Flexible Hybrid Electronics: System Design & Reliability Next Generation Flexible Hybrid Health Monitoring Devices SEMICON West 13 July 2016

Proprietary Information

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FHE Health Monitoring Programs

• FCB Print Design & Layout • FHE Integration

• FleX-IC Design & Fabrication • FHE Integration

Power

Amplified Signal

• FHE Circuit Design • FCB Layout

Signal Ground

• FHE Circuit Design • FCB Print Design & Layout • FHE Integration

10101101 Sensor

FleXOpAmp

©2016 American Semiconductor, Inc. All rights reserved.

FleXADC

MCU

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Solving FHE Design Flow Challenges • • •

Flexible Circuit Boards (FCBs) are similar in function to PCBs The current FCB layout to fabrication data flow presents known challenges  Even with the issues identified and in mind, the data flow is difficult Additional design considerations include printed devices, e.g. passives & TFT devices PCB Data Flow

PCB Layout SW

Gerber Data File

Printing Data Flow

Graphics Layout SW

PCB Fabrication

Graphics Data File

Printing

Current FCB Data Flow

Drawn Printed (21% delta)

PCB Layout SW

Gerber Data File

Graphics Data File

FCB Fabrication

Desired FCB Data Flow

PCB Layout SW ©2016 American Semiconductor, Inc. All rights reserved.

Graphics Layout SW

Gerber Data File

FCB Fabrication 3

FCB Fabrications Multiple Suppliers & Materials Vendor A: 4 mil (100um) lines on PET • 13” web – backside substrate scratches due to rollers, cosmetic only • Printed trace width: 175um • Trace resistance: 40Ω MCU pad to ZIF

©2016 American Semiconductor, Inc. All rights reserved.

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FCB Fabrications Multiple Suppliers & Materials Vendor B: 4 mil (100um) lines on PET • 18” x 32” sheets • Printed trace width: 160um • Trace resistance: 23Ω MCU pad to ZIF

©2016 American Semiconductor, Inc. All rights reserved.

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FCB Fabrications Multiple Suppliers & Materials Vendor B: 4 mil (100um) lines on Ultem • 18” x 32” sheets (no scratches on backside of substrate) • Printed trace width: 160um • Trace resistance: 22Ω MCU pad to ZIF

©2016 American Semiconductor, Inc. All rights reserved.

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FCB Fabrications Multiple Suppliers & Materials Vendor B: 4 mil (100um) lines on Etched PET • 18” x 32” sheets (no scratches on backside of substrate) • Printed trace width: 100um • Trace resistance: 23Ω MCU pad to ZIF

©2016 American Semiconductor, Inc. All rights reserved.

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Thin Devices Flexible Electronics present a new opportunity for semiconductor industry •

Challenges  Availability – FHE low volume and IDMs are unlikely to support  Die thinness targets are still in flux  Conventional die challenges  Wafer/die handling  Die cracking/chipping  Singulation methods • Blade, Laser, Stealth, DBG  Reliability / mechanical robustness • New unknowns due to flexibility

Grind Edge Damage With edge trim

Images Courtesy of Disco Hi-Tec America

Dicing Edge Damage Small Grit (#4800)

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Without edge trim

Typical Grip (#2000)

Emerging Technology Solutions  FleX™ Silicon-on-Polymer – Ultra Thin Die  Thin device integration methods  Thin device / FHE reliability test procedures Images Courtesy of Disco Hi-Tec America ©2016 American Semiconductor, Inc. All rights reserved.

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Key Technology Enabling FHE Products • Thin device singulation has been identified as a serious challenge   

Thin (ex: 50um) conventional die have been reported to chip or fracture when diced Laser singulation has been evaluated as an alternative, but slag issues persist Dice before grind has been suggested to resolve conventional thin device singulation

• FleX Silicon-on-Polymer device singulation has been resolved   

Tape mount, saw, and vacuum pick have been demonstrated with good results Chipping and fracturing at wafer saw is NOT a problem for FleX Silicon-on-Polymer technology Development of Tape and Reel or equivalent packaging for assembly is in progress

No edge chip or fracture on SoP ©2016 American Semiconductor, Inc. All rights reserved.

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FleX™ Commercial Silicon-on-Polymer™ Process Silicon-on-Polymer (SoP) is a Thin Device technology to convert single crystalline foundry wafers into flexible thin devices. Technology: Devices: Interconnect: Flexibility:

FleX SoP-SOI TowerJazz CS18/13 PD-SOI CMOS FleX-ADC, FleX-MCU, FleX-OpAmp, … 4-level Aluminum