VINNAPAS ® SOLID RESINS – POLYVINYL ACETATES
CREATING TOMORROW’S SOLUTIONS
VINNAPAS ® SOLID RESINS – VERSATILE POLYMERS
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Contents General Product Information – Chemical Structure – VINNAPAS® Product Overview – Solubility Table – Viscosity Graphs – Polymer Compatibility Table – Application Areas
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Low Profile Adhesives Sound Dampening Sheets Coatings Powder Injection Molding (PIM) VINNAPAS® General Information WACKER at a Glance
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The brochure “VINNAPAS® SOLID RESINS – POLYVINYL ACETATES“ describes the properties, application areas and benefits of VINNAPAS® solid resins for the following applications: – Low profile – Adhesives – Sound dampening sheets – Paints and coatings – Powder injection molding (PIM)
WACKER and VINNAPAS® are registered trademarks of Wacker Chemie AG
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GENERAL PRODUCT INFORMATION
WACKER markets a thermoplastic synthetic resin polyvinyl acetate (PVAc) under the trade name VINNAPAS®. VINNAPAS® solid resins are homogeneous, colorless, odorless and tasteless resins that pose no known physiological risks.
In addition to the VINNAPAS® B and UW grades, WACKER manufactures carboxylated VINNAPAS® copolymer C grades based on vinyl acetate and crotonic acid. VINNAPAS® VL grades are copolymers of vinyl acetate and vinyl laurate.
We produce VINNAPAS® with varying degrees of polymerization and thus varying molecular weights and varying viscosities in solution.
Special Characteristics All VINNAPAS® grades give clear films with good gloss and excellent adhesion. This is particularly true of the low-viscosity B grades, which are often preferred for primer coatings or for combinations with other coatings raw materials.
Homopolymeric VINNAPAS® grades are divided into two groups: VINNAPAS® B
VINNAPAS® UW
Low-to-medium viscosity
High viscosity
VINNAPAS® B grades are fusible. They are brittle at temperatures of 20 °C.
VINNAPAS® UW resins are thermoplastics. At 20 °C, they are more elastic than the VINNAPAS® B grades.
Delivery form: Pastilles/pellets
Delivery form: Beads
Copolymeric VINNAPAS® grades are also divided into two groups: VINNAPAS® C
VINNAPAS® VL
Low-to-medium viscosity
Low-to-medium viscosity
VINNAPAS® C grades are fusible and hydrophilic.
VINNAPAS® VL grades are hydrophobic and fusible. They exhibit cold flow at room temperature.
Delivery form: Particles
Delivery form: 25-kg blocks
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Varnishes, coatings and impregnations based on VINNAPAS® resins are resistant to oil and grease and show reduced water-vapor permeability, together with good aging properties and high abrasion resistance. All VINNAPAS® grades are distinguished by their excellent light stability.
CHEMICAL STRUCTURE OF POLYVINYL ACETATES
VINNAPAS® B and UW Grades
PVAc (polyvinyl acetate) – homopolymer
VINNAPAS® C Grades
Vinyl acetate / crotonic acid copolymer
VINNAPAS® VL Grades
Vinyl acetate / vinyl laurate copolymer
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VINNAPAS ® SOLID RESINS PRODUCT OVERVIEW Properties
Grades
Viscosity [mPa s] 1 10 % in ethyl acetate
Acid number 2 [mg KOH/g]
Residual monomer (VAM) 3 [ppm]
VINNAPAS® homopolymer polyvinyl acetate (CAS No. 9003-20-7) B 1.5 sp 1.2 –1.4 < 0.5 < 5.0 B 3 sp
1.4 – 1.6
< 0.5
< 5.0
B 5 sp
1.6 – 2.0
< 0.5
< 5.0
B 14 sp
1.9 – 2.3
< 0.5
< 5.0
B 17 sp
2.5 – 3.0
< 0.5
< 5.0
B 30 sp
3.0 – 3.5
< 0.5
< 5.0
B 60 sp
3.5 – 5.0
< 0.5
< 5.0
B 10013
5.0 – 6.5
< 0.5
–
UW 1 fs13 / 15
8.0 – 11.0
< 0.5
–
UW 4 fs13 / 15
23.0 – 30.0
< 0.5
–
UW 10 fs13 / 15
35.0 – 55.0
< 0.5
–
Volatiles content 4 [%]
Density 5 [g/cm 3]
Solid, colorless pastilles odorless and tasteless Solid, colorless pastilles odorless and tasteless Solid, colorless pastilles odorless and tasteless Solid, colorless pastilles odorless and tasteless Solid, colorless pastilles odorless and tasteless Solid, colorless pastilles odorless and tasteless Solid, colorless pastilles odorless and tasteless Solid, colorless pastilles odorless and tasteless Solid, colorless beads odorless and tasteless Solid, colorless beads odorless and tasteless Solid, colorless beads odorless and tasteless
< 1.0
1.17 ± 0.01
< 1.0
1.17 ± 0.01
< 1.0
1.17 ± 0.01
< 1.0
1.17 ± 0.01
< 1.0
1.18 ± 0.01
< 1.0
1.18 ± 0.01
< 1.0
1.18 ± 0.01
< 0.5
1.18 ± 0.01
< 1.0
1.18 ± 0.01
< 1.0
1.18 ± 0.01
< 1.0
1.18 ± 0.01
Powder, odorless and tasteless
< 1.0
1.20 ± 0.01
Solid, colorless to yellowish particles Solid, colorless to yellowish particles Solid, colorless to yellowish particles
< 0.5
1.18 ± 0.01
< 0.5
1.17 ± 0.01
< 0.5
1.18 ± 0.01
Colorless to yellowish blocks, odorless and tasteless Colorless to yellowish blocks, odorless and tasteless
< 1.0
1.12 ± 0.01
< 1.0
1.06 ± 0.01
Delivery form
VINNAPAS® homopolymer polyvinyl acetate powder (CAS No. 9003-20-7) B 60 fg12
3.5 – 5.0
< 0.5
–
VINNAPAS® copolymer vinyl acetate /crotonic acid (CAS No. 25609-89-6) C 305
2.5 – 3.5
30 – 38
–
C 341
3.5 – 3.8
6–8
–
C 501
7.5 – 9.5
5.5 – 7
–
VINNAPAS® copolymer vinyl acetate /vinyl laurate (CAS No. 26354-30-3) B 500/20 VL
8.0 – 12.0
< 0.5
< 5.0
B 500/40 VL
8.0 – 12.0
< 0.5
< 5.0
1) 2) 3) 4)
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20 °C (Höppler); DIN 53 015 WACKER method VPS 09 WACKER method QVCL 002 WACKER method VPS 07
5) 6) 7) 8)
DIN 53 479 DIN 53 195 DIN EN ISO 1628-2; 1 wt. % in acetone By ring and ball, DIN ISO 4625; ASTM: E 28-97
9) WACKER method, size exclusion chromatography Conditions: PS Standard; THF; 60 °C, weight average 10) Differential scanning calorimetry; Mettler DSC 821 E; heating rate 20 °C/min 11) Bohlin high temperature viscosity; Bohlin CVO 120; heating rate 5 °C/min
K value 7
Softening point 8 [°C]
Molecular weight 9 [Mw g/mol]
Glas-transition temperature 10 Tg [C°]
Melt viscosity11 at 120 °C [Pa s]
Vinyl acetate [%]
550–800
20 ± 1
68–74
10–15 x 103
33 ± 1
75
100
550–800
23 ± 1
73–77
15–20 x 103
33 ± 1
240
100
550–800
26 ± 1
76–82
20–25 x 103
34 ± 1
311
100
550–800
27 ± 1
81–85
25–33 x 103
38 ± 1
356
100
550–800
31 ± 2
86–92
35–45 x 103
39 ± 1
1340
100
550–800
33 ± 2
92–96
45–55 x 103
39 ± 1
2250
100
550–800
40 ± 2
96–102
55–70 x 103
42 ± 1
4080
100
550–800
43 ± 2
103–110
80–100 x 103
42 ± 1
13 300
100
700–850
51 ± 3
114–124
110–150 x 103
43 ± 1
20 900
100
700–850
63 ± 3
150–160
270–310 x 103
44 ± 1
29 100
100
700–850
70 ± 3
190–210
330–430 x 103
44 ± 1
n.m.14
100
400–600
40 ± 2
98–104
55–70 x 103
42 ± 1
4080
100
550–800
30 ± 2
88–98
35–55 x 103
47 ± 1
3880
> 85
550–800
34.5 ± 1
96–101
55–65 x 103
42 ± 1
3160
> 85
550–800
50 ± 2
118–128
140–200 x 103
43 ± 1
14 100
> 85
–
50 ± 2
90–100
125–175 x 103
21 ± 1
2400
≥ 80
–
51 ± 4
very soft
180–240 x 103
0±1
545
≥ 60
Apparent density 6 [g/l]
12) fg = finely ground; contains 2 % Wacker HDK® (pyrogenic silica as antiblocking agent) 13) finely ground material available on request 14) n. m.= not measurable 15) fs = contains pyrogenic silica; product also available without pyrogenic silica
This information is intended only as a guide. We make no warranty as to the accuracy of these data and they should not be interpreted as a specification. Specification limits are available on request.
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SOLUBILITY OF VINNAPAS ® IN DIFFERENT SOLVENTS
Esters Methyl acetate Ethyl acetate n-Butyl acetate sec-Butyl acetate iso-Butyl acetate Amyl acetate Glycolic acid butyl ester 2-Methoxy ethyl acetate 2-Ethoxy ethyl acetate Ketones Acetone Methyl ethyl ketone Methyl isobutyl ketone Diisobutyl ketone Cyclohexanone Isophorone Soluble
Insoluble
Partially soluble (depending on molecular weight)
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Alcohols Methanol Ethanol, anhydrous Ethanol, 94 % 2-Propanol, anhydrous 1-Propanol, 90 % n-Butanol Cyclohexanol Ethylene glycol Glycerol/methyl glycol 2-Ethoxy ethanol 2-Butoxy ethanol
Aromatic hydrocarbons Ethyl benzene Toluene Xylene Styrene Chlorinated hydrocarbons Methylene chloride Chloroform Carbon tetrachloride Trichloroethylene Perchloroethylene
Aliphatic hydrocarbons White spirit Mineral oils
Ether Diethyl ether Tetrahydrofuran
COMPLEX VISCOSITIES OF STANDARD GRADE SOLID RESINS
Viscosity [mPa s] 1.00E+05
1.00E+04
1.00E+03
1.00E+02
1.00E+01
1.00E+00 50 °C
100 °C
150 °C
200 °C
250 °C
Temperature [°C] B 1.5 sp
B 5 sp
UW 1
UW 4
B 14 sp UW 10
B 17 sp
B 30 sp
B 60 sp
B 500/20 VL
B 500/40 VL
C 305
B 100 C 501
100 % polymer; Bohlin high temperature viscometer; Bohlin CVO 120; heating rate 5 °C/min
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VISCOSITY OF VINNAPAS ® IN STYRENE
Viscosity [mPa s] 100 000
10 000
1000
100
10 20 %
25 %
30 %
35 %
Wt. % in ethyl acetate B 1.5
B 60 sp
B 100
Brookfield viscosity at 23 °C / 20 rpm
10
UW 1
UW 4
UW 10
C 341
C 501
C 305
40 %
VISCOSITY OF VINNAPAS ® B GRADES IN ETHYL ACETATE
Viscosity [mPa s] 3.0
2.5
2.0
1.5
1.0
0.5 10 %
15 %
20 %
25 %
30 %
35 %
40 %
45 %
50%
55 %
60 %
Wt. % in ethyl acetate B 1,0
B 1.5 sp
B 5 sp
B 14 sp
B 17 sp
B 30 sp
B 60 sp
B 100
Brookfield viscosity at 23 °C / 20 rpm
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COMPATIBILITY OF VINNAPAS ® WITH OTHER BINDERS
Synthetic polymers Urea-formaldehyde Polystyrene Polyvinyl butyral Polyvinyl chloride Vinyl chloride – vinyl acetate copolymers Poly(n-butyl)methacrylate Cellulose acetate Nitrocellulose (soluble in alcohol) Nitrocellulose (soluble in ester) Polyvinyl methyl ether Chlorinated paraffins Chlorinated rubber Polyisobutylene Resins and natural products Alkyd resins Resins and resin derivatives Terpene resins Cumarene resins /cumarene-indene resins Compatible
Incompatible
Limited compatibility
Plasticizers Plasticizers are added to VINNAPAS® resins to increase the flexibility and tack to lower the heat-sealing temperature and increase water resistance. Products (coatings, adhesives) based on VINNAPAS® resins usually require only small amounts of plasticzer to increase their flexibility. Higher levels of plasticizer (20 % or more) considerably lower the softening point, reducing the heat-resistance of the adhesives and increasing the surface tackiness of adhesives and coatings based on VINNAPAS®.
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The most effective plasticizers for VINNAPAS® are: – Phthalates (dimethyl-, diethyl- dibutyland butylbenzyl phthalate) – Phosphates (tributyl-, tricresyl-, triphenyland tributoxyethyl phosphate) – Triacetine (glycerol triacetate) – Adipates
COMPATIBILITY OF SOLUTIONS BASED ON VARIOUS VINNAPAS ® GRADES
Determination after one week
B 1.5 sp
B 100
UW 1
UW 10
C 341
C 501
B 500/20 VL
B 500/40 VL
Ethyl acetate (20 % solution) mixture 50 : 50 B 1.5 sp B 100 UW 1 UW 10 C 341 C 501 B 500/20 VL B 500/40 VL Acetone (20 % solution) mixture 50 : 50 B 1.5 sp B 100 UW 1 UW 10 C 341 C 501 B 500/20 VL B 500/40 VL Ethyl acetate /ethanol (20 % solution) mixture 50 : 50 B 1.5 sp B 100 UW 1 UW 10 C 341 C 501 B 500/20 VL B 500/40 VL Compatible
Incompatible
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VINNAPAS ® SOLID RESINS APPLICATION AREAS
Applications
Parquet adhesive
Grades
General-purpose adhesive
Additive for hotmelt adhesives
VINNAPAS® homopolymer polyvinyl acetate (CAS No. 9003-20-7) B 1.5 sp B 3 sp B 5 sp B 14 sp B 17 sp B 30 sp B 60 sp B 100 UW 1 fs 1) UW 4 fs 1) UW 10 fs 1) VINNAPAS® homopolymer polyvinyl acetate powder (CAS No. 9003-20-7) B 60 fg 2) VINNAPAS® copolymer vinyl acetate /crotonic acid copolymer (CAS No. 25609-89-6) C 305 C 341 C 501 VINNAPAS® copolymer vinyl acetate /vinyl laurate (CAS No. 26354-30-3) B 500/20 VL B 500/40 VL VINNAPAS® copolymer vinyl acetate /vinyl laurate; ethyl acetate solution (CAS No. 26354-30-3) B 100/20 VLE 3) Recommended
Suitable
1) fs = fumed silica (WACKER HDK ), product also available without pyrogenic silica 2) fg = finely ground 3) 50 % solution in ethyl acetate ®
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Wood binders
Low-profile additive
Sound-damping sheets
Nonwovens
Powder laminating agents
Powder injection molding (PIM)
High-tech ceramics
Packaging coatings
Food
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LOW PROFILE
WACKER POLYMERS VINNAPAS® solid resins prevent shrinking during the curing of unsaturated polyesters. This is one of the most important criteria in the automotive industry. VINNAPAS® solid resins are considered to be low-profile additives because they provide excellent dimensional stability. The acceptable volume-shrinkage of the unsaturated polyester is 0.05 %, expressed in terms of the original dimensions of the unit before curing. In the closedmold process, an excellent property profile is essential. This includes surface smoothness, high gloss, high dimensional stability and reduced shrinkage. Low-profile additives (LPA) are used in UP resin-based formulations to achieve the desired product quality. VINNAPAS® C 501, C 341 (carboxylated polyvinyl acetate resins), as well as VINNAPAS® UW 1 and B 100 (non-carboxylated polyvinyl acetate resins) are used as
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low-profile additives. Without the use of VINNAPAS® as a low-profile additive, warping of the unit being constructed would occur, as well as poor surface quality. These are critical performance requirements for the automotive and transportation industries. Low-profile additives yield a high-quality surface called a Class A surface. The special effect that VINNAPAS® solid resins contribute stems from extraordinary solubility characteristics during curing of unsaturated polyesters. VINNAPAS® solid resins become gradually insoluble during the curing process. They expand and hinder the natural shrinkage which takes place during curing of unsaturated polyester. These important solubility characteristics of VINNAPAS® solid resins can be adjusted via the following parameters: – Molecular weight – Degree of functionality – Type of functionality – Polymer structure
WACKER POLYMERS strives for continuous improvement in this market segment through the development of new, custommade products. In close collaboration with customers, new products are being developed and existing VINNAPAS® products enhanced. The emphasis of our research and development is on supplying our customers with VINNAPAS® solid resins that display the versatility needed for use in a wide spectrum of applications. Guide formulations are available on request.
SMC production
Cutter Fiberglass SMC paste Polyamide film
Compacting rolls SMC paste
Polyethylene film Finished (SMC)
Typical SMC Formulation Components Unsaturated Polyester Resin Orthophthalic polyester resin (65 % in styrene) Additives VINNAPAS® PVAc (40 % in styrene) tert-Butyl perbenzoate Peroxy ester Pigment dispersion Zinc stearate Filler Calcium carbonate 3 µm Glass fibers 50 mm chopped fiberglass, wt. %
Parts by wt. 65.0 35.0 1.0 0.2 10.0 2.0 180.0 27–29
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ADHESIVES
VINNAPAS® solid resins are used in the adhesive industry as binders for solventbased adhesives due to their excellent adhesion to many substrates, such as paper, carton board, wood, textile, leather, glass, metal and many plastics. The VINNAPAS® B grades are suitable for adhesives which do not need to meet specific heat-resistance requirements. Increased heat resistance can be achieved by a combination of VINNAPAS® B grades and VINNAPAS® UW grades together with a filler, such as calcium carbonate. For manufacturing an adhesive containing VINNAPAS®, we recommend dissolving the VINNAPAS® resin or resin combination in a suitable solvent mixture under sufficient agitation followed by the addition of fillers, pigments, etc. Adhesives formulated with VINNAPAS®
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solid resins can be plasticized with dibutyl phthalate in order to obtain a highly flexible bond or to improve the low-temperature flexibility, if required. VINNAPAS®-based adhesives can be applied by common methods, such as brushing, roll coating, knife coating or spraying. Major application areas are parquet floor adhesives, where WACKER holds a market-leading position, general-purpose adhesives, acrylic adhesives and heat-sealing adhesives. For sprayable adhesives based on VINNAPAS® solid resins, a low molecular weight VINNAPAS® B grade should be used. Guide formulations are available on request.
SOUND-DAMPING SHEETS
Cabin top
Cabin side
Luggage compartment
Floor damping
Tunnel damping
Cabin front
A major problem today in the automotive industry is the excessive noise generated by the vibration of metal parts in the vehicle. The use of an effective sound dampening material contributes to the reduction or elimination of the excessive noise. VINNAPAS® UW resins can be used as the principal component for effective vibration-dampening materials and sound dampening sheets. These resins lead to excellent sound properties over a broad temperature range. Sheets formulated with VINNAPAS® UW resins result in more effective sound-damping,
Side damping
no toxic emissions and no fogging compared to asphalt-containing sheets due to their high molecular weight and chemical composition. Additional benefits exhibited by VINNAPAS®-based sound-damping sheets are excellent paintability, ease of handling, and reduced overall weight. A typical formulation contains, in addition to the VINNAPAS® UW resin, plasticizer, filler and carbon black. A broad range of fillers can be used; among the most common are calcium carbonate and mica. The addition of plasticizer allows the formulator the versatility to fine-tune the sounddamping sheets to the required flexibility and effective temperature range.
VINNAPAS® resins are widely compatible with a large spectrum of plasticizers. The most common plasticizers used in this application are phthalates, phosphates and glycol derivatives. The raw materials are mixed in an extruder and further processed into thin sheets. The adhesion of these sheets to the metal can be increased by applying common pressure-sensitive adhesives in the form of an emulsion. Guide formulations are available on request.
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COATINGS
VINNAPAS® C grades contain carboxyl functionality and are recommended for priming metal surfaces, e.g. aluminum foil, due to their excellent adhesion. VINNAPAS® C 305 is soluble in alkaline water. However, the dried film exhibits very good water resistance. Typical applications where these properties are useful are coated aluminum labels for drinking bottles where solubility in alkaline water is needed for cleaning purposes.
Grease-Repellent Paper Coating
Due to their outstanding clarity, VINNAPAS® solid resins are suitable for many applications where natural resins are traditionally used. In particular, the low-to-medium viscosity grades (B 5 sp – B 100) may be used as the synthetic resin component in cellulose nitrate lacquers (maple wood varnishes, lacquers for posters and labels). Viscosity and hardness of the lacquer can be widely varied depending on the VINNAPAS® grade selected. In regards to primers for porous materials, such as wood, plaster and masonry, the low-viscosity VINNAPAS® grades (e.g. B 1.5 sp, B 5 sp) are highly suitable in the production of lacquers with high filler uptake and good spreading power. Since the resins are absolutely colorless, the color of the primed surface remains unchanged. VINNAPAS® solid resins also ensure good adhesion and recoatability. In these applications, the incorporation of plasticizers may also be useful to improve the properties of the coating.
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Also, VINNAPAS® C grades have outstanding adhesion to paper and board and are recommended for use as primers for the metallizing of these substrates. They may be used in combination with non-functional VINNAPAS® resins in order to adjust adhesion and mechanical properties to the requirements of the application. Likewise, non-functional VINNAPAS® grades in the higher viscosity range (UW grades) have good metallizing properties.
useful in overprint varnishes for paper and cardboard as well as for impregnations with reduced water vapor permeability. Solutions based on VINNAPAS® resins may be used for textile sizing and for finishing, impregnating and stiffening cardboard, felt and synthetic fiber mats. The finishing effect can be modified via the resin concentration, the VINNAPAS® resin grade and the plasticizer content. The preferred VINNAPAS® resins grades are of medium (VINNAPAS® B 100) and high (VINNAPAS® UW grades) viscosity. VINNAPAS® has a high binding power for pigments and fillers. For this reason, a high pigment loading may be achieved when products based on VINNAPAS® are used. Being of neutral pH, the VINNAPAS® B and UW grades tolerate not only neutral pigments and fillers, but also slightly alkaline pigments and fillers in the formulation.
VINNAPAS® VL grades have exceptional flexibility and have good adhesion on various plastic substrates, aluminum and glass. These properties make them extremely well suited for the production of coatings or screen inks with a so-called “soft touch.” VINNAPAS® VL grades have excellent compatibility with a wide range of different polymers, and they work as a kind of migration-free polymeric plasticizer in such systems. Their main application field is nitrocellulose-based systems.
Low and medium-viscosity VINNAPAS® solid resin grades have proved suitable for the production of concrete sealing fluids and barrier coatings on gypsum sheets. In addition to reduced dusting due to improved abrasion resistance, these coatings offer good protection against the penetration of oil, grease, humidity, etc. These lacquers may be used, for example, in indoor applications, such as cellar floors, stairs, etc. For external applications, we recommend our VINNOL® copolymers.
In combination with VINNAPAS® C grades, VINNAPAS® VL are used for the production of highly grease resistant paper coatings that are used in applications, such as butter packaging. Being colorless and non-toxic, VINNAPAS® resins are
Guide formulations are available on request.
VINNOL® is a registered trademark of Wacker Polymer Systems GmbH & Co. KG.
POWDER INJECTION MOLDING (PIM)
VINNAPAS® UW 4 Thermogravimetric Analysis (TGA) under Air [wt. %] 100
80
60
40
Residual content 27.9 %
20 Residual content 14.6 %
0 100 0
200 10
300 20
400 30
500 40
Residual content 0.4 % 600
50
700 60
800 70
900 80
1000 ºC 90
min
Temperature Time [°C min]
The Powder Injection Molding (PIM) industry is aware of the variations in the composition of premixes due to the virtue of particle segregation and dusting. These effects are quite evident in compositions with high alloy content. However, they appear to be present in all mixtures, independent of alloy content. Visibly identifiable indications result frequently from dusting. Visible indications are less apparent in respect of segregation due to particle migration, but are quite well known. Variations in composition due to segregation and dusting also result in mechan-
ical and physical property variations in blends, as well as in parts that are manufactured from these blends. It is difficult to quantify the effects caused by segregation and dusting. However, there is a large amount of evidence to suggest that these phenomena are causing both technical and economic problems for the PIM industry. Technically, these phenomena limit the ability to blend metal powders without an additional binder. Segregation and dusting may also cause dimensional variations that lead to part rejections, loss in productivity and an overall negative economic impact.
There are a number of manufacturing options available which can eliminate or reduce the effects of segregation and dusting. The three most significant are: atomization of prealloys, diffusion bonding by annealing, and binder treatment of premixes. The VINNAPAS® grades B 100, UW 1 and UW 4 are highly recommended for use as a binder in these formulations. Our products combine the following properties: – Outstanding binding – Excellent thermoplastic characteristics – Superior burn-out properties
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VINNAPAS ® GENERAL INFORMATION
Storage of VINNAPAS® Polyvinyl Acetate VINNAPAS® resins exhibit excellent stability when stored under cool and dry conditions. However, being thermo-plastic materials, it is strongly suggested that the lower molecular weight VINNAPAS® B grades particularly be stored below 20 ºC to prevent caking. All VINNAPAS® resins will retain their free-flowing characteristics when stored in a cool (less than 20 ºC) and dry place. Shelf life Please refer to the technical data sheet.
Dangerous Chemicals Regulations All VINNAPAS® resins (B, UW, and C grades) are not classified as dangerous chemicals under the German – Gefahrstoffverordnung (GefStoffV, 11th issue 1997) – and therefore do not have to be labeled as such. A certificate of origin, details on labeling and safety data sheets are available upon request.
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Packaging Standard packaging for VINNAPAS® B, UW and C grades: PE-bags, 25 kg net weight. Other types of packaging available upon request. Further information regarding individual products (technical data sheets, material safety data sheets) is available at: Tel. +49 8677 83-7979 Fax +49 8677 83-8181
[email protected] www.wacker.com
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WACKER AT A GLANCE
WACKER SILICONES is a leading supplier of complete siliconebased solutions that comprise products, services and conceptual approaches. As a provider of solutions, the business division helps customers press ahead with innovations, exploit global markets fully, and optimize business processes to reduce overall costs and boost productivity. Silicones are the basis for products offering highly diverse properties for virtually unlimited fields of application, ranging from the automotive, construction, chemical, electrical engineering and electronics industries, through pulp and paper, cosmetics, consumer care and textiles, to mechanical engineering and metal processing. WACKER POLYMERS is the global leader for high-quality binders and polymer additives. This business division’s activities encompass construction chemicals and functional polymers for lacquers, surface coatings and other industrial applications, as well as basic chemicals, i. e. acetyls. Products such as dispersible polymer powders, dispersions, solid resins, powder binders and surface coating resins from WACKER POLYMERS are used in the construction, automotive, paper and adhesives industries, as well as by manufacturers of printing inks and industrial coatings. WACKER FINE CHEMICALS is an expert in organic synthesis, silane chemistry and biotechnology, providing tailored solutions for its customers in the life sciences and consumer care industries. The range of innovative products includes complex organic intermediates, organosilanes, chiral products, cyclodextrins and amino acids.
CREATING TOMORROW’S SOLUTIONS
With its comprehensive expertise, WACKER FINE CHEMICALS is a preferred partner for highly challenging custommanufacturing projects in the fields of chemistry and biotechnology. WACKER POLYSILICON has been producing hyperpure silicon for the semiconductor and photovoltaics industries for over 50 years. As one of the largest global manufacturers of polycrystalline silicon, WACKER POLYSILICON supplies leading wafer and solar-cell manufacturers. Siltronic is one of the world’s leading producers of hyperpure silicon wafers, supplying many major chip manufacturers. Siltronic develops and produces wafers up to 300 mm in diameter at facilities in Europe, the USA, Asia and Japan. Silicon wafers form the basis of state-of-the-art micro and nanoelectronics used, for example, in computers, telecommunications, motor vehicles, medical technology, consumer electronics and control systems.
06.06
WACKER is a technological leader in the chemical and electrochemical industries and a worldwide innovation partner to customers in many key global sectors. With around 14,400 employees, WACKER generated sales of EUR 2.76 billion in 2005. Germany accounted for 21% of sales, Europe (excluding Germany) for 31%, the Americas for 22 % and Asia-Pacific, including the rest of the world, for 26 %. Headquartered in Munich, Germany, WACKER has some 20 production sites worldwide and a global network of over 100 sales offices. With R&D spending at 5.3 % of sales in 2005, WACKER is among the world’s most research-intensive chemical companies.
5279e/06.06
Wacker Chemie AG Hanns-Seidel-Platz 4 81737 München, Germany Tel. +49 89 6279-0 Fax +49 89 6279-1770
[email protected] www.wacker.com/vinnapas