TI Sitara™ ARM® Cortex™-A8 & ARM9™

Quick Overview

Aug 2011

Embedded processing portfolio TI Embedded Processors Microcontrollers (MCUs)

ARM®-Based Processors

Digital Signal Processors (DSPs)

Software & Development Tools 16-bit ultralow power MCUs

32-bit real-time MCUs

MSP430™

C2000™ Delfino™ Piccolo™

32-bit ARM® MCUs

®

Stellaris

ARM® Cortex™-M3

Up to 25 MHz

40 MHz to 300 MHz

Up to 80 MHz

Flash 1 KB to 256 KB

Flash, RAM 16 KB to 512 KB

Analog I/O, ADC LCD, USB

PWM, ADC, CAN, SPI, I2C

Flash 64 KB to 256 KB USB, ENET MAC+PHY, CAN, ADC, PWM, SPI

Measurement, sensing, general purpose

Motor control, digital power, lighting, ren. energy

$0.25 to $9.00

$1.85 to $20.00

32-bit ARM MPUs

Sitara™ ARM® Cortex™-A8 & ARM9™

DSP DSP+ARM

Multicore DSPs

Ultralow power DSPs

C6000™ Integra™ DaVinci™

C6000™

C5000™

Up to 10GHz Multicore, Fixed/Floating +Accelerators

Up to 300 MHz 16-bit Fixed Point + FFT Accelerator

Up to 4 MBL2, 32 KB L1, 1 MB SL2

Up to 320 KB RAM Up to 256 KB ROM

Digital Media Processors

Value Line to 300 MHz to >1.5 GHz 600 MHz Floating DSP + Perf. Line to 1.5 GHz Video Accelerators Up to 32KB I/D cache L2 Cache 256 KB L2, LPDDR, mDDR, DDR2/DDR3 DDR2/3 support

Motion control, HMI, industrial automation

GEMAC, PCIe+PHY, SATA+PHY, CAN, USB+PHY, PRU Industrial automation, portable data terminals, Single-board computing

USB 2.0 OTG, GEMAC, SATA, SPI, UPP, PRU, PCIe2.0, McBSP, McASP Video, audio, voice, security, conferencing, test & measurement

RapidIO, PCIe, 10/100MAC, Hyperlink, DDR2/3 Telecom, medical, mission critical, base stations

USB 2.0, ADC, SPI McBSP, I2C, LCD, On-chip regulators Portable audio/voice, fingerprint biometrics, portable medical

$1.00 to $8.00

$5.00 to $50.00

$5.00 to $200.00

$40 to $200.00

$2.99 to $10.00

MPUs – Microprocessors

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Sitara™ offers Performance

Scalability

•Up to 450MHz ARM9™ to 1.5GHz Cortex™A8 devices •Industry’s first widely available Cortex-A8 devices - 2 DMIPS per MHz •Graphics acceleration up to 27M polygons/s performance for advanced user interface •High speed DDR2 and DDR3 memory performance

• Largest software compatible ARM MCU & Embedded MPU portfolio • ARM only to ARM + accelerator functionality while reusing both SW and HW designs • Leverage TI’s extensive portfolio of embedded ARM devices to maximize your product’s changing needs • Fully pin-for-pin and software compatible options to scale from ARM only to ARM + DSP

Connectivity

Strength of Software

•10/100/1000 Ethernet •CAN 2.0 and High speed USB interface •Multiple serial port options per device •Lowest cost processor with SATA interface •Flexible LCD controller for up 720p displays moving to 1080p in future devices •Industrial peripheral support

• Free and easy access to software • Low cost development tools with reference code • Application specific and advanced development kits • Aggressive Linux community, Windows Embedded CE and RTOS ecosystem of development partners • Driver software available for most high-level operating systems

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Sitara™ ARM® microprocessors Available Now ARM9™ New!

ARM Cortex™-A8

In Development ARM Cortex-A8 “AM38x Next” (2011) “AM33x Next” (2011)

Low Power ARM9 with flexible peripherals

AM3894 New! AM3892 New! AM3715 AM3703 AM3517 AM3505 OMAP3515 OMAP3503 High-performance Cortex-A8 with system integration

• Power efficient (down to 37mW standby, 402mW active) • User configurable interfaces through the programmable real-time unit (PRU) • Integrated peripherals: PROFIBUS, 10/100 Ethernet, USB, SATA, CAN, UART and many others

• Up to 1.5GHz (3000 DMIPS) • Power efficient (down to 12mW standby, 700mW active) • Integrated graphics for rich user interface functions • Integrated interfaces of PCIe, USB, 10/100/1000 Ethernet, SD card, WiFi®, CAN, and many others

• Beyond 1.5GHz performance • 1080p display support • Enhanced graphics for superior user interface functions

AM1810 AM1808 AM1806 AM1802 AM1707 AM1705

New!

More performance and value options

Support for Linux, Windows® Embedded CE, Android, & RTOS

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Sitara™ ARM® MPU roadmap Production

Development

Sampling

AM389x • • • • • • •

ARM Cortex-A8 Up to 1.5GHz 2x 1G-Enet 3D Graphics PCIe, SATA DDR2/3 Advanced Display

AM37x • • • •

OMAP35x • • • •

ARM Cortex™ -A8 Up to 720 MHz 3D Graphics LPDDR1

AM387x

ARM Cortex-A8 Up to 1GHz 3D Graphics LPDDR1

• Cortex-A8 • Increased integration

performance line - performance and features optimized value line - device and system cost optimized

AM35x AM17x

AM18x

• • • • •

• • • • • •

ARM9™ Up to 456MHz 10/100 Enet PRU SDRAM

ARM9 Up to 456MHz 10/100 Enet PRU SATA SDRAM/LPDDR1 /DDR2

• • • • • •

ARM Cortex-A8 Up to 600MHz 3D Graphics 10/100 Enet CAN LPDDR1/DDR2

AM335x • ARM Cortex-A8 • Cost optimization • Increased features

Speeds shown are for commercial temperature. Dates approximate initial samples. Not all peripherals shown. Limitations apply among package and pin muxing. Devices features subject to change without warning or notification.

| -----------------------------------------TODAY------------------------------------------- | --------------1H11------------- | ---------------2H11------------ |

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Sitara™ target markets Power Automation

Industrial / Medical

• • • •

AM1808 AM3517 AM387x AM335x

• • • •

AM1808 AM335x AM389x AM387x

POS/ Data Terminals

• AM3715/03 • AM1808 • AM3517

Consumer

• AM3715/03 • AM3517 • AM335x

Communication

• • • • •

AM3703 AM387x AM389x AM1808 AM335x

Long Product Lifecycles with Focus on Reliability and Quality

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TI Base SW/Components

Cortex™-A8 software summary

TI HW/Libraries

ARM® Cortex-A8+graphics User Interface

3rd party/Customer

Application Level Software Browser/ Media Players

“Applications”

Application Frameworks – Java, Qt, GStreamer, Flash, Android, DShow, Direct Draw

Board Support Package •Linux – Open Source – TI Developed •Android – Open Source – TI Funded •Windows Embedded CE – TI Owned, Developed by Microsoft Gold Partner •Commercial Linux and Android – Many Partners •RTOS – QNX, VxWorks, Nucleus, Integrity etc.

Video, Imaging, Speech, Audio Codecs and Frameworks on NEON™

OpenGL® ES and OpenVG™ Library On SGX

2D Graphics Library On NEON

OS Kernel ARM Cortex-A8 with on chip USB, High End CAN controller (HECC) and Ethernet MAC Accelerators – SGX 530 and Neon

OMAP35x, AM35x, AM37x, AM335x

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AM3517/05 Cortex™-A8 based processors Benefits • 1200 DMIPs for OS’s like Linux, Win CE, RTOS • 10M polygons/second for robust GUIs • Multi window overlay for hardware accelerated user interface Sample Applications • Industrial/home automation • Point of service • Single board computers • Digital signage Power • Total Power: 700mW • Standby Power: 12mW Schedule and packaging • Production: Now • ZCN: 17x17mm BGA, 0.65mm pitch, 491-ball. Utilizes Via Channel™ array technology with 0.8mm pitch plus design rules • ZER: 23x23mm PBGA, 1.0mm pitch, 484-ball

AM3517/05 Processors

ARM® Cortex™-A8 600 MHz 16K/16K L1 256K L2 64K SRAM

Display Subsystem 3D Graphics Accelerator (AM3517 only)

LCD Controller

Video Processing Front End

Video Encoder 10 bit DAC 10 bit DAC

Video Input (16-bit)

L3/L4 Interconnect Connectivity

Serial Interface

Memory Interface

USB OTG w/ PHY

McBSP x5

DDR2

USB HS Host x2

MCSPI x4

NAND/NOR

CAN Controller

I2C x3

MMC/SD/SDIO x3

10/100 EMAC

HDQ/ 1-wire

Timers

UART x3

GP x12

UART w/ IrDA

WDT x1

Peripheral limitations may apply among different packages Some features may require third party support All speeds shown are for commercial temperature range only

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AM3894/2 Cortex™-A8 based processors Benefits • Faster program execution and more simultaneous applications • Communicate simultaneously over multiple high speed connections • Reduced BOM parts count Sample Applications • Networking & Communications (routers, gateways, switches, servers, NAS) • Single board computers • Interactive kiosks • Multi-display products • Industrial control / HMI Software and development tools • Linux, WinCE and drivers direct from TI • Android and RTOS (QNX, Green Hills, etc) from partners • Full featured and low cost development board options Schedule and packaging • Samples: Now • Production: 4Q’11 • Dev. Tools: Now (DDR2). DDR3 will be available 1Q11. • Packaging: 25x25, 0.65mm via channel array, 1031 ball Availability of some features, derivatives, or packages may be delayed from initial silicon availability Peripheral limitations may apply among different packages Some features may require third party support All speeds shown are for commercial temperature range only

ARM® Cortex-A8 1.2 GHz/ 1.5 GHz*

Graphics (AM3894 only)

Display processor

PowerVR SGX 3D Gfx

Resizer

32K/32K L1

Security AES, 3DES

256K L2

RNG

64K RAM

Display

512K Shared RAM

HS OSD

SD OSD

SD Encoder

SD DAC x3

HD Encoder

HD DAC x3

HDMI Xmit (w/HDCP)

HDMI PHY

HD Video I/O x2

L3/L4 Interconnect Serial Interface UART x3 SPI 2 I C x2 McASP x3 McBSP PCIe (2.0) x2 lanes SPDIF SATA x2 (3Gbps)

System EDMA x4 Timers x8 WDT Smart Card x2

Parallel SD/SDIO GPIO

USB 2.0 + PHY x2 (host and device) EMAC 10/100/1G x2 (GMII, MII)

Memory Interface DDR2/3 x2 Async EMIF/NAND

* Initial sampling will be for the XAM3894 1.0GHz

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AM3715/03 Cortex™-A8 based processors Benefits • 2000DMIPS for OS’s like Linux, Win CE, RTOS • Up to 30% reduction in power • 20M polygons per second for robust GUIs

AM3715/03 Processors

ARM® Cortex™-A8 800MHz/1 GHz

Sample Applications • Smart connected devices • Patient monitoring • Single board computers • Low power PC

Power • Dynamic Voltage and Frequency Scaling (DVFS) • Total Power: 735mW (800MHz) • Standby Power: 0.1mW (600MHz) Schedule and packaging • Production: Now • CBP: 12x12mm PBGA, 0.4mm pitch, 515-ball, Package on Package (PoP) • CBC: 14x14mm PBGA, 0.5mm pitch, 515-ball, PoP • CUS: 16x16mm PBGA, 0.65mm pitch. 423-ball. Utilizes Via Channel™ array technology with 0.8mm pitch plus design rules

32K/32K L1 256K L2 64K SRAM

Display Subsystem 3D Graphics Accelerator (AM3715 only)

LCD Controller

Video Processing Front End

Video Encoder 10 bit DAC 10 bit DAC

Video Input (12-bit)

L3/L4 Interconnect Connectivity

Serial Interface

Memory Interface

USB OTG

McBSP x5

LPDDR1

USB HS Host x3

MCSPI x4

NAND

I2C x3

MMC/SD/SDIO x3

HDQ/ 1-wire

Timers

UART x3

GP x12

UART w/ IrDA

WDT x2

Peripheral limitations may apply among different packages Some features may require third party support All speeds shown are for commercial temperature range only

10

AM335x Cortex™-A8 based processors Benefits • High performance Cortex-A8 at ARM9/11 prices • PRU Subsystem for flexible, configurable communications Sample Applications • Building automation • Home networking • Medical appliances

  

Printers Advanced toys Smart toll systems

Software and development tools • Linux, WinCE and Android drivers direct from TI • RTOS (QNX, Green Hills, etc) from partners • Full featured and low cost development board options Schedule and packaging • Samples: 4Q’11; Production: 2Q’12 • Dev. Tools: 4Q’11 • Packaging: 13x13mm, 0.65mm pitch via channel array; and 15x15mm, 0.8mm pitch

Package differences ARM speed USB 2.0 OTG + PHY EMAC PRU

15x15mm 550/650/720 MHz x2 2-port switch All I/O pins

13x13mm 550 MHz x1 Single port Reduced I/O pins

Availability of some features, derivatives, or packages may be delayed from initial silicon availability. Peripheral limitations may apply due to pin multiplexing; applies to both packages Some features may require third party support. All speeds shown are for commercial temperature range only.

ARM® Cortex-A8 720 MHz 32K/32K L1 w/SED 256K L2 w/ECC 64K RAM

Graphics

Display

PowerVR SGX 3D Graphics

24 bit LCD Ctrl (WXGA)

Secure Boot & Crypto acc. (2) 64K Shared RAM

Touch Scr. Ctrl. (TSC) (1) PRU SS PRU x2 200 MHz 8K P. w/SED 8K D. w/SED

12K RAM w/SED Peripherals

L3/L4 Interconnect Serial Interface UART x6 SPI x2 I2C x3 McASP x2 (4ch) CAN x2 (2.0B)

System & Parallel

EDMA Timers x8 WDT x2 RTC eHRPWM x3 eQEP x3 eCAP x3 JTAG/ETB ADC (8ch) 12-bit SAR (1) GPIO

MMC/SD/ SDIO x3 USB 2.0 OTG + PHY x2

EMAC 2-port switch 10/100/1G w/1588 (MII,RMII, RGMII & MDIO)

Memory Interface LPDDR1/DDR2/DDR3 (16b, 200MHz Clock)(3) NAND/NOR/Async (16b ECC)

NOTES: (1) Use of TSC will limit available ADC channels. (2) 3DES crypto acceleration not supported. Run time security also not supported. (3) LPDDR1 is limited to 180 MHz. SED: single error detection/parity ECC: Error Checking & Correction

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TI Base SW/Components

ARM9™ software summary

TI HW/Libraries 3rd party/Customer

User Interface

Application Level Software Browser/ Media Players

“Applications”

Application Frameworks – Java, Qt, GStreamer, Flash, Android, DShow, Direct Draw

Board Support Package •Linux – Open Source – TI Developed •Windows Embedded CE – TI Owned, Developed by Microsoft Gold Partner •Commercial Linux and Android – Many Partners •RTOS – QNX, VxWorks, Nucleus, Integrity etc.

Video, Imaging, Speech, Audio Codecs and Frameworks (ARM9) OS Kernel

ARM9 with on chip USB, Ethernet, SATA Accelerators – PRU AM17x and AM18x

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AM1808/06/02 ARM9™ based processors Benefits • Multiple connectivity and interface options • Rich, intuitive user interfaces • High system integration = reduced system cost Sample Applications • Industrial/home automation • Test & measurement • Portable data terminals Power • Total Power: 402mW • Standby Power: 37mW Schedule and packaging • Production • AM1808/06: Now • AM1802: 1Q’11 • Samples: AM1802: Now • ZCE: 13x13mm nFBGA, 0.65mm pitch, 361-balls (AM1808/06) • ZWT: 16x16mm BGA, 0.8mm pitch, 361-balls • Extended Temperature Grade Options • Commercial (0C to 90C) • Extended (-40C to 90C) (AM1802) • Industrial (-40C to 105C) (AM1808/06) • Pin to pin compatible processor: OMAP-L138 Peripheral limitations may apply among different packages Some features may require third party support All speeds shown are for commercial temperature range only

1802

1802/1808

1806/1808

AM18x Processor

ARM9 300 MHz 375/456 MHz 16K/16K L1

1808

PRU Subsystem

128K SRAM

Display Subsystem

Video Ports

Input x2 LCD Controller

Output x2

L3/L4 Interconnect Connectivity

Serial Interface

USB OTG w/ PHY

McASP

UART x3

UHPI

SPI x2

McBSP x2

uPP

I2C x1

I2C x2

USB HS w/ PHY

Memory Interface

Timers

SATA

Flash/SDRAM

WDT x1

10/100 EMAC

LPDDR1/DDR2

GP x3

MMC/SD/SDIO x1

PWM x2

MMC/SD/SDIO x2

eCAP x3

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AM1810 overview AM1810 Processor

ARM9 16K/16K L1

PRU Subsystem with PROFIBUS

Display Subsystem

Video Ports

Input x2 LCD Controller

Output x2

Interconnect Connectivity

Serial Interface

USB OTG w/ PHY

McBSP x2

McASP

USB HS w/ PHY

SPI x2

UART x2

SATA

I2C x2

PROFIBUS UART

EMAC

Memory Interface

Timers

Flash/SDRAM

WDT x1

LPDDR1/DDR2

GP x3

MMC/SD/SDIO x2

PWM x2

UHPI uPP

eCAP x3

Key Features • • • • • • • •

ARM926EJ-S RISC core 10/100 Ethernet Integrated LCD controller 16-bit Flash memory interface 16-bit DDR2/mDDR interface Three 16650-type UARTs Industrial grade (-40 to 105°C) Active power 1mW/MHz

PROFIBUS • Programmable Real-time Unit Subsystem with PROFIBUS • UART1 or UART2 can be used for PROFIBUS

Availability • Samples Nov 2010 • Production March 2011 • Guaranteed long-term supply 14

Sitara™ software and ecosystem Complementing great processors with great software! • Production quality Software Development Kit including: – Drivers and kernel port to Linux, Android, Windows Embedded CE and other industry leading operating systems (Green Hills, QNX, etc…) – Development tools for Linux and Windows Embedded CE – Proof-of-concept demonstration and example software

• Active open source community accompanied by the world’s largest ecosystem of 3rd party tools and application specific solutions

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HLOS software availability TI owned – No charge

TI owned – No charge

Linux

Android

WinCE*

Community

Commercial

Froyo(2.2) Community

G’bread(2.3) Community

6.0 R3

WEC 7.0

AM17x

Now

Now

Not planned

Not planned

Now

Not planned

AM18x

Now

Now

Community (rowboat)

Not planned

Now

Not planned

OMAP35x

Now

Now

Now

Now

Now

3Q11 #

AM35x

Now

Now

Now

Now

Now

3Q11 #

AM37x

Now

Now

Now

Now

Now

3Q11 #

AM389x

Now

3Q11

Not planned

Now

Not planned

Not planned

Highly reusable software code base enables scaling between Sitara™ ARM MPUs and across TI’s embedded processing portfolio * #

WinCE requires runtime royalties to Microsoft WEC 7 early access available December 2010

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RTOS software availability Green Hills

Wind River

QNX

Mentor

Quadros

Integrity

VxWorks

Neutrino

Nucleus

RTXC

AM17x

Now

Now

Now

Now

Now

AM18x

Now

Now

Now

Now

Now

OMAP35x

Now

Now

Now

Now

Now

AM35x

Now

Now

Now

Now

Now

AM37x

Now

3Q11

Now

Now

Now

AM389x

Now

TBD

TBD

TBD

TBD

• RTOS licensing needs to be done between RTOS partner and customer • Other RTOS: Micro Digital (SMX), Micrium (uC/OS II), and ENEA (OSE5) are available on AM18x

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Software, Tools & Development Kits Overview for Sitara™ ARM® Cortex™-A8 and ARM9™ MPUs Software Highlights

Software Block Diagram

 Android™, Linux®, and WinCE® EZ Software

Development Kits save time and money  Include royalty free board support packages, example    

applications and benchmarks Developed and supported by TI Take full advantage of the processor, graphics and display subsystems Supported on a variety of hardware platforms including evaluation modules and community development boards Develop in your preferred environment  Eclipse-based Code Composer Studio™ IDE  Variety of OS-specific tools  Extended debug capability with TI/commercial JTAG emulators

 Versatile RTOS offering through variety of RTOS partners

 Comprehensive support ecosystem leveraging TI’s E2E and open source development communities available 24/7

Sitara Kits Available Today Sitara Development Boards

SW Support Embedded Processors Wiki TI Software Support SW Partner Network

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Linux® TI provides Linux BSP and SDK Releases NRE or royalty FREE Links • BSP availability/roadmap • SDK availability/roadmap • Linux Tool Chain • Code Composer Studio v5 • Flash Support • TI e2e Linux forum • Embedded processor wiki

– Developed and supported by TI – Major release every 6 months - roughly synchronized with the new kernel releases – Release accessible either through ti.com or through open source GIT Trees – BSP release includes: Linux drivers, UBoot, Linux file system – SDK release includes: BSP release plus graphics SDK (Open GL ES API), Qt framework, performance benchmarks, Matrix application launcher, flashing tool and pin-mux utilities… • Flash support available as plug in

– Standard tool chain (Code Sourcery G++ Lite, CCSv5) provided as part of the SDK release

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Linux® SDK • Enables customers to quickly develop applications on TI platforms and products • Components – Documentation • Quick Start Guide, SW Developer’s Guide, User Guides

– Installer • Easy installation of all SDK components including all target and host software components

– Matrix Application Launcher • User Interfaces based on Qt/WebKit & Ncurses • Touchscreen, mouse and keyboard support

– Example Applications and Demos • Benchmarks, 2D/3D demos, Web browser, WLAN/Bluetooth® support…

– CCSv5 Beta (Eclipse IDE) – • Compile, build, debug (CodeSourcery Lite gcc tool chain) • Qt SDK plug-in • Preconfigured projects for all example applications • Beta timing: September 2010

– Utilities • Flashing Tool, Pin Mux configuration

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Android™ on – www.arowboat.org • Rowboat (www.arowboat.org) – a community portal for Android on TI ARM® Cortex™-A8 platforms – A completely free, open-source project for all customers, developers, and third parties • Supported by TI Development team

Links • Android SW Roadmap • Android Tool Chain

•TI Android e2e Forum • Embedded processor wiki

– Android base port and graphics support available for TI EVMs and Community boards (Beagleboard now) on rowboat. – Includes: Code (binary and source), WiKi, How-to’s, links, IRC, FAQs, and more – Large 3rd party network is contributing on rowboat and providing customized solutions

• TI Android Development Kit – Derived from rowboat to aid customers development and out of the box experience. • Stable periodic snapshots (approx. every 6 months) available on www.ti.com • Tested by TI quality assurance team • Include product specific documentation

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Quick Tour … Browser, Apps, Performance

22

Windows® Embedded Compact 7.0 (Compact 7.0) • Windows Embedded Compact 7.0 is the next generation of CE • It helps to: – Develop rich intuitive user interfaces with the power of Silverlight for Windows Embedded – Experience immersive browsing (IE7) with updated standards support, tabs, pan, zoom and support for Flash10.1 (Flash10.1 support coming soon) – Provide seamless connection to Windows 7 via Windows Device Stage – Consume rich media with a new media library manager and support for rich HD media streaming – Leverage HW better with support for ARM v7 (VFP and Neon support) and hardware graphics acceleration – Deliver quick time to market with a reliable platform and familiar, easyto-use development kits

• More information and download instruction available at – http://www.windowsembedded.com/compact7

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Graphics Support • 3D Graphics SDK is integrated into Linux®, Android® and Windows® Embedded (CE) SDKs – – – – –

Available free to customers/App developers for Linux, Android and WinCE Utilizes POWERVR SGX 3D H/W accelerator Khronos Open API (Open GL ES, Open VG) compliant Standard development kits available for Linux, Android and WinCE Proof-of-concept demonstration and example software with SDK

• Neon Accelerated 2D Graphics library available for Linux SDK from TI – – – –

BitBlt Engine Library Integrated with Qt 1.2 (Object code only) Available for AM and DM37x processors now Customer information required for delivery Download link available with Linux SDK download page

• Neon Accelerated 2D graphics library available for WinCE and Android – Open Source Acceleration for Android (SKIA) – TI library for DirectDraw Acceleration for WinCE – Software as part of TI Android and WinCE deliverables

• Active 3rd party options and application specific solutions

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TI Software Support TI maintains a well-defined process and flow for software support, with robust online resources, tracking mechanisms and quick turnaround responses to customers • Online resources – All questions, issues and enhancement requests are submitted using e2e Community Forums with targeted response time of less than 24 hours

• Connects users directly with engineers developing & supporting TI products • Accesses extensive knowledge base on TI products • TI drives issues to closure and clearly marks answers – Before posting questions, users should check for existing answers on TI’s Embedded Processing Mediawiki or e2e forums – For issues that have tracking numbers, users can use SDOWP to check status

• Software related forums – Development Kits

• Code Composer Studio™ (CCS), TI compilers – Embedded Software

• Linux®, Android™, WinCE®, BIOS , Codecs forums

More… 25

Software Support Flow Step 1

Search issue in Forums/Wikis Search existing FAQs on: • e2e Forums • Embedded Processor Mediawiki

Step 2

Reporting the issue Provide issue information into the relevant SW e2e forum

If Answer Found

No further action required Otherwise, move to step 2

Issue Solved Problem solved Issue Not Solved SW Problem Identified

Move to step 3 Provide additional information: go back to step 2 Information about problem is provided with URL for status tracking – move to step 3

Step 3

Closing the Issue Mark forum thread as answered

If SW Problem Identified

Follow progress on the problem resolution through online access to database if applicable

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Migraine free development with TI Support Product scalability Ease of use Documentation/Sales Collateral Demos Developer Network and community Ecosystem

Sales and Logistics Business model Supply chain logistics Sales channels Market presence and reputation

Software Operating system Industry standard frameworks Software Development Kits (SDK) Applications and benchmarks Development community

Silicon Analog – Power/Signal Chain Roadmap Packaging Quality / Lifecycle commitments

Hardware Platforms System collateral Evaluation hardware System modules Low cost boards Starter kits

Tools Code Composer Studio (TI IDE) eXpressDSP™ Data Visualization tool OS specific tools (Code Sorcery for Linux; Visual Studio for MS Windows Embedded CE, etc) Developer Network tools for enhanced debugging

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