Future Development to support the LED industry

Dow Corning Toray PROPRIETARY 10 June 2014 Dow Corning proprietary Future Development to support the LED industry Dow Corning Corporation 2014.8.13 ...
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Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

Future Development to support the LED industry Dow Corning Corporation 2014.8.13

Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

Market Trends and Material Implications $/lm (Total C ost) lm/W

Power

lm/ cm2

oC

These well known LED industry trends …

? New Design … are continually forcing material changes to higher performance materials

Demands of the LED industry are forcing new materials adoption

Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

DEVELOPMENT OF PHOTO THERMALLY STABLE PHENYL ENCAPSULANT

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Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

VOC & Overall DC’s Development Direction Products

Critical Customer Requirement  Photo/Thermal stability  TC performance

Liquid Encapsulant

 Higher initial LOP  Color binning  Anti-Silver corrosion

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The document is prepared for a discussion purpose only and does not mean any commitment to develop and/or commercialize those products at the displayed timing.

Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

Light output decay stability

Liquid Encapsulant Product Roadmap

Anti-sulfur + improved HRI DC current HRI Q1

2

3

2014

4

Q1

2

3

4

2015

5 The document is prepared for a discussion purpose only and does not mean any commitment to develop and/or commercialize those products at the displayed timing.

Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

HRI encapsulant upgrade - Background • Drive current of middle power PLCC package continue to increase to achieve higher lm / watt • LOP maintenance under the increased drive current is important and is dependent on two aspects – Ag corrosion protection – Degradation / discoloration protection of encapsulant

• Higher drive current will increase photo density and temperature requirement for encapsulant and need for further improvement of HRI encapsulant used in standard middle power PLCC package • Balancing the gains in thermal and photo stability with higher gas permeability compared to HRI encapsulant

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Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

HRI upgrade; Thermal-Photo stability Weight loss at 200C and 250C 200C

250C New HRI prototype

New HRI prototype

HRI-standard

HRI-standard

Thermal-hardening at 200C

HRI-standard

New HRI prototype

Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

DEVELOPMENT OF FILM ENCAPSULANT TO ACHIEVE LOWER COST OF OWNERSHIP IN LED PACKAGES

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Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

Silicones for Chip Scale Package Designs • Chip Scale Packages (CSPs) can be characterized by: – Reduced form factor – Elimination/reduction of housing – Low cost manufacturing

• CSP manufacturing processes may simultaneously drive a change in how silicone materials are applied in devices

“Typical” CSP

Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

Reactive Hot Melt Characteristics Conceptual flow / cure profile

Tan δ

Storage Modulus

Parameters:

Flow Cure

50

100

150

200

Temperature (deg. C)

250

300

• Flow onset • Extent of flow • Cure onset • Cure speed

Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

SILICONE SOLUTION TO SUPPORT THE LED INDUSTRY

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Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

Good fit for silicone materials in future LED Components In a typical LED package, at least 1/3 (and up to 2/3) of the total volume is silicone Improved white reflective materials for LED chip housing

Encapsulants requiring high heat and light flux stability

Materials for phosphor dispersion and light control Thermally conductive die attach materials to conduct heat from the LED chip

Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

Reflective silicone product map Liquid Transfer molding Dow Corning ® WR-6000

Hardness

D80

Other application process

2nd gen Dispensable

D50

Available products

Under development

A60

Dow Corning ® Dispensable coating WR-3001 mPa·s

2000

20000

Paste

Viscosity

The document is prepared for a discussion purpose only and does not mean any commitment to develop and/or commercialize those products at the displayed timing.

Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

Dow Corning will support China LED industry with sustainable proven technology and innovation • Dow Corning’s dedicated investment and innovation extends beyond high RI silicones, to encompass a broad range of materials solutions that aim to enable next-generation LED devices, including transparent and thermally conductive die attach adhesives phosphor film binders and white reflective materials. • Asia leads the market transition to LEDs for general lighting, driven especially by swift penetration in China. Supply chain integrity and consistent material quality are both key factors in ensuring that LEDs offer a credible, cost-effective alternative to conventional lighting. Industry-wide defense and support of proven, patented and cuttingedge LED solutions such as Dow Corning’s OE Series helps validate the competitive value of LED lighting, and advances the interests of all in the LED market

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Dow Corning Toray PROPRIETARY

10 June 2014 Dow Corning proprietary

The information provided in this presentation does not constitute a contractual commitment by Dow Corning. While Dow Corning does its best to assure that information contained in this presentation is accurate and fully up-to-date, Dow Corning does not guarantee or warranty the accuracy or completeness of information provided in this presentation. Dow Corning reserves the right to make improvements, corrections and/or changes to this presentation in the future.

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