Thermal Management Solutions
©
2014 Kitagawa Gm GmbH
CONTENTS
Heat dissipating materials -Heat spreader-
Ceramic Heat Sink P1
Heat spreading sheet P2
Thermally conductive materials Non-silicon type
First Solution Proposer Thermally conductive sheet P5-6
Thermally conductive vibration damping sheet P7
Thermally conductive materials Silicon type
Thermally conductive sheet P8
How to read markings High thermal conductivity type Generated heat from high heat generating device such as CPUs is released efficiently.
Soft (low hardness) type Reduce the load of components that have issues of mechanical strength for required equipments to be smaller and thinner.
Phase transition type Adhered tightly even for tiny gaps because of liquefaction in high viscosity.
NEW NEW
New product
©
201 2 01 4 Kit Kitag ag ga wa Gmb ga GmbH H
Application example
enclosure Heat-generating IC heat sink Heat-generating IC
PC board
PC board
Thermally conductive sheet used between heat generating component and heat sink.
Thermally conductive sheet used between heat generating component and metal enclosure.
sheet metal
Heat-generating IC
PC board PC board Heat-generating IC enclosure Thermally conductive sheet used between heat generating component and metal enclosure.
Thermally conductive sheet used between heat generating component and sheet metal.
enclosure
Heat spreading sheet Heatgenerating IC Heat spreading sheet
Heat-generating IC
PC board
PC board
sheet metal Heat spreading sheet used for module where temperature difference is not preferable.
Heat spreading sheet used for hot spots within enclosure.
Secondary processing for expansion in application
Round, square and other custom profile as well as half-cutting.
Customized cutting for multi-layer product
Another processing (Custom processing according to your application available. Please feel free to contact KGS sales.) [ANNOTATION] Ɣ'$1*(52)%851,1*$YRLGLQVWDOODWLRQLQH[WUHPHWHPSHUDWHUH FRQGLWLRQRIKHDWLQJHOHPHQW Ɣ:LSHRIIRLOGXVWPRLVWXUHIURPPRXQWLQJVXUIDFH Ɣ'RQRWUHPRYHSURWHFWLYHILOPXQWLOMXVWEHIRUHXVHGXHWRSUHYHQWWKHVXUIDFHIURPLQVHUWLQJRLODQGGXVW Ɣ7KHWKLFNQHVVLQWKLVEURFXUHGRHVQRWLQFOXGHSURWHFWLRQILOP Ɣ'RQRWVWRUDJHSURGXFWVLQWKHDUHDVZLWKFRQGLWLRQVVXFKDVKLJKWHPSUDWXUHKXPLGLW\DQGGLUHFWVXQOLJKW Please storage CHANGE GEL under 35℃. (Recommend temperature:25℃) Ɣ$OOGDWDVKRZQLQWKLVEURFKXUHDUHQRWJXDUDQWHHGYDOXHV Ɣ7KHSURGXFWVZLWKDXWRKHVLRQPLJKWEHKDUGWRUHPRYHZKHQLWLVKHDWFRPSUHVVHG Ɣ8VHUVDUHVROHO\UHVSRQVLEOHIRUPDNLQJSUHOLPLQDU\WHVWVWRGHWHUPLQHWKHVXLWDELOLW\RISURGXFWVIRUWKHLULQWHQGHGXVH Ɣ'HVFULSWLRQVDQGSURGXFWVVKRZQLQWKLVEURFKXUHDUHVXEMHFWWRFKDQJHZLWKRXWQRWLFHIRUWKHVDNHRILPSURYHPHQWV Ɣ6WDWHPHQWVFRQFHUQLQJSRVVLEOHRUVXJJHVWHGXVHVPDGHKHUHLQPD\QRWEHUHOLHGXSRQRUEHFRQVWUXHGDVD guarantee of no patent infringement. ƔProduct might not be for sale by country or region. Ɣ7KHUPDOFRQGXFWLYLW\RIDOOSURGXFWVLVPHDVXUHGLQ4XLFN7KHUPDO&RQGXFWLYLW\0HWHURI.\RWR(OHFWURQLFV 0DQXIDFWXULQJ&R/WG470 Ɣ,WLVSURKLELWHGUHSULQWRIWKHDUWLFOHLQWKLVEURFKXUHZLWKRXWSULRUZULWWHQFRQVHQWE\.LWDJDZD,QGXVWULHV&R/WG
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CERACOLD / CECD
3RURXV&HUDPLF+HDW6LQNZLWK excellent insulation properties Heat dissipating materials
Features Ŷ "CECD" provides improved heat dissipation due to a greater surface area to FRQWDFWZLWKWKHDLUDQGEHWWHUWKHUPDOHPLVVLYLW\FRPSDUHGWRDOXPLQXP Ŷ$URXQGOLJKWHUWKDQDOXPLQXP Ŷ1RHOHFWURPDJQHWLFZDYHVHPLWWHGIURP&(&'GXHWRH[FHOOHQWLQVXODWLRQ SURSHUWLHVXQOLNHFRQYHQWLRQDOPHWDOKHDWVLQN
Unit:mm
/
/
3DUW1R
7KLFNQHVVW
/
/
&(&'7
&(&'7
&(&'7
t
Ceramics Adhesive tape
Thermal conductivity
:P・K
Special gravity
ー
9ROXPHUHVLVWLYLW\
ȍ・cm
≧8
Color
ー
Green
$OOVSHFLILFDWLRQVDQGFKDUDFWHULVWLFVVKRZQKHUHLQDUHW\SLFDOYDOXHEXWDUHQRW JXDUDQWHHG
Heat dissipation effect
Heat dissipation effect of heat spreading sheet
Test sample Thermocouple
Heater element
3RZHUVRXUFH
3&ERDUG
Heater element temperature(℃)
Thermally conductive characteristics
℃ ℃
℃
68℃
reference EODQN
Aluminum plate WPP
CERACOLD WPP
〈Measuring conditions〉 +HDWHUHOHPHQWƑPP: Dimensions
ƑPPWPP
(0&HIIHFWZLWKKHDWVLQN 1RLVVXHVZLWKFDSDFLWLYHFRXSOLQJRUDQ\ GLVWXUEDQFH noise due to excellent insulation properties
'LVWXUEDQFHQRLVHLVUHFHLYHGWKURXJKIORDWLQJPHWDO particles acting as antenna
Noise current from IC is transmitted due to capacitive coupling
Metal
IC
0HWDOKHDWVLQN
⇒Radiated noise
Ceramics IC
CERACOLD
©
2014 Kitagawa GmbH
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Heat spreader sheet / HSD
7KLQDQGIOH[LEOHKHDWVSUHDGLQJVKHHW IRUFRROLQJKRWVSRWV Features
Heat dissipating materials
Ŷ ([FHOOHQWWKHUPDOFRQGXFWLYLW\RQKRUL]RQWDOGLUHFWLRQ$Ɛ:PÂN Ŷ 'XHWRLWVH[FHOOHQWIOH[LELOLW\LWFDQEHDSSOLHGWRFXUYHGVXUIDFHV Ŷ ,QVXODWLRQILOPFDQEHDSSOLHGWRDGGLQVXODWLRQSURSHUW\
Ŷ 2SWLPDOWKHUPDOVROXWLRQIRUKRWVSRWVRQPRELOHGHYLFHVVXFKDVWDEOHWV URXWHUVDQGRWKHUV
+6'
Aluminum foil(ȝP) 3DUW1R
Thermally conductive DGKHVLYHOD\HUȝP
+6'/
/
7KLFNQHVV
mm :P・K
Adhesion
NPP
)ODPPDELOLW\
UL
Aluminum foil(ȝP/ȝP)
Thermally conductive DGKHVLYHOD\HUȝP Liner
+6'
Thermal conductivity (horizontal direction)
Release paper +6'/
Unit
$OXPLQXP >6 8/Equivalent
8/970Equivalent
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Heat dissipation effect
+HDWGLVWULEXWLRQLPDJHV +6'
UHIHUHQFHEODQN
Test sample
+6'
+6'
Graphite sheet
①
PET film(ȝP)
PET film(ȝP)
PET film(ȝP)
PET film(ȝP)
②
②
Aluminum foil(ȝP)
Aluminum foil(ȝP)
Aluminum foil(ȝP)
Graphite(ȝP)
③
③
Thermally conductive adhesive layer(ȝP)
Thermally conductive adhesive layer(ȝP)
①
Thermography Test sample Thermocouple Heater element
'RXEOHVLGHGDGKHVLYHWDSH(ȝP)
Heat dissipation effect of heat spreading sheet Heater element temperature(℃)
Testing method
Thermally conductive adhesive layer(ȝP)
Power source
+6'
+6'
+6'
PC board
Reference EODQN
〈Measuring conditions〉 Heater element ƑPP: Test sample ƑPP
©
2014 Kitagawa GmbH
Graphite sheet (ȝP)
3
Thermally conductive materials Characteristics (Non-silicon type)
Thermally conductive sheet General characteristics
Thermally conductive materials
Part No.
Unit
CPVT
Color
ʊ
Green
Thickness
mm
0.10/0.15 0.20/0.25
Thermal conductivity
W/m・K
2.0
Hardness
ASKER C
28
(Non-silicon type)
Volume resistivity
ȍ・cm
1.0 × 1013
Flammability
UL94
ʊ
mm
210 × 510
CPVS-F
CPSS
CPV
CPAG
Dark Green
Gray
Gray
1.0/1.5/2.0 2.5/3.0/4.0
0.5/1.0 1.5/2.0/2.4
1.0/2.0 3.0/4.0/5.0
2.0
2.0
> 0.8
0.8
18
8
CPVS
Green 0.3/0.5/1.0 1.5/2.0/2.5
1.0/1.5 2.0/2.5
1.0 × 1012
5.3 × 1011 V-2 (t1.0 - t2.0)
V-2 (t0.5 - t2.0)
V-2 (t1.0 - t3.0 ) V-0 (t4.0)
(54)
(70)
Durometer A 30
Durometer A 64
5.0 × 1013
5.54 × 1011
VTM-0 (t1.0)
V-1 Equivalent※3 V-0 Equivalent※4
*1*2
Standard dimensions
210 × 510
210 × 510
400 × 400
345 × 345
All specifications and characteristics shown herein are typical value, but are not guaranteed.
©
2014 Kitagawa GmbH
Thermally conductive materials Characteristics (Silicon type)
4
Thermally conductive sheet General characteristics SPV
SPVS
Color
ʊ
Green
Green
Thickness
mm
0.5/1.0
0.5/1.0
Thermal conductivity
W/m・K
3.0
5.0
Hardness
ASKER C
40
70
Volume resistivity
ȍ・cm
2.0 × 1011
3.0 × 1011
Flammability
UL94
V-1 Equivalent
V-0
mm
210 × 510
210 × 510
*1*2
All specifications and characteristics shown herein are typical value, but are not guaranteed.
Ɣ Non-Silicone product
0
Ɣ Silicone product
ƔCPSS(p.6)
10
ƔCPVS(p.5) 20 30 40
Hardness
ASKER C
Comparison of characteristics
Hardness
Standard dimensions
50
e anc m r fo per r e h Hig
ƔCPVT(p.5)
SPV(p.9)Ɣ ƔCPV(p.6)
60
SPVS(p.9)Ɣ
ƔCPAG(p.7)
70 80
Thermal高熱伝導 Conductivity
90 100 0 ※
1
2 3 Thermal Conductivity
4
Hardness of GP1 is shown that of substrate itself ※Products of 0.25mm or less in thickness are not listed herein
Soft type(Low hardness type) Higher flexibility for fitting odd-shaped surface
Intimate contact on odd-shaped surface to produce low thermal resistance.
Soft type
Low load
General type
Low pressure to PC board and enclosure while mounting.
Soft type
©
2014 Kitagawa GmbH
General type
5 W/m・K
(Silicon type)
Unit
Thermally conductive materials
Part No.
5
NEW NEW
COOLPROVIDE / CPVT
Ultra-thin, thermally conductive sheet with single sided self-tackiness, suitable for mobile devices where clearance is limited. Features
Thermally conductive materials
Ŷ Available
thickness ranging from 0.1mm ~ 0.25mm at every 0.05mm pitch. Load to PC board can be minimized by choosing appropriate thickness.
Ŷ Sheet
form with single sided self-tackiness provides better workability compared to grease.
Non-tacky layer Thermally conductive layer with acrylic material
(Non-silicon type)
Thickness
mm
0.10/0.15/0.20/0.25
Thermal conductivity
W/m・K
2.0
Hardness
ASKER C
28
Volume resistivity
ȍ・cm
1.0 × 1013
Color
ー
Green
Liner
All specifications and characteristics shown herein are typical value, but are not guaranteed.
COOLPROVIDE / CPVS Thermal conductive sheet of low hardness (ASKER C18). Features Ŷ Low
hardness (ASKER C18) is realized as a non-silicon Thermal conductive sheet.
Ŷ Because
of excellent conformability, contact resistance can be reduced.
Ŷ Provides
excellent vibration damping solution. (loss factor : 0.9)
Ŷ Pressure
to electronic devices can be reduced after assembly because of excellent stress relief characteristics.
Single sided self-tackiness type/CPVS-F Non-tacky layer Thermally conductive layer with acrylic material Liner
Double sided self-tackiness type/CPVS
Thickness
mm
0.3*1/0.5*1/1.0/1.5/2.0/2.5
Thermal conductivity
W/m・K
2.0
Hardness
ASKER C
18
Volume resistivity
ȍ・cm
5.3 × 1011
ー
0.9
Color
ー
Green
Flammability
UL94
V-2*2
Loss factor
Liner Thermally conductive layer with acrylic material Liner *1
0.3mm、0.5mm : CPVS-F type (Single sided self-tackiness type) only *2See page 6. All specifications and characteristics shown herein are typical value, but are not guaranteed.
©
2014 Kitagawa GmbH
COOLPROVIDE / CPSS
6 Sheet with high thermal conductivity of super low hardness (ASKER C8). Features Ŷ Because
of excellent conformability, contact resistance can be reduced.
low hardness (ASKER C8) is realized as a non-silicon thermally conductive sheet.
Ŷ Because
of excellent flexibility and stree-strain relief characteristic like putty, loads to devices and printed circuit boards can be reduced after assembling.
Single sided self-tackiness type/CPSS-F Non-tacky layer
Liner
mm
1.0/1.5/2.0/2.5/3.0/4.0
Thermal conductivity
W/m・K
2.0
Hardness
ASKER C
8
Volume resistivity
ȍ・cm
1.0 × 1012
Color
ー
Dark Green
Flammability
UL94
Double sided self-tackiness type/CPSS Liner
Vー2 *2
*1)Double sided self-tackiness type:t=4.0mm only. *2)t4.0mm : V-0 All specifications and characteristics shown herein are typical value, but are not guaranteed.
Thermally conductive layer with acrylic material Liner
COOLPROVIDE / CPV
Thermal conductive sheet with wide variety of thickness. Features Ŷ Non-silicone Ŷ Both Ŷ5
thermal conductive sheet with EPDM as a base material.
of mechanical strength and flexibility are provided.
types for 0.5 mm to 2.4 mm are available.
Thermally conductive layer made of EPDM Adhesive layer Liner
Thickness
mm
Thermal conductivity
W/m・K
0.5/1.0/1.5/2.0/2.4 > 0.8 *2 *1
A 30
Hardness
Durometer Type A
Volume resistivity
ȍ・cm
5.0 × 1013
Color
ー
Gray
Flammability
UL94
VTM-0*2
*1)In conformity to JIS K 6253 *2)VTM-0 : t1.0mm All specifications and characteristics shown herein are typical value, but are not guaranteed.
©
2014 Kitagawa GmbH
*1
(Non-silicon type)
Thermally conductive layer with acrylic material
Thickness
Thermally conductive materials
Ŷ Super
7
NEW NEW
THERMAL DAMPER / CPAG Non-silicone thermally conductive, vibration damping material with thermal conductivity and higher damping performance Features
Thermally conductive materials
Ŷ Equipped
with both thermal conductivity and higher damping performance.
Ŷ Non-silicone
material
Ŷ Provides
excellent vibration damping solution. (loss factor : 0.9)
Ŷ Provided
in sheet form. Customized profiles are also available.
(Non-silicon type)
Thickness
mm
1.0/2.0/3.0/4.0/5.0
Thermal conductivity
W/m・K
0.8
Loss factor
ʊ
Thermally conductive layer with acrylic material
0.9 *1
Hardness
Durometer Type A
Volume resistivity
ȍ・cm
5.54×1011
Color
ー
Gray
Flammability
UL94
V-1 Equivalent*2 V-0 Equivalent*3
A 64
*1)In conformity to JIS K 6253 *2)IV-1 Equivalent:t2.0mm *3)IV-0 Equivalent:t3.0mm, 4.0mm All specifications and characteristics shown herein are typical value, but are not guaranteed.
2014 Kitagawa GmbH
COOLPROVIDE / SPV
High thermal conductivity type : 3 W/mK Features Ŷ Sheet
of high thermal conductivity with excellent flexibility
Ŷ Available
for temporary fixing by autohesion
Ŷ Available
in two thicknesses, 0.5mm and 0.1mm
Liner Thermally conductive silicone layer Liner
Thickness
mm
0.5 / 1.0
Thermal conductivity
W/m・K
3.0
Hardness
ASKER C
40
Volume resistivity
ȍ・cm
2.0×1011
Color
ー
Green
Flammability
UL94
V-1 Equivalent*
*V-1 Equivalent : t0.5mm All specifications and characteristics shown herein are typical value, but are not guaranteed.
COOLPROVIDE / SPVS
High thermal conductivity type : 5 W/mK Features Ŷ UL94
V-0 recognized product.
Ŷ Available
for temporary fixing by autohesion
Ŷ Available
in two thicknesses, 0.5mm and 0.1mm
Thickness
mm
0.5 / 1.0
Thermal conductivity
W/m・K
5.0
Thermally conductive silicone layer
Hardness
ASKER C
70
Liner
Volume resistivity
ȍ・cm
3.0×1011
Color
ー
Green
Flammability
UL94
V-0
Liner
All specifications and characteristics shown herein are typical value, but are not guaranteed.
©
2014 Kitagawa GmbH
Terminology
Low molecular weight siloxane
Labeled as D3 (trimer), D4 (tetramer) and D5 (pentamer) according to the amount of bonding molecular of Cyclic dimethyl (D-units: Molecular formula SiO(CH3)2). Up to D20 are called low molecular cyclic siloxane or simply low molecular siloxane. Among other things, D3~D10 are indices for silicone quality standard to avoid contact faults.
CH3
Dn:
ATTENTION: Due to its high volatility, low molecular siloxane evaporates into the atmosphere as vapor even at room temperature.
Si-0 CH3 n
n=3∼10
・Electrical or electric circuit failure: Insulating silica is deposited which causes contact faults. ・Impact on optical equipment: Optical characteristics change when low molecular siloxane is deposited onto optical components. Thermal conductivity and thermal resistance
Thermal basic formula: )RXULHU V(TXDWLRQ4 Ȝîǻ7・S)/d) 44XDQWLW\RIKHDW: Ȝ7KHUPDOFRQGXFWLYLW\:P・K), ǻ77HPSHUDWXUHGLIIHUHQFH6&URVVVHFWLRQDODUHDG'LVWDQFH Thermal conductivity: Heat property of a material to conduct heat * This value is not affected by surrounding environment such as equipment used. * The thinner the material is, the smaller the temperature difference is. Ȝ7KHUPDOFRQGXFWLYLW\) = (Q・G ǻ7・S) Gǻ7 FRQVWDQW Thermal impedance: Heat property of a material to restrict a heat flow * This value changes depending on a distance from a heat source, adhesion and area even the same thermally conductive pad is used. * This value can be made small when the area is big, thermal conductivity is high and the distance (thickness) is short. R1(Thermal impedance):℃: GȜ・S) Volume resistivity (Compliance to JIS K 6911)
In general, electrical resistance is used to measure electrical conductivity (ability to conduct an electric current) of a substance (material). Volume resistivity is electrical resistance per unit volume (1cm x 1cm x 1cm) and is represented by (ȍ・㎝). Each material has a specific resistivity. This value is calculated by measuring potential difference (V) between two electrodes which are apart by the distance of (L) when constant current I (A) is applied to cross sectional area (W x t) as indicated on the right.
Tensile shear strength(JIS K 6850)
To calculate tensile shear strength, the maximum stress, which breaks the bonding surface while materials are being pulled in a parallel direction to the bonding surface, is divided by the bonding surface area (shear area).
©
2014 Kitagawa GmbH
Electric current I
Potential difference
V
L
t
W