The importance and relevance of advanced electron microscopy in nanotechnology Dr Debbie Stokes

Overview • Advanced electron microscopy and FEI Company • Role of electron microscopy in nanotechnology • Specific examples • Key challenges in nanotechnology

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FEI facilities Eindhoven NL EO Product Division 475 employees

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Plus Shanghai, China, just opened

Nanotechnology applications: nanofabrication Deposition

FOV = 10x10 μm2 Cap of piezo resistive pressure sensor (KU Leuven, Belgium)

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Milling

FOV = 2x2 μm2 Fresnel Micro Lens

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Lithography

FOV = 5x5 μm2 Nano Arrays

The NextGen TEM FEI Company selected to work with five DoE labs: • Berkeley • Frederick Seitz • Argonne • Oak Ridge • Brookhaven

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Titan S/TEM

0.1nm Image : B. Freitag , FEI

Movement of single atoms on surface can be monitored 6

Atoms are activated by focusing the beam maximal on the area FEI Copyright © 2007

HR-TEM on Silicon TITAN image Cs-corrector vs. non-Cs corrected TEM @ 300kV

5 nm

5 nm

Images and FSR : B.Freitag, Sample J.Thibault, Marseille 7

Non-Cs-corrected HR-TEM FEI Copyright © 2007

Cs corrected HR-TEM

Transistor gate (TITAN Cs-corrected vs. non-corrected TEM @ 300 kV)

5 nm

5 nm Non Cs-corrected HR-TEM

Cs-corrected HR-TEM

More accurate interface structure determination (roughness) 8

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HR-TEM Example: Si3N4 (001), NCSI TITAN 80-300 U = 300 kV 1 / gmax = 0.8 Å CS = – 13 µm Zopt = + 6 nm [010]

Si N 0.85 Å

[100] Karsten Tillmann, Lothar Houben, 9

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SWCNT PbTe and CuBr, Cs-corrected at 80 kV

5 nm

2 nm 2 nm

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Nanoparticles with Cs-corrected TEM (gold nano-particles)

Better detection of small nano-particles (