Intel® Mobile Communications Connecting the world – today and tomorrow

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Profile IMC

Intel® Mobile Communications (IMC) develops and markets innovative semiconductor products and solutions for wireless communications. IMC’s goal is to connect the world with leading-edge seamless wireless solutions. IMC offers cost-effective 2G/3G single-chip platforms for ULC/Entry phones as well as 3G/4G slim modem and RF solutions for smartphones and connected devices. IMC provides superior customer solutions, leveraging its unique advantages in the areas of RF and mixed-signal systems and monolithic integration, and its comprehensive know-how in cellular software and systems Intel Mobile Communications – formerly the Wireless Solutions division of Infineon Technologies AG – was acquired by Intel in early 2011 and will operate as a standalone business. The profitable and fast-growing division reported USD 2 billion in revenue in calendar year 2010, up approximately 50 percent compared with 2009.

IMC is connecting the world – today and tomorrow We are living in an increasingly connected world. Phones are becoming more affordable and smarter and wireless connectivity across computing and consumer electronic devices is on the rise. Accordingly, market analysts expect approximately 10 billion cellular devices to be sold in the next five years. This represents a significant market opportunity. Multiple cellular broadband and connectivity technologies are key to ensuring the best connectivity experience for these devices. IMC is committed to connecting the world with its innovative portfolio of seamless wireless solutions. Today, the company powers some of the world’s best-selling smartphones, tablets and ULC/Entry phones. Going forward, IMC is aiming for the best user experience in a world where computing and telecommunications technologies are converging. IMC is ideally positioned to fully exploit the enormous opportunities of this market and meet its evolving needs. Its products feature ultra-low power consumption, the highest level of integration for innovative designs, industry-leading voice quality and data throughput and seamless connectivity across multiple technologies.

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Innovation and Quality

Continuous product innovation is an integral part of IMC’s business model and ensures lasting customer success. The rise of the mobile phone is an ongoing success story and has powered the creation of great applications and services for a better life worldwide. The proliferation of features is expected to accelerate further, fuelled by affordable wireless broadband modems and platforms to be integrated in an increasing variety of portable devices. Communication, like computing, will become ubiquitous and IMC is driving this trend with a growing number of solutions ranging from slim modems to complete platform designs. IMC’s outstanding knowledge in digital radio designs together with its proven hardware and software system integration expertise paves the way for even higher performance modems and system platforms – running at lowest power on the smallest footprints.

At IMC, risk management is based on prevention and is built into all business processes. The company’s impressive quality management toolbox includes Six Sigma, 8D problem-solving methodology and CMMI level 3, and is used as a guideline during software development. IMC’s quality management policy ensures a win-win partnership with customers. The company works closely together with customers, listens to them and fulfils their requirements across the whole value chain. Stringent conformance, interoperability and field tests prepare mobile phone platforms for fast product qualification and integration into the customer solutions. IMC’s quality culture is inspired by the zero-defects mindset of well-trained and highly educated people.

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2G (GSM, GPRS, EDGE)

The ULC and Entry segments represent the greatest volume carrier and remain the powerhouse of the mobile market, covering GSM (call-centric) devices through GPRS (messaging & low/mid-end multimedia) to EDGE solutions (mobile internet, mid/high-end multimedia). This market is increasingly relying on complete platform solutions, actively bridging the gap between silicon and handset. On-chip integration is driving overall system cost reduction in lock-step with the evolution of software, bringing features previously restricted to more costly handsets to low-cost and ULC phones. Meanwhile, time-to-market trends are reflecting the move by platform vendors to provide far more flexible, robust and fully-featured system solutions.

Following in the wake of the Intel® X-GOLD™ 101/110, which played a pioneering role in the ULC segment, the Intel® X-GOLD™ 213 family is now driving further application and feature set migration. Unified hardware and software architecture designs protect the customer’s investment by optimizing the scalability and porting effort required across the IMC Entry and ULC portfolio. The adoption of IMC products by all major Tier1 handset manufacturers is a testimony to their success.

2G >> 3G >> 4G >> connected devices 4

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3G (WCDMA, HSPA)

The low-cost 3G segment has emerged due to the spectrum reallocation affecting 2G networks. This was done to compensate for higher 3G traffic demands in existing networks, and reinforces the necessity for affordable 3G handsets. This trend is further augmented by the migration of 3G features to the price-point expectation of the Entry (or low-cost) segment. Covering a range of features reflecting the counterpart 2G solutions on the one hand and OOS (open operating system) solutions on the other, the low-cost 3G segment is playing a revolutionary role, enabling ULC solutions in a 3G environment. These solutions bridge the traditional gap between cost-driven 2G handsets and application-rich 3G handsets, acting as a forerunner for cost-down platform designs for 3G networks. The Intel® X-GOLD™ 613, building on the platform success in the 2G arena, is now powering cost-optimized platform solutions for the 3G domain. The experience

of creating dedicated solutions for the 2G Entry segment is now driving new market dynamics. Slim modem platforms for smartphones connect various types of user equipment to wireless networks. They are found in smartphones, tablet PCs, wireless routers, data sticks, notebooks and netbook computers, personal devices and machine-to-machine (M2M) equipment.

IMC’s slim modem platforms for W-CDMA and HSPA have been adopted by top smartphone and tablet OEMs, and have been approved by wireless network operators all over the world. They are used in data cards as well as in modules for embedded 3G connectivity.

The combination of a slim modem with a powerful application processor deliver the best user experience, best power consumption and highest performance. With IMC products, customers do not have to compromise on footprint or design appeal. The Intel® XMM™ 6xx slim modem platforms combine an RF transceiver from the Intel® SMARTi™ family with a single-chip Intel® X-GOLD™ 6xx baseband IC with integrated power management and IMC’s protocol stack.

2G >> 3G >> 4G >> connected devices 5

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4G (HSPA+, LTE)

Moving on to the 4G market, HSPA+ is an extension of HSPA and provides the user with higher data rates and hence a better experience when browsing the web on mobile equipment or when downloading files. IMC’s slim modem platforms for HSPA+ require even less board space and battery power than their HSPA predecessors. This is due to the combination of the Intel® X-GOLD™ 6xx baseband and power management IC with an innovative RF engine concept powered by a Intel® SMARTi™ RF transceiver. Instead of using discrete power amplifiers (PA), all transmit signals are boosted by one “Single Chain PA” (SCPA), thus reducing components and space. LTE (Long Term Evolution) is a wireless standard converging CDMA and 3GPP standards with downlink data rates exceeding 100 Mb/s.

Intel® slim modem platforms for LTE follow the same partitioning concept as slim modem platforms for HSPA, featuring an Intel® X-GOLD™ baseband IC with integrated PMU plus a Intel® SMARTi™ transceiver chip. This Intel® X-GOLD™ IC contains all the interfaces, power management functionality and baseband functions for GSM, GPRS, EDGE, W-CDMA, HSPA+ and LTE. RF (radio frequency) is one of the major key differentiators in mobile phone design, making RF performance a key success factor.

The outstanding performance of IMC RF radio transceivers positions IMC as a market leader – with more than 2 billion IMC-enabled mobile phones already sold. IMC is continuously setting new benchmarks with the latest members of the very successful and proven Intel® SMARTi™ product family. All IMC solutions are clearly designed for the lowest current consumption, the smallest size and best-in-class RF performance at the lowest cost.

RF performance has a direct impact on the user experience as it influences key indicators such as current consumption, modem size and performance. It thus determines talk/standby time, mechanical design, data throughput, reception in critical environments, etc.

2G >> 3G >> 4G >> connected devices 6

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Connected devices

As data rates increase, mobile networks are becoming an increasingly attractive way to connect notebook computers, netbooks and tablet PCs to the web. Wireless broadband has become a valid alternative to wired internet access, with the possibility to connect at any time from any place. Apart from the huge range of personal computers and connected personal devices already available, analysts predict huge growth in devices that communicate directly with each other, such as smart meters which communicate energy consumption levels directly to the supplier via a wireless module.

The possibility of having multiple devices connected to each other and the ability to exchange data anytime and anywhere will change the way we use electronic devices in our daily lives. Together with the wider Intel® portfolio, IMC’s products are an effective and seamless way to connect the world – today and tomorrow.

2G >> 3G >> 4G >> connected devices 7

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For more information on Intel Mobile Communications, visit www.intel.com/go/mobilecommunications

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