SD series
Customer: Customer Part Number: Innodisk Part Number: Innodisk Model Name: Date:
Innodisk Approver
Customer Approver
Industrial Micro SD card
Table of contents LIST OF FIGURES .............................................................................................................................................. 5 1. PRODUCT OVERVIEW .................................................................................................................................. 6 1.1 INTRODUCTION OF INNODISK INDUSTRIAL MICRO SD CARD ............................................................................ 6 1.2 PRODUCT VIEW AND MODELS ....................................................................................................................... 6 1.3 PRODUCT FEATURES.................................................................................................................................... 6 2. PRODUCT SPECIFICATIONS ........................................................................................................................ 7 2.1 CAPACITY AND DEVICE PARAMETERS ........................................................................................................... 7 2.2 PERFORMANCE............................................................................................................................................ 7 2.3 ELECTRICAL SPECIFICATIONS....................................................................................................................... 7 2.3.1 Power Requirement ......................................................................................................................... 7 2.3.2 Power Consumption ........................................................................................................................ 7 2.4 ENVIRONMENTAL SPECIFICATIONS ................................................................................................................ 8 2.4.1 Temperature Ranges ....................................................................................................................... 8 2.4.2 Humidity ............................................................................................................................................ 8 2.4.3 Shock and Vibration ........................................................................................................................ 8 2.4.4 Mean Time between Failures (MTBF) ............................................................................................. 8 2.5 CE AND FCC COMPATIBILITY ....................................................................................................................... 8 2.6 ROHS COMPLIANCE .................................................................................................................................... 8 2.7 RELIABILITY ................................................................................................................................................ 8 2.8 TRANSFER MODE ........................................................................................................................................ 9 2.9 PIN ASSIGNMENT ......................................................................................................................................... 9 2.10 MECHANICAL DIMENSIONS ....................................................................................................................... 10 2.11 ASSEMBLY WEIGHT.................................................................................................................................. 10 2.12 SEEK TIME .............................................................................................................................................. 10 2.13 HOT PLUG ............................................................................................................................................... 10 2.14 NAND FLASH MEMORY ........................................................................................................................... 10 3.1 OVERVIEW ................................................................................................................................................. 11 3.2 SD 2.0 CONTROLLER ................................................................................................................................ 11 3.3 ERROR DETECTION AND CORRECTION ........................................................................................................ 11 3.4 WEAR-LEVELING ....................................................................................................................................... 12 3.5 BAD BLOCKS M ANAGEMENT ...................................................................................................................... 12 5. PART NUMBER RULE ................................................................................................................................. 13
2
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
REVISION HISTORY Revision
Description
Date
Preliminary
First released
Jan. 2012
Rev. 1.0
Add 8GB in available capacities.
Sep. 2012
Rev. 1.1
1. Update product picture
Nov. 2012
2. Add features 3. Add description of enhanced power cycling 4. Add chapter of i-S.M.A.R.T Utility Rev. 1.2
Add device parameters
April, 2014
Add mechanical drawing Rev.1.3
3
Update ECC bits
March, 2016
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
List of Tables TABLE 1: DEVICE PARAMETERS .............................................................................................................................. 7 TABLE 2: PERFORMANCE ....................................................................................................................................... 7 TABLE 3: INNODISK INDUSTRIAL SD CARD POWER REQUIREMENT ........................................................................... 7 TABLE 4: POWER CONSUMPTION ............................................................................................................................ 7 TABLE 5: TEMPERATURE RANGE FOR INDUSTRIAL SD CARD .................................................................................... 8 TABLE 6: SHOCK/VIBRATION TESTING FOR INDUSTRIAL SD CARD ............................................................................ 8 TABLE 7: INDUSTRIAL SD CARD MTBF ................................................................................................................... 8 TABLE 8: INNODISK INDUSTRIAL MICRO SD CARD PIN ASSIGNMENT......................................................................... 9
4
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
List of Figures FIGURE 1: INNODISK INDUSTRIAL SD CARD ............................................................................................................. 6 FIGURE 2: INNODISK INDUSTRIAL MICRO SD CARD BLOCK DIAGRAM ..................................................................... 11
5
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
1. Product Overview 1.1 Introduction of Innodisk Industrial Micro SD card While micro SD card has been a popular embedded storage device for mobile market, Innodisk has been developing a more reliable micro SD card that will support ruggedized applications in the embedded fields. Therefore, Innodisk would like to introduce you the industrial-grade micro SD card built with SLC (Single Level Cell) flash, delivering the most reliable micro SD card with outstanding performance and excellent endurance. 1.2 Product View and Models Innodisk Industrial Micro SD card is available in follow capacities. 1GB
2GB
4GB
8GB
Figure 1: Innodisk Industrial SD card
1.3 Product Features
Interface: SD 2.0/1.1/1.0 SLC NAND Flash Support SD/SPI mode Built-in ECC corrects up to 24 bits per 1 KB Resistance to Shock and Vibration Enhanced endurance by Global Wear-Leveling algorithm Support i.S.M.A.R.T utility to monitor status of Innodisk micro SD card.
Enhanced Power Cycling: Pass 1,000 times copy and compare test under Non-Safe Mode/Safe Mode. Supports CPRM
6
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
2. Product Specifications 2.1 Capacity and Device Parameters Innodisk Industrial SD card device parameters are shown in Table 1. Table 1: Device parameters SLC Capacity
LBA
User Capacity(MB)
1GB
1024065536
976
2GB
2052718592
1957
4GB
4026531840
3840
8GB
8095006720
7720
2.2 Performance Burst Transfer Rate: up to 104 MB/s in SD 3.0 SDR104 Table 2: Performance Capacity
1GB
2GB
4GB
8GB
Sequential
14
16
20
20
Read (max.)
MB/sec
MB/sec
MB/sec
MB/sec
Sequential
8
9
14
16
Write (max.)
MB/sec
MB/sec
MB/sec
MB/sec
Note: Base on CrystalDiskMark 3.01 with file size 1000MB
2.3 Electrical Specifications 2.3.1 Power Requirement Table 3: Innodisk Industrial SD card Power Requirement Item Input voltage
Symbol VIN
Rating 3.3V ± 5%
Unit V
2.3.2 Power Consumption Table 4: Power Consumption
7
Mode
Power Consumption (mA)
Read Write Idle
30 (max.) 50 (max.) 1.6 (max.) Rev. 1.3
TPS, March. 2016
Industrial Micro SD card * Target: Industrial Micro SD card MLC 64GB
2.4 Environmental Specifications 2.4.1 Temperature Ranges Table 5: Temperature range for Industrial SD card Temperature
Range Standard Grade: 0°C to +70°C Industrial Grade:-40°C to +85°C -55°C to +95°C
Operating Storage
2.4.2 Humidity Relative Humidity: 10-95%, non-condensing
2.4.3 Shock and Vibration Table 6: Shock/Vibration Testing for Industrial SD card Reliability Vibration Mechanical Shock
Test Conditions 7 Hz to 2K Hz, 20G, 3 axes Duration: 0.5ms, 1500 G, 3 axes
Reference Standards IEC 68-2-6 IEC 68-2-27
2.4.4 Mean Time between Failures (MTBF) Table 7 summarizes the MTBF prediction results for various Industrial SD card configurations. The analysis ™
was performed using a RAM Commander failure rate prediction. ‧ Failure Rate: The total number of failures within an item population, divided by the total number of life units expended by that population, during a particular measurement interval under stated condition. ‧ Mean Time between Failures (MTBF): A basic measure of reliability for repairable items: The mean number of life units during which all parts of the item perform within their specified limits, during a particular measurement interval under stated conditions. Table 7: Industrial SD card MTBF Product Innodisk Industrial Micro SD card
Condition Telcordia SR-332 GB, 25°C
MTBF (Hours) >3,000,000
2.5 CE and FCC Compatibility Industrial SD card conforms to CE and FCC requirements.
2.6 RoHS Compliance Industrial SD card is fully compliant with RoHS directive.
2.7 Reliability 8
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card Parameter
Value
Read Cycles Wear-Leveling Algorithm Bad Blocks Management Error Correct Code Flash endurance TBW(Sequential Write) 1GB 2GB 4GB 8GB
Unlimited Read Cycles Support Support Support SLC: 100,000 P/E cycles 90 180 360 720
2.8 Transfer Mode Industrial Micro SD card support following transfer mode: SD 3.0 / SD 2.0
2.9 Pin Assignment Innodisk Industrial Micro SD card compliant with standard SD SPEC., please refer to Table 8 for pin assignment.
SD Mode
SPI Mode
Pin # Name
Description
Name
Description
1
DAT2
Data line bit 2.
-
2
CD,DAT3
Card Detect
CS
Chip select
3
CMD
Command/Response
DI
Data in
4
VDD
Supply voltage
VDD
Supply voltage
5
CLK
Clock
CLK
Clock
6
VSS
Supply voltage ground
VSS
Supply voltage ground
7
DAT0
Data Line [Bit 0]
DO
Data Out
8
DAT1
Data Line [Bit 1]
-
Table 8: Innodisk Industrial Micro SD card Pin Assignment 9
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
2.10 Mechanical Dimensions
2.11 Assembly Weight An Innodisk Industrial SD card 3.0 within MLC flash ICs, 16GB’s weight is TBD grams approx.
2.12 Seek Time Innodisk Industrial SD card is not a magnetic rotating design. There is no seek or rotational latency required.
2.13 Hot Plug The SD card support hot plug function and can be removed or plugged-in during operation.
2.14 NAND Flash Memory Innodisk Industrial Micro SD card uses both SLC (Single Level Cell) and Multi Level Cell (MLC) NAND flash memory, which is non-volatility, high reliability and high speed memory storage.
10
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
3. Theory of Operation 3.1 Overview Figure 2 shows the operation of Innodisk Industrial Micro SD card from the system level, including the major hardware blocks.
Figure 2: Innodisk Industrial Micro SD card Block Diagram
3.2 SD 2.0 Controller Innodisk Industrial Micro SD card is designed with a SD 2.0 controller, which has single channel for flash interface.
3.3 Error Detection and Correction Highly sophisticated Error Correction Code algorithms are implemented. The ECC unit consists of the Parity Unit (parity-byte generation) and the Syndrome Unit (syndrome-byte computation). This unit implements an algorithm that can correct up to 16 bits per 1024 bytes in an ECC block. Code-byte generation during write operations, as well as error detection during read operation, is implemented on the fly without any speed penalties.
11
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
3.4 Wear-Leveling Flash memory can be erased within a limited number of times. This number is called the erase cycle limit or write endurance limit and is defined by the flash array vendor. The erase cycle limit applies to each individual erase block in the flash device. Innodisk Industrial Micro SD card uses a global wear-leveling algorithm to ensure that consecutive writes of a specific sector are not written physically to the same page/block in the flash. This spreads flash media usage evenly across all pages, thereby extending flash lifetime.
3.5 Bad Blocks Management Bad Blocks are blocks that contain one or more invalid bits whose reliability are not guaranteed. The Bad Blocks may be presented while the product is shipped, or may develop during the life time of the Micro SD card. When the Bad Blocks is detected, it will be flagged, and not be used anymore. The Micro SD card implement Bad Blocks management, Bad Blocks replacement, Error Correct Code to avoid data error occurred. The functions will be enabled automatically to transfer data from Bad Blocks to spare blocks, and correct error bit.
12
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
5. Part Number Rule 1
CODE Description
2
4
5
6
7
8
9
10
11
12
13
14
15
16
D S 2 M
-
0
8
G
I
8
1
A
C
1
S
T
Disk
3
Micro SD card
Capacity
Category
Operation Internal Temp. Control
FW
17
18
19
CH Flash.
Definition st
th
Code 1 (Disk)
Code 12 (Flash Mode)
D : Disk
A: Standard F/W version nd
Code 2
th
~ 4 (Form Factor)
S2M: micro SD card th
th
th
Code 6 ~8 (Capacity)
Code 13 (Operation Temperature)
01G: 1GB
C: Standard Grade (0℃~ +70℃)
02G: 2GB
W: Industrial Grade (-40℃~ +85℃) th
Code 14 (Internal control)
04G: 4GB th
Code 15 (Channel of data transfer)
08G: 8GB
S: Single Channel th
th
Code 9 ~11 (Series) th
Code 16 (Flash Type)
I81: SD series B: Toshiba SLC T: Micron SLC
th
th
Code 19 ~20 (Customized Code)
13
Rev. 1.3
TPS, March. 2016
20
Industrial Micro SD card
Appendix CE
14
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
FCC
15
Rev. 1.3
TPS, March. 2016
Industrial Micro SD card
16
Rev. 1.3
TPS, March. 2016
