Perfect tools with laser machining

www.dmgmori.com Laser machining for manufacturing precision tools LASERTEC 20 PrecisionTool PH 10 | 100 linear magazine automation LASERTEC 20 / 50 ...
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Laser machining for manufacturing precision tools

LASERTEC 20 PrecisionTool PH 10 | 100 linear magazine automation LASERTEC 20 / 50 FineCutting LASERTEC 50 Shape (Piko)

LASERTEC

Perfect tools with laser machining

Laser machining for manufacturing precision tools

Perfect PCD cutting edges, rapid separation of circular blanks, carbide extrusion die with Ra = 0.3 μm.

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Wherever conventional mechanical machining processes such as grinding and eroding are pushed to their limits by excessive process forces or negative thermal reactions in diamond cutting materials, innovative laser technology can bring its unique strengths and numerous advantages to bear. A pioneer in this field, SAUER has many years of experience in lasering PCD, CVD-D, CBN and carbide. In particular, the LASERTEC 20 / 50 series covers the separation of PCD circular blanks and the creation of chip breakers and finishes on cutting edges as well as clearance angles. As the machines use a novel laser source with high energy efficiency and do not require any consumables, the diamond tool manufacturing technology can said to be green.

Perfect tools with laser machining

Applications CUTTING EDGES

SEPARATION

EXTRUSION DIE

with clearance angle and hip breaker geometry in PCD / CVD-D

of PCD / CBN cutting inserts from circular blanks

and prototype indexable inserts made of carbide

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LASERTEC 20 PrecisionTool

LASERTEC 20 / 50 FineCutting

LASERTEC 50 Shape (Piko)

LASERTEC 20 PrecisionTool / FineCutting

The laser offers unique advantages compared to grinding and wire-cut EDM. In light of the consistent demand for PCD precision tools, many tool manufacturers are facing the major challenge of sustainably optimising their production process chains. The key process steps in this context are the segmentation of PCD elements and the subsequent finishing of the tools. In both cases, laser technology has emerged as the most efficient solution with the best machining results. It produces perfect cutting edges which extend the life span of PCD tools by up to 2.5 times compared to conventional manufacturing. The cutting edge radius that can be produced by laser technology is between 2 and 3 µm.

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Laser vs grinding and eroding.

10 µm

Grinding ++ The diamond grains break out ++ Coarse-grained PCD varieties cannot be ground ++ Chip breakers are not possible ++ Wear on the grinding disc limits the corner radius

10 µm

Eroding

10 µm

Lasering

++ Diamond cannot be eroded, only the binding material

++ Lasers work through diamond and the binding material

++ Coarse-grained PCD varieties cannot be eroded

++ Coarse-grained PCD varieties can be processed easily

++ Chip breakers are not possible

++ Chip breakers are possible

++ The wire diameter limits the corner radius

++ Minimum corner radius: 15 µm

++ The eroding process has to be carried out 2 – 3 times for good quality

++ Perfect cutting edge with no breakouts

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Cutting edges with no breakouts, clearance angle and chip breakers made of PCD / CVD-D and CBN. Highlights of laser machining PCD / CVD-D and CBN 1

Non-contact precision machining without tool wear

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Cutting edge without breakouts since the laser cuts through diamond and binding material

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High-quality machining even of coarse-grained PCD varieties

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Chip breakers in the clamping area can be incorporated in one set-up with the cutting edge machining

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Internal radii of at least 15 µm are possible

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Low operating costs (no costs for wire-cutting or grinding)

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Automation solutions for handling cutting inserts, end mills and Monoblock tools with HSK holders

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LASERSOFT software packages for the laser machining of end mills, ISO and special cutting inserts and chip breakers – with a marking module

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Highlights ++ Highly dynamic 5-axis precision machine with 5 µm positioning accuracy and portal configuration, on a compact footprint of just 3.5 m² ++ Unrivalled dynamics with linear drives in the X-, Y- and Z-axes with > 2 g ++ Integrated swivelling rotary table (4th / 5th axis as standard) with torque technology (–15° / +130°) ++ Precision cooling in all axes ++ Maximum workpiece size: ø 200 mm × 344 mm (may be limited by the position of the C-axis) ++ SINUMERIK 840D solutionline 3D contouring system with user-friendly CELOS® interface 06

LASERTEC 20 PrecisionTool / FineCutting

Highly dynamic 5-axis precision machining on a footprint of just 3.5 m². The LASERTEC 20 combines dynamics, precision, compactness, diversity and intelligence in one high-tech machine. The linear drives in X / Y / Z with > 2 g, the 5-axis portal design with built-in NC swivelling rotary table on a compact footprint of just 3.5 m², maximum contour accuracy as well as the numerous application-specific LASERSOFT software features are merely most remarkable highlights of this high-precision machine. With its universal 5-axis kinematics featuring built-in A- and C-axes, the extremely stable monoBLOCK® design and its outstanding positioning accuracy and repeatability, the LASERTEC 20 is ideally suited to machining perfect cutting edges with clearance angles and / or PCD / CVD-D chip breaker geometry as well as the separation of PCD circular blanks with the highest standards of quality.

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1: Clearly structured, extremely compact, optimally accessible working area with integrated NC swivelling rotary table  2: Highly compact, fully integrated PH 10 | 100 linear magazine for handling cutting inserts, end mills and HSK tools

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Long-term stability

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Retusche

Stable, vibration-dampening mineral composite ­ column (approx. 3 t) in our monoBLOCK® design – on a compact footprint of just 3.5 m² 4

Linear technology

Linear drives with > 2 g max. acceleration and precision cooling in X / Y / Z as standard (60-month warranty)

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3D workpiece measurement

High-precision tool measurement and workpiece positioning in the working area with the infra-red measuring sensor 6

Zero-point clamping system

High-repeatability workpiece handling e.g. via the HSK interface

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1: Exchange of HSK tools via an HSK63 holder or of shank tools via a hydraulic expansion chuck 2: Handling of cutting inserts, end mills and HSK tools 3: Option: Fixed storage for pallets, cutting inserts or shaft tools

Linear magazine PH 10 | 100

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Ultra-compact handling system with application-­ specific configuration levels. ++ Ultra-compact linear magazine with optimum accessibility and with workpiece automation from above

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++ Automation solutions for handling cutting inserts, end mills, tools with HSK interface (different types of tools can be combined) ++ Application-specific configuration levels for handling a maximum of 42 HSK tools ++ Option: Replaceable gripper hands on the handling arm for HSK tools, shank tools or cutting inserts ++ Tool clamping using collet system or hydraulic expansion chuck

LASERTEC 20 PrecisionTool with PH 10 I 100 linear magazine

Max. number of levels Number of places per level Raster dimension (centre of pallet to centre of pallet) Maximum tool diameter Max. tool length (from HSK face contact) * Max. tool length 135 mm, ** Max. tool length 240 mm

6* / 4**

6* / 4**

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4

95 mm

190 mm

85 mm

140 mm

240 mm

240 mm

All in one: Laser machining of a cutting edge, clearance angle and chip breaker geometry in a PCD progressive die on the LASERTEC 20 PrecisionTool

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1 – 4: Separation and cutting-out of PCD and CBN circular blanks in 2D and 3D, 10 × faster than wire-cut EDM

LASERTEC 20 / 50 FineCutting

Highly dynamic separation of PCD / CBN circular blanks is 10 × faster than wire-cut EDM.

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Machine set-up ++ Long-term stability: mineral cast base frame ++ Dynamics: The latest linear / torque technology ++ Precision: Positioning accuracy on the µm scale ++ Versatility: 5-axis version to pre-cut clearance angles Technology ++ Clean, precise cuts ++ Conicity at 3.2 mm Material thickness only 25 µm per side ++ Low heat-affected zone from 50 μm ++ Clearance angle cutting speeds of up to 100 mm/min. in 1.6 mm PCD

LASERTEC 50 Shape (Piko)

3D laser removal with pico­ second laser for manufacturing carbide extrusion dies with Ra = 0.3 µm. Thanks to its highly compact, stable design, in combination with the high-performance pico­ second laser the LASERTEC 50 is particularly suited to demanding 5-axis machining work involving the production of complex prototypes and special cemented carbide workpieces.

Indexable inserts – Carbide prototypes ++ Automatic fine positioning ++ Simple programming based on 3D CAD data ++ Job Manager

Carbide extrusion die with Ra = 0.3 μm ++ Picosecond laser with 25 or 50 W output ++ A high-end solution delivering the best possible surface quality

5-axis machining with picosecond laser ++ Built-in NC swivelling rotary table for complex prototypes and special machining ++ High-repeatability workpiece handling, e.g. via the HSK interface

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LASERTEC series

Layout plans LASERTEC 20

LASERTEC 20

Front view

Top view

655 2,592

710

1,884

2,035

Extraction FineCutting 950

2,427

Extraction PrecisionTool

950

2,729

LASERTEC 20 with PH 10 I 100 linear magazine

LASERTEC 20 with PH 10 I 100 linear magazine

Side view

Top view

3,100

655

4,310

3,318

2,810

2,435

2,035

350

1,172

1,412

708

12

1,150

1,840 3,879

LASERTEC 50

Side view

Top view

705

LASERTEC 50

2,772

2,390

2,000

1,410

1,390

860

509

2,812 2,875

LASERTEC series

Technical data Available as

LASERTEC 20 PrecisionTool / FineCutting

Working area X-axis

mm

200

Y-axis

mm

400

Z-axis (focusing axis)

mm

280

Table size (3 axes)

mm



Maximum table load (3 axes)

kg

A-axis (swivel range)

degrees

C-axis (turning range / speed)

degrees / rpm

Table size (5 axes)

mm

Maximum table load (5 axes)

kg

– –10 to +130 360° / 150 ø 200 10

Travel speed Rapid traverse X / Y / Z

m/min

Acceleration

g

40 / 40 / 40 >2

Connected values and aggregates Connected load (including aggregates)

kVA

max. 40

Operating voltage

V/Hz

400 / 50

Machine / system weight

kg

Machine dimensions W / D / H

mm

Extraction system dimensions, W / D / H

mm

340 / 660 / 1,400

Footprint, W / D / H

mm

2,568 / 2,462 / 2,383

3,750 2,200 / 2,020 / 2,200

Control system CNC control system

CELOS® with SIEMENS 840D solutionline

Available as

LASERTEC 50 Shape

Working area X-axis

mm

500

Y-axis

mm

500

Z-axis (focusing axis)

mm

700

Table size (3 axes)

mm

400 × 500 (work surface)

Maximum table load (3 axes)

kg

A- / B-axis (swivel range)

degrees

–100 to +160

C-axis (turning range)

degrees

360° infinite

Table size (5 axes)

mm

Maximum table load (5 axes)

kg

150

ø 200 14

Travel speed Rapid traverse X / Y / Z

m/min

Acceleration

g

Machine / system weight

kg

Footprint, W / D / H

mm

60 / 60 / 30 1 5,000 3,700 / 4,250 / 2,400

Control system CNC control system

CELOS® with SIEMENS 840D solutionline

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25 years of know-how and expertise

LASERTEC showroom in Pfronten. LASERTEC Excellence ++ Long-standing experience in laser machining PCD / CBN / CVD diamond / carbide ++ Expertise in application technology: training, customer support, complete turnkey solutions

++ Special LASERSOFT software packages ++ Regular LASERTEC technology seminars

PrecisionTool – Application overview PCD / CVD-D / CBN applications

LASERTEC 20 PrecisionTool

Cutting edge with clearance angle in PCD / CVD-D



Chip breakers in PCD / CVD-D



Separation of PCD / CBN circular blanks

LASERTEC 20 / 50 FineCutting

LASERTEC 50 Shape (Piko)



Tungsten carbide applications Prototyping of carbide indexable inserts with chip breakers



Carbide pressing stamps with chip breaker geometries



DMG MORI Global Headquarter Sulzer-Allee 70, CH-8404 Winterthur Tel.: +41 (0) 44 / 8 01 12 - 41, Fax: +41 (0) 44 / 8 01 12 - 31 [email protected], www.dmgmori.com

FLY_D6859_0116UK  Technische Änderungen vorbehalten. Die hier abgebildeten Maschinen können Optionen, Zubehör und Steuerungsvarianten beinhalten.

++ Holistic process understanding

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