Taking the Stress out of Packaging

Taking the Stress out of Packaging Adrian Arcedera l Sr. Director, MEMS and Sensor Products Sep-14 1 About Amkor Technology Amkor Technology, Inc....
Author: Brandon Phelps
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Taking the Stress out of Packaging Adrian Arcedera l Sr. Director, MEMS and Sensor Products

Sep-14

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About Amkor Technology Amkor Technology, Inc. is one of the world's largest and most accomplished providers of state-of-the-art packaging design, assembly and test services. Founded in 1968, Amkor is a strategic partner to leading semiconductor companies and electronics OEMs. Our operational base encompasses over 5.8M ft2 of volume production, development, sales and support services in Asia, Europe and the United States. Our solutions enable our customers to focus on semiconductor design and wafer fabrication while utilizing Amkor as their turnkey provider and, where required, their packaging technology innovator.

Sep-14

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MEMS and Sensor Experience

CCD Sensor 1980s

Ceramic/ Hermetic Package 1990s

ChipArray® BGA, MLF®, Fingerprint, SOIC 2000

2002

2005

Cavity MEMS, In-Frame MLF®, Cavity SOIC 2008

2009

Laminate to Laminate 2011

Film Assist SOIC 2012

MLF®, Cavity MEMS Polymer Lid 2013

Sep-14

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Growth and Adoption of Automotive MEMS Sensors The role of government regulations in the MEMS market

Fuel Economy Improvements

Tire Pressure Monitoring

Electronic Stability Control

Airbags

1970’s

1980’s

Pedestrian/ Collision Avoidance?

1990’s

2000’s

2010’s

2020’s Sep-14

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Rapid Growth in Consumer MEMS

Color Inkjet

iPhone

Nintendo Wii