YAESU
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FT -847 HF & V /UHF Band Transceiver
Technical Supplement
VERTEX STANDARD 4-8-8 Nakameguro,
CO., LTD.
Meguro-Ku,
Tokyo 153-8644,
Japan
VERTEX STANDARD us Headquarters 17210 Edwards
Rd., Cerritos,
CA 90703, U.S.A.
International Division 8350 N.W. 52nd Terrace,
Suite 201, Miami, FL 33166. U.S.A.
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Y AESU EUROPE B. V.
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Unit 12, Sun Valley Business Park, Win nail Close Winchester, Hampshire. S023 OLB, U.K.
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Box 75525, 1118 ZN Schiphol, The Netherlands
YAESU UK LTD. YAESU GERMANY GmbH .'-'"
Am Kronberger
Hang 2, 0-65824
VERTEX STANDARD
Schwalbach.
Germany
HK LTD.
Unit 5. 20/F., Seaview Centre, 139-141 Hoi Bun Road,
Kwun Tong, Kowloon, Hong Kong
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Contents Introduction
1-1
Specifications
1-2
Chip Component Information
1-3
Mechanical Details (Exploded Views & Mechanical Parts)
2-1
Alignment
3-1
Block & Interconnection
Diagrams
4-1
PCB Diagrams & Parts List AF-CNTL Unit
5A-1
PLL Unit
5B-1
RF Unit
5C-1
V /U-P A Unit
5D-1
PA Unit
5E-1
DSP Unit
5F-1
Panel Unit
5G-1
SSB-Filter-l/ -2 Unit
5H-1
Phone-Jack Unit
5 I-I
Mic Unit
5 J -1
HPF Unit
5K-1
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This manual provides technical information necessary for servicing the Yaesu FT-847 HF & Transceiver.It does not include information on installation and operation, which are described in the FT-847 Operating Manual provided with the transceiver, or on accessories which are described in their manuals. The FT-847is carefully designed to allow the knowledgeable operator to make nearly all ad-
covered by warranty. For the major circuit boards, each side of the board is identified byiV/ the type of the majority of components installed on that side. In most casesone side has only chip components, and the other has either a mixture of both chip and lead components (trimmers, coils, electrolytic capacitors, packaged ICs, etc.), or lead components only. While we believe the technical information in
justments required for various stationconditions, modes and operator preferencessimply from the controls on the panels, without opening the case of the transceiver. The FT-847 Operating Manual describes these adjustments, plus certain in-
this manual is correct, Yaesu assumesno liability for damage that may occur as a result of typographical or other errors that may be present. Your cooperation in pointing out any inconsistencies in the technical information would be
ternal settings. Servicing this equipment requires expertisein handling surface mount chip components. Attempts by unqualified persons to service this equipment may result in permanent damage not
appreciated. Yaesu Musen reserves the right to make changes in this transceiver and the alignment procedures, in the interest of technological improvement, without notification of owners.
FT -847 Technical
SupplementI
1-1
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Specifications General Frequency Range:
Receive 100 kHz -30 MHz, 36 MHz -76 MHz, 108 MHz -174 MHz, 420 MHz -512 MHz Transmit 160 -6 Meters, 2 Meters, 70 Centimeters (Amateur bands only) 5.1675 MHz (Alaska Emergency Channel) USB, LSB, CW, AM, FM Fl (9600 bps Packet), F2 (1200 bps Packet) AFSK 0.1 Hz (CW, SSB), 10 Hz (AM, FM) ,
Emission Modes: Synthesizer Steps (Min.): Antenna Impedance: Operating Temp. Range: Frequency Stability:
50-0., Unbalanced -10 °C to +50 °C (14 of to 122 OF) Better than:f:2 ppm (0 °C to +40 °C) SSB/CW / AM/ AFSK Better than:f:5 ppm (-10 °C to +50 °C) SSB/CW / AM/ AFSK Better than :f: 11 kHz :f: 5 ppm} FM DC 13.8 V = :f:l0 %, Negative Ground Receive: 1.5 A (Squelched), 2.0 A (Max. Audio) Transmit: 22 A (@ 100 W RF output) 260 (W) x 86 (H) x 270 (D) mm (10.24" x 3.39" x 10.63") Approximately 7 kg (14.4lbs.)
Power Requirements: Current Consumption: Case Size: Weight:
Transmitter Power Output: Modulation
Types:
FM Maximum Deviation: Spurious Radiation:
Carrier Suppression: Opp. Sideband Suppression: 3rd-Order IMD: SSB Frequency Response: Microphone Impedance:
160 -6 m: 100 Watts (25 Watts AM carrier) 2 m/70 cm: 50 Watts (12.5 Watts AM carrier) SSB: Balanced Modulator FM: Variable Reactance AM: Early Stage (Low Level) :f:5 kHz (:f:2.5 kHz on FM-N) Harmonics: At least 40 dB down (1.8 -29.7 MHz) At least 60 dB down (50/144/430 MHz) Non-harmonic: At least 50 dB down (1.8 -29.7 MHz) At least 60 dB down (50/144/430 MHz) At least 40 dB At least 40 dB At least 31 dB down (14 MHz, 100 W PEP output) 400 Hz -2600 Hz (-6 dB) 2000.- 10 ko. (Supplied microphone: 600 Q.)
Receiver Sensitivity:
SSB/CW AM-N FM 500 kHz -1.8 MHz: -20 JIV 1.8-28MHz: 0.25JIV 2JIV 28-30MHz: 0.25JIV 2JIV 0.5JIV 50 -54 MHz: 0.20 JIV 1 JIV 0.25 JIV 144/430 MHz: 0.125 JIV -0.2 JIV (Above specificationsare worst-case.SSB/CW/AM-N figures arefor 10 dB SIN, 12 dB SINAD on FM) Squelch Sensitivity: SSB/CW/AM FM 500 kHz -1.8 MHz: 20 JIV 1.8-28MHz: 2pV 28 -30 MHz: 2 JIV 0.25 JIV 50 -54 MHz: 1 JIV 0.20 JIV 144/430 MHz: 0.5 JIV 0.16 JIV Image Rejection: Better than 60 dB IF Rejection: Better than 60 dB Selectivity (-6/-60dB): SSB/CW: 2.2 kHz/4.5 kHz CW-N: 0.5 kHz/2.0 kHz (Optional YF-115C installed) AM: 9 kHz/20 kHz AM-N: 2.2kHz/4.5kHz FM: 15 kHz/30 kHz FM-N: 9 kHz/20 kHz Audio Output: At least 1.5 0. into 8 W @ 10 % THO Audio output impedance: 40. -160. Specifications are subject to change, in the interest of improvement, without notice or obligation. Specifications are guaranteed only within Amateur bands.
1-2
FT -847 Technical
Supplement
-Chip Component Information The diagrams below indicate some of the distinguishing features of common chip components .
Capacitors (Unit: ~
L
~ T
H
W
mm)
Type
L
H
2125
2.0
1608
1.6 0.8
0.65 ~ 0.95
1005
1.0 0.5
0.45 ~ 0.55
1.25 0.35 ~ 0.5
Tantalum Capacitors w
L
(Unit:
-L H T
+ -C
mm)
Type L W P 2.0 1.25 A 3.2 1.6 B 3.4 2.8 5.8 3.2
H 1.2 1.6 1.9 2.3
Resistors ~
L
Marking* 100, 222, 473...
-L
473
H
T Indicated Letters
Tens
Ones
Multiplier
0
0
100
1 2
1 2
101 102
1 2 3 4 5 & , : , 0 .:: Type
L
(Unit: mm) W H
1/10
2.0 1.25 0.5
1/16
1.6 0.8
1/165
1 0 0 5 035 ...222==2.2kQ
0.45
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5
105
6 7
6 7
106 107
8
8
108
9
9
109
Examples:
l00==10Q
473==47kQ
1-3 FT-847 Technical Supplement
Chip Component Information Replacfng Chip Components Chip components are installed at the factory by a series of robots. The first one placesa small spot of adhesive resin at the location where each part is to be installed, and later robots handle and place parts using vacuum suction. For single sided boards, solder pasteis applied and the board is then baked to harden the resin and flow the solder. For double sided boards, no solder paste is applied, but the board is baked (or exposed to ultra-violet light) to cure the resin before dip soldering. In our laboratories and service shops, small quantities of chip components are mounted manually by applying a spot of resin, placing the components with tweezers, and then soldering by very small dual streamsof hot air (without physical by first contact removing duringsolder soldering). using aWe vacuum remove suction parts
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Precautions for Chip Replacement 0 Do not disconnect a chip forcefully, or the foil pattern may peel off the board. 0 Never re-use a chip component. Dispose of all removed chip components immediately to avoid mixing with new parts. 0 Limit soldering time to 3 secondsor less to avoid damaging the component and board. Removing Chip Components 0 Remove the solder at eachjoint, one joint at a time, using solder wick whetted with nonacidic fluxes as shown below. Avoid applying pressure, and do not attempt to remove tinning from the chip's electrode. ,
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iron, which applies a light steady vacuum at the iron tip, and then breaking the adhesive with tweezers.
0 Grasp the chip on both sides with tweezers,
Special vacuum/ desoldering equipment is recommended if you expect to do a lot of chip replacements. Otherwise, it is usually possible to remove and replace chip components with only a tapered, temperature-controlled soldering iron, a set of tweezers and braided copper solder wick. Soldering iron temperature should be below 280°C (536°F).
and gently twist the tweezers back and forth (to break the adhesive bond) while alternately heating eachelectrode. Be careful to avoid peeling the foil traces from the board. .Dispose of the chip when removed. 0 After removing the chip, use the copper braid and soldering iron to wick away any excess solder and smooth the land for installation of the replacement part.
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1-4
FT -847 Technical Supplement
-Chip Installing
Component
Information
a Replacement Chip
As the value of some chip components is not indicated on the body of the chip, be careful to get the right part for replacement. 0 Apply a small amount of solder to the land on one side where the chip is to be installed. Avoid too much solder, which may cause bridging (shorting to other parts).
0 Hold the chip with tweezers in the desired position, and apply the soldering iron with a motion line as indicated by the arrow in the diagram below. Do not apply heat for more than 3 seconds.
0 Remove the tweezersand solder the electrode on the other side in the manner just described.
1-5 FT -847 Technical
Supplement
T -Exploded
View & Miscellaneous
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