Thermal Management Solutions

Thermal Management Solutions © 2014 Kitagawa Gm GmbH CONTENTS Heat dissipating materials -Heat spreader- Ceramic Heat Sink P1 Heat spreading sh...
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Thermal Management Solutions

©

2014 Kitagawa Gm GmbH

CONTENTS

Heat dissipating materials -Heat spreader-

Ceramic Heat Sink P1

Heat spreading sheet P2

Thermally conductive materials Non-silicon type

First Solution Proposer Thermally conductive sheet P5-6

Thermally conductive vibration damping sheet P7

Thermally conductive materials Silicon type

Thermally conductive sheet P8

How to read markings High thermal conductivity type Generated heat from high heat generating device such as CPUs is released efficiently.

Soft (low hardness) type Reduce the load of components that have issues of mechanical strength for required equipments to be smaller and thinner.

Phase transition type Adhered tightly even for tiny gaps because of liquefaction in high viscosity.

NEW NEW

New product

©

201 2 01 4 Kit Kitag ag ga wa Gmb ga GmbH H

Application example

enclosure Heat-generating IC heat sink Heat-generating IC

PC board

PC board

Thermally conductive sheet used between heat generating component and heat sink.

Thermally conductive sheet used between heat generating component and metal enclosure.

sheet metal

Heat-generating IC

PC board PC board Heat-generating IC enclosure Thermally conductive sheet used between heat generating component and metal enclosure.

Thermally conductive sheet used between heat generating component and sheet metal.

enclosure

Heat spreading sheet Heatgenerating IC Heat spreading sheet

Heat-generating IC

PC board

PC board

sheet metal Heat spreading sheet used for module where temperature difference is not preferable.

Heat spreading sheet used for hot spots within enclosure.

Secondary processing for expansion in application

Round, square and other custom profile as well as half-cutting.

Customized cutting for multi-layer product

Another processing (Custom processing according to your application available. Please feel free to contact KGS sales.) [ANNOTATION] Ɣ'$1*(52)%851,1*$YRLGLQVWDOODWLRQLQH[WUHPHWHPSHUDWHUH FRQGLWLRQRIKHDWLQJHOHPHQW Ɣ:LSHRIIRLOGXVWPRLVWXUHIURPPRXQWLQJVXUIDFH Ɣ'RQRWUHPRYHSURWHFWLYHILOPXQWLOMXVWEHIRUHXVHGXHWRSUHYHQWWKHVXUIDFHIURPLQVHUWLQJRLODQGGXVW Ɣ7KHWKLFNQHVVLQWKLVEURFXUHGRHVQRWLQFOXGHSURWHFWLRQILOP Ɣ'RQRWVWRUDJHSURGXFWVLQWKHDUHDVZLWKFRQGLWLRQVVXFKDVKLJKWHPSUDWXUHKXPLGLW\DQGGLUHFWVXQOLJKW Please storage CHANGE GEL under 35℃. (Recommend temperature:25℃) Ɣ$OOGDWDVKRZQLQWKLVEURFKXUHDUHQRWJXDUDQWHHGYDOXHV Ɣ7KHSURGXFWVZLWKDXWRKHVLRQPLJKWEHKDUGWRUHPRYHZKHQLWLVKHDWFRPSUHVVHG Ɣ8VHUVDUHVROHO\UHVSRQVLEOHIRUPDNLQJSUHOLPLQDU\WHVWVWRGHWHUPLQHWKHVXLWDELOLW\RISURGXFWVIRUWKHLULQWHQGHGXVH Ɣ'HVFULSWLRQVDQGSURGXFWVVKRZQLQWKLVEURFKXUHDUHVXEMHFWWRFKDQJHZLWKRXWQRWLFHIRUWKHVDNHRILPSURYHPHQWV Ɣ6WDWHPHQWVFRQFHUQLQJSRVVLEOHRUVXJJHVWHGXVHVPDGHKHUHLQPD\QRWEHUHOLHGXSRQRUEHFRQVWUXHGDVD guarantee of no patent infringement. ƔProduct might not be for sale by country or region. Ɣ7KHUPDOFRQGXFWLYLW\RIDOOSURGXFWVLVPHDVXUHGLQ4XLFN7KHUPDO&RQGXFWLYLW\0HWHURI.\RWR(OHFWURQLFV 0DQXIDFWXULQJ&R/WG 470 Ɣ,WLVSURKLELWHGUHSULQWRIWKHDUWLFOHLQWKLVEURFKXUHZLWKRXWSULRUZULWWHQFRQVHQWE\.LWDJDZD,QGXVWULHV&R/WG

©

2 4 Kitaga 20 201 gawa wa G Gmb mb H



1(: 1(:

CERACOLD / CECD

3RURXV&HUDPLF+HDW6LQNZLWK excellent insulation properties Heat dissipating materials

Features Ŷ "CECD" provides improved heat dissipation due to a greater surface area to FRQWDFWZLWKWKHDLUDQGEHWWHUWKHUPDOHPLVVLYLW\FRPSDUHGWRDOXPLQXP Ŷ$URXQGOLJKWHUWKDQDOXPLQXP Ŷ1RHOHFWURPDJQHWLFZDYHVHPLWWHGIURP&(&'GXHWRH[FHOOHQWLQVXODWLRQ SURSHUWLHVXQOLNHFRQYHQWLRQDOPHWDOKHDWVLQN

Unit:mm

/

/

3DUW1R

7KLFNQHVVW

/

/

&(&'7







&(&'7







&(&'7







t

Ceramics Adhesive tape

Thermal conductivity

:P・K



Special gravity





9ROXPHUHVLVWLYLW\

ȍ・cm

≧8

Color



Green

$OOVSHFLILFDWLRQVDQGFKDUDFWHULVWLFVVKRZQKHUHLQDUHW\SLFDOYDOXHEXWDUHQRW JXDUDQWHHG

Heat dissipation effect

Heat dissipation effect of heat spreading sheet

Test sample Thermocouple

Heater element

3RZHUVRXUFH

3&ERDUG

Heater element temperature(℃)

Thermally conductive characteristics

 ℃ ℃

℃



68℃

 reference EODQN

Aluminum plate WPP

CERACOLD WPP

〈Measuring conditions〉 +HDWHUHOHPHQWƑPP : Dimensions

ƑPP WPP

(0&HIIHFWZLWKKHDWVLQN 1RLVVXHVZLWKFDSDFLWLYHFRXSOLQJRUDQ\ GLVWXUEDQFH noise due to excellent insulation properties

'LVWXUEDQFHQRLVHLVUHFHLYHGWKURXJKIORDWLQJPHWDO particles acting as antenna

Noise current from IC is transmitted due to capacitive coupling

Metal

IC

0HWDOKHDWVLQN

⇒Radiated noise

Ceramics IC

CERACOLD

©

2014 Kitagawa GmbH

1(: 1(:

Heat spreader sheet / HSD



7KLQDQGIOH[LEOHKHDWVSUHDGLQJVKHHW IRUFRROLQJKRWVSRWV Features

Heat dissipating materials

Ŷ ([FHOOHQWWKHUPDOFRQGXFWLYLW\RQKRUL]RQWDOGLUHFWLRQ $Ɛ:PÂN  Ŷ 'XHWRLWVH[FHOOHQWIOH[LELOLW\LWFDQEHDSSOLHGWRFXUYHGVXUIDFHV Ŷ ,QVXODWLRQILOPFDQEHDSSOLHGWRDGGLQVXODWLRQSURSHUW\

Ŷ 2SWLPDOWKHUPDOVROXWLRQIRUKRWVSRWVRQPRELOHGHYLFHVVXFKDVWDEOHWV URXWHUVDQGRWKHUV

+6'

Aluminum foil(ȝP) 3DUW1R

Thermally conductive DGKHVLYHOD\HU ȝP

+6'/



/

7KLFNQHVV

mm :P・K

Adhesion

NPP

)ODPPDELOLW\

UL

Aluminum foil(ȝP/ȝP)

Thermally conductive DGKHVLYHOD\HU ȝP Liner

+6'

Thermal conductivity (horizontal direction)

Release paper +6'/

Unit

 $OXPLQXP >6 8/Equivalent

8/970Equivalent

$OOVSHFLILFDWLRQVDQGFKDUDFWHULVWLFVVKRZQKHUHLQDUHW\SLFDOYDOXHEXWDUHQRW JXDUDQWHHG

Heat dissipation effect

+HDWGLVWULEXWLRQLPDJHV +6'

UHIHUHQFH EODQN

Test sample

+6'

+6'

Graphite sheet



PET film(ȝP)

PET film(ȝP)

PET film(ȝP)

PET film(ȝP)





Aluminum foil(ȝP)

Aluminum foil(ȝP)

Aluminum foil(ȝP)

Graphite(ȝP)





Thermally conductive adhesive layer(ȝP)

Thermally conductive adhesive layer(ȝP)



Thermography Test sample Thermocouple Heater element

'RXEOHVLGHGDGKHVLYHWDSH(ȝP)

Heat dissipation effect of heat spreading sheet Heater element temperature(℃)

Testing method

Thermally conductive adhesive layer(ȝP)

Power source





 





+6'

+6'

+6'



   

PC board

Reference EODQN

〈Measuring conditions〉 Heater element ƑPP : Test sample  ƑPP

©

2014 Kitagawa GmbH

Graphite sheet (ȝP)

3

Thermally conductive materials Characteristics (Non-silicon type)

Thermally conductive sheet General characteristics

Thermally conductive materials  

Part No.

Unit

CPVT

Color

ʊ

Green

Thickness

mm

0.10/0.15 0.20/0.25

Thermal conductivity

W/m・K

2.0

Hardness

ASKER C

28

(Non-silicon type)

Volume resistivity

ȍ・cm

1.0 × 1013

Flammability

UL94

ʊ

mm

210 × 510

CPVS-F

CPSS

CPV

CPAG

Dark Green

Gray

Gray

1.0/1.5/2.0 2.5/3.0/4.0

0.5/1.0 1.5/2.0/2.4

1.0/2.0 3.0/4.0/5.0

2.0

2.0

> 0.8

0.8

18

8

CPVS

Green 0.3/0.5/1.0 1.5/2.0/2.5

1.0/1.5 2.0/2.5

1.0 × 1012

5.3 × 1011 V-2 (t1.0 - t2.0)

V-2 (t0.5 - t2.0)

V-2 (t1.0 - t3.0 ) V-0 (t4.0)

(54)

(70)

Durometer A 30

Durometer A 64

5.0 × 1013

5.54 × 1011

VTM-0 (t1.0)

V-1 Equivalent※3 V-0 Equivalent※4

*1*2

Standard dimensions

210 × 510

210 × 510

400 × 400

345 × 345

All specifications and characteristics shown herein are typical value, but are not guaranteed.

©

2014 Kitagawa GmbH

Thermally conductive materials Characteristics (Silicon type)

4

Thermally conductive sheet General characteristics SPV

SPVS

Color

ʊ

Green

Green

Thickness

mm

0.5/1.0

0.5/1.0

Thermal conductivity

W/m・K

3.0

5.0

Hardness

ASKER C

40

70

Volume resistivity

ȍ・cm

2.0 × 1011

3.0 × 1011

Flammability

UL94

V-1 Equivalent

V-0

mm

210 × 510

210 × 510

*1*2

All specifications and characteristics shown herein are typical value, but are not guaranteed.

Ɣ Non-Silicone product

0

Ɣ Silicone product

ƔCPSS(p.6)

10

ƔCPVS(p.5) 20 30 40

Hardness

ASKER C

Comparison of characteristics

Hardness

Standard dimensions

50

e anc m r fo per r e h Hig

ƔCPVT(p.5)

SPV(p.9)Ɣ ƔCPV(p.6)

60

SPVS(p.9)Ɣ

ƔCPAG(p.7)

70 80

Thermal高熱伝導 Conductivity

90 100 0 ※



2 3 Thermal Conductivity

4

Hardness of GP1 is shown that of substrate itself ※Products of 0.25mm or less in thickness are not listed herein

Soft type(Low hardness type) Higher flexibility for fitting odd-shaped surface

Intimate contact on odd-shaped surface to produce low thermal resistance.

Soft type

Low load

General type

Low pressure to PC board and enclosure while mounting.

Soft type

©

2014 Kitagawa GmbH

General type

5 W/m・K

(Silicon type)

Unit

Thermally conductive materials  

Part No.



NEW NEW

COOLPROVIDE / CPVT

Ultra-thin, thermally conductive sheet with single sided self-tackiness, suitable for mobile devices where clearance is limited. Features

Thermally conductive materials  

Ŷ Available

thickness ranging from 0.1mm ~ 0.25mm at every 0.05mm pitch. Load to PC board can be minimized by choosing appropriate thickness.

Ŷ Sheet

form with single sided self-tackiness provides better workability compared to grease.

Non-tacky layer Thermally conductive layer with acrylic material

(Non-silicon type)

Thickness

mm

0.10/0.15/0.20/0.25

Thermal conductivity

W/m・K

2.0

Hardness

ASKER C

28

Volume resistivity

ȍ・cm

1.0 × 1013

Color



Green

Liner

All specifications and characteristics shown herein are typical value, but are not guaranteed.

COOLPROVIDE / CPVS Thermal conductive sheet of low hardness (ASKER C18). Features Ŷ Low

hardness (ASKER C18) is realized as a non-silicon Thermal conductive sheet.

Ŷ Because

of excellent conformability, contact resistance can be reduced.

Ŷ Provides

excellent vibration damping solution. (loss factor : 0.9)

Ŷ Pressure

to electronic devices can be reduced after assembly because of excellent stress relief characteristics.

Single sided self-tackiness type/CPVS-F Non-tacky layer Thermally conductive layer with acrylic material Liner

Double sided self-tackiness type/CPVS

Thickness

mm

0.3*1/0.5*1/1.0/1.5/2.0/2.5

Thermal conductivity

W/m・K

2.0

Hardness

ASKER C

18

Volume resistivity

ȍ・cm

5.3 × 1011



0.9

Color



Green

Flammability

UL94

V-2*2

Loss factor

Liner Thermally conductive layer with acrylic material Liner *1

0.3mm、0.5mm : CPVS-F type (Single sided self-tackiness type) only *2See page 6. All specifications and characteristics shown herein are typical value, but are not guaranteed.

©

2014 Kitagawa GmbH

COOLPROVIDE / CPSS

6 Sheet with high thermal conductivity of super low hardness (ASKER C8). Features Ŷ Because

of excellent conformability, contact resistance can be reduced.

low hardness (ASKER C8) is realized as a non-silicon thermally conductive sheet.

Ŷ Because

of excellent flexibility and stree-strain relief characteristic like putty, loads to devices and printed circuit boards can be reduced after assembling.

Single sided self-tackiness type/CPSS-F Non-tacky layer

Liner

mm

1.0/1.5/2.0/2.5/3.0/4.0

Thermal conductivity

W/m・K

2.0

Hardness

ASKER C

8

Volume resistivity

ȍ・cm

1.0 × 1012

Color



Dark Green

Flammability

UL94

Double sided self-tackiness type/CPSS Liner

Vー2 *2

*1)Double sided self-tackiness type:t=4.0mm only. *2)t4.0mm : V-0 All specifications and characteristics shown herein are typical value, but are not guaranteed.

Thermally conductive layer with acrylic material Liner

COOLPROVIDE / CPV

Thermal conductive sheet with wide variety of thickness. Features Ŷ Non-silicone Ŷ Both Ŷ5

thermal conductive sheet with EPDM as a base material.

of mechanical strength and flexibility are provided.

types for 0.5 mm to 2.4 mm are available.

Thermally conductive layer made of EPDM Adhesive layer Liner

Thickness

mm

Thermal conductivity

W/m・K

0.5/1.0/1.5/2.0/2.4 > 0.8 *2 *1

A 30

Hardness

Durometer Type A

Volume resistivity

ȍ・cm

5.0 × 1013

Color



Gray

Flammability

UL94

VTM-0*2

*1)In conformity to JIS K 6253 *2)VTM-0 : t1.0mm All specifications and characteristics shown herein are typical value, but are not guaranteed.

©

2014 Kitagawa GmbH

*1

(Non-silicon type)

Thermally conductive layer with acrylic material

Thickness

Thermally conductive materials  

Ŷ Super

7

NEW NEW

THERMAL DAMPER / CPAG Non-silicone thermally conductive, vibration damping material with thermal conductivity and higher damping performance Features

Thermally conductive materials  

Ŷ Equipped

with both thermal conductivity and higher damping performance.

Ŷ Non-silicone

material

Ŷ Provides

excellent vibration damping solution. (loss factor : 0.9)

Ŷ Provided

in sheet form. Customized profiles are also available.

(Non-silicon type)

Thickness

mm

1.0/2.0/3.0/4.0/5.0

Thermal conductivity

W/m・K

0.8

Loss factor

ʊ

Thermally conductive layer with acrylic material

0.9 *1

Hardness

Durometer Type A

Volume resistivity

ȍ・cm

5.54×1011

Color



Gray

Flammability

UL94

V-1 Equivalent*2 V-0 Equivalent*3

A 64

*1)In conformity to JIS K 6253 *2)IV-1 Equivalent:t2.0mm *3)IV-0 Equivalent:t3.0mm, 4.0mm All specifications and characteristics shown herein are typical value, but are not guaranteed.

2014 Kitagawa GmbH

COOLPROVIDE / SPV

High thermal conductivity type : 3 W/mK Features Ŷ Sheet

of high thermal conductivity with excellent flexibility

Ŷ Available

for temporary fixing by autohesion

Ŷ Available

in two thicknesses, 0.5mm and 0.1mm

Liner Thermally conductive silicone layer Liner

Thickness

mm

0.5 / 1.0

Thermal conductivity

W/m・K

3.0

Hardness

ASKER C

40

Volume resistivity

ȍ・cm

2.0×1011

Color



Green

Flammability

UL94

V-1 Equivalent*

*V-1 Equivalent : t0.5mm All specifications and characteristics shown herein are typical value, but are not guaranteed.

COOLPROVIDE / SPVS

High thermal conductivity type : 5 W/mK Features  Ŷ UL94

V-0 recognized product.

Ŷ Available

for temporary fixing by autohesion

Ŷ Available

in two thicknesses, 0.5mm and 0.1mm

Thickness

mm

0.5 / 1.0

Thermal conductivity

W/m・K

5.0

Thermally conductive silicone layer

Hardness

ASKER C

70

Liner

Volume resistivity

ȍ・cm

3.0×1011

Color



Green

Flammability

UL94

V-0

Liner

All specifications and characteristics shown herein are typical value, but are not guaranteed.

©

2014 Kitagawa GmbH

Terminology

Low molecular weight siloxane

Labeled as D3 (trimer), D4 (tetramer) and D5 (pentamer) according to the amount of bonding molecular of Cyclic dimethyl (D-units: Molecular formula SiO(CH3)2). Up to D20 are called low molecular cyclic siloxane or simply low molecular siloxane. Among other things, D3~D10 are indices for silicone quality standard to avoid contact faults.

CH3

Dn:

ATTENTION: Due to its high volatility, low molecular siloxane evaporates into the atmosphere as vapor even at room temperature.

Si-0 CH3 n

n=3∼10

・Electrical or electric circuit failure: Insulating silica is deposited which causes contact faults. ・Impact on optical equipment: Optical characteristics change when low molecular siloxane is deposited onto optical components. Thermal conductivity and thermal resistance

Thermal basic formula: )RXULHU V(TXDWLRQ4 Ȝî ǻ7・S)/d) 44XDQWLW\RIKHDW : Ȝ7KHUPDOFRQGXFWLYLW\ :P・K), ǻ77HPSHUDWXUHGLIIHUHQFH6&URVVVHFWLRQDODUHDG'LVWDQFH Thermal conductivity: Heat property of a material to conduct heat * This value is not affected by surrounding environment such as equipment used. * The thinner the material is, the smaller the temperature difference is. Ȝ 7KHUPDOFRQGXFWLYLW\) = (Q・G  ǻ7・S)   Gǻ7 FRQVWDQW Thermal impedance: Heat property of a material to restrict a heat flow * This value changes depending on a distance from a heat source, adhesion and area even the same thermally conductive pad is used.   * This value can be made small when the area is big, thermal conductivity is high and the distance (thickness) is short. R1(Thermal impedance):℃: G Ȝ・S) Volume resistivity (Compliance to JIS K 6911)

In general, electrical resistance is used to measure electrical conductivity (ability to conduct an electric current) of a substance (material). Volume resistivity is electrical resistance per unit volume (1cm x 1cm x 1cm) and is represented by (ȍ・㎝). Each material has a specific resistivity. This value is calculated by measuring potential difference (V) between two electrodes which are apart by the distance of (L) when constant current I (A) is applied to cross sectional area (W x t) as indicated on the right.

Tensile shear strength(JIS K 6850)

To calculate tensile shear strength, the maximum stress, which breaks the bonding surface while materials are being pulled in a parallel direction to the bonding surface, is divided by the bonding surface area (shear area).

©

2014 Kitagawa GmbH

Electric current I

Potential difference



L

t

W