductive Polymer D. Saint-Patrice, F. Jacquet, C. Bridoux, S. Bolis, R. Anciant, A. Pouydebasque, and A. Sillon E.

Vigier-Blanc

-

1711 -

CEA-LETI-M1NATEC;

STMicroelectronics

Structure-Dependent Dielectric Constant in Thin Laminate Substrates STATS ChipPAC, Inc.; Hyun-Tai Kim, Yong-Taek Lee, Gwang Kim, and Billy Ahn Robert C. Frye RF Design Consulting, LLC -

171? Kai Liu

-

STATS ChipPAC, Ltd.;

-

Critical New Issues Relating to Interfacial Reactions Arising from Low Solder Volume in 3D IC Packaging H.Y. Chuang, W.M. Chen, W.L. Shih, and C.R. Kao National Taiwan University; Y.S. Lai Advanced Semiconductor Engineering, Inc.

172.1

Void Growth in Thermosonic Copper/Gold Wire Bonding on Aluminum Pads H. Xu and V.L. Acoff- University of Alabama; C. Liu and V.V. Silberschmidt- Loughborough University;

1729

-

-

Z. Chen

-

Nanyang Technological University

Microstructures and Tensile Properties of Active Solder Alloy Mingxiang Chen, Cong Peng, Xing Chen, and Sheng Liu Huazhong University of Science & Technology (HUST), Wuhan National Lab for Optoelectronics

1736

Characterization of Intermetallic Compound (IMC) Growth in Cu Wire Ball Bonding on Al Pad Metallization SeokHo Na, TaeKyeong Hwang, JungSoo Park, JinYoung Kim, HeeYeoul Yoo, and ChoonHeung Lee Amkor Technology

1740

Bumping and Stacking Processes for 3D IC Using Flux-Free Polymer Kwang-Seong Choi, Ki-Jun Sung, Hyun-Cheoi Bae, Jong-Tae Moon, and Yong-Sung Eom Telecommunications Research Institute (ETRI)

1746

Study on

-

-

-

Electronics and

Co-Design of Flip Chip Interconnection Paper-Based RFID Tags

with

Anisotropic Conductive Adhesives and Inkjet-Printed Circuits for 1752

Li Xie, Jue Shen, Jia Mao, Fredrik Jonsson, and

Lirong Zheng

-

Royal Institute of Technology (KTH)

Process Development and Reliability Study with Anisotropic Conductive Film Bonding Surface Finishes Flextronics International Jenson Lee, David Geiger, and Dongkai Shangguan

on

Multiple Types

of PCB 1758

-

Design and Fabrication of Chongshen Song

-

a

Test Chip for 3D Integration Process Evaluation

1764

Chinese Academy of Sciences; Zheyao Wang and Litian Liu

Tsinghua University

-

Low-Temperature Bonding of LSI Chips to Polymer Substrate Using Au Cone Bump for Flexible Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, and Tanemasa Asano Kyushu University

Electronics

1770

-

Posters 2 Chairs: Nam Pham

-

IBM Corporation; and Mark Eblen

Inc.

Kyocera America,

-

Recrystallization Behavior of Lead Free and Lead Containing Solder in Cycling Awni Qasaimeh, Younis Jaradat, Luke Wentlent, Linlin Yang, Babak Arfaei, and Universal Instruments Corporation New York, Binghamton; Liang Yin

1775 Peter

Borgesen

-

38:

State University of

-

Microstructures of Silver Films Plated on Different Substrates and Annealed at Different Conditions

Wen P. Lin, Chu-Hsuan Sha, Pin J. Wang, and Chin C. Lee

-

1782

University of California, Irvine

Through Aluminum Via for Noble Metal PCB and Packaging Substrate Samsung LED; Young Ki Jung Kyu Park, Seung Hwan Choi, and Myoung Soo Choi Sang Hyun Shin Samsung Electro-Mechanics

Formation of

-

1787 Lee and

-

Through-Silicon-Via Xiaomin Duan

-

A

to Active Device Noise

Coupling Study for CMOS SOI Technology Hamburg-Harburg; Xiaoxiong Gu

IBM T.J. Watson Research Center, TU

Center; Jonghyun Cho and Joungho Kim

-

1791 -

IBM T.J. Watson Research

KAIST

Analysis of Thermo-Mechanical Behavior of ITO Layer on PET Substrate Korea Institute of Industrial Technology (KITECH); Gyu-Je Hyo-Soo Lee, Jae-Oh Bang, and Hai-Joong Lee LG Innotek Co. Ltd.; Seung-Boo Jung Hynix Semiconductor; Kyung-Hoon Chai Sungkyunkwan University -

-

Development of

a

Electrical and

-

-

Non-Conductive, No-Flow, Wafer-Level

Chan-Lu Su, Kuo Yu Yeh, and Chang Chih Lin

1796 Lee

-

Underfill

Powertech

1800

Technology

Inc.

Aging Characterization of Organic Capacitive Substrate

Yun-Tien Chen, Shur-Fen Liu, Chin-Hsien Hung, and Wei-Hsuan

Wang

-

Taiwan Union

Meng-Huei

Chen

1805 -

Industrial Technology Research Institute

(ITRI);

Technology Corporation

Integrated Process for Silicon Wafer Thinning Shengjun Zhou Shanghai Jiao Tong University; Chuan Liu and Xiaobing Luo Huazhong University of Science and Technology (HUST); Xuefang Wang Huazhong University of Science & Technology (HUST); Sheng Liu Shanghai Jiao Tong University, Huazhong University of Science and Technology (HUST)

1811

Characterization of Thermo-Mechanical Stress and Reliability Issues for Cu-Filled TSVs Dean Malta, Christopher Gregory, Matthew Lueck, and Dorota Temple RTI International; Michael Krause, Frank Altmann, and Matthias Petzold Fraunhofer IWM; Michael Weatherspoon and Joshua Miller Harris Corporation

1815

An Embedded Wi-Fi Front-End-Module in Prlnted-Circuit-Board

1822

-

-

-

-

-

-

Jong-ln Ryu, Microstrip

Se-Hoon

-

Park, Dongsu Kim, and Jun-Chul Kim

-

by Employing

Printed Lines

Korea Electronics Technology Institute

Antenna

Steven C.

Tuning Using Variable Reactive Microelectromechanical Systems Yee, Christopher R. Anderson, Harry K. Charles, Samara L. Firebaugh, and

Deborah M. Mechtel

-

1828

United States Naval Academy

Silicon Microfilter Device Fabrication and Characterization for Diverse Microfluidics

Bivragh Majeed, Lei Zhang,

Deniz S.

Tezcan, Philippe Soussan, and Paolo Fiorini

-

Applications IMEC

1834

Investigation

of Various Photo-Patternable Adhesive Materials and Their

Conditions for MEMS Sensor

Processing

Wafer

Bonding Jonghyun

1839 Kim

-

Institute of Microelectronics, A*STAR; II Kim and Kyung-Wook Paik

-

KAIST

Maximum Channel Takaaki

Density in Multimode Optical Waveguides for Parallel Interconnections Ishigure, Ryota Ishiguro, Hisashi Uno, and Hsiang-Han Hsu Keio University

1847

-

Advanced Wafer

Thinning

and

Handling

for

Through

Silicon Via

185;'

Technology

-

Jaesik Lee, Vincent Lee, Justin Seetoh, Serene Mei Ling Thew, Yen Chen Yeo, Hong Yu Li, Keng Hwa Teo, and Institute of Microelectronics, A*STAR Shan Gao Achievement of Low Temperature Chip Stacking by a Wafer-Applied Underfill Material Ren-Shin Cheng, Kuo-Shu Kao, Jing-Yao Chang, Yin-Po Hung, Tsung-Fu Yang, Yu-Wei Huang, Su-Mei Chen, and Tao-Chih Chang Industrial Technology Research Institute (ITRI); Qiaohong Huang, Rose Guino, Gina Hoang, Jie Bai, and Kevin Becker Henkel Corporation

185B

-

-

An Efficient

Power

on the

Modeling of the Multi-Gigabit SSO Interference to the Pre-Driver in the Weak Charge Exchange Domain Partitioning Technique with Intentionally Utilizing High Ryuichi Oikawa Renesas Electronics Corporation

Power

Supply System Based Supply Impedance

UU •'.

-

Effect of Fine Solder Ball Diameters on Intermetallic Growth of

During Thermal Aging Yong-Sung Park and Kyung-Wook Paik Jae-Hong Lee MK Electron Co., Ltd

Sn-Ag-Cu

Solder at Cu and Ni Pad Finish Interfaces 1870

-

KAIST; Jeong-Tak Moon, Young-Woo Lee, and

-

An Efficient Edge Traces Technique for 3D Interconnection of Stack Chip Sun-Rak Kim, Ah-Young Park, Choong D. Yoo, and Seung S. Lee KAIST; Jae Hak Lee and Jun-Yeob Song Institute of Machinery and Materials -

39:

1 {;.'•• -

Korea

Posters 3 Chairs: Nam Pham

-

IBM

Corporation;

and Mark Eblen

-

Kyocera America,

Inc.

Evaluation of the Use of

a Rubber Buffer Layer to Protect Embedded SIP Devices from High Mechanical Forces Cork Institute of Technology Amjad Alsakarneh, Liam Moore, and John Barrett

1883

-

Microwave

Artificially

Structured Periodic Media Microfluidic Sensor

188**

Nophadon Wiwatcharagoses, Kyoung Youl Park, Jose A. Hejase, Lanea Williamson, and Prem Chahal Michigan State University -

Effect of Chemical

Tz-Cheng

Yi-Shao Lai

Prospects

Aging

-

and Limits in

on

Warpage

for

Encapsulated Packages—Characterization National Cheng Kung University; Advanced Semiconductor Engineering, inc.

Chiu and

Hong-Wei Huang

Wafer-Level-Packaging Toepper,

Martin Wilke, Kai Zoschke, Michael Frank

Wippermann

-

and Simulation

1894

-

of

Image Sensors Ehrmann, Herbert Reichl,

Oswin

1901 and Klaus-Dieter

Lang

-

Fraunhofer IZM;

Fraunhofer IOF

Evaluation of Additives and Current Mode

on Copper Via Filling Myung-Won Jung and Jae-Ho Lee Hongik University; Young-Sik Song and Tae-Hong Yim Korea Institute of Industrial Technology

190B

-

-

Myung-Won Jung

and Jae-Ho Lee

Suk-Ei Lee and Yeong-Kwon Ko Effects of

Bonding

Yoo-Sun Kim

-

Replace CMP and Lithographic Processes in Cu/Sn 1913

Hongik University; Seoung-Hun Samsung Electronics Company -

Parameters and ACF Material

-

to

Properties

on

Kim and

the ACF Joint

Yun-Sung

Moon

Morphology

Institute of Microelectronics, A'STAR; Kiwon Lee, Won-Chul Kim, and

Miniature Detachable Photonic Turn Connector for Optical Module Interface Darrell Childers, Eric Childers, Joe Graham, Mike Hughes, Dirk Schoellner, and Alan

-

LS-Nikko

in Ultrasonic

Kyung-Wook

Paik

Company;

Bonding -

191?

KAIST

192?

Ugolini

-

Electropolishing and Electroless Plating of Copper and Tin Bump Fabrication

US Conec, Ltd.

Layer Deposition (ALD) of Alumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High Capacitance Density on Silicon Interposers Kanika Sethi, Himani Sharma, P. Markondeya Raj, Venky Sundaram, and Rao Tummala Georgia Institute of Technology

Conformal Atomic

1928

-

Electromigration Prediction and Test for 0.18um Power Technology in Wafer Level Reliability Jifa Hao, Yong Liu, and Mark Rioux- Fairchild Semiconductor Corporation; Yuanxiang Zhang and Lihua Liang -Zhejiang University of Technology

1933

Novel

1939

Chip Stacking Process for 3D Integration Jaesik Lee, Daniel M. Fernandez, Myo Paing, Yen Chen Yeo, and Shan Gao

Institute of Microelectronics, A*STAR

-

Identification of Failure Modes in Portable Electronics Subjected to Mechanical-Shock Using Supervised

Learning

Pradeep

Lall and Prashant Gupta

-

Auburn University; Kai Goebel

Modeling for Silicon-On-Sapphire (SOS) Based

Thermal

John

Compact

Zhiyuan Yang

3D

Integrable

of 1944

Damage Progression

and

Shing

Lee

-

Peregrine

Amplifier Design

in Wireless Communication

1958

Semiconductor

SU8 Embedded Microwave

Loaded Half Mode Substrate

Power

NASA Ames Research Center

-

Filters

Bandpass

Using Complementary Split Ring Resonator 1963

Integrated Waveguide

D.E. Senior, X. Cheng, P. Jao, C. Kim, and Y.K. Yoon

-

University

of Florida

Compact Electromagnetic-Bandgap Structures for Embedding into Si and Glass Interposers Koichi Takemura, Noriaki Ando, Hiroshi Toyao, Takashi Manako, and Tsuneo Tsukagoshi NEC Corporation

1970

Delamination

1976

-

M.

Toughness

Sadeghinia,

H. Pape

-

of Cu-EMC Interfaces at Harsh Environment

K.M.B Jansen, and L.J. Ernst

Infineon

Technologies

-

Delft University of Technology; G. Schlottig and

AG

Filling Method and Alloy for Advanced 3D-SiP Ryohei Sato, Yukihiro Sato, Yoshiharu Iwata, and Hidenori Murata Shigenobu Sekine, Ryuji Kimura, and Keijiroh Kishi Napura Co., Ltd.

Study

on

TSV with New

Akihiro Tsukada,

1981 -

Osaka University;

-

Solution-Derived Electrodes and Dielectrics for Low-Cost and

High-Capacitance

(TSV) Capacitors Yushu Wang, Shu Xiang, P. Markondeya Raj, Himani Sharma, and Byron Williams Texas Instruments

Trench and Through-Silicon-Via 1987

Rao Tummala

-

Institute of

Georgia

Technology;

-

40:

Posters 4 Chairs: Nam Pham

-

IBM

Corporation;

and Mark Eblen

-

Kyocera America, Inc.

Electrical, Optical, and Fluidic Through-Silicon Vias for Silicon Interposer Applications Mahavir S. Parekh, Paragkumar A. Thadesar, and Muhannad S. Bakir Georgia Institute -

Mechanical Characterization of Nickel Nanowires by Using Electron Microscope Emrah Celik, Ibrahim Guven, and Erdogan Madenci

-

a

Customized Atomic

Halogen-Free Organic Substrates

Microscope in Scanning

of Arizona

-

of Fine Pitch

Technology

1999

University

Variation-Tolerant and Low-Power Clock Network Design for 3D ICs Xin Zhao, Saibal Mukhopadhyay, and Sung Kyu Lim Georgia Institute of

Reliability

1992 of

2007

Technology

for Green Electronics

Koushik Ramachandran, Fuhan Liu, Nitesh Kumbhat, Venky Sundaram, and Rao Tummala Dow Chemical Company Technology; Mark Wilson

2015 -

Georgia

Institute of

-

High Throughput and Fine Pitch Cu-Cu Interconnection Technology for Multichip Chip-Last Embedding Abhishek Choudhury, Nitesh Kumbhat, Sadia A. Khan, P. Markondeya Raj, Venky Sundaram, and Rao Tummala Georgia Institute of Technology; Georg Meyer-Berg Infineon Technologies AG

2021

LSI

2028

-

-

Packaging Development for High-End CPU Built into Supercomputer Joji Fujimori Fujitsu Semiconductor Limted; Masateru Koide Fujitsu Advanced Technologies -

-

Limited

In-Plane/Out-of-Plane Mixed Probe

Techniques

Kuan-Chung Lu, Tzyy-Sheng Horng,

and

to Obtain the RF Characteristics of the SMA Connectors

Lih-Tyng Hwang

-

National Sun Yat-Sen

2033

University

Electrical and Thermal 3D IC Centric Microfluidic Heat Sink Design and Technology Yue Zhang, Calvin R. King Jr., Jesal Zaveri, Yoon Jo Kim, Vivek Sahu, Yogenda Joshi, and Muhannad S. Bakir- Georgia Institute of Technology

2037

Coupled

Nanocomposite for Low Stress Underfill Ziyin Lin and Kyung-Sik Moon Georgia Chinese University of Hong Kong

2045 Institute of

-

Technology; Ching-Ping Wong

Institute of

Georgia

-

Technology,

Self-Assembly Technologies with High-Precision Chip Alignment and Fine-Pitch Microbump Bonding for Advanced Die-to-Wafer 3D Integration T. Fukushima, Y. Ohara, M. Murugesan, J.-C. Bea, K.-W. Lee, T. Tanaka, and M. KoyanagI Tohoku University

2050

Analysis of CNT Based

2056

-

3D TSV for

Anurag Gupta, Bruce C. Kim, Li Li Cisco Systems, Inc.

RF

Emerging

Applications

Sukeshwar Kannan, and Sai Shravan Evana

-

of Alabama;

University

-

Tin-Bismuth

Plating for Component Finishes TechSearch Zhang, Jaiwei Zhang, John Evans, and Wayne Johnson Auburn University; Jan Vardaman Advanced Semiconductor Engineering, International, Inc.; Issei Fujimura Ishihara Chemical Co., Ltd.; Andy Tseng Rui

-

-

Inc; Jeff Knight

-

-

Endicott Interconnect

of Board

-

Pradosh

Enhancement of Dielectric Strength and Processibility of High Dielectric Constant Al Nanocomposite by Organic Molecule Treatment Zhuo

Li, Kyoung-Sik Moon, and Saewon Kim Georgia Institute Technology, Chinese University of Hong Kong -

of

Technology; CP. Wong

Low Temperature Cu-Cu Direct Bonding Using Formic Acid Vapor Pretreatment Wenhua Yang, Hiroyuki Shintani, Masatake Akaike, and Tadatomo Suga University of -

Modeling, Optimization

and

Benchmarking

206/

-

Configuration and Shock Loading Conditions for Board Level Drop Test Guruprasad and James Pitarresi Binghamton University; Brian Roggeman Binghamton University, Universal Instruments Corp.

Impact

2060

-

of

-

2073

Georgia Institute of

2079

Tokyo

Chip-to-Chip

Electrical Interconnects with Low Loss

Institute of

Rizwan Bashirullah

Air-Clad Dielectrics

2084 -

Georgia

Technology;

University

-

Vachan Kumar and Azad Naeemi

of Florida

Advanced Solder TSV Filling Technology Developed with Vacuum and Wave Soldering Korea Institute of Industrial Technology (KITECH); Young-Ki Ko, Chang-Woo Lee, and Sehoon Yoo Hiromichi T. Fujii and Yutaka S. Sato Tohoku University

2091

-

-

41:

Student Posters Chairs: Nam Pham

Ultra-Compact

-

IBM

Corporation;

Dual-Band WLAN Filter

Jun H. Park,

Seong

and Mark Eblen

-

Kyocera America,

Inc.

Using Independent Band Stop Resonators Kwangwoon University; Jeong T. Lim

J. Cheon, and Jae Y. Park

-

The Development of Thin Film Barriers for Encapsulating Organic Electronics Yongjin Kim, Namsu Kim, Hyungchul Kim, and Samuel Graham Georgia Institute of -

Metamaterial-fnspired Kyoung

Youl

Prem Chahal

Absorbers for Terahertz

Park, -

Jose A.

Michigan

Hejase,

State

2090 -

SGR Tech Co., Ltd. 2101

Technology 2107

Packaging Applications

Collin S. Meierbachthol,

Nophadon Wiwatcharagoses,

and

University

Novel ZnO Nanowires/Silicon Hierarchical Structures for Superhydrophobic, Low Reflection, and High Efficiency Solar Cells Yan Liu, Ziyin Lin, and Kyoung Sik Moon Georgia Institute of Technology; CP. Wong Technology, Chinese University of Hong Kong -

-

Georgia Institute of

2114

Micro Texture

Dependence

of the Mechanical and Electrical

Reliability

of

Electroplated Copper Thin

Film Interconnections

2119

Naokazu Murata, Naoki Saito, Fumiaki

Endo, Kinji Tamakawa, Ken Suzuki, and Hideo Miura

-

Tohoku University

Characterization of the Mechanical Properties of Actual Solder Joints Using DIC State University of New York, Binghamton Tung T. Nguyen and Seungbae Park

2126

-

Vertical Interconnect Measurement

Techniques

Based

University of Kaohsiung; Engineering Group Damage

Prediction in

Erkan Oterkus

-

Chen-Chao

Double-Sided

on

Short-Open-Load-Reciprocal Calibration Kuan-Chung Lu, Yi-Chieh Lin, and Tzyy-Sheng Horng

Wang, Chi-Tsung

Cavity

and 2130

National Sun Yat-Sen University; Sung-Mao Wu National Advanced Semiconductor Chiu, and Chih-Pin Hung

-

-

-

Graphene Thermoplastics for Potential Electronic Packaging Applications Aerospace; Erdogan Madenci University of Arizona

National Institute of

2134

-

Multi-Path Fan-Shaped Compliant Off-Chip Interconnects Robert E. Lee, Raphael Okereke, and Suresh K. Sitaraman Air

Probing System

Low-Loss Transmission Lines for

2141 -

Georgia

Institute of

Technology

High Speed Serial Link Applications University of Florida; Yu-Chun Chen, Rajarshi Saha,

Jikai Chen, Yan Hu, and Rizwan Bashirullah Paul Kohl Georgia Institute of Technology

-

2146 and

-

The Use of

Implicit Mode Functions to Drop Impact Dynamics of Stacked Chip Scale Packaging Liangbiao Chen and Gang Sheng University of Alaska; Cheng-Fu Chen and Terrence Wilburn University of Alaska Fairbanks

2152

-

-

Large-Area Low-Cost Substrate Compatible CNT Schottky Diode Xianbo Yang and Prem Chahal Michigan State University

for THz Detection

2158

-

Room

Temperature Si02 Wafer Bonding by Adhesion Layer Method Kondou and Tadatomo Suga University of Tokyo

Ryuichi

2165

-

-

Electromagnetic-SPICE Modeling and Analysis of 3D Power Network Rensselaer Polytechnic Institute (RPI); Jian-Qiang Lu Rensselaer Polytechnic Institute; Bucknell Zheng Xu -

and John U. Knickerbocker

Design and Characterization of -

IBM T.J. Watson Research Center

Power

Delivery System

and Chih-Wen Kuo

for

Multi-Chip Package

with Embedded Discrete

Capacitors

2179

National Sun Yat-Sen University; Po-Chih Pan, Yi-Hua Chen, and Kuo-Hua Advanced Semiconductor Engineering, Inc.; Li Li, Ken Han, and Glenn Cooper Cisco Systems, Inc.

Hung-Hsiang Cheng Chen

-

2171 C. Webb

-

-

Watt-Level Wireless Power Transfer Based

on Stacked Flex

Circuit Technology

2185

Xuehong Yu, Florian Herrault, Chang-Hyeon Ji, Seong-Hyok Kim, and Mark G. Allen Georgia Gianpaolo Lisi, Luu Nguyen, and David I. Anderson National Semiconductor Corporation -

Institute of Technology;

-

Assessment of Current Pridhvi Dandu and

Density Singularity in Electromigration of Solder Bumps Lamar University Xuejun Fan -

2192