Prototyping

Low Volume

Mid Volume

F U L L CO N V E C T I O N R E F LO W O V E N

High Volume

Customized Solutions

RO300FC N2

RO-CONTROL – PC software for simulation, control, measurement and documentation of perfect solder profiles Full convection heating ideal for lead free soldering Small footprint 2m x 0,7m at 300 mm process width

Integrated microprocessor control with LCD

Equal heating rates at minimal Delta T. As an option with N2 High troughput still at very small dimensions

SWISS MADE

Apropriate for Prototyping and volume production “ Even low and small volumes of boards have to be soldered safe and reliable – with the same ongoing quality level. The RO300FC is setting the benchmark for small-batch production worldwide ”

Soldering of complex SMD boards and new package technologies requires a well-controlled soldering process. Lead free solders for SMT electronics have a higher melting temperature than solders with lead. The convection heating technology is the ideal solution for the reflow process. It guarantees the precise control of the higher process temperatures and the minimum thermal stress for the sensitive electronic components. The integrated microprocessor control with LCD display provides an easy-to-use operator interface and storage capacity of up to 28 profiles. The memory provides program proposals and enough space for own profiles.

O P E R AT I O N

High tech engineering for a maximum in flexibility and quality The RO300FC exclusively heats with

perfect reflow results and a robust

The vertical hot air stream evenly

hot air convection and can be used for

construction. It is well suited for

heats the complete PCB. The high air

the different tasks in SMT assembly,

continuous production, small batch

volume guarantees equal heating

especially for the reflow soldering of

manufacturing and prototyping.

rates in all the components and the

lead free solder pastes or the curing of

Perfect zone separation allows the

substrate. This technology eliminates

adhesives. It features easy operation,

setup of profiles for all applications.

the risk of hot spots or heat shadows.

BENEFITS

Perfect soldering results Uniform heating

With or without Nitrogen

Process control

The convection technology

The RO300FC-N2 can be

With the optional flying

applies the same tempera-

operated with nitrogen or

thermocouples, tempera-

ture everywhere on the

with air. The changeover

tures can be recorded

board independent of

takes less than five minutes.

directly on the board and

component size or color,

displayed on the machine’s

making programming as

Transport choices

easy as possible.

Depending on the applica-

LCD display.

tion a mesh belt or a chain

Easy to maintain

RO-CONTROL

conveyor system is used for

For the cleaning of flux

New soldering tasks can be

substrate transport.

residues all necessary parts

simulated and it offers

of the oven can be removed

unlimited storage space

Easy integration

easily and cleaned outside

for programs. Measured

SMEMA connectors provide

the oven.

temperature profiles can be

the ability to link the oven

superimposed graphically.

with any other compatible equipment.

CO N TA C T U S

Essemtec AG Mosenstrasse 20 CH-6287 Aesch/LU Switzerland Phone: +41 (0)41 919 60 60 Fax: +41 (0)41 919 60 50 [email protected]

For a complete list of all representatives and more product information please visit our website: www.essemtec.com

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Disclaimer: The information contained in this brochure is for general information purposes only. The information is provided by Essemtec and whilst we endeavour to keep the information up-to-date and correct, we make no representations or warranties of any kind, express or implied, about the completeness, accuracy, reliability, suitability. Essemtec reserves the right to alter any product or service. Aesch, November 2014

Copyright Information: All materials contained in this brochure are copyright © Essemtec AG, Switzerland. This information is issued to provide outline information only. Use, application or reproduction for any purpose or formation of any order or contract is prohibited unless agreed by Essemtec. Concept: MaZ Text: FrB Layout: ErD

Version 4 • June 28, 2013

Configuration Machine base

PCB Handling

 standard feature

RO300FC RO300FCN2 RO300FC-C Heating zones 3 3 3 Cooling zones 1 1 1  Nitrogen operation   Air operation *    Base console   Mesh belt conveyor  Pin (chain) conveyor  SMEMA interface  optional feature *Changeover time Nitrogenair operation: less than 5 Minutes

RO300FCN2-C 3 1  *   

Specifications Dimensions Control

Substrate dimensions Conveyor

Process dimensions

Process data

Supplies

Length x Width x Height Weight Type Languages Temperatures selectable Program capacity Board counter Gas temperature adjustment Max. reflow width Substrate width Transport direction Pin length Conveyor speed range Conveyor speed repeatability Conveyor motor type Rail parallelism In feed length Out feed length Entrance height (max) Free space below substrate Heated length Length of heating zone Length of active cooling zone Overall length cooling zone Total Air circulation heating zones Air circulation per heating zone Air circulation peak zone Air circulation cooling zone Atmosphere quality Electrical Power consumption Minimum exhaust volume Filter / Air Cleaning Systems Exhaust specifications

Environment Features

N2 consumption for