PUBLICATIONS IN REFEREED SCIENTIFIC JOURNALS

CURRICULUMVITAE Rolf E. Hummel Pamphalon Professor – Electronic Materials EDUCATION 1953 1956 1960 1963 EXPERIENCE 1958-63 1964-69 1969-74 1971-72 1...
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CURRICULUMVITAE Rolf E. Hummel Pamphalon Professor – Electronic Materials

EDUCATION 1953 1956 1960 1963

EXPERIENCE 1958-63 1964-69 1969-74 1971-72 1974 1980 1981 1987 1987-88 1988 1988 1995 2001 2003 2008

6/09

Place of Birth: Sindelfingen, Germany Date of Birth: July 21, 1934 Marital Status: Married, 3 children US Citizen

Abitur, Waldorf-School of Stuttgart, Germany, Secondary School Vordiplom (B.S., Physics), Technical Univ., Stuttgart, Germany Diplomphysiker, (MS in Physics), Technical University, Stuttgart, Germany Dr. rer. nat. (Ph.D., Metallurgy and Physics), Max-Planck-Institute for Metallurgical Research, Stuttgart, Germany

Research Associate, Max-Planck-Institute for Metallurgical Research, Stuttgart Assistant Professor, University of Florida, Gainesville, Florida Associate Professor, University of Florida, Gainesville, Florida Visiting Professor, Max-Planck-Institute for Metallurgical Research, Stuttgart, Germany, and Technical University, Berlin, Department of Metal-Physics Professor, University of Florida, Gainesville, Florida Visiting Scientist, Solar Energy Research Institute (SERI), Golden, Colorado (6 months) Visiting Professor, Universite Pierre et Marie Curie, Laboratoire d'Optique des Solides, Paris, France (6 months) Visiting Scientist, Texas Instruments, Semiconductor Process and Design Center, Dallas, Texas (3 months) Visiting Professor, Ion Beam Engineering Experimental Laboratory, Kyoto University, Sakyo Kyoto, Japan (6 months) Visiting Scholar, National Academy of Science, Institute of Physics, Beijing, People's Republic of China (2 months) Visiting Scholar, Korea Advanced Institute for Science and Technology, Seoul, Korea (2 weeks) Visiting Professor, Victoria University, Wellington, New Zealand (3 months) Visiting Professor, Kyoto University (Japan), Institute for Advanced Energy (3 months) Professor Emeritus, University of Florida, Gainesville, Florida Visiting Professor, Hanoi University of Technology (5 weeks teaching tour)

FIELDS OF INTEREST Optical and electrical properties of metals, alloys, and semiconducting materials; differential reflection spectroscopy; spark-processed luminescing Si; reliability of semiconductor devices; thin films; electrotransport in thin films; implantation damage in semiconductor materials; application of optical methods to corrosion; Energetic Materials (Explosives detection); optoelectronics; new teaching methods. TEACHING AWARDS 1980 Teacher of the Year, College of Engineering 1989 Excellence in Undergraduate Teaching, University of Florida 1990 College of Engineering, Outstanding Undergraduate Teaching Award 1990 University of Florida, Outstanding Graduate Teaching Award 1994 University of Florida "TIP" Award (Excellence in Teaching Award) 1997 Anderson/CLAS Scholar Faculty Honoree 1998 University of Florida TIP Award (Excellence in Teaching Award) 1999 Undergraduate Teaching and Advising Award 1999 Distinguished Faculty Award, Florida Blue Key 2000 Anderson/CLAS Scholar Faculty Honoree 2002 Outstanding Teacher Award, American Society for Engineering Education (SE Section) 2002 Departmental Outstanding Service Award 2003 Departmental Outstanding Service Award 2003 Triple Point Teaching Award for excellence in undergraduate teaching 1

PUBLICATIONS IN REFEREED SCIENTIFIC JOURNALS I. Electromigration and Reliability of Thin Film Metallizations for Microelectronic Devices 1.

An Advanced Method to Study Electrotransport in Thin Films by Resistance Measurements, R.E. Hummel and W.A. Slippy, Jr., Phys. Stat. Sol. (a), 2 (1970) K1.

2.

Observations on Electrotransport in Thin Films Using Resistance Measurements, R.E. Hummel and H.M. Breitling, Proc. of the Europhysics Conf., Marstrand, Sweden, June 1970, Atomic Transport in Solids and Liquids, (A. Lodding and T. Lagerwell, Eds.); and Z. Naturforschung, 26a (1971) 36.

3.

On the Direction of Electromigration in Thin Silver, Gold and Copper Films, R.E. Hummel and H.M. Breitling, Appl. Phys. Lett., 18 (1971) 373.

4.

Electromigration in Thin Silver, Copper, Gold, Indium, Tin, Lead and Magnesium Films, H.M. Breitling and R.E. Hummel, J. Phys. Chem. Sol., 33 (1972) 845.

5.

Observations on Electromigration in Various Thin Films of Group I-IV, R.E. Hummel, Proc. of the Intl. Conf. on Thin Films, May 1972, Venice, Italy; and Thin Solid Films, 13 (1972) 175.

6.

Activation Energy of Electrotransport in Thin Silver and Gold Films, R.E. Hummel and H.J. Geier, Trans. of Intl. Conf. on Low Temperature Diffusion and Applications to Thin Films, August 1974, Yorktown Heights, NY; and Thin Solid Films, 25 (1975) 335.

7.

On the Controversy About the Direction of Electrotransport in Thin Gold Films, R.E. Hummel and R.T. DeHoff, Appl. Phys. Lett., 27 (1975) 64.

8.

Activation Energy for Electrotransport in Thin Aluminum Films by Resistance Measurements, R.E. Hummel, R.T. DeHoff and H.J. Geier, J. Phys. Chem. Solids, 37 (1976) 73.

9.

Electromigration in Thin Films, R.E. Hummel, Proc. of Symp. on Electro- and Thermotransport in Metals and Alloys, September 1976, Niagara Falls, NY, AIME publication, New York, NY (1977) 93.

10.

The Effect of Minor Constituents on the Electrotransport Induced Failure Site in Thin Gold Films, R.E. Hummel, B.K. Krumeich and R.T. DeHoff, Appl. Phys. Lett., 33 (1978) 960.

11.

Quantitative Measurements of Thin-Film Microstructures during Electromigration Experiments, R. McEachron, R.T. DeHoff and R.E. Hummel, J. of Metals. 31 (1997) 123.

12.

AThermal Grooving, Thermotransport and Electrotransport in Doped and Undoped Thin Gold Films, R.E. Hummel, R.T. DeHoff, S. Matts-Goho and W.M. Goho, Thin Solid Films, 78 (1981) 1.

13.

New Insights on the Reversal of the Site of Electromigration Failure in Gold Films Doped with Alkali, R.E. Hummel, S. Matts-Goho and R.T. DeHoff, J. Appl. Phys., 54 (1983) 2855.

14.

The Role of Thermal Grooving, Thermotransport and Electrotransport on the Failure of Thin Film Metallizations, R.E. Hummel, S. Matts-Goho and R.T. DeHoff, Proc. 22nd Intl. Reliability Phys. Symp., April 1984, Las Vegas, NV, (IEEE Cat. No. 84CH1990-1) 234.

15.

Electromigration and Thermal Grooving in Thin Films, R.E. Hummel, S.Y. Lee and R.T. DeHoff, Proc. on Electromigration of Metals and 1st Intl. Symp. on Multilevel Metallization and Packaging, New Orleans, LA, 1985, (J.R. Lloyd, J. Pierce, R.A. Levy and R.G. Frieser, Eds.), The Electrochem. Soc., Inc., Pennington, NJ, 17.

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16.

Application and Deterioration of Thin Films Used for Microelectronic Devices, R.E. Hummel in Chemisorption of Gases on Metal Films, (P. Wissman, Ed.), Elsevier Sci. Pub., Amsterdam, New York (1986).

17.

On the Role of Indium Underlays on the Prevention of Thermal Grooving in Thin Gold Films, S.Y. Lee, R.E. Hummel and R.T. DeHoff, Thin Solid Films, 149 (1987) 29.

18.

On the Current Density Dependence of Electromigration in Thin Films, R.E. Hummel, Phys. Stat. Sol. (a), 107 (1988) K175.

19.

Electromigration Behavior of ICB-Deposited Aluminum Films on SiO2, R.E. Hummel and I. Yamada, Appl. Phys. Lett., 53 (1988) 1765.

20.

Application of ICB Techniques for the Deposition of Thermally Stable Metal Films, I. Yamada, H. Usui and R.E. Hummel, Proc. 1st Intl. Conf. on ULSI Materials, May 15-20, 1988, Atlanta, GA.

21.

Electromigration Behavior of Aluminum Films Deposited on Silicon by Ionized Cluster Beam (ICB) and Other Techniques, R.E. Hummel and I. Yamada, Appl. Phys. Lett., 54 (1989) 18.

22.

On the Electromigration Failure Under Pulsed Conditions, R.E. Hummel and H.H. Hoang, J. Appl. Phys., 65 (1989) 1929.

23.

The Effects of Copper Underlays on the Stability of Gold Thin Films During Isothermal Annealing, J.Y. Kim, R.E. Hummel and R.T. DeHoff, J. Vac. Sci. and Technol., A7 (1989) 1273.

24.

Electromigration of Ionized Cluster Beam Deposited Aluminum Metallizations,@ R.E. Hummel, Proc. 27th Intl. Reliability Phys. Symp., April 1989, Phoenix, AZ, (IEEE Cat. No. 89CH2650-0) 207. AA New Look at the Reliability of Thin Film Metallizations for Microelectronic Devices, R.E. Hummel, Advances in Solid State Physics, 29 (1989) 251, Vieweg Verlag, Wiesbaden (Germany).

25.

26.

The Effects of Tin Underlays on the Stability of Gold Thin Films During Isothermal Annealing, J.Y. Kim and R.E. Hummel, Phys. Stat. Sol. (a), 124 (1991) 211.

27.

Hole and Hillock Formation in Gold Metallizations at Elevated Temperatures Deposited on Titanium, Vanadium and Other Barrier Layers, J.Y. Kim and R.E. Hummel, Phys. Stat. Sol. (a), 122 (1990) 255.

28.

Electromigration Lifetime and Crystal Structure of Thin Aluminum Film Connectors for Microelectronic Devices Deposited by the Ionized Cluster Beam Technique,@ R.E. Hummel, A. Morrone and B. Lambers, J. Vac. Sci. and Technol., A8 (1990) 1437.

29.

Electromigration and Contact Filling of Aluminum Films Deposited by Ion-Enhanced Processes, R.E. Hummel, D. Malone and H. Kawasaki, Nucl. Instr. and Meth. in Phys. Res. (B), Beam Interactions with Materials and Atoms, 59/60 (1991) 297.

30.

Sub-Micron Contact Filling and Electromigration of Self-Ion-Enhanced Physical Vapor Deposited Aluminum Films,@ R.E. Hummel and D.W. Malone in Materials Reliability Issues in Microelectronics, (J.D. Lloyd, F.G. Yost and P.S. Ho, Eds.), 225 (1991) 67.

31.

Electromigration in VLSI Metallization Test Structures Stressed Over a Range of DC Pulse Conditions and Frequencies up to 133 MHz, D.W. Malone and R.E. Hummel, Materials Reliability in Microelectronics VI, (W. Filter, J. Clement, A. Oates, R. Rosenberg, P. Lenahan, Eds.), MRS Proceedings, 428 (1997) 115.

32.

Electromigration Failure of Integrated Circuit Metallizations Subjected to High Frequency- pulsed Current, D.W. Malone and R.E. Hummel, J. Appl. Phys. 83 (1998) 5750.

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II. Optical Properties: Differential Reflection Spectroscopy (General, Alloys, Ordering, Precipitation, etc.) 1.

Optical Reflectivity Measurements on Alloys by Compositional Modulation, R.E. Hummel, D.B. Dove and J.A. Holbrook, Phys. Rev. Lett., 25 (1970) 290.

2.

'Differential Reflectometer' for Measurements of Small Differences in Reflectivity, J.A. Holbrook and R.E. Hummel, Rev. Sci. Inst., 44 (1973) 463.

3.

Compositional Modulation of Cu-Zn, Cu-Al and Cu-Ni Alloys, R.E. Hummel, J.A. Holbrook and J.B. Andrews, Proc. Intl. Conf. on Modulation Spectroscopy, November 1972, Tucson, AZ, (B.O. Seraphin, Ed.); and Surface Sci., 37 (1973) 717.

4.

Application of the Differential Reflectometer for Materials Research Such as Corrosion, Ordering, Alloying, etc.,@ R.E. Hummel, J.B. Andrews and J.A. Holbrook, Z. Metallk., 64 (1973) 573.

5.

Modulated Reflectivity Measurements on α-phase Cu-Zn, Cu-Al, Cu-Ga and Cu-Ge Alloys, R.E. Hummel and J.B. Andrews, Phys. Rev. B, 8 (1973) 2449.

6.

Optical Properties and Electronic Structure of Dilute Cu-Au, Cu-Zn, Cu-Al, Cu-Ga, Cu-Si, Cu-Ge, Cu-Sn and Cu-As Alloys, R.J. Nastasi-Andrews and R.E. Hummel, Phys. Rev. B, 16 (1977) 4314.

7.

Interpretation of Compositional Modulation Spectra to Determine Some Optical Properties of Alloys, R. Enderlein and R.E. Hummel, Phys. Stat. Sol. (b), 88 (1978) 173.

8.

Optical Investigations of Short Range Ordering of α-Copper-Aluminum Alloys, J.B. Andrews, R.J. NastasiAndrews and R.E. Hummel, Phys. Rev. B, 22 (1980) 1837.

9.

Differential Reflectometry of Sputtered Silver-Aluminum Films Between 1.6 and 6.2 eV, R.E. Hummel, Optics Communications, 39 (1981) 55.

10.

Use of the Differential Reflectometer in Metallography, R.E. Hummel, Practical Metallography, 19 (1982) 280.

11.

Differential Reflectometry and Its Applications in the Study of Alloys, Ordering, Corrosion and Surface Properties, Review paper, R.E. Hummel, Phys. Stat. Sol. (a), 76 (1983) 12.

12.

Differential Reflectometry, R.E. Hummel, J. de Physique, série Colloque C10 Supplément au numero 12 (1983) 105.

13.

New Look at the Line-Shape of Differential Reflectograms for Dilute Alloys, R.E. Hummel and R. Enderlein, Phys. Rev. B, 2 (1984) 1529.

14.

Optical Properties and Electronic Structure of Copper-Cobalt Alloys, R.E. Hummel and W.M. Goho, Phys. Stat. Sol. (b), 147 (1988) 417.

15.

The Influence of Precipitation on the Optical Properties and Electronic Structure of Copper-Cobalt Alloys, R.E. Hummel, W.M. Goho and V. Gerold, Phys. Stat. Sol. (a), 106 (1988) 641.

16.

Differential Reflectometry and Its Application in Materials Science, R.E. Hummel, Surface and Interface Analysis, 12 (1988) 11.

17.

Differential Reflection Spectrometry, R.E. Hummel in Analysis of Microelectronic Materials and Devices, (M. Grasserbauer and H.W. Werner, Eds.), John Wiley, NY (1991) 719.

18.

Characterization of Multilayer Thin Film Structures by Differential Reflection Spectroscopy, D.R. Hagmann and R.E. Hummel, Mat. Res. Bull., 31 (1996) 1449. 4

III. Optical Properties: Study of Corrosion Phenomena by Differential Reflection Spectroscopy 1.

Use of Electrochemical Techniques in Combination with Differential Reflectometry to Elucidate Experimental Pourbaix Diagrams, R.E. Hummel, E.D. Verink, Jr. and C.W. Shanley, Proc. 6th Intl. Cong. on Metallic Corrosion, 1975, Melbourne, Australia.

2.

Differential Reflectometry: A New Optical Technique to Study Corrosion Phenomena, C.W. Shanley, R.E. Hummel and E.D. Verink, Jr., Corr. Sci., 20 (1980) 467.

3.

Differential Reflectometry of Corrosion Products of Copper, C.W. Shanley, R.E. Hummel and E.D. Verink, Jr., Corr. Sci., 20 (1980) 481.

4.

Optical Studies of Dezincification in a-Brass, J.E. Finnegan, R.E. Hummel and E.D. Verink, Jr., Corr. Sci., 37 (1981) 256.

5.

Differential Reflectometry of Thin Film Metal Oxides on Copper, Tungsten, Molybdenum and Chromium,@ F.K. Urban III, R.E. Hummel and E.D. Verink, Jr., Corr. Sci., 22 (1982) 647.

6.

The Passivation of Nickel in Aqueous Solutions -- I. The Identification of Insoluble Corrosion Products on Nickel Electrodes Using Optical and ESCA Techniques, R.E. Hummel, R.J. Smith and E.D. Verink, Jr., Corr. Sci., 27 (1987) 803.

7.

The Passivation of Nickel in Aqueous Solutions -- II. An In Situ Investigation of the Passivation of Nickel Using Optical and Electrochemical Techniques,@ R.J. Smith, R.E. Hummel and J.R. Ambrose, Corr. Sci., 27 (1987) 815.

8.

The Passivation of Nickel in Aqueous Solutions -- III. The Passivation of Ni-30 wt.% Cu Alloys as Studied by In Situ Electrochemical and Optical Techniques, R.E. Hummel and R.J. Smith, Corr. Sci., 28 (1988) 279.

9.

The Passivation of Nickel in Aqueous Solutions -- IV. Optical and Electrochemical Investigations of the Anodic Behavior of Nickel in Chloride Containing Solutions, R.J. Smith and R.E. Hummel, Corr. Sci., 30 (1990) 849.

10.

Differential Reflectometry and Other Optical Techniques in Corrosion Research,@ R.E. Hummel, Proc. NATO Advanced Study Institute, Electrochemical and Optical Techniques for the Study of Metallic Corrosion, M.G.S. Ferreira and C.A. Melendes, Eds., Viana Do Castello, July 9-21 (1989); published by Kluwer Academic Publishers, Boston/London (1991) 241-283.

IV. Optical Properties: Ion Implantation l.

Optical Investigations of Ion Implant Damage in Silicon, R.E. Hummel, W. Xi, P.H. Holloway and K.A. Jones, J. Appl. Phys., 63 (1988) 2591.

2.

Differential Reflectometry Studies of Implantation Damage and Annealing Behavior of Silicon Wafers Involving Light and Heavy Ions, R.E. Hummel and W. Xi, Proc. Symp. AIon Implantation for Elemental and Compound Semiconductors, S.J. Pearton and K.S. Jones, Eds., 176th Meeting of the Electrochemical Society, Hollywood, FL, October 15-20 (1989), Proc. Vol. 90-13, The Electrochem. Soc., Inc., Pennington, NJ (1990) 196.

3.

Differential Reflection Spectroscopy -- A Versatile Modulation Technique for the Study of the Electronic Properties of Alloys, Semiconductors, and Thin Films, R.E. Hummel, Proc. Intl. Conf. of Modulation

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Spectroscopy, F.H. Pollak, M. Cardona and D.E. Aspnes, Eds., San Diego, CA, March 19-21 (1990), SPIE Volume 1286, Bellingham, WA (1990) 146. 4.

Ion Implantation Damage and Annealing of Silicon as Characterized by Differential Reflectometry, R.E. Hummel, W. Xi and D. Hagmann, J. Electrochem. Soc., 137 (1990) 3583.

5.

A Study of the Solid Phase Epitaxial Regrowth of Amorphous Silicon Utilizing Differential Reflectometry, D.R. Hagmann, W. Xi and R.E. Hummel, Nucl. Instr. and Meth. in Phys. Res. (B), Beam Interactions with Materials and Atoms, 59/60 (1991) 110.

6.

Redistribution of Fe, Cr and Mo in Buried Oxide Silicon-on-Insulator Structures During High Temperature Furnace Annealing, M.M.S. Puga, R.E. Hummel and D.E. Burk, J. of Physics: Semiconductor Sci. and Technol., 7 (1992) 1058.

7.

The Effect of Fe, Cr and Mo on the Resistivity of the Top Silicon Layer of Buried Oxide Silicon-onInsulator Structures, M.M.S. Puga, R.E. Hummel and D.E. Burk, J. of Physics: Semiconductor Sci. and Technol., 7 (1992) 1067.

8.

Solid Phase Epitaxial Regrowth of Ion-Implanted Amorphous Silicon Characterized by Differential Reflectometry, S.W. Feng, R.E. Hummel, and D.R. Hagmann, Nucl. Inst. and Meth. in Phys. Res. (B), 74 (1993) 151.

9.

On the Initial Annealing Stage of As+ Implanted Silicon, R.E. Hummel, S.W. Feng, and D.R. Hagmann, Z. Metallkunde, 84 (1993) 320.

10.

Differential Reflectance Studies of Structural Changes in GaAs Caused by Ar+ Ion Bombardment,@ M.H. Ludwig and R.E. Hummel, Mat. Res. Soc. Proc., Materials Research Society, 300 (1993) 345.

11.

Irradiation Effects of Ar- Cluster Ion Beams on Si Surfaces, G.H. Takaoka, G. Sugahara, R.E. Hummel, J.A. Northby, M. Sosnowski, and I. Yamada, Mat. Res. Soc. Proc., Vol. 316, AMaterials Synthesis and Processing Using Ion Beams,@ R.J. Culbertson, D.W. Holland, K.S. Jones, and K. Maex, Eds., (1994) 1005.

12.

Comparison of UT-MARLOWE Predictions of Implant-Induced Damage With Experimentally Measured Amorphous Layer Thicknesses, M.F. Morris, S. Tian, S.H. Yang, S.J. Morris, B. Obradovic, A.F. Tasch, and R.E. Hummel, Proceedings of the 11th Int. Conf. on Ion Implantation Technol., held in Austin, TX, June 16-21, 1996, IEEE (1997), 551.

13.

Implantation Damage and Epitaxial Regrowth of Silicon Studied by Differential Reflectometry, R.E. Hummel, Materials Science and Engineering, A, 253 (1998) 50-61.

14.

Novel Method for the Formation of Large-grained, Silicon Thin Films on Amorphous Substrates, R. K. Singh, S.M. Jung, S.M. Lee, and R.E. Hummel, J. Electrochem. Soc. 145 (1998) 3963.

V. Neutron Irradiation Damage in Solids 1.

Einflu von Neutronenbestrahlung auf -Kupfer-Aluminum-Legierungen, W. Köster and R.E. Hummel, Z. Metallk., 55 (1964) 388.

2.

Über den Einfluβ von Wärmebehandlung und Neutronenbestrahlung auf die elektrischen und magnetischen Eigenschaften goldreicher Gold-Mangan-Legierungen, W. Köster and R.E. Hummel, Z. Metallk., 55 (1964) 79.

3.

The Influence of Neutron Irradiation, Heat Treatment and Deformation on the Martensitic Transformations in Metastable ß1-Brass, R.E. Hummel and J.W. Koger, Scripta Met., 2 (1968) 403.

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4.

Effect of Neutron Irradiation on the Martensitic Transformation in ß1-Copper-Zinc, R.E. Hummel and J.W. Koger, Phys. Stat. Sol., 30 (1968) 515.

5.

Thermal Cycling of Neutron Irradiated ß1-Brass, R.E. Hummel, Phys. Stat. Sol., 34 (1969) K67. VI. Metallurgy

1.

Über Eigenschaften von Gold-Mangan-Legierungen und deren Beeinflussung durch Wärmebehandlung und Neutronenbestrahlung, R.E. Hummel, Dissertation (1963).

2.

Das Zweistoffsystem Gold-Mangan bis zu 25 At.-% Mn, W. Köster and R.E. Hummel, Z. Metallk., 55 (1964) 175.

3.

On the Characteristic Temperatures of the Martensitic Transformation in ß1-Copper-Zinc, R.E. Hummel and J.W. Koger, Trans. AIME, 239 (1967) 1655.

4.

On the Martensitic Transformation of ß1-Cu-Zn After Repeated Thermal Cycling, R.E. Hummel and J.W. Koger, Trans. AIME, 242 (1968) 154.

5.

The Effect of Deformation on the Martensitic Transformation of Beta Brass,@ R.E. Hummel, J.W. Koger and V. Pasupathi, Trans. AIME, 242 (1968) 249.

6.

Über die Phasenumwandlungen des metastabilen ß1-Messings, R.E. Hummel, Z. Metallk., 59 (1968) 153.

7.

The Effect of a Stable Phase on the Martensitic Transformation, R.E. Hummel and J.W. Koger, Trans. AIME, 242 (1968) 1754.

8.

Der Einfluss der Nahordnung in Kupfer-Aluminum-Legierungen auf Elektrische und Optische Eigenschaften, V. Gerold and R.E. Hummel, Z. Metallk., 72 (1981) 761.

9.

What Can Optics Contribute to the Understanding of Metals and Alloys? R.E. Hummel, Z. Metallk., 75 (1984) 268.

VII. Optical Properties: Electronic Structure of Materials 1.

Metalloptische Untersuchungen an Silber-Palladium und Nickel-Chrom-Legierungen, H.E. Schmidt and R.E. Hummel, Z. Metallk., 52 (1961) 337.

2.

Reflectivity of Silver- and Aluminum-Based Alloys for Solar Reflectors, R.E. Hummel, Solar Energy, 27 (1981) 449.

3.

Electronic Properties of Materials: I. Fundamentals of Band Theory, R.E. Hummel, J. Educ. Modules for Mats. Sci. and Engr., 4 (1982) 1.

4.

Electronic Properties of Materials: II. Electrical Properties of Materials, R.E. Hummel, J. Educ. Modules for Mats. Sci. and Engr., 4 (1982) 781.

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VIII. Optical Properties: Porous Silicon/Spark-Processed Silicon 1.

Novel Technique for Preparing Porous Silicon,@ R.E. Hummel and Sung-Sik Chang, Appl. Phys. Lett., 61 (1992) 1965.

2.

Composition and Structure of Spark Eroded Porous Silicon, R.E. Hummel, S.-S. Chang, M. Ludwig, and A. Morrone, MRS Proceedings, Microcrystalline Semiconductors - Materials Science and Devices, 283 (1993) 45.

3.

Structure and Photoluminescence Properties of Porous Silicon Prepared by Spark Erosion, R.E. Hummel, S.-S. Chang, M. Ludwig, and A. Morrone, Proc. Intl. Workshop on Light Emission and Electronic Properties of Nanoscale Silicon, February 1-3, 1993, Charlotte, NC. On the Origin of Photoluminescence in Spark-Eroded Porous Silicon, R.E. Hummel, A. Morrone, M. Ludwig, and S.-S. Chang, Appl. Phys. Lett., 63 (1993) 2771.

4.

5.

Bright Visible Photoluminescence of Spark-Processed Ge, GaAs, and Si, M.H. Ludwig, R.E. Hummel, and S.-S. Chang, J. Vac. Sci. Technol. B, 12 (1994) 3023.

6.

Luminescence of Spark-Processed Materials, M.H. Ludwig, R.E. Hummel, and M. Stora, Thin Solid Films, 255 (1995) 103.

7.

Comparison of Anodically Etched Porous Silicon with Spark-Processed Silicon, R.E. Hummel, M. Ludwig, S.-S. Chang, and G. LaTorre, Thin Solid Films, 255 (1995) 219.

8.

Strong, Blue, Room-Temperature Photoluminescence of Spark-Processed Silicon, R.E. Hummel, M.H. Ludwig, and S.-S. Chang, Solid State Communications, 93 (1995) 237.

9.

Possible Mechanisms for Photoluminescence in Spark-Processed Si, R.E. Hummel, M.H. Ludwig, and S.-S. Chang, MRS Proceedings, 358 (1995) 151.

10.

Time-Resolved Photoluminescence Measurements on Spark-Processed Blue and Green Emitting Silicon, R.E. Hummel, P.M. Fauchet, and M.H. Ludwig, Solid State Communications, 95 (1995) 553.

11.

Does the Blue/Violet Photoluminescence of Spark-Processed Silicon Originate from Hydroxyl Groups?, R.E. Hummel, M.H. Ludwig, J. Hack, and S.-S. Chang, Solid State Communications, 96 (1995) 683.

12.

Cathodoluminescing Properties of Spark-Processed Silicon, M.H. Ludwig, J. Menniger, and R.E. Hummel, J. Phys: Condensed Matter, 7 (1995) 9081.

13.

Position and Temperature-Dependent Optical Properties of Spark-Processed Si, M.H. Ludwig, J. Menninger, R.E. Hummel, and A. Augustin, Appl. Phys. Lett., 67 (1995) 2542.

14.

Spark-Processing - A Novel Technique to Prepare Light-Emitting, Nanocrystalline Silicon, R.E. Hummel and M.H. Ludwig, J. Luminescence, 68 (1996) 69.

15.

On the Formation Process of Luminescing Centers in Spark-Processed Silicon, M.H. Ludwig, A. Augustin, R.E. Hummel, and Th. Gross, J. Appl. Phys., 80 (1996) 5318.

16.

X-ray Emission Spectra and the Effect of Oxidation on the Local Structure of Porous and Spark-Processed Silicon, E.Z. Kurmaev, S.N. Shamin, V.R. Galakhov, V.I. Sokolov, M.H. Ludwig, and R.E. Hummel, J. Phys.: Condens. Matter, 9 (1997) 2671.

17.

Raman Study of the Relationship Between Nanoparticles and Photoluminescence in Spark-Processed Silicon, S. Rupp, J. Quilty, H.J. Trodahl, M.H. Ludwig, and R.E. Hummel, Appl. Phys. Lett., 70 (1997) 723.

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18.

Multicolor-Effects of Luminescing, Nanostructured Silicon After Spark-Processing in Pure and Composite Gases, M.H. Ludwig, A. Augustin, and R.E. Hummel, MRS Proceedings, Advances in Micro-Crystalline and Nano-Crystalline Semiconductors, 452 (1997) 153.

19.

Ferromagnetic Properties of Spark-Processed Photoluminescing Silicon, J. Hack, M.H. Ludwig, W. Geerts, and R.E. Hummel, MRS Proceedings, Advances in Micro-Crystalline and Nano-Crystalline Semiconductors, 452 (1997) 147.

20.

Color-Switching Effect of Photoluminescing Silicon After Spark-Processing in Oxygen, M.H. Ludwig, A. Augustin, and R.E. Hummel, Semiconductor-Science and Technology, 12 (1997) 981.

21.

Local Structure of Porous Silicon Studied by Means of X-ray Emission Spectroscopy, E.Z. Kurmaev, V.R. Galakhov, S.N. Shamin, V.I. Sokolov, R.E. Hummel, M.H. Ludwig, Applied Physics A, Materials Science & Processing, 65 (1997) 183.

22.

Does the Fast, Blue Photoluminescence from Spark-Processed Silicon Originate from Tungsten Doping? R.E. Hummel, N. Shepherd, M.H. Ludwig, M.E. Stora, Thin Solid Films 325 (1998) 1.

23.

Comparison of Photoluminescence Behavior of Porous Ge and Spark-Processed Ge,. S.S. Chang and R.E. Hummel, J. Luminescence, 86 (2000) 33.

24.

Electroluminescence and Magnetic Field Quenching of Photoluminescence of Spark-Processed Si: R.E. Hummel, M.E. Stora, N. Shepherd, S. Yu, and F. Fajardo, Journal of Porous Materials, 7 (2000) 131.

25.

Luminescence Properties of Ambient Air Aged and Thermally Oxidized Porous Silicon. S.S. Chang, A. Sakai, and R.E. Hummel, Materials Science and Engineering, B64 (1999) 118.

26.

Novel Photoconductive Effect in Spark-Processed Silicon with Metal Contacts. M.E. Stora and R.E. Hummel, Materials Science and Engineering, B69-70 (1999) 118.

27.

Optical Properties of Spark-Processed Ge, S.-S. Chang, G.J. Choi and R.E. Hummel, Materials Science and Engineering, B76 (2000) 237.

28.

UV and Green Photoluminescence from Spark-Processed Zinc, S.-S. Chang, G.J. Choi, H.H. Park, M.E. Stora, and R.E. Hummel, Materials Science and Engineering, B83 (2001) 29.

29.

“Interpretation of Photoluminescence Spectra Obtained for Spark-Processed Si.,” R.E. Hummel, N. Shepherd, and D. Burton, Appl. Phys. Letters, 79, (2001), 3218.

30.

“Photonic and Magnetic Properties of Spark-Processed Silicon,” R.E. Hummel in: “Silicon-Based Materials and Devices” H.S. Nalva, Ed., Academic Press, (2001) 2237.

31.

“Variation of Spark-Processing Parameters on the Photoluminescence Properties of Spark-Processed Silicon,” M.E. Stora and R.E. Hummel, J. Phys. Chem. Solids, 63, (2002) 1655-1668.

32.

“Semi-Empirical Calculation of the Optical Spectra of Silica Clusters in Spark-Processed Silicon,” J. Polihronov, M. Hedstrom, R.E. Hummel, and H.P. Cheng, J. Luminescence, 96 (2002) 119.

33.

“Photoluminescence of Spark-Processed Metals.” M.E. Stora and R.E. Hummel, J. Phys. Chem. Solids, 63,(2002), 1867.

34.

“Improved Electroluminescence of Spark-Processed Silicon by an Aerosol-Assisted Technique”, N. Shepherd and R. E. Hummel, phys. stat. sol. (a) 197 (2003),222.

35.

“A Model for the Electroluminescence of Spark-Processed Si” N. Shepherd, and R.E. Hummel, J. Phys. Chem. Solids, 64 (2003), 967.

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36.

“Optical Properties and Energetics of Oxygenated Silicon Ring-Shaped Clusters”, J. Polihronov, and R. E. Hummel, J. Luminescence, 101/1-2, ( 2003), 55.

37.

“Porosity and Density of Spark-Processed Si”, J. Polihronov, T. Dubroca, M. Manuel, and R.E. Hummel, Materials Science and Engineering (B): Solid State Materials for Advanced Technology, B107 (2004), 124.

38.

“Can Chemically Etched Germanium or Germanium Nanocrystals Emit Visible Photoluminescence?”, G. Kartopu, V. A. Karavanskii, U. Serincan, R. Turan, R.E. Hummel, Y. Ekinci, A. Gumnaes, and T. G. Finstad, phys. Stat. sol. (a) 202, No. 8. (2005), 1472 .

39. “Simultaneous Micro-Raman and Photoluminescence Study of Spark-Processed Germanium: Report on the Origin of the Orange Photoluminescence Emission Band.” G. Kartopu, S.C. Bayliss, R.E. Hummel, and Y. Ekinci, J. Appl. Phys., 95 , (2004), 3466. 40. “Absorption and Emission of Light in Spark-Processed Silicon” J. G. Polihronov, M. Hedstrom, H-P Cheng, and R. E. Hummel, J. Physics and Chemistry of Solids, 67, (2006) 1543 41. “Infrared Luminescence from Spark-Processed Silicon”, K. Kim and R.E. Hummel, J. Physics and Chemistry of Solids, 69 ,(2007),199 42. “Infrared Photoluminescence from Erbium-doped Spark-Processed Silicon”, K. Kim, and R.E. Hummel, J. Appl Phys., 100, (2006), 43114 . 43. ”Infrared Electroluminescence from Erbium-doped Spark-Processed Silicon”, K. Kim, and R. E. Hummel, J. Luminescence, 127, (2007), 339 44. “Quasiferromagnetism in Semiconductors”, T. Dubroca, J. Hack, and R. E. Hummel, Appl. Phys. Letters, 88, (2006), 182504. 45. “Comment on “Unusual magnetic transitions and nature of magnetic resonance spectra in oxide glasses containing gadolinium”, T. Dubroca, J. Hack, and R.E. Hummel, Physical Review B 74 ( 2006), 026403.

IX. Explosives Detection 1.

“Detection of Explosive Materials by Differential Reflection Spectroscopy” R. E. Hummel, A. M. Fuller, C. Schoellhorn, and P. H. Holloway, Appl. Phys. Lett. 88, (2006) 231903.

2.

“Remote Sensing of Explosive Materials using Differential Reflection Spectroscopy ”, R.E. Hummel, A.M. Fuller, C. Schoellhorn, and P.H. Holloway, in “Trace Chemical Sensing of Explosives”, R. L. Woodfin Ed. , John Wiley N.Y. (2007) Chapter 15, page 301.

3.

“Standoff Detection of Explosive Materials by Differential Reflection Spectroscopy”, Anna M. Fuller, Rolf E. Hummel, Claus Schoellhorn,, and Paul H. Holloway, Proceedings SPIE Optics East, Boston MA, October 2-5 2006.

4.

“Developments on Standoff Detection of Explosive Materials by Differential Reflectometry”, Claus Schoellhorn, Anna M. Fuller, Julien Gratier, and Rolf E. Hummel, Applied Optics 46, (2007), 6232.

5)

“New Developments on Standoff Detection of Explosive Materials by Differential Reflectometry”, Claus Schoellhorn, Anna M. Fuller, Julien Gratier, and Rolf E. Hummel, SPIE Defense and Security Symposium proceedings, 9-13 April 2007, Orlando,FL

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X. General 1.

A Visiting Scholar's View on Electronic Materials Research in the People's Republic of China, Part I, R.E. Hummel, J. Metals, 41/7 (1989) 60.

2.

A Visiting Scholar's View on Electronic Materials Research in the People's Republic of China, Part II, R.E. Hummel, J. Metals, 41/8 (1989) 57.

3.

A Visiting Scholar's View on Electronic Materials Research in the People's Republic of China, Part III, R.E. Hummel, J. Metals, 41/9 (1989).

4.

Liefert die Kupferchlorid-Kristallisations-Methode einen Nachweis für die Gestaltkräfte des Lebendigen? R.E. Hummel, Elemente der Naturwissenschaft, 57 (1992) 112.

5.

Teaching Junior High School Physics: Personal Experiences and Observations, MRS Bulletin, 18 (1993) 92.

6.

An Integrated Graduate Course Covering the History, Properties, and Applications of Materials, R.E. Hummel, J. Matls. Educ., 19 (1997) 161.

7.

Computer Failures: A Non-problem? R.E. Hummel, MRS Bulletin, 22 (1997) 4.

8.

Ultraviolet Transmittance in Eyeglass Materials, C.R. Reardon and R.E. Hummel, J. Undergraduate Research, Nov. (2000).

9.

Teaching by Computer B Education of the Future or a Fad ? R.E. Hummel, J. Materials Educ. 20 (1998) 255.

10.

“Contemplations After Forty Years of Teaching at UF”. R.E. Hummel, The Pedagogator, Vol 8, Nr. 8 (2005)

BOOK CHAPTERS AND REVIEW ARTICLES 1.

“Electrotransport in Thin Films,” R.E. Hummel in Electro- and Thermotransport in Metals and Alloys, (R.E. Hummel and H.B. Huntington, Eds.), The Met. Soc. of AIME, NY (1977) 93.

2.

Differential Reflectometry and Its Application in the Study of Alloys, Ordering, Corrosion and Surface Properties, R.E. Hummel, Phys. Stat. Sol. (a), 76 (1983) 12.

3.

Application and Deterioration of Thin Films Used for Microelectronic Devices, R.E. Hummel in Chemisorption of Gases on Metal Films, (P. Wissman, Ed.), Elsevier Sci. Pub., Amsterdam, New York (1986) 111.

4.

Differential Reflectometry and Other Optical Techniques in Corrosion Research,@ R.E. Hummel, Proc. NATO Advanced Study Institute, Electrochemical and Optical Techniques for the Study of Metallic Corrosion, (M.G.S. Ferreira and C.A. Melendes, Eds.), Kluwer Academic Publishers, Boston/London (1991) 241-283.

5.

AA New Look at the Reliability of Thin Film Metallizations for Microelectronic Devices, R.E. Hummel, Advances in Solid State Physics, 29 (1989) 251, Vieweg Verlag, Wiesbaden (Germany).

6.

Differential Reflection Spectrometry, R.E. Hummel in Analysis of Microelectronic Materials and Devices, (M. Grasserbauer and H.W. Werner, Eds.), John Wiley, NY (1991) 719.

11

7.

Electromigration and Related Failure Mechanisms in Integrated Circuit Interconnects, R.E. Hummel, International Materials Reviews, 39 (1994) 97.

8.

Reflectometry and Differential Reflectometry, R.E. Hummel in Encyclopedia of Analytical Science, (A. Townshend, Ed.) (1995).

9.

Electromigration in Integrated Circuits, D.W. Malone and R.E. Hummel, Critical Reviews in Solid State and Materials Science, 22 (1997) 199-238.

10.

Implantation Damage and Epitaxial Regrowth of Silicon Studied by Differential Reflectometry, R.E. Hummel, in Modifications of Ceramics and Semiconductors by Ion Bombardment, R. Novak, C.Y. McHargue, and W. Ensinger, Eds., Materials Science and Engineering, A, Structure Materials: Properties, Microstructure and Processing, A253 (1998) 50-61

11.

Differential Reflectance Spectroscopy in Analysis of Surfaces R.E. Hummel, in Encyclopedia of Analytical Chemistry: Instrumentation and Applications, R.A. Meyers, Ed., J. Wiley, Sussex (2000) pp. 9047-9071.

12.

Materials Characteristics: Optical Properties and Thermal Properties”, R.E. Hummel in: Laser Materials Processing Handbook, Magnolia Publishing Inc., Orlando (2001) pp. 167-173.

13.

Photonic and Magnetic Properties of Spark-Processed Silicon. R.E. Hummel in: Silicon-Based Materials and Devices, Vol. I, Academic Press (2001) pp. 237-265

14.

“Remote Sensing of Explosive Materials using Differential Reflection Spectroscopy ”, R.E. Hummel, A.M. Fuller, C. Schoellhorn, and P.H. Holloway, in “Trace Chemical Sensing of Explosives”, R. L. Woodfin Ed. , John Wiley N.Y. (2007) Chapter 15, page 301. BOOKS

1.

Optical Properties of Metals and Alloys, R.E. Hummel, Springer-Verlag, Berlin, Heidelberg, New York (1971).

2.

Electro- and Thermotransport in Metals and Alloys, R.E. Hummel and H.B. Huntington, Eds., proceedings of an international symposium held in Niagara Falls, NY, September 22, 1976, TMS publication (1977).

3.

Electronic Properties of Materials, (An Introduction for Engineers), R.E. Hummel, Springer-Verlag, Berlin, Heidelberg, New York, Tokyo (1985).

4.

Electronic Properties of Materials (An Introduction for Engineers), II nd Edition, R.E. Hummel, SpringerVerlag Berlin, Heidelberg, New York, Tokyo (1993).

5.

Handbook of Optical Properties Volume I: Günther, Eds., CRC Press (1995)

6.

Handbook of Optical Properties, Volume II: Optics of Small Particles, Interfaces, and Surfaces, R.E. Hummel and P. Wissmann, Eds., CRC Press (1997).

7.

Understanding Materials Science - History, Properties, Applications, R.E. Hummel, Springer-Verlag, Berlin, Heidelberg, New York (1998).

8.

Electronic Properties of Materials, III Edition, R. E. Hummel, Springer-Verlag, Heidelberg, New York, Tokyo (2001).

9.

Understanding Materials Science – History, Properties, Applications, II Edition, R. E. Hummel, SpringerVerlag, Heidelberg, New York, Tokyo (2004)

Thin Films for Optical Coatings, R.E. Hummel and K.

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