Dow Corning Toray PROPRIETARY
10 June 2014 Dow Corning proprietary
Future Development to support the LED industry Dow Corning Corporation 2014.8.13
...
Higher initial LOP Color binning Anti-Silver corrosion
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The document is prepared for a discussion purpose only and does not mean any commitment to develop and/or commercialize those products at the displayed timing.
Dow Corning Toray PROPRIETARY
10 June 2014 Dow Corning proprietary
Light output decay stability
Liquid Encapsulant Product Roadmap
Anti-sulfur + improved HRI DC current HRI Q1
2
3
2014
4
Q1
2
3
4
2015
5 The document is prepared for a discussion purpose only and does not mean any commitment to develop and/or commercialize those products at the displayed timing.
Dow Corning Toray PROPRIETARY
10 June 2014 Dow Corning proprietary
HRI encapsulant upgrade - Background • Drive current of middle power PLCC package continue to increase to achieve higher lm / watt • LOP maintenance under the increased drive current is important and is dependent on two aspects – Ag corrosion protection – Degradation / discoloration protection of encapsulant
• Higher drive current will increase photo density and temperature requirement for encapsulant and need for further improvement of HRI encapsulant used in standard middle power PLCC package • Balancing the gains in thermal and photo stability with higher gas permeability compared to HRI encapsulant
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Dow Corning Toray PROPRIETARY
10 June 2014 Dow Corning proprietary
HRI upgrade; Thermal-Photo stability Weight loss at 200C and 250C 200C
250C New HRI prototype
New HRI prototype
HRI-standard
HRI-standard
Thermal-hardening at 200C
HRI-standard
New HRI prototype
Dow Corning Toray PROPRIETARY
10 June 2014 Dow Corning proprietary
DEVELOPMENT OF FILM ENCAPSULANT TO ACHIEVE LOWER COST OF OWNERSHIP IN LED PACKAGES
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Dow Corning Toray PROPRIETARY
10 June 2014 Dow Corning proprietary
Silicones for Chip Scale Package Designs • Chip Scale Packages (CSPs) can be characterized by: – Reduced form factor – Elimination/reduction of housing – Low cost manufacturing
• CSP manufacturing processes may simultaneously drive a change in how silicone materials are applied in devices
“Typical” CSP
Dow Corning Toray PROPRIETARY
10 June 2014 Dow Corning proprietary
Reactive Hot Melt Characteristics Conceptual flow / cure profile
Good fit for silicone materials in future LED Components In a typical LED package, at least 1/3 (and up to 2/3) of the total volume is silicone Improved white reflective materials for LED chip housing
Encapsulants requiring high heat and light flux stability
Materials for phosphor dispersion and light control Thermally conductive die attach materials to conduct heat from the LED chip
The document is prepared for a discussion purpose only and does not mean any commitment to develop and/or commercialize those products at the displayed timing.
Dow Corning Toray PROPRIETARY
10 June 2014 Dow Corning proprietary
Dow Corning will support China LED industry with sustainable proven technology and innovation • Dow Corning’s dedicated investment and innovation extends beyond high RI silicones, to encompass a broad range of materials solutions that aim to enable next-generation LED devices, including transparent and thermally conductive die attach adhesives phosphor film binders and white reflective materials. • Asia leads the market transition to LEDs for general lighting, driven especially by swift penetration in China. Supply chain integrity and consistent material quality are both key factors in ensuring that LEDs offer a credible, cost-effective alternative to conventional lighting. Industry-wide defense and support of proven, patented and cuttingedge LED solutions such as Dow Corning’s OE Series helps validate the competitive value of LED lighting, and advances the interests of all in the LED market
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Dow Corning Toray PROPRIETARY
10 June 2014 Dow Corning proprietary
The information provided in this presentation does not constitute a contractual commitment by Dow Corning. While Dow Corning does its best to assure that information contained in this presentation is accurate and fully up-to-date, Dow Corning does not guarantee or warranty the accuracy or completeness of information provided in this presentation. Dow Corning reserves the right to make improvements, corrections and/or changes to this presentation in the future.