VTT Micromodules Packaging and Interconnection Enabling smart system integration

VTT Micromodules Packaging and Interconnection

Packaging and Interconnection Competences: Ceramic 3D LTCC modules for high-frequency, highpower, or multi-disciplinary applications for small footprint and harsh environment High precision mounting and bonding Electronics reliability, stress and thermal management Photonics packaging; Optical system integration and miniaturisation Design for manufacturing

Services: Technology foresight & development Concept design; Proof-of-concept demonstrations Prototype and small series manufacturing; LTCC manufacturing, Design and testing services. Mounting, bonding and assembly services.

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VTT Micromodules Packaging and Interconnection

Metallurgy and Kinetics in Joints

Thermomechanic Design

3D Multi-layer structures

New materials and their combinations

Lay-out Design

Interconnection, Assembly, Sealing

Electrical / Photonics Design

Thin-film processes, Sreen printing, Litography

Functionality, Structure, Reliability

Packaging and Interconnection Process

Modelling / Design

Manufacturing

Testing

Materials and Interconnection

Ceramic Substrates, Thick Film processes

SoP*- Solutions - Ceramic modules - New SoP solutions

Interconnection solutions *System on Package

Product / Service

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VTT Micromodules Packaging and Interconnection

VTT LTCC Prototyping Services Prototyping services of LTCC multilayer substrate & module packaging technology Design, testing and characterization Wide range of applications, including optoelectronics, microwave, telecommunication and instrumentation. Wide range of material systems are available to meet the special requirements of different applications. LTCC Assembly SMD soldering LTCC Expertise Chip & wire, flip chip High quality equipment BGA bumping Hermetic sealing Multi-panel format 114 x 114 mm Lower cost format 50mm x 50mm Prototyping cycle typically 2-4 weeks Minimum 80 m vias, 50 m lines (photoimaged < 50 m lines ) Contacts to material suppliers and LTCC mass producers

Equipment: USHIO MP-8200 punching machine Baccini printer with auto visual alignment PTC isostatic laminator PTC manual lab cutter 8”x8” Sierratherm firing furnace Disco Dicing machine Lumonics Laser 4

VTT Micromodules Packaging and Interconnection

Interconnection and Sealing Technologies 1. Flip chip bonding Flip chip solder joining Thermo compression joining Thermo sonic joining Adhesive joining (ICA, ACA, NCA) Au stud bumping 2. Direct bonding of embedded chips 3. Wire & Ribbon bonding 4. Hermetic sealing/encapsulation Soldering, brazing & welding 5. Module interconnection (BGA, LGA … ) 6. Optical interconnection

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Bonding Equipment

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1. Manual Flip-chip bonder (Fine Tech) 2. High Accuracy (± 0.5 µm) Flip-chip bonder (RD Automation - M 9A)

3. Semi-auto High-accuracy & Sensitive Wedge and Ball bonder

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(TPT HB16) 2

4. Die bonder (adhesives or soldering) and component placer (TRESKY 3002) 5. Wedge bonder (Kulicke&Soffa 4129) 6. Ball bonder (F&K Delvotec 5410) 7. Precision Positioning Station for fiber optic packaging (Newport Auto-align

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8100)

8. Dicing saw (Disco DAD 341) Sub-micron accuracy ± 0.5 µm Minimum die size 200 x 200 µm

4 nm position resolution and +/- 25 nm bi-directional repeatability

Die bonding: adhesives or soldering Wire bonding: Al (17.5/33 µm), Au (17,5/25/33 µm) Au ribbon 75 µm x 25 µm 6

Thermal Management Thermal Simulations Thermomechanical Stresses Simulations

Stress on substrate

Stress on seal

Max 68 MPa

Max 298 M Pa

Thermal vias location optimisation Cooling performance Thermal and thermomechanical simulation tools: Flotherm/Flostress Ideas TMG Comsol Multiphysics

Max 234 MPa

0.2 mm

DP 951 0.25 mm

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0.5 mm

0.18/0.5

11.7 %

0.18/0.425

16.3 %

0.18/0.35 rectangular

20.8 %

0.18/0.35 hexagonal

24.0 %

VTT Main activities

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Flip Chip Bumping Au-stud bumping: onto different thin-film and thick-film metallizations on chips or wafers (Si, GaAs etc) or module substrates (alumina, LTCC, glass) for joining by thermocompression, ultrasonic or adhesive bonding Typical 17,5 µm 25 µm 33 µm Bump height

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30

35

Bump width

60

80

100

GaAs test chip

Solder bumps by stencil printing, solder joining for solder joining Bumped substrate

Single and double Au bumps

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VTT Micromodules Packaging and Interconnection

LTCC TOOLBOX

Fine-line Printing: 50 µm line and space, 80 µm vias (gold)

Hermetic sealing

Characterization of new LTCC materials

Passive 3D alignment structures Thermal vias

Liquid cooling (and handling)

Integration of millimeter wave circuits

High-speed optical emitter/ detector array integration

Planarization 10

VTT Micromodules Packaging and Interconnection

LTCC References Photonics Packaging

Microwave and Millimeterwave Modules

Hermetic fiber pigtailed laser

Sensor Packaging

MEMS Digital Microphone Low noise amplifier for 2 GHz

Wavelength tunable diode laser

Integrated infrared detector array module

60 GHz Adaptive Antenna Array Front End 11

VTT Micromodules Packaging and Interconnection

Interconnection and Sealing References

Hermetic fiber pigtailed laser

Stud bumped flip-chip VCSEL

Thin (50 µm) flip-chip die with ACA and NCA adhesives on 30 µm plastic substrate for smart cards (100 µm total thickness) Wire-bonded chips in cavity covered by brazed lid

Flip Chip on MEMS

Ribbon bonded IC

Flip-chip bonding with anisotropic conductive adhesive to flexible printed circuit substrate and overmolding by using thermoplastic polymer

High accuracy passive optical fiber alignment 12

VTT Micromodules Packaging and Interconnection

Packaging and Interconnection Key Future Research Activities and Visions Adaptive RF Front End and Antenna 3D Packaging and Conformal/Structural Integration Flip Chip Bonding, Embedding and Reliability on Polymers for Large Area Sensing Applications Polymer/Flex based 3 D Multilayer Modules, Packaging and Integration

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Packaging and Interconnection Key Future Research Activities and Visions PARTLY TRANSPARENT SEALING RESISTOR

Active Multi-layer ceramics •Tunability for adaptive RF and optical components •Sensing/actuation Integration of ferroelectric, ferromagnetic and/or piezoelectric layers

DIE MEMS

GRD SIG POW GRD SIG SIG SIG GRD POW PCB

Deposited layers Piezoelectric layer for sensing MICROWAVE FILTER Ferroelectric layer for electrical tuning THERMAL VIAS AND GROUND COUPLER

{ 50 Ω TRANSMISSION LINE

Ferromagnetic layer for radiation protection or electrical shortening CAPACITOR

In co-operation with Oulu University Microelectronics Laboratory

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VTT Micromodules Packaging and Interconnection Contact Information Team Leader: [email protected] Puh. +358 20 722 2005 Mob: +358 40 774 9846 Ceramic SoP: Kari [email protected] Puh. +358 20 722 2261 Mob: +358 40 769 0597 Interconnection & Reliability: [email protected] Puh. +358 20 722 2287 Mob: +358 40 767 3029 15