Pan Pacific Microelectronics Symposium 2014 (PAN PAC 2014)

Kohala Coast, Hawaii, USA 11-13 February 2014

ISBN: 978-1-63266-060-2

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TABLE OF CONTENTS 2014 Pan Pacific Symposium Technical Papers Scroll to the title and select the blue link to open a paper in a new window.

TA1– Interposer Technologies for Design to Manufacturing Infrastructure Chair: M. Juergen Wolf, P.E., Fraunhofer Institute Microelectronic Interposers: From R&D to Manufacturing Rao Tummala, Ph.D., Brett Sawyer, Chandrasekharan Nair, Vijay Sukumaran, Yuya Suzuki, Hao Lu and Venky Sundaram, Georgia Institute of Technology ..... 1 Electrical Design of Silicon, Glass and Organic Interposer Channels Heegon Kim, Hyunsuk Lee, Jonghyun Cho, Youngwoo Lee and Joungho Kim, Korea Advanced Institute of Science and Technology (KAIST) ..... 6 Path to the Future of Glass Interposers Shintaro Takahashi, Masaki Mikayama and Nobuhiko Imajo, Asahi Glass Co., Ltd. ..... 13 New Era for Packaging and Coming Challenges for Interposers Gilles Poupon, Yann Lamy and A. Rouzad, CEA-LETI Minatec ..... 19

TA2– Prognostics and Health Management Chair: Keith Sweatman, Nihon Superior Co., Ltd. Research on a Lifetime Prediction Model for IR- LEDs Under High Pulse Currents Cong Shao and Shunong Zhang, Ph.D., P.E., Beihang University and Zhonghua Liu, Beijing Bonxone Technology Limited Corporation ..... 26 Fault Injection and Simulation of the Solder Joint Mechanical Creep in Integrated Circuit Hu Weiwei, Ph.D., Meng Xiangkun, Sun Yufeng and Zhao Guangyan, Beihang University ..... 32

TA3 – Special Assembly Challenges Chair: Steffen Kröhnert, NANIUM S.A. POP Rework - A Case Study Robert Wetterman, BEST Inc. ..... 38 Optical Fiber Array Connector Designed for Assembly Automation Terry P. Bowen, Aleksandar K. Angelov, Steve Dellinges, Thomas Huegerich, Wayne Montoya, Frances T. Peralta, Nick Pugliano, Sandeep Razdan, Jibin Sun, Jian Wang, John Wasserbauer and Haipeng Zhang, TE Connectivity ..... 44 TP1 – Roadmaps and Industry Trends Chair: Bozena Kaminska, Simon Fraser University The Internet of Everything Evolution Judy Priest, Cisco Systems, Inc. ..... 49 2013 iNEMI Technology Roadmap Overview Bill Bader and Chuck Richardson, iNEMI ..... 55

The Future of Organic and Printed Electronics: OE-A Roadmap Wolfgang Clemens, PolyIC GmbH & Co. KG; Donald Lupo, Tampere University of Technology; Mark Verrall, Ph.D., Merck Chemicals Ltd. and Klaus Hecker and Sven Breitung, OE-A

..... 63

Power Conversion Trends That Will Impact System Packaging and Assembly Carl Blake, BSEE, PSMA, CBK Consulting and Transphorm Inc. ..... 70

Keynote Presentation I Chair: Charles Bauer, Ph.D., TechLead Corporation Reliability Time Bombs in Electronics & Photonics Systems Nihal Sinnadurai, ATTAC ..... 78

WA1 – 3D and TSV Technologies Chair: Kirsten Weide-Zaage, Ph.D., Leibniz University 3D Integration: Status and Requirements M. Juergen Wolf, P.E. and Klaus-Dieter Lang, Fraunhofer IZM ..... 87 Alignment and Performance for Chip-to-Chip Communication Meihui Guo and Jen-Feng Huang, National Sun Yat-Sen University and Yu-Jung Huang, I-Shou University ..... 92 3D TSV Vertical Interconnection Using NCF Materials Kyung-Wook Paik, Ph.D., Yongwoon Choi and Ji-Won Shin, KAIST ..... 97

WA2 – Business Strategies Chair: Dag Andersson, Ph.D., Swerea IVF AB Polymer Based Electronics: Economically Viable Renewable Energy System Bozena Kaminska, Jasbir N. Patel and Badr Omrane, Simon Fraser University ..... 103 Intellectual Assets Management – Possibilities and Difficulties Bill Brox, Chalmers University of Technology ..... 109 Winning Business – Sometimes the Best Idea is Not Enough Timothy K. Duggins, The Horizon Phoenix Group LLC ..... 114

WA3 – Manufacturing Paradigms Chair: Michael Weinhold, European Institute of Printed Circuits Disruptive Innovation Pulls Manufacturing Out of the Box Herbert J. Neuhaus, Ph.D. and Charles E. Bauer, Ph.D., TechLead Corporation ..... 119 Electronic Product Assembly in High Labor Rate Markets - A Case Study in Exploiting the Counterweight to Low Labor Rate Competition: Automation Tom Borkes, The Jefferson Project ..... 125 Single Enterprise Methodology Charles Barnhart, Charlie Barnhart & Associates LLC (CBA) ..... 139

WA4 – Statistics and Probability Chair: Dock Brown, Medtronic (Retired) Asymptotic Behavior of Beta Distribution Wen-Jang Huang, National University of Kaohsiung ..... 145 Optimal Designs for Response Surface Models With Correlated Responses Mong-Na Lo Huang, National Sun Yat-Sen University ..... 152 Statistics of Crack Initiation and Propagation (SCRIP) Horatio Quinones, Ph.D., HILARA Inc. ..... 158

WP1 – Simulation and Modeling Chair: Chris Bailey, Ph.D., MBA, University of Greenwich Local Mechanical Testing and Parameter Identification for the Modeling of Interconnection Materials Falk Naumann, Georg Lorenz and Matthias Petzold, Fraunhofer Institute for Mechanics of Materials IWM ..... N/A Measurement and Modeling of the Polyimide Dielectric Coating Induced Wafer Warpage Chunsheng Zhu, Wenguo Ning, Gaowei Xu and Le Luo, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science (CAS); Chungseng Zhu and Wenguo Ning, Graduate School of Chinese Academy of Sciences ..... 164 3D Technology Interconnect Reliability TCAD Hajdin Ceric, R. L. de Orio, A. P. Singulani, and S. Selberherr, Technical University Wien ..... 170 Investigation of Chip-Package Interaction in 3D Integration Kirsten Weide-Zaage, Ph.D., and J. Kludt, Leibniz University of Hannover; Hélène Frémont and A. Tetelin, University of Bordeaux ..... 178 WP2 – Embedded Assemblies Chair: David Raby, STI Electronics, Inc. Embedded Product Descriptions in XML – Supply Chain Data Transfer Methodology Dieter W. Bergman, IPC Inc. ..... 185 Multi-Die Embedding in Fan-Out WLP Steffen Kröhnert, Nanium S.A. ..... N/A A New Embedded Structure Package for Next Generation, WFOP™ (Wide Strip Fan-Out Package) Naoki Hayashi, Hirokazu Machida, Nobukaki Shintani, Norihito Masuda, Kiyoaki Hashimoto, Atsushi Furuno, Katsushi Yoshimitsu, Yoshimi Kikuchi, Mitsuru Ooida, Akio Katsumata and Yoichi Hiruta, J-DEVICES Corporation ..... 196 Device Embedding Technology in PCBs Route to Success? Michael Weinhold, European Institute of Printed Circuits (EIPC) and Weinhold Consulting ..... 203

Keynote Presentation II Chair: Charles Bauer, Ph.D., TechLead Corporation Digital Health; Facts, Fiction and Future! Matthew K. Hudes, Deloitte Consulting LLP ..... 208

THA1 – Reliability and Failure Analysis Chair: Bill Brox, Chalmers University No-Clean Pb-Free Flux: A Chemical View of Reliability Phil Isaacs, Eddie Kobeda and Jing Zhang, IBM Corporation ..... 214 Recent Advances in the X-Ray Inspection Technology with Emphasis on Large Board Computer Tomography and Automation Evstatin Krastev, Ph.D. and John Tingay, Nordson DAGE ..... 223 Simultaneous Analysis of Package Warping and Internal Defect Condition Using Acoustic Micro Imaging Janet E. Semmens, Sonoscan, Inc. ..... 231 Failure Analysis in a Mixed-Signal Chip Yu-Jung Huang and Shen-Li Fu, Ph.D., I-Shou University; Ming-Kun Chen and Yi-Lung Lin, Advanced Semiconductor Engineering Test RD ..... 236 THA2 – Power Electronics Chair: Shen-Li Fu, Ph.D., I-Shou University Virtual Prototyping for Power Electronics Packaging – Current Status and Future Challenges Chris Bailey, University of Greenwich ..... 242 Compact Thermal Models for Virtual Prototyping of Electronic Assemblies: Past, Present & Future J.H.J. Janssen, NXP Semiconductors ..... 248 Advanced Technologies & Materials for Packaging of Power Electronic Modules Anton Miric, M. Sc., Heraeus Materials Technology GmbH and Co. KG ..... 253 Transient Liquid Phase Sintered Joints for Wide Bandgap Power Electronics Packaging Patrick McCluskey and Hannes Greve, University of Maryland ..... 259

Keynote Presentation III Chair: Phil Isaacs, IBM Corporation Principles and Implementation of LED Packaging Technologies for White Light Illumination S.W. Ricky Lee, Ph.D., Hong Kong University of Science & Technology ..... 269

THP1 – Enabling Technologies for 3D Wafer Processes Chair: Hélène Frémont, University of Bordeaux Advances in Etch and Deposition Technologies for 2.5 and 3D BEOL Processing Keith Buchanan, Dave Thomas, Hefin Griffiths, Kathrine Crook, Daniel Archard, Mark Carruthers, Steve Burgess and Stephen Vargo, Ph.D., SPTS Technologies Ltd. ..... 272 Under Bump Metal Etching - A Little Known Key Process in Wafer Level Packaging Ross Kulzer, P.E., Semsysco GmbH ..... 278 Thin Wafer Processing for 3D Integration: Status & Update Markus Wimplinger, Jürgen Burggraf, Harald Wiesbauer, Thomas Uhrmann and Thorsten Matthias, EV Group E. Thallner GmbH; Garrett Oakes, EV Group, Inc., and Masaya Kawano, EV Group Japan KK ..... 283 Optimization of Leveler Concentration to Minimize the Contamination of Copper in Via Filling Ki-Tae Kim and Jae-Ho Lee, Hongik University ..... 292 Fraunhofer Cluster 3D Integration M. Juergen Wolf, P.E., Stefan Schulz, Peter Schneider and Ehrenfried Zschech, Fraunhofer Institute ..... 297

THP2 – Connection Taxonomy Chair: Soren Norlyng, MICRONSULT Simulation-Driven Packaging of Proof of Concept Thermoelectric Modules Klas Brinkfeldt, Ph.D., Michael Edwards and Dag Andersson, Swerea IVF AB; Julia Simon, Sébastien Noël and Krunoslav Romanjek, CEA ..... 302 Reliability of Flex-to-Flex Interconnections on Inkjet-Printed PCBs Using Electrically Conductive Adhesives Juha Niittynen, M. Sc., Santtu Koskinen, Janne Killunen, Juha Pippola, Laura Frisk and Matti Mäntysalo, Tampere University of Technology ..... 311 Semiconductor Die Attach with High Copper Solder Alloys Keith Sweatman, Takatoshi Nishimura and Tetsuro Nishimura, Nihon Superior Company, Ltd. ..... 319 Semiconductor Die Attach with Nano-Ag: A Case Study of Commercial Application Takatoshi Nishimura, Keith Sweatman, Tetsuro Nishimura, Nihon Superior Co. Ltd. and Teruo Komatsu, Applied Nanoparticle Laboratory Co., Ltd. ..... 327 Novel Nanofiber Anisotropic Conductive Films (ACFs) for Fine Pitch Assembly Kyung-Wook Paik, Ph.D., Tae-Wan Kim, Sang-Hoon Lee, and Kyoung-Lim Suk, KAIST ..... 334