Product Quality Lifecycle Management Program 7628 Thorndike Road, Greensboro, NC 27409
Document #
PRO-000148
Owner
Preston Scott
Revision
B
Department
Quality
Contents 1 2 3 4 5 6 7
PURPOSE .......................................................................................................................................2 SCOPE ............................................................................................................................................2 DEFINITIONS ..................................................................................................................................2 PRODUCT QUALITY LIFECYCLE MANAGEMENT PROCESS FLOW .........................................2 GENERAL REQUIREMENTS FOR RELIABILITY TESTING ..........................................................3 PRODUCT QUALIFICATION – LIST OF STRESS TESTS .............................................................3 REVISION HISTORY .......................................................................................................................5
Revision B See !7 for Revision History Initiated by Preston Scott 10/23/13
RFMD ·∙ 7628 Thorndike Road ·∙ Greensboro, NC ·∙ 27409-‐9421
Product Quality Lifecycle Management Program PRO-‐000148 Rev B
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PURPOSE 1.1
2
The scope of this document covers all commercially available integrated circuit products.
DEFINITIONS 3.1
4
The purpose of this document is to describe the comprehensive methodology for assuring quality over the lifecycle of RFMD products.
SCOPE 2.1
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Potential Problem Analysis (PPA) – method of anticipating most likely problems based on group knowledge and experience. Similar to Failure Mode and Effects Analysis (FMEA), the process begins with brainstorming and concludes with a list of issues ranked in order of importance.
PRODUCT QUALITY LIFECYCLE MANAGEMENT PROCESS FLOW 4.1
Technology Qualification - As shown in Table 1, qualification work begins withthe reliability assessment of individual subcomponents and sub processes. This technology level qualification work may begin at an approved RFMD supplier or (in the case of RFMD internal manufacturing processes) may occur solely at RFMD. In the case of technology qualification work completed at suppliers, the results must be reviewed and approved by RFMD. Additional work may be necessary at RFMD to successfully approve an external technology for use by RFMD.
4.2
Product Qualification - Once a technology is successfully qualified, it is integrated into a saleable product. Product qualification then commences with the goal of evaluating all sub processes and subcomponents as they exist in the form of a completed product. Table 1 – Qualification Process Flow
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4.3
Early Production Phasing - Once a product is successfully qualified, it may be selected for a period of highly intensive, large sample size testing known as early production phasing. The goal of phasing is to closely monitor representative products and technologies as they are “phased-in” to high volume manufacturing processes. Large samplings of parts are selected on a weekly basis to assess process stability and reliability across the manufacturing process. These parts are then submitted for a set of core reliability tests such as moisture sensitivity level (MSL), temperature cycling, solderability, and unbiased Highly Accelerated Stress Test (HAST).
4.4
Ongoing Reliability Monitoring (ORM) – After product qualification and early production phasing are complete, representative technology platforms are re-evaluated on a quarterly basis to assess reliability over time. Core ORM tests include solderability, MSL, temperature cycling, and High Temperature Operating Life (HTOL).
GENERAL REQUIREMENTS FOR RELIABILITY TESTING 5.1
Unless otherwise indicated, pass/fail criteria are dictated by comparison of an approved pre- and post- stress electrical test suite.
5.2
For tests requiring multiple assembly lots, each lot must (as a minimum) be from a non-consecutive assembly build (i.e. non-consecutive shifts).
5.3
Whenever possible, process lots shall be deliberately chosen to reflect demonstrated or anticipated production variability. The appropriate process parameters investigated should in turn be based on risk defined by a Potential Problem Analysis (PPA) which reflects thorough understanding of failure modes of the technology.
5.4
Any failures encountered during qualification shall be investigated through electrical and physical failure analysis in order to determine root cause. All failures shall be dispositioned through root cause explanation or corrective action prior to product release.
PRODUCT QUALIFICATION – LIST OF STRESS TESTS 6.1
All RFMD products undergo a core suite of reliability stress tests as given in Table 2. A description of each test is given for clarity. The list is not comprehensive. Additional reliability tests may be added for particular products to address risks identified through product level PPA or by customer request. When appropriate generic data may be used to fulfill sample size requirements.
Product Quality Lifecycle Management Program PRO-‐000148 Rev B
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Table 2 – Core Product Qualification Test Suite Reliability Test High Temperature Operating Life (HTOL) Temperature Humidity Bias (THB) Electrostatic Discharge - Human Body Model (ESDMM) Electrostatic Discharge Charged Device Model (ESD-CDM)
Latch-Up (LU) Moisture Sensitivity Level
Standard
Sample Size for Reliability Demonstration
Description
77x3
Products are powered at worst case conditions at elevated temperatures to simulate an entire lifetime of operation.
JESD22A101
77 x 3
Products are powered in worst case conditions at elevated temperature and humidity to identify corrosion susceptibility in harsh conditions.
JESD22A114
3 parts per voltage
Products are stressed using ESD waveforms in order to characterize ESD susceptibility during human handling.
JESD22A101
3 parts per voltage
Products are stressed using ESD waveforms in order to characterize ESD susceptibility during handling.
6x1
Products are tested for sensitivity to a phenomena whereupon an input signal can trigger a low impedance path between supply rails in a CMOS circuit.
77 x 3
Products undergo an accelerated moisture soak and reflow process to identify areas of weakness due to moisture sensitivity.
77 x 3
Products are exposed to successive hot and cold temperatures to evaluate sensitivity to periodic temperature changes.
JESD22A108
JESD78C
J-STD-020
Temperature Cycling (TC)
JESD22A104
High Temperature Storage
JESD22A103
77 x 3
Unbiased HAST
JESD22A118
77 x 3
JESD22B102 JESD22B105
22 x 3 15 leads from 3 parts
MIL-STD883, M2011
30 wires from 5 parts
Wirebonded die are subjected to wire pulls to assess wire breakage force and location.
JESD22A116
30 wires from 5 parts
Wirebonded die are subjected to a bond shearing force to assess mechanical integrity of the bond interface.
MIL-STD883, M2019
5 dice from 1 lot
Mounted die are sheared from their carrier package to assess mechanical integrity of die attach interface.
JESD22B117
30 bumps from 5 parts
Solder balls are sheared from their carrier to assess the mechanical integrity of the ball-carrier interface.
Solderability Lead Integrity Wire Bond Pull Wire Bond Shear Die Shear Solder Ball Shear
Products are stressed at high temperature to simulate prolonged exposure to high temperature during factory storage. Products are stressed at elevated temperature, humidity, and pressure to identify any interfacial weaknesses which may result from exposure to harsh environments, Product leads are subjected to a high temperature solder bath and examined for solder wetting characteristics. Product leads are subjected to a series of bending and flexing forces to assess their mechanical integrity.
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REVISION HISTORY
Rev.
Description
A
Initiated by Preston Scott, 06/06/2011.
B
Updated to reflect new RFMD style guide. No substantive changes.
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