07.06.2014
RELIABILITY OF MEMS & MEMS TESTING DOCTORAL SCHOOL EPFL
Alex Dommann Neuchâtel, 13.06.2014
RESEARCH & DEVELOPMENTS AND SERVICES IN ACADEMIC PARTNERSHIPS:
Microcity
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07.06.2014
Materials meet Life
Materials
meet
Life
Materials meet life M AT E R I A L S
MEET
LIFE
nm
S U R FA C E µm
STRUCTURE mm
FUNCTION / INTERACTION
m
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4
2
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Reliability Science and Technology
PHOTONICS
InP splitter
R A M - A N A LYS I S
FOS
Microlens
interferometry
Bragg grating cladding
DFT: gate oxide
PH YSIC S O F FA ILU RE
MEASUREMENTS THz Image IR image of PCB chip
Au wire
ELECTRICITY
FIBs
NANO-STRUCTURING E L E C T R O N I C M AT E R I A L S
MICRO-ELECTRONICS
CMOS
ps-laser
Cell culture
UT sensing
CNT
MEDTECH 07.06.2014
5
Defect Analysis in SiSC MEMS
X-ray Diffraction
• HRXRD (global defect analysis)
Microscopy
•AFM (surface defects) •FIB + TEM (defect profile in cross section)
| doae | Page 6
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ELECTRON MICROSCOPY CENTER EQUIPMENT
2 TEMs
2 SEMs
FEI XL30 ESEM FEI NovaNanoSEM
Sample preparation
Philips CM30 Jeol JEM 2200FS (analytic STEM/TEM)
2 Ion mills Polishing machine Coater (etc.)
JEM-ARM200F microscope
Analysis
2 Mac Workstations
MacTempas CrystalKit Exit-wave reconstruction for in-line holography Simulations (xHREM, EMS, own programs)
Tomography workstation
Surface Analytics @ Empa TEM/STEM
FIB
He-SEM
3D NanoChemiscope
HRSEM
HRXRD
ToF-SIMS 7.5 x 7.5 mm2
AFM
| doae | Page 8
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Our tools: Selected instruments for characterization, testing & qualification
| doae | Page 9
ELECTRON MICROSCOPY CENTER EQUIPMENT
2 TEMs
2 SEMs
FEI XL30 ESEM FEI NovaNanoSEM
Sample preparation
Philips CM30 Jeol JEM 2200FS (analytic STEM/TEM)
2 Ion mills Polishing machine Coater (etc.)
Analysis
2 Mac Workstations
MacTempas CrystalKit Exit-wave reconstruction for in-line holography Simulations (xHREM, EMS, own programs)
Tomography workstation
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Micro- and Nano-Characterization
24.5°C
479°C
High-Temperature Nanoindenter Commercialization start in 2013 (CSM instruments, CH)
Graphene Monolayer PRL, 108 (2012) 047601 Nano, 6 (2012) 7077 Nature, 470 (2011) 374
3D NanoChemiscope
Ag NP (748 atoms)
Adv. Mat., 22 (2010) 4467 Nature Chem., 4 (2012) 287 Angw. Chem. (int. ed.) 48 (2010) 8890
IBM/Empa joint venture
(EU-FP 7 project)
JEOL ARM 200
Operation of a High-end TEM Start: 1.2.2013
ToF-SIMS 7.5 x 7.5 mm2
PCBM/CyI polymer blend AFM
PCBM (yellow) CyI (blue)
EMPA- ACCELERATE PROGRESS BY SHARING KNOW HOW Interfacial design of nanostructured materials
Materials
Simulations
Multi-layer and system fabrication
Materials Processing
AnalyticalServices (Microscopy XRays AFM usw…)
Model simulations of joining processes
Materials behavior by in-situ studies
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Center for X-ray analytics
We develop novel X-ray technologies from nanometer to meter scale
Building materials
XCT / XPCI / SAXS
Medical technology
Sustainable building
Polymers and fibres Advanced materials Image Analysis
Alloys
XRD Services
Reliable electronics & energy storage systems
Nanomaterials
X-ray diffraction 07.06.2014
13
PLLA screw to join nonloaded bone fragments
PHBV ear Ti alloy dental implant with special surface treatment
Locking compression plate w/ locking screws for 12-B2/12B3 AO classification fracture
Cell-seeded polymer graft to regenerate the myocardium after an infarction Rolled EAP actuator
MedTech
Stacked EAP actuator DLC coated CCM motionpreserving spinal disk prosthesis DLC coated hip joint head (failure case) hip joint stem with special surface treatment
DLC coated knee implant (failure case)
Internal TAN pedicular fixation system (over 3 vertebrae)
Combining the expertise of more than 10 Empa laboratories
ZrO2 hip joint head Carbon fibre reinforced hip protector POM bone rongeur with compliant joint Locking compression plate with standard screws for 42A2 AO classification fracture
Tendon bicomponent fibre with P3HBV core & PLA sheath
| doae | Page 14
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Dental implant Gingiva coloured coatings
Cool-Pad Cooling Vest 2 ultra-thin membranes provide cooling with water evaporation
MedTech Flexible textile patch for light therapy
Combining the expertise of more than 10 Empa laboratories
Incontinence Pants using a reusable pad that works according to the «waterfall principle».
Smart Stockings a surgical stocking for the gerontology market
| doae | Page 15
TEXTILE SENSORS AND BODY MONITORING Polymer Optical Fibers (POF) POFs drawn at Empa
Cladding (low refractive index) Core (high refractive index) Light source
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www.empa.ch/lpp
FLEXIBLE OPTICAL FIBERS - APPLICATIONS
Therapy
Lighting
Sensing
PHOTONIC TEXTILES FOR PHOTOPLETHYSMOGRAPHY Monitoring Measuring Sp O2
Heart rate Breathing Hypovolemia Wound healing Light source Black ring 3D-embroidery Embroidered POFs
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OPTICAL FIBERS FOR BIOSENSING IN LIQUID Wound healing monitoring pH sensitive optical fibers
FORCE SENSOR BASED ON ELASTIC OPTICAL FIBERS Principle Out coupled light
Applied pressure
Light intensity I1
Light intensity I0 Out coupled light
Measurement setup Applied pressure
Light source
www.empa.ch/lpp
Optical fibers
Detector 20
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Pressure [mbar]
AIR PRESSURE STOCKING
9850 9800
Markus, waking, trial 2
9750 9700 9650 9600 400
420
440
460
480
500
Time [sec]
DYNASUIT
Force N
500 450 400 350 300 250 200 150 100 50 0 0
100
200
300
400 500 pressure mbar
600
700
800
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Accelerometer
| doae | Page 23
Characterization, Testing & Reliability - The area of MEMS characterization, testing & reliability is generally data collection leading to model validation or predictive model development. - Our focus is on a science-based understanding of failure mechanisms, material properties, and surface interactions. - Methods are used to develop acceleration factors for MEMS device lifetime prediction. - The greatest challenge in MEMS reliability is that failure mechanisms are device dependent. For this reason, devices are classified: - Class I – no moving parts - Class II – moving parts with no contact - Class III – moving with impacting surfaces - Class IV – moving with rubbing surfaces
| doae | Page 24
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MEMS classes :
Class - 1
Class -2
Class 3
Class - 4
No moving parts
Moving parts with contacts
Moving with impacting surfaces
Moving with rubbing surfaces
- Accelerometers - Pressure sensors - Strain gauges
-
Gyros Comb drives Resonators Filters
- Relays - Valves - Switches
- Switches - Shutters - Scanners
| doae | Page 25
Reliability topics:
Lifetime predictions
• Failure mechanism Physics of failure Acceleration models Acc. Testing (Weibull probability) •
Failure modes Root cause & failure analysis MEMS testing & qualification Continuous improvement & design for reliability
• •
Design phase failure modes : Functional & MEMS materials failure modes & non-analyzed conditions Manufacturing failure modes : Front & Back end In-use failure modes
• FMEA Analytical methods • Testing MEMS classes Equipment Quality standards (Mil) and qualification • Yield reliability Yield improvement (design for test (DfT), process & packaging integration) • Reliability enhancement (reproducibility & product qualification) Design for reliability (DFR) | doae | Page 26
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Mechanical failure modes
In-use failure modes : Charging
Fracture Mech. shock resistance
Electrical breakdown & ESD
Electrical failure modes
Electromigraion
Reliable MEMS
Vibration
Radiation
Anodic oxidation & galvanic corrosion of Si
Creep Metal corrosion
Fatigue
Environmental | doae | Page 27
Structural properties addressed by X-ray diffraction techniques during process development
Grainboundries Grain Size Texture Mosaicity
Polytypes Stress Strain
Phases
Composition
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QUALITY CONTROL / MATERIALS CHARACTERISATION Techniques available for materials characterization: XRF / XPS
Ultrasounds Eddy currents
Powder diffraction
Thermography
X-ray reflectivity
AFM / STM
X-ray diffraction (XRD / HRXRD)
Optical microscopy
X-ray small angle scattering (SAXS)
X-rays
X-ray imaging
TEM / SEM / ESEM …
Bragg Equation z
A
C B
Bragg Equation: n = 2d sin This extra distance must be an integral (n) multiple of the wavelength () for the phases of the two beams to be the same. | doae | Page 30
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Interference of waves
Δλ = nλ
n = 0, 1, 2, ...
When a number of waves of the same wavelength propagating in the same direction interfere with each other under continuous phase shift, only the coherent among them will be amplified. In total, the rest will almost completely cancel each other out.
| doae | Page 31
STOE Powder Diffraction System
Information obtained from diffraction patterns:
Diffraction pattern
80.0
Relative Intensity (%)
1) Peak positions: - refer to geometrical parameters: (unit cell, space group) - influenced by stresses
28-Mar-2010
100.0
60.0
40.0
20.0
0.0 20.0
30.0
40.0
50.0
60.0
70.0 2Theta
2) Peak intensities: - refer to electron density distribution within the unit cell - influenced by preferred orientation / texture in thin films and manufactured materials (rolling processes,…)
3) Peak shape: - refers to the quality (defects) in single crystal materials (broadness) - refers to the crystallite size in polycrystalline materials (broadness) - strain (asymmetry) - (influenced by diffractometer setup) | doae | Page 32
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Diffractometer setup: Texture Measurement:
| doae | Page 33
Diffractometer setup: Measurement of Lattice Strain
Determination of the variations in lattice parameter as a function of the offset. | doae | Page 34
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MEMS fabrication and integration: Application of High Resolution X-ray Diffraction (HRXRD) :
Design: - components - device - packaging level
Fabrication
Assembly
Components characterization: Packaging: - structural analysis: - defect + strain analysis phases, texture, strain, … - defect and strain analysis related to MEMS parts in fabrication processes
MEMS
Product
Strain dynamics and mobility of Defects by XRD: - in-situ testing: structural + mechanical - aging studies: T, radiation, high cycle fatigue
HRXRD ON SCSI MEMS
PANalytical X’Pert PRO MRD
Detector 1: RSM setup Detector 2: RC setup
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Omega 34.36000 2Theta 68.72000
004
Phi 0.00 Psi 0.00
X -17.00 Y 27.85 Z 0.000
Omega
Si-RSM_4N_200um.xrdml
Si
1.2 1.5
Structural
2.0 2.6
0.06
3.4
Characterization 4.5
0.04
5.8 7.6 9.9
0.02
HRXRD
12.9
OPX/CPX: Nouvelles têtes étroites Functional://// electrical, mechanical Diamant
16.9 22.0
0.00
2xU
28.7
2xU
U U
U=46.5mm
37.5
-0.02
49.0 63.9 83.4
-0.04
108.9 142.1
-0.06
185.5 242.1
+
-0.08 -0.06
-0.04
-0.02
0.00
0.02
0.04 0.06 Omega/2Theta
Reliability in MEMS
Nano-Indentation Nano-Scratch
Mechanical: Bending + tensile tests Simulations
Testing
Materials Research Diffractometer (MRD) (Perfect) epitaxial layer, stressed and textured samples highly textured layers
Detector 1
Ge[220] 4 - Crystal monochromator Symm. or Asymm.
X-ray mirror
Triple Axis Section
X-ray tube (line focus) Soller slits Divergence slit (optional)
Optical slit Detector 2
+ all kinds of applications + interchangeable optics
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DEVELOPMENT FOR IN-SITU TESTING: 1) 2) 3) 4) 5) 6) 7) 8)
Two point bending test:
Actuator motor Moving support (16 mm) Static support Force sensor (2 N) Manual position adjustment Fixation force sensor Support frame Probe holder
Tensile test:
cross-section: 50 x 50mm cross-section: 50 x 50mm
LOGARITHMIC PLOT OF EXPERIMENTAL FORCEDISPLACEMENT
Specimen used as obtained by DRIE (no post treatment): Strongest Fracture strain observed: Strongest Fracture stress observed
= 1.785% = 7.0 GPa
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Tensile test: set-up In-situ mechanical testing : strain and defect analysis
HRXRD ON SCSI MEMS
Mechanical Test Instrument with the sample also positioned with respect to the diffractometer setup:
Detector 1: RSM setup Detector 2: RC setup
PANalytical X’Pert PRO MRD
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X-ray Rocking Curve (RC) measurements square-long-line Omega 34.56320 Phi 0.00 2Theta 69.12640 Psi 0.00
Omega 34.56320 Phi 0.00 2Theta 69.12640 Psi 0.00
X 8.00
0Y00.00 4
square-long-line_I13.xrdml
counts/s
counts/s
square-long-line_I6.xrdml
X 0.00 Y 0.00
reference
004_test_10_Ar-sample.xrdml
1M
100K
100K
10K
1K
10K
100
1K -100
-50
0
50 100 Omega/2Theta (s)
-100
1. Strain
-50
0
50 100 Omega (s)
2. Curvature
3. Defects from diffused scattering
= d/d = -/tan =E
scan | doae | Page 43
DEFECTS IN A CRYSTAL
from: I.F. Mercer: "Crystals", The Natural History Museum, London 1994
+ surface defects (roughness, …) + sample size effect
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07.06.2014 (tilt)
a) RSM
/ 2 (strain) Intensity
b) RC Strain layers HRXRD for Lattice strained
Lattice Tilt
(tilt)
a) RSM
c) Lattice planes (real space)
d2
dgradient
d1
d1
d1 d1
d1 d1
/ 2 (strain)
Intensity
b) RC
d1
dgradient d1
Lattice Tilt
d1
d1
d1 d1
(tilt)
c) Lattice planes a) (real RSMspace)
Lattice Strain d2
/ 2 (strain) b) RC
Intensity
| doae | Page 45
c) Lattice planes (real space)
d2
dgradient
d1
d1
d1 d1
d1 d1
Study of materials properties: fracture toughness
When SCSi structures break ? Why SCSi structures break ?
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What is a reciprocal space? (1) real space
reciprocal space
1/a
a
1/b b
010
110 100
origin points represent atomic positions
200
points represent reflections
| doae | Page 47
BRAGG’S LAW AND THE EWALD DIAGRAM
, d
k,q d
1 d
origin Bragg's Law = 2d sin
Ewald Sphere r=1/ = k
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WHAT IS A RECIPROCAL SPACE MAP?
dhkl
1/dhkl
INFORMATION IN THE RECIPROCAL SPACE • position • shape
kh
1/d
2
Ewald Radius
ki 50
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HRXRD X-ray Rocking Curve (RC):
Reciprocal Space Mapping (RSM): 004
Omega 34.56320 Phi 0.00 2Theta 69.12640 Psi 0.00
X 0.00 Y 0.00 Z 0.000
X-ray scattering can be separate into distinct features: Intensity (counts)
Omega
2-Diced-Si004_RSM_2.xrd
1.4 2.3
Wafer surface: polished diced
3.7
0.3
5.9 9.4
0.2
15.1
0.1
24.1 38.5
-0.0
61.5
-0.1
157.4
98.4
34.40
34.45
34.50 34.55
34.60
34.65
34.70 Omega (°)
251.7
-0.2 -0.3 -0.2
= strain = d/d = -/tan = stress = E E = Young’s Modulus
402.5 643.6
-0.1 0.0 0.1 Omega/2Theta
1. Strain 2. Curvature 3. Defects from diffused scattering
1029.2 1645.8 2631.8 4208.6 6730.1 10762.3 17210.3
| doae | Page 51
Mechanical Testing: In-situ Tensile Tests on SiSC micro-beams Example of a tensile test on SCSi (single crystal, 50mm beam) Omega 34.36000 2Theta 68.72000
004
Phi 0.00 Psi 0.00
X -17.00 Y 27.85 Z 0.000
Omega
Si-RSM_4N_200um.xrdml
1.2 1.5
A
0.06
B
2.0 2.6 3.4 4.5
0.04
5.8 7.6 9.9
0.02
12.9
A
B
16.9
0.00
Lattice Tilt 22.0
C
28.7 37.5
-0.02
49.0 63.9 83.4
-0.04
108.9 142.1
-0.06
185.5 242.1
-0.08 -0.06
-0.04
-0.02
0.00
0.02
0.04 0.06 Omega/2Theta
= strain = d/d = stress = x E
C (RSM) and (FEM): divergence of 0.01-5% | doae | Page 52
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Mechanical Testing: In-situ Tensile TestsOmega 34.60460Phi 0.00 2Theta 69.21640 Psi 0.00 004
Omega 34.56320 Phi 0.00 2Theta 69.12640 Psi 0.00
X 0.00 04 Y0 -0.31 Z 10.135
Omega 34.36000Phi 0.00 2Theta 68.72000Psi 0.00
X -17.00 Y 27.85 Omega Si-RSM_0N_d=200.xrdml Z 0.000
Omega
Omega
0.06
0.04
0.04
0.02
0.02 0.00
0.00
2.9
0.05
2.7
2.6
3.6
4.5
20.9
46.0
-0.06
-0.06
68.2
31.0
-0.05
101.1 149.8 -0.06-0.04-0.02 0.00 0.02 0.04 0.06 Omega/2Theta 222.0 329.0
722.5
1587.0
6.2
-0.10
7.6
8.1
9.9
10.7
12.9
14.1
16.9
18.6
22.0 28.7
24.4
37.5
32.2
49.0
42.4
63.9
-0.10-0.08-0.06-0.04-0.02-0.000.020.040.060.08 83.4 Omega/2Theta 108.9
487.5
1070.8
4.7
5.8
0.00
14.1
-0.04
0N
2.0
6.4
-0.04
-0.08
2.1
3.4
-0.02
1.6
1.5
4.3
9.5
4N
Si-RSM_6N_200um.
1.2
1.2
1.3
-0.02
-0.06-0.04-0.020.000.02 0.040.06 Omega/2Theta
Si-RSM_4N_200um.xrdml
0.10 2.0
0.06
X -17.00 Y 27.54 Z 0.000
55.8 73.5
142.1
96.7
185.5
127.3
242.1
6N
167.7
2352.0
220.8
3485.7
290.7
| doae | Page 53
RSM Simulation
| doae | Page 54
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07.06.2014
Mechanical Testing: In-situ Tensile Tests
Omega 34.56320Phi 0.00 2Theta 69.12640Psi 0.00
004
X -17.00 Y 28.02 Z 0.000
Omega
Omega 34.56320Phi 0.00 2Theta 69.12640Psi 0.00
Si-RSM_1N_200_2.xrdml
X -17.00 Y 27.84 Z 0.000
Omega
1.2
1.2 1.6
1.7 2.3
0.06
2.1
0.06
2.9
3.1
0.04
0.04
4.1 5.6
0.02
3.8 5.1
0.02
6.8
7.6
0.00
0.00
10.4 14.1
Loading to 6N
-0.02
19.1 25.9
-0.04
9.1 12.2
-0.02
16.3 21.8
-0.04
29.2
35.2
-0.06
+ Relaxation
47.7
-0.06
39.0 52.1
64.8
-0.06-0.04-0.02 0.00 0.02 0.04 0.06 Omega/2Theta
-0.06-0.04-0.02 0.00 0.02 0.04 0.06 Omega/2Theta
88.0 119.4
69.6 93.0 124.2
162.0
Initial load: 1N
Si-RSM_d=200_1N.xrdml
219.9
Final load: 1N
298.5
166.0 221.8
405.1
296.4
549.9
396.0
| doae | Page 55
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Technology support: Qualification of subcomponents, components and devices Concept Phase
Consulting
Design Phase
Components Fabrication
Components Assembly & Packaging
Characterization / Testing Quality Control Reliability Studies
Microsystem
Reports & Consulting
Microstructural Properties Mechanical Behavior Stresses and Defects | doae | Page 56
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RELIABILITY CHALLENGES IN SPACE – OTHER
Space hazards Temperature cycling Eclipses (Power management) Vacuum and outgassing Space debris Images: http://www.esa.int http://www.grc.nasa.gov
MEMS investigations : Strain distribution in pressure sensors
HRXRD strain gradient measurement Bonding stress gradient Defect mobility, aging Effect on quality factor Effect on hermeticity
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MEMS investigations : Strain distribution in pressure sensors Wafer level encapsulation of micro-systems.
Cap wafer & Resonator wafer
Bonding Strain Profile
Resonator MEMS: - Functional & packaged - Hermeticity evaluation - Packaging strain - Environmental testing
Silicon test device
| doae | Page 60
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07.06.2014
Mechanical Testing
| doae | Page 61
Mechanical Testing: High Cycle Fatigue b) counts
Omega ( )
a)
Omega/2Theta ( )
Omega/2Theta ( )
Accelerated aging of MEMS by high cycle fatigue.
| doae | Page 62
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Radiation Damage
| doae | Page 63
Aging: Radiation Damage
a)
b)
Normalized intensity (rel. units)
1
c)
0.1
0.01
0.001
0.0001
1E-005
1E-006 -500
b)
-400
-300
-200
-100
-120''
3
Omega/2Theta ( )
Omega/2Theta ( )
Wide TCD-spectra obtained at positions of the specimen = -120” (solid line) and = 120” (dashed line).
200
300
400
500
120'' MP
PP
Intensity (pps)
b)
100
PP
MP
a)
0
(sec. of arc)
The experimental (dots) and fitted (solid line) TCD intensity curves. Dashed line is the double-crystal rocking curve (for comparison).
c) counts
Omega ( )
RSMs a)
2
DP
DP 1
0 -300
-200
-100
0
(sec. of arc)
100
200
300
| doae | Page 64
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07.06.2014
Nexray
RTD 2009
HRXRD analysis: 50 μm Ge towers XRD reciprocal space maps of 50 mm high Ge towers, including Si substrate
Si
Detailed scan of Ge(004) reflection
~ 50 mm Ge SEM picture of 50 mm high Ge towers, no fusion occurring
HRXRD around Ge (004) peak HRXRD measurements on 50 mm Ge towers show that they are fully relaxed
Nexray
RTD 2009
Eleastic relaxation of thermal strain
The relaxation of the thermal strain in Ge pillars is explained by FEM simulations.
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07.06.2014
Nexray
RTD 2009
Submicron diffraction experiments at ESRF ID01 beamline
3D RSM (sliced)
Focused beam: ~300x500 nm (Fresnel Zone Plates, FZP) X-ray energy: 11.07 keV 2D pixel detector was used 3D reciprocal space maps Reflections investigated: Si, Ge (004), (115), (206)
2D Pixel Detector X-rays
FZP Measurements of strain and tilt in single Ge towers.
Nexray
Sample
RTD 2009
Scanning X-ray nanodiffraction of arrays of epitaxial Ge
ID01 beamline of ESRF Mapping lattice bending close to the interface | doae | Page 68
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Nexray
RTD 2009
Quality Control 2: X-ray Nanodiffraction
X-ray FWHM indicates perfect single crystal far away from the interface!
Three-dimensional X-ray nanodiffraction of a perfect epitaxial Ge crystal.
| doae | Page 70
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COATING CENTER @ EMPA Private Public Partnership Coating Center @ Empa
Swiss Industry Polytype R&D in Coating Technologies Advanced Surface Analytics
QUALITY CONTROL / MATERIALS CHARACTERISATION Techniques available for materials characterization: XRF / XPS
Ultrasounds Eddy currents
Powder diffraction
Thermography
X-ray reflectivity
AFM / STM
X-ray diffraction (XRD / HRXRD)
Optical microscopy
X-ray small angle scattering (SAXS)
X-rays
X-ray imaging
TEM / SEM / ESEM …
Metrology Defect detection, failure mode analysis
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QUALITY CONTROL TECHNIQUES Quality Control
Mechanical testing
e- Microscopy
XRF Bulk Analysis
Soft Materials
Phase Analysis
Electrical Testing
GI-XRF NanoParticles
X-ray
XPS Thin films
Imaging
Phase Contrast Imaging
The Joint Reliability Team EUCEMAN – EUROPEAN CENTER FOR MICRO AND NANORELIABILITY
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Standardization, validation and robustness of in vitro testing for nanosafety - a bridge to industry
Nexray
RTD 2009
AKNOWLEDGEMENT
A. DommannB, H. von KänelC, P. GröningB, A. NeelsA,B, T. BandiA, S. BeerA, R. BergamaschiniD, C. BosshardA, F. CardotA, D. ChrastinaD, S. CecchiC, H. ElsenerB, C. FalubC, J. FrigerioC, S. GiudiceA, A. GonzalezC, F. IsaD, G. IsellaD, R. Jose JamesA, R. KaufmannB, C. KottlerA, T. KreiligerC, R. LongtinB, L. NeumannA, A. MarzegalliD, L. MiglioD, S. MouazizA, P. NiedermannA, A. PezousA, J. SanchezB, G. Spinola DuranteA, F. Mancarella,E J. Fompeyrine,E B. Alén,E Y. ZhaA, , A. Schifferle, H. Shea, J. Hérran, G. Bourban, E. Mukhamadzhanv, A. FlischB, U. SennhauserB, E. MazzaB, R. ErniB A: CSEM B: EMPA
C: ETHZ, E: IBM D: L-NESS, Politecnico di Milano, Como, Italy
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