VLMO31.. Vishay Semiconductors
Standard SMD LED PLCC2 FEATURES • Lead (Pb)-free product - RoHS compliant • SMD LED with exceptional brightness • Luminous intensity categorized e3 • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with IR reflow, vapor phase and wave solder processes according to CECC 00802 and J-STD-020C • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Lead (Pb)-free device • Preconditioning: acc. to JEDEC level 2a • ESD-withstand voltage up to 2 kV according to JESD22-A114-B
94 8553
DESCRIPTION This device has been designed for applications requiring narrow brightness and color selection. The package of this device is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: standard • Angle of half intensity: ± 60°
APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use
PARTS TABLE PART
COLOR, LUMINOUS INTENSITY
TECHNOLOGY
VLMO31J1K2-GS08
Soft orange, IV = (4.5 to 11.2) mcd
GaAsP on GaP
VLMO31J1K2-GS18
Soft orange, IV = (4.5 to 11.2) mcd
GaAsP on GaP
VLMO31J1L2-GS08
Soft orange, IV = (4.5 to 18) mcd
GaAsP on GaP
VLMO31J1L2-GS18
Soft orange, IV = (4.5 to 18) mcd
GaAsP on GaP
VLMO31K1L2-GS08
Soft orange, IV = (7.1 to 18) mcd
GaAsP on GaP
VLMO31K1L2-GS18
Soft orange, IV = (7.1 to 18) mcd
GaAsP on GaP
Document Number 81333 Rev. 1.2, 11-Sep-07
www.vishay.com 1
VLMO31.. Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMO31.. PARAMETER
TEST CONDITION
SYMBOL
VALUE
VR
6
V
Tamb ≤ 60 °C
IF
30
mA
tp ≤ 10 µs
IFSM
0.5
A
PV
100
mW
Reverse voltage2) DC Forward current Surge forward current Power dissipation Junction temperature
UNIT
Tj
100
°C
Operating temperature range
Tamb
- 40 to + 100
°C
Storage temperature range
Tstg
- 40 to + 100
°C
t≤5s
Tsd
260
°C
mounted on PC board (pad size > 16 mm2)
RthJA
400
K/W
Soldering temperature Thermal resistance junction/ambient
Note: 1) Tamb = 25 °C unless otherwise specified 2) Driving LED in reverse direction is suitable for short term application
OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMO31.., SOFT ORANGE PARAMETER Luminous
TEST CONDITION
intensity2)
IF = 10 mA
PART
SYMBOL
MIN
MAX
UNIT
VLMO31J1K2
IV
4.5
TYP.
11.2
mcd
VLMO31J1L2
IV
4.5
18
mcd
VLMO31K1L2
IV
7.1
18
mcd
598
611
nm
Dominant wavelength
IF = 10 mA
λd
Peak wavelength
IF = 10 mA
λp
605
Angle of half intensity
IF = 10 mA
ϕ
± 60
Forward voltage
IF = 20 mA
VF
2.0
Reverse voltage
IR = 10 μA
VR
VR = 0, f = 1 MHz
Cj
Junction capacitance
nm deg 2.8
6
V V
15
pF
Note: 1) Tamb = 25 °C unless otherwise specified 2) in one Packing Unit I Vmax/IVmin ≤ 1.6
LUMINOUS INTENSITY CLASSIFICATION GROUP STANDARD J K L M
LIGHT INTENSITY (MCD) OPTIONAL
MIN
MAX
1 2 1 2 1 2 1 2
4.5 5.6 7.1 9.0 11.2 14.0 18.0 22.4
5.6 7.1 9.0 11.2 14.0 18.0 22.4 28.0
Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel.
CROSSING TABLE VISHAY
OSRAM
VLMO31J1K2 VLMO31J1L2 VLMO31K1L2
LOT670-J1K2 LOT670-J1L2 LOT670-K1L2
COLOR CLASSIFICATION GROUP 1 2 3 4 5 6
SOFT ORANGE DOM. WAVELENGTH (NM) MIN. MAX. 598 601 600 603 602 605 604 607 606 609 608 611
Note: Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nm.
In order to ensure availability, single wavelength groups will not be orderable. www.vishay.com 2
Document Number 81333 Rev. 1.2, 11-Sep-07
VLMO31.. Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified
1.2 IVrel - Relative Luminous Intensity
IF - Forward Current (mA)
60 50 40 30 20 10
20
40
60
80
100
Tamb - Ambient Temperature (°C)
95 10905
0.2
590
610
630
650
670
λ - Wavelength (nm)
100 soft orange I F - Forward Current (mA)
Tamb < 60 °C
t p /T = 0.005 0.01
1000
0.02 0.05 0.2 0.5 DC
10
0.1
1 0.01
1
10
1
10°
40° 1.0 0.9
50°
0.8
60° 70°
0.7
2
3
4
5
Figure 5. Forward Current vs. Forward Voltage
20° 30°
1
V F - Forward Voltage (V)
95 9990
Figure 2. Forward Current vs. Pulse Length
0°
0
100
t p - Pulse Length (ms)
95 9985
10
0.1 0.1
I v rel - Relative Luminous Intensity
I F - Forward Current (mA)
0.4
Figure 4. Relative Intensity vs. Wavelength
10000
IV rel - Relative Luminous Intensity
0.6
95 10324
Figure 1. Forward Current vs. Ambient Temperature
100
0.8
0 570
0 0
soft orange 1.0
10 soft orange
1
0.1
80°
0.01 95 10319
0.6
0.4
0.2
0
0.2
0.4
1
0.6 95 9997
Figure 3. Rel. Luminous Intensity vs. Angular Displacement
Document Number 81333 Rev. 1.2, 11-Sep-07
10
100
I F - Forward Current (mA)
Figure 6. Relative Luminous Intensity vs. Forward Current
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VLMO31.. Vishay Semiconductors
2.0 soft orange
IV rel - Relative Luminous Intensity
I V re l - Relative Luminous Intensity
2.4 2.0 1.6 1.2 0.8 0.4
1.2
0.8 0.4 0
0 95 10259
soft orange 1.6
10
20
50
100
200
500 I F (mA)
1
0.5
0.2
0.1
0.05
0.02
0
tp /T
20
Figure 7. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle
40
60
80
100
Tamb - Ambient Temperature (°C)
95 9994
Figure 8. Rel. Luminous Intensity vs. Ambient Temperature
PACKAGE DIMENSIONS in millimeters 3.5 ± 0.2
0.9
1.75 ± 0.10
technical drawings according to DIN specifications
Mounting Pad Layout Pin identification area covered with solder resist
4
2.6 (2.8)
A
2.8
C
2.2
+ 0.15
1.2
4 1.6 (1.9) ?
3
2.4
+ 0.15
Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05 95 11314-1
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Document Number 81333 Rev. 1.2, 11-Sep-07
VLMO31.. Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL
REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED
SMD LED (VLM.3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape.
10.4 8.4
120°
4.5 3.5
13.00 12.75
2.5 1.5
62.5 60.0
Identification Label: Vishay Type Group Tape Code Production Code Quantity
Adhesive Tape
14.4 max.
321 329
18857
Blister Tape
Figure 11. Reel Dimensions - GS18
SOLDERING PROFILE IR Reflow Soldering Profile for lead (Pb)-free soldering Preconditioning acc. to JEDEC Level 2a
Component Cavity
94 8670
300
TAPING OF VLM.3...
5.75 5.25 3.6 3.4
4.0 3.6
Temperature (°C)
2.2 2.0
3.5 3.1
8.3 7.7
4.1 3.9
200 max. 30 s
150 max. 100 sec
max. 120 sec
100 max. Ramp Down 6 °C/sec
max. Ramp Up 3 °C/sec
0 0 0.25
4.1 3.9
240 °C 217 °C
50
1.85 1.65
1.6 1.4
max. 260 °C 245 °C
255 255°C°C
250
50
100
150
2.05 1.95
200
250
300
Time (s)
19470-2
max. 2 cycles allowed
Figure 12. Vishay Leadfree Reflow Soldering Profile (acc. to J-STD-020C)
94 8668
Figure 9. Tape Dimensions in mm for PLCC-2 TTW Soldering
REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.)
4.5 3.5 2.5 1.5
5s
200
ca. 2 K/s 100 °C...130 °C
100 ca. 5 K/s
2 K/s forced cooling
0 0
Label: Vishay Type Group Tape Code Production Code Quantity
full line: typical dotted line: process limits
ca. 200 K/s
150
50 63.5 60.5
Lead Temperature second wave
235 °C...260 °C first wave
13.00 12.75
Identification
948626-1
(acc. to CECC00802)
250 Temperature (°C)
10.0 9.0
120°
300
50
100
150
200
250
Time (s)
Figure 13. Double Wave Soldering of Opto Devices (all Packages) 180 178
14.4 max. 94 8665
Figure 10. Reel Dimensions - GS08
Document Number 81333 Rev. 1.2, 11-Sep-07
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VLMO31.. Vishay Semiconductors BAR CODE PRODUCT LABEL 106 A
H VISHAY 37
B
C
D
E
F
20131
G
A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: J1 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code
RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/ - 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. L E V E L
CAUTION
DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. Aluminum bag
This bag contains MOISTURE –SENSITIVE DEVICES
2a
1. Shelf life in sealed bag 12 months at