The Eyes of the Space Imaging Systems

March 07, 2013 Sukhbir Kullar Senior Program Manager – Aerospace, Teledyne DALSA

Agenda • Brief Overview on Teledyne DALSA • Space Imaging Heritage • Multispectral Sensors • Hyperspectral Sensors

Teledyne DALSA at a Glance • Provider of high performance digital imaging and semiconductor solutions • Operations based in Canada, US and Netherlands • Sales and customer support offices in many countries • 1100 employees world-wide • Parent company is Teledyne Technologies Incorporated • Headquarters in Thousand Oaks, CA • Revenue of $2.1 billion in 2012

Digital Imaging Applications • Teledyne DALSA supplies digital imaging components for diverse applications • Machine vision / industrial inspection • Life sciences • Human Vision • Space imaging / Defense and Security

Breakdown of Revenue By End Market Application

Wafer Foundry • CCD • 0.5um processes

• High-voltage CMOS • World's leading "pure play" MEMS foundry • Manufacturing tiny mechanical devices used in game controllers, cell phones, and laptops

Moving Beyond the Visible Spectrum • Traditionally been a supplier of visible imaging components • Moving beyond visible light to provide components and systems that can capture x-ray and infrared images

X-ray Imaging

Visible Light Imaging

Infrared Imaging

Vertically Integrated Supplier • We are the digital imaging industry’s only completely vertically integrated supplier, offering “Silicon to Smart Cameras”

Frame Grabbers Digital Cameras Image Sensors

Secure supply of silicon wafers

Smart Image Processing Cameras Software

Heritage

Canadarm2 onboard ISS • Area scan camera and sensor • 2/3" 768H x 488V ILT CCD

• Compact multi-PCB electronics module • Deployed in 2001

Mars Rovers Spirit and Opportunity – 2004 • Teledyne DALSA-built image sensor chips are the eyes of the Mars Twin Rovers • Nine 1K x 1K CCD image sensors • Joint development with JPL

Mars Rovers Curiosity – 2012 • Teledyne DALSA-built image sensor chips are responsible for navigation and hazard avoidance • 12 1K x 1K CCD image sensors • Five different Teledyne businesses contributed to the launch, landing, and operation of the Curiosity Rover

Photogrammetry • World’s leading supplier of wafer scale image sensors for photogrammetry • Customers include the leading photogrammetry camera OEMs who produce high-quality urban maps, large-scale ortho photos and stereo imagery for services such as Google Earth and Bing Maps • Imagers up to 250 million pixels

Astronomy • World’s first 100+ megapixel image sensor in 2006 • 10,560 x 10,560 pixels • Developed for Semiconductor Technology Associates for Astrometry Department of the U.S. Naval Observatory

MUSES onboard ISS Multi-User System for Earth Sensing • NASA awarded this contract to Teledyne Brown • An earth imaging platform designed to host high-resolution digital cameras • Teledyne will operate and maintain the system • Teledyne DALSA’s sensors are expected to be used in this instrument • Launch scheduled in early 2015

OSIRIS-REx Mission • An Asteroid sample return mission • Teledyne DALSA’s sensor will be used in three cameras – PolyCam, MapCam and SamCam • Flight model delivery in Q1’2014 • Launch scheduled in 2016 • Sample return in 2023

Image Sensors for Space • 20+ year space imaging heritage • 1993: World’s first 25M pixel image sensor • Business has quadrupled in past decade, totaling about 15% of Teledyne DALSA’s revenue • "ITAR free" solutions subject to Canadian export controls

• Broad capabilities • • • • • •

CCD and CMOS, radiation tolerance Linescan, TDI, and areascan High resolution (up to wafer scale) High speed (up to 100 million fps) Backside thinning Hyperspectral and Multispectral

Multispectral and Hyperspectral Sensors

Multispectral / Hyperspectral Comparison Multispectral Used to discriminate features and patterns Patterned filter coatings form part of the sensor

Creates a dataset with narrow bands over discrete frequency ranges

Has discrete spectral bands (typically < 20)

Higher resolution and relatively smaller dataset

Hyperspectral Used to identify and characterize materials A prism or grating is placed in front of sensor for separating different wavelengths

Creates a hyperspectral data cube with narrower bands over a continuous range

Has continuous spectral bands (typically 100s)

Lower resolution and much larger dataset

Multispectral Sensors Image Sensor - Silicon • Monolithic • Compact design • Different pixel sizes for P and B zones • TDI design for increased sensitivity and throughput • Special design & timing for low crosstalk

Spectral zone B1 (20x20 μm2) I s o l a t i o n

Spectral zone B2 (20x20 μm2) I s o l a t i o n

r o w s

Spectral zone B3 (20x20 μm2) I s o l a t i o n

r o w s

Spectral zone B4 (20x20 μm2) I s o l a t i o n

r o w s

Spectral zone P (10x10 μm2) I s o l a t i o n

• Designed to withstand harsh environmental conditions

r o w s

r o w s

Multispectral Sensors Filters • Patterned coatings deposited directly on the optical lid

100 90

Transmittance (%)

80 70 60 P

50

B4

40

B3

30

B2 B1

20 10 0 300

400

500

600

700 800 Wavelength (nm)

900

1000

1100

1200

Multispectral Sensors Pixel Count

Pixel Size (um)

Max Data Rate (MHz)

MIL-STD Testing

Radiation Testing (krad)

P: 12k - 4k 3-4 B: 1k - 3k

7, 8.75, 10 17.5, 20, 28, 35

6.25 - 33

Yes

20 - 30

4-band, 4k MS CCD

5-band, 6k MS CCD

5-band, 12k MS CCD

Hyperspectral Sensors • A prism or grating placed in front of the sensor for separating different wavelengths • Separated wavelengths fall on different rows of the image sensor • Image sensor reads out the information for different wavelengths forming a hyperspectral data cube

Hyperspectral Sensors • Backside thinned for good QE • High frame rate (>300fps) • Fast transfer time (