PRECISE CLEANING SOLUTIONS

www.pbt-cleaning.com

ABOUT PBT WORKS COMPANY PBT Works s.r.o. is the outstanding worldwide producer of cleaning systems for the electronic assembly solution. We rise to the challenge to offer unprecedented solution which can meet growing demands of cleanness not only partially but repeatedly and equally with capability to trace the process.  Since 1992  More than 750 installations worldwide  55 employees work permanently to satisfy our customer´s needs  More than 50 representatives worldwide  2500 m2 company facility  ISO 9001 and ISO 14001 conform

 Experience with challenging projects  The most advance methods of simulation & experiments  Offering innovative solutions  Close collaboration with universities and research institutes

 Own laboratories and testing facilities  Professional advicing for optimal machine configuration  Achieving the best cleaning results

 Our design team converts research ideas into the most up-to date equipment  Complete in-house mechanical, hardware and software design  Flexibility in customer specific requirements

 Complete manufacturing and assembly within our company  SPC on entire production process

 Worldwide sales and service support through local representatives

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UNIQUE FEATURES OF OUR SYSTEMS Processes combination

Uniform system of Spray in Air

Wide range of cleaning methods for different tasks. Agitation: SIA Spray-In-Air US Ultrasonic SUI Spray-Under-Immersion AUI Air-Under-Immersion OUI Oscillation-Under-Immersion Chemistry:  Water based solvents  Semi-aqua solvent technology  Saponified process  Detergents

 Additional optimization by exchangable nozzle kits available

Complete traceability of process

traceable

direct spray

 Unique linear and matrix nozzle system for the best uniformity of sprayfield  Synchonized motion of nozzle manifolds prevents stencil from damage caused by unballanced spray load

 Barcode or matrix PCB indentification reading  Complete process parameter set logging in all process stages  Automatic concentration reading and logging

Powerful drying

vacuum dry

direct dry

 Efficient and careful vacuum drying  Direct distribution of drying heated air eliminates energy lost

Consumption minimisation

zero waste

Fully closed loop of rinsing

 Completelly independent circulation systems for each process step  Lowest liquid drag-over  Strictly drained common parts of piping  Process chambers and tooling have finest design to limit adhered liquid and drag out

 Powerfull air knife enables complete liquid blowoff from cleaned objects

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 Integrated in machine  DI water close-loop reclaim systems - environmentally friendly and cost saving  No drain required  Adaptive rinsing cycle time control

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CLEANING MACHINES OVERVIEW Single-chamber Cleaning Machines

Multi-bath

Super SWASH

Super SWASH Twingo

795 x 80 x 816

740 x 80 x 740 2x 450 x 500 x 500 (820 x 80 x 800 800 x 100 x 770 740 x 40 x 740 optionally)

COMPACLEAN

STENCILCLEAN SIA

MODULECLEAN

Process Data: Max. effective space: WxLxH (mm) W-left/right, L-front/rear, H-height High density PCBA defluxing, HDI, DCB, BGA, hybrids, PoP, SiP, etc. Eurocards / hour (3U-160, 100 x 160mm)

42 pcs

112 pcs

Typical consumption / cycle (cleaning agent) - liters

0.2 - 0.3 l

0.15 - 0.25 l

Low density PCBA, Misprints from paste and glue Eurocards / hour (3U-160, 100 x 160mm)

84 pcs

116 pcs

80 - 140 pcs

24 - 48 pcs

112 - 210 pcs

Typical consumption / cycle (cleaning agent) - liters

0.2 - 0.3 l

0.25 - 0.35 l

0.3 - 0.4 l

0.3 - 0.4 l

0.15 - 0.25 l

Stencils (metal and plastic) from paste and glue

1 pc / 32"

2 pcs / 29"

1 pc / 29"

1 pc / 29"

Stencils / hour

5 - 8 pcs

8 - 12 pcs

2 - 4 pcs

8 - 10 pcs

Typical consumption of cleaning agent / cycle

0.12 - 0.15 l

0.15 - 0.2 l

0.15 - 0.2 l

0.05 - 0.1 l

Maintenance parts from soldering process (Solder pallets etc.) Solder pallets / hour 500 x 500 x 80 mm (other sizes optionally)

2 - 3 pcs (more pcs on request)

4 - 6 pcs

Technical Data:

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Cleaning agent volume

70 l

70 l

71 l

67 l

300 / 140 l

Max. cleaning temperature

60 °C

60 °C

60 °C

60 °C

60 °C

Max. rinsing temperature

40 °C

40 °C

40 °C

room

50 °C

Max. drying temperature

110 °C

110 °C

110 °C

85 °C

110 °C

Machine dimension WxLxH (mm) W-left/right, L-front/rear, H-height

1700 × 11501400 × 1765

1700×11501400×1765

880 × 1680 × 1866

1500 × 776 × 1200

4200 x 2300 x 3000

Machine weight without liquid

495-630 kg

500-625 kg

380-485 kg

240-270 kg

1800 kg

Multi-bath Cleaning Machines UNICLEAN

MINICLEAN US

MINICLEAN SIA

optionally (see page 13.)

140-300 x 380 x 325

600 x 100 x 650

FLUXCLEAN T

FLUXCLEAN SD / HD

Process Data: Max. effective space: WxLxH (mm) W-left/right, L-front/rear, H-height

277 (rinse 155) 450 x 650-850 x 500 x 500 / x 470-620 740 (rinse 437)x 586 x 550

High density PCBA defluxing, HDI, DCB, BGA, hybrids, PoP, SiP, etc. Eurocards / hour - typical (3U-160, 100 x 160mm)

up to 240 pcs

Typical consumption / cycle (cleaning agent) - liters

0.2 - 0.3 l

Low density PCBA, Misprints from paste and glue Eurocards / hour (3U-160, 100 x 160mm)

up to 240 pcs

84 pcs

60 pcs

on request

Typical consumption / cycle (cleaning agent) - liters

0.15 - 0.3 l

0.2 - 0.3 l

0.2 - 0.3 l

on request

Stencils (metal and plastic) from paste and glue

1 pc / 23"

Stencils / hour

3 - 4 pcs

Typical consumption of cleaning agent / cycle

0.1 - 0.15

Maintenance parts from soldering process (Solder pallets etc.) Solder pallets / hour 500 x 500 x 80 mm (other sizes optionally)

32 - 40 pcs

2-3 / 9-12 pcs

Technical Data:

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Cleaning agent volume

25-75 l (optionally)

24-48 l

36 l

300-375 l

80 / 315 l

Max. cleaning temperature

60 °C

55 °C

55 °C

55 °C

room

Max. rinsing temperature

40 °C

room

room

55 °C

room

Max. drying temperature

110 °C

90 °C

90 °C

110 °C

room

Machine dimension WxLxH (mm) W-left/right, L-front/rear, H-height

3900 × 2045 × 2450

2450 x 12001400 x 23702700

760 x 730 x 1350 / 2200 x 804 x 1263

Machine weight without liquid

1700 kg

650 kg

54 / 170 kg

2170-2370 2240-2440 × 1020 × 1180 × 1020 × 1180 335 kg

400 kg

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SUPER SWASH DIRECT SPRAY AGAINST SURFACE TECHNOLOGY APPLICATION  Universal cleaning solution (PCBA, misprint, stencil in one system)  Designed to clean difficult Hi-density PCBA, with low standoff components  HDI, DCB, BGA, hybrids, PoP, SiP, etc.  High throughput & low process cost stencil cleaning  Excellent PUMP PRINT® stencil cleaning Recommended Super SWASH version: IV III IIR+ II

II IR+

IR+

direct spray

zero waste

direct dry

   




P

version III

traceable

5μm 1μm 5μm

1μm

1μm 1μm

T

L

T

L

T

L

μS

USABLE DIMENSION OF CHAMBER 80 mm

816 mm

795 mm 6

Spray cleaning with water based agent Tap water semi closed loop rinsing 1st DI water closed loop rinsing 2nd DI water closed loop rinsing 3rd DI water closed loop rinsing Pressed heated air drying UNIQUE FEATURES  5 step process - each splits to 5 substeps  Up to 3 step DI water reclaim plant  Easy process optimization due to glass door and illuminated wall  Efficient air knife for drip-off and fast drying  Possible spray nozzles optimization  Optional selective single-side cleaning  3 years waranty (on request) CONTROL SYSTEM  WINDOWS® 7 based, touchscreen, LAN  Complete process traceability (option)  Barcode reader for product (option)  Cleaner concentration measuring (option)  Machine event logging  Week program for automatic start-up /shut down  Remote support  Intuitive control system

SUPER SWASH TWINGO Super SWASH with double frame position APPLICATION  Extreme high capacity of stencil cleaning  Great PCBA cleaning volume Recommended Twingo version: II IR+

III IIR+ II

Spray cleaning with water based agent Tap water semi closed loop rinsing 1st DI water closed loop rinsing 2nd DI water closed loop rinsing Pressed heated air drying UNIQUE FEATURES  Chamber can hold two stencil/fram  Capacity enhancing of Super SWASH  Increased liquid flow  Optimal nozzle system  Unique air knife system  Easy maintenance  3 years waranty (on request)

direct spray

direct dry

zero waste

USABLE DIMENSION OF CHAMBER 2 x 40 mm

   




traceable

CONTROL SYSTEM  WIN 7® based, touchscreen, LAN connection  Based on Super SWASH concept

STENCIL AND PCB CLAMPING SYSTEM  Reliable clamping solution for heavy and irregularly shaped PCBA  Customised clamping tooling systems available

740 mm

740 mm

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COMPACLEAN HIGH PRESSURE SPRAY-IN-AIR CLEANING SYSTEM APPLICATION  High capacity & low process cost PCBA cleaning  Solder pallet cleaning Recommended COMPACLEAN version: III IIR+ II IR+

Spray cleaning with water based agent Tap water semi closed loop rinsing 1st DI water closed loop rinsing 2nd DI water closed loop rinsing Pressed heated air drying UNIQUE FEATURES  Fixed nozzle system  Basket oscillation  Uniform covering of cleaned area  All processes totally separated  Closed DI water loops available  4 step process - each splitted to 5 substeps  Easy maintenance  3 years waranty (on request)

zero waste

   

CONTROL SYSTEM  WIN 7® based, touchscreen, LAN connection  Complete process traceability available  Barcode reader for product identification (option)  Cleaner concentration measuring (option)  Machine event logging  Week program for automatic start-up /shut down  Remote support  Intuitive control system  Adaptive rinsing cycle time control  Three levels password protection

traceable




USABLE DIMENSION OF CHAMBER 500 mm 500 mm 220 mm

160 mm (optionally 200 mm)

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450 mm

PROCESS DIAGRAM version III

STENCILCLEAN SIA AUTOMATIC CLEANING SYSTEM FOR STENCILS AND PCB APPLICATION  Price-effective & reliable stencil cleaning  Effective also for PUMP PRINT® stencil  Available for PCBA cleaning  Very competitive price/performance level! Recommended version: I IR+ II II

Spray cleaning with water based agent Tap water semi closed loop rinsing 1st DI water closed loop rinsing Pressed heated air drying

direct dry

zero waste

   

UNIQUE FEATURES  Double motoric driven manifold with liquid and air knife system to ensure direct effect  Synchronous spraying and drying from both sides  This prevents stencil from damaging  Rinsing by cleaner, water or DI water  Controlled drag-out compensation  Wide choice of options  Heating in cleaning medium  Anticollision system  Easy setting & operation  Easy maintenance




USABLE DIMENSION OF CHAMBER 80 mm

740 mm (optionally 800 mm)

740 mm (optionally 820 mm) PROCESS DIAGRAM version II

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CONTROL SYSTEM  PLC control, touch screen 5“  Temperature, cycle time and conductivity controlled  Password protection PLC TOUCHSCREEN

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MODULECLEAN FLEXIBLE CLEANING SYSTEM WITH HIGH THROUGHPUT APPLICATION  Defluxing of the most difficult PCBA  Highest capacity defluxing  Cleaning before wire bonding  Fine cleaning of mechanical parts  Combined processes (PCBA + stencil + misprint)  Excellent results in cleaning of low solid and lead free technology with newest component packages types  HDI, DCB, BGA, hybrids, PoP, SiP, etc.

direct spray

direct dry

zero waste

   

 Various configurations depending on application requirements

vacuum dry

traceable




AVAILABLE PROCESS MODULES Possible combinations:  Cleaning processes SIA, SUI, US, OUI  Rinsing process SIA, SUI, US, OUI  Drying processes hot air blow, vacuum dry

US + SUI

7

SIA

7

/

SUI

/

7

ER - SUI with DI water

/

7

/

—6 3 3

10

3

3

—P

—P

V or F - Vacuum or Hot air drying

7

3

UNIQUE FEATURES  MODULECLEAN offers wide range of process possibilities  The most up-to-date system for high capacity cleaning  MODULECLEAN overcomes in-line systems in saving energy and fluid consumption  Completelly closed loops configuration possible  DI water reclaim plant is integrated  Lowest drag out due to powerful air knives CONTROL SYSTEM  Machine is PC contolled under WIN7®  Infrared controlled vacuum dryer  Week program for automatic start-up /shut down  Complete process traceability available  LAN connection traceability with data transfer  Barcode reader for product identification (option)  Cleaner concentration measuring (option)  Pull out speed from the bath controlled  Machine events logging  Remote support  Three levels password protection USABLE DIMENSION OF CHAMBER 100 mm

PUSH CART FOR OPERATION & AUTOMATIC LOADING TO MACHINE

770 mm

800 mm AUTOMATIC TRANSPORT OF BASKETS  Robotic or parallel transport of frames available  Input / Output buffer  Manual or push carts loading  Direct input and output from/to pushcarts possible  Operator´s intervention during input and output is eliminated

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UNICLEAN HIGH CAPACITY CLEANING SYSTEM

zero waste

   

traceable




APPLICATION  Effective and high capacity PCBA cleaning  Cleaning before wire bonding  Excellent results in cleaning of low solid and lead free technology with newest component packages types  HDI, DCB, BGA, hybrids, PoP, SiP, etc.  Mechanical parts degreasing

vacuum dry

PROCESS DIAGRAM

T

L

T

P

T

μS

L

T

μS

1μm

1μm

P

P

 Various configurations depending on application requirements

10μm

P

12

L

1μm

1μm

UNIQUE FEATURES  Combination of different agitation methods (US, SUI, OUI, AUI)  Cleaning capacity is comparable with in-line systems while lower energy and cleaning medium consumption occurs  Fully automated  Modular design - can be built according to process and capacity requirements  Operator’s influence is totally eliminated  Fully closed loops system  DI water reclaim plant is integrated  Vacuum drying as standard  Cleanroom capable CONTROL SYSTEM  WINDOWS® SW with touchscreen 21.5"  Adaptive controll of robotic transfer during each process  Complete process traceability available  Barcode reader for product identification (option)  Input / Output conveyor buffers  Cleaner concentration measuring (option)  Adaptive automatic refill (option)  Machine events logging  Remote support  Password protection in three levels  Minimal entrance requirement for moving  Fully ESD complying

USABLE DIMENSION OF CHAMBER

SUI BATH AGITATION

410 mm 360 mm 310 mm 260 mm

430 mm 380 mm 330 mm 280 mm

310 mm 270 mm 210 mm

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MINICLEAN US / SIA ULTRASONIC OR SPRAY IN AIR CLEANING SYSTEM APPLICATION  Effective PCB defluxing & Missprint cleaning  Mechanical parts degreasing  23“ stencil cleaning (SIA version)  Laboratories and small production sites

direct spray

zero waste

   




CONTROL SYSTEM  PLC with touch screen display  Setting and monitoring of all process parameters  Adaptive rinsing cycle time control  Password protection

UNIQUE FEATURES  MINICLEAN US - ultrasonic system  MINICLEAN SIA - Spray in Air with nozzle matrix system  Uniform cleaning results  DI water reclaim system integrated  Powerful hot air drying up to 90°C

USABLE DIMENSION OF CHAMBER MINICLEAN US 325 mm

PROCESS DIAGRAM US

380 mm

140 mm 300 mm MINICLEAN SIA SIA

100 mm

650 mm

600 mm 14

FLUXCLEAN T HIGH CAPACITY AUTOMATIC CLEANING SYSTEM APPLICATION  Solder pallets and other maintenance cleaning  Mechanical parts  High output

UNIQUE FEATURES  Unbeatable cleaning capacity  Unique Spray under Immersion cleaning process  Separate filtration pump  Heated Spray-in-Air rinsing  Fully automatic operation system  Comfortable and fast handling  ECOWELL - external DI water supply enables high volume PCB cleaning (optionally)  3 years waranty (on request) CONTROL SYSTEM  PLC controll system with touch screen  Week program for automatic start-up /shut down  Three levels password protection USABLE DIMENSION OF CHAMBER

PUSH CART + BASKET  One pushcart and three baskets enable rapid cleaning process  Ergonomic optimization of loading  Pushcart starts cleaning process automatically

850 mm 650 mm

470 mm 620 mm

450 mm PROCESS DIAGRAM

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FLUXCLEAN SD / HD AIR IN IMMERSION CLEANING SYSTEM

APPLICATION  Low process cost solution  Solder pallets and other maintenance cleaning  Mechanical parts  Small and middle size production

UNIQUE FEATURES  FLUXCLEAN SD (standard duty) Polypropylene baths & metal frame  FLUXCLEAN HD (heavy duty) - stainless steel  Cleaning, rinsing and drying baths  Air In Immersion process in cleaning and rinsing baths  Baths dimension and additional accessories can be modified on customer request

FLUXCLEAN SD

FLUXCLEAN HD

USABLE DIMENSION OF CHAMBER FLUXCLEAN HD

FLUXCLEAN SD

500 mm

586 mm

500 mm

550mm

277 mm (washing, drying) 16

155 mm (rinsing)

740mm (washing, drying)

437 mm (rinsing)

ECOWELL DI WATER UNIT FOR HIGH CAPACITY PCBA DEFLUXING APPLICATION  High throughput PCBA defluxing

UNIQUE FEATURES  External DI water source connected with various cleaning machines (optionally)  Double adaptive DI water regeneration loops  Flexible reclaim process depending on pollution grade  Inteligent rinsing cycle time control  Long-life DI water filtering vessels  Economical & efficient system  Fully closed loops system CONTROL SYSTEM  PLC touch screen PROCESS DIAGRAM

zero waste

17

   




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CUSTOMIZED SOLUTION Longtime experiences and deep knowledge of the cleaning processes allowing us to offer customer-specific solutions based on the requirements in various industrial fields. COMBINATION OF DIFFERENT AGITATION METHODS SIA Spray-in-Air US Ultrasonic SUI Spray-under-Immersion AUI Air-under-Immersion OUI Oscillation-under-Immersion

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APPLICATION  PCBA and Hybrid Substrates defluxing  Cleaning before wire bonding  Degreasing of Lead-frames in component assembly  Silicon wafers after wire cutting or lapping  Parts and tools contaminated by grease  Optical parts cleaning  Fine cleaning of mechanical parts

TESTING SUBSTRATE GLASS - CERAMIC TESTING SUBSTRATE FOR CLEANING RESULTS EVALUATION

 Transparent - easy evaluation of residual under chips thanks to glass board  400 chips provide demonstrable statistics  Chips dimension 0508 (0.05" x 0.08")  Stand-off 60 +-5μm  Gaps between chips 300 +-20μm  100x100 mm glass board  Interrupted testing possibility  Temperature stability  Reusable - up to 20 cycles  Chips mounted by patented process

300 μm

300 μm 60 μm ±5 μm

Glass

 50% residues under chips

VISUAL EVALUATION

Chip

Chip

 100% cleaned

 Easy and reliable evaluation by magnification only

AUTOMATIC EVALUATION BY 2D SPI  VERIMA 2D SPI  Adapted for substrate evaluation  Numeric depiction  Accurate results

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Ϯ ϳϰ ϲϵ ϲϬ ϱϳ ϱϰ ϲϯ ϳϭ ϱϳ ϲϮ ϲϯ

ϯ ϳϯ ϲϱ ϱϯ ϲϭ ϱϴ ϲϭ ϱϴ ϲϭ ϳϬ ϲϳ

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Ϯϵ ϱϯ ϱϮ ϭϵ ϰϱ ϭϭ ϯϵ ϰϲ ϯϰ ϯϭ ϲϭ

ϯϬ ϱϵ ϯϵ ϯϯ Ϯϲ ϯϴ ϯϲ ϰϮ ϰϮ ϰϰ ϰϬ

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ϯϰ ϰϲ ϲϬ ϯϴ ϭϳ ϱϯ ϱϬ ϮϮ ϰϲ ϰϮ ϯϯ

ϯϱ ϱϭ ϯϵ ϰϵ ϱϬ ϰϳ ϰϮ ϰϯ ϯϴ ϯϵ ϯϬ

ϯϲ ϱϬ ϱϯ ϱϯ ϯϯ ϰϰ ϱϰ ϱϳ ϱϱ ϲϭ ϰϮ

ϯϳ ϱϵ ϱϬ ϰϮ ϱϲ ϰϱ ϱϯ ϱϳ ϰϭ ϱϵ ϱϵ

ϯϴ ϲϬ ϲϰ ϲϱ ϱϳ ϱϯ ϲϲ ϰϮ ϰϴ ϱϮ ϱϴ

ϯϵ ϱϰ ϲϲ ϱϭ ϳϬ ϳϱ ϳϬ ϰϲ ϲϳ ϳϱ ϳϯ

ϰϬ ϱϱ ϳϭ ϳϵ ϴϬ ϲϭ ϲϬ ϲϴ ϲϵ ϳϳ ϲϰ

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Producer: PBT Works s.r.o. Lesní 2331 CZ 756 61 Rožnov pod Radh. Czech Republic

Phone: +420 571 669 311 Fax: +420 571 622 331 [email protected] www.pbt-cleaning.com

Issue date: 24.02.2015