National Association for Surface Finishing Annual Technical Conference 2005 (SUR/FIN 2005)

St. Louis, Missouri, USA 13-16 June 2005

ISBN: 978-1-62748-187-8

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TRACK I – NANO PLATING I Monday Afternoon, June 13, 2005 Session Organizer: Dr. Paco Gonzalez

Electroplating in the Context of Worldwide Nanotechnology Initiatives U. Erb, Materials Science and Engineering, University of Toronto, Toronto, Ontario, Canada Synthesis, Structure, and Properties of Nanocrystalline Ni-P Electrodeposits U. Erb1, Y. Zhou1, K.T. Aust1, F. Gonzalez2 & G. Palumbo2 1 Department of Materials Science and Engineering, University of Toronto, Toronto, Ontario , Canada; 2Integran Technologies, Inc., 1 Meridian Road, Toronto, Ontario, Canada Are Direct Current Chromium Deposits Nanogranular? Craig V. Bishop, Dr. Allen R. Jones, Dr. Agnes Rousseau, Atotech USA; Dr. Charles McFarland Composite Nanomaterials: Contribution of Chromium Electrodeposition Patrick Benaben, Ecole Nationale Superieure des Mines, SaintEtienne, France Microribbons in Hard Chromium Electrodeposits Allen R. Jones and Craig V. Bishop, Atotech WW R&D Nanocrystalline Cobalt-Phosphorus Alloy Coatings for Chrome Replacement within the Aerospace Industry1$ J.L. McCrea, S. Kim, D. Jeong, F. Gonzalez and G. Palumbo, Integran Technologies Inc, Toronto, Ontario; K. O. Legg, Rowan Technology Group, Libertyville IL; B. D. Sartwell, Naval Research Laboratory, Washington DC.

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TRACK II – GLOBAL ENVIRONMENTAL DRIVERS Monday Afternoon, June 13, 2005 Session Organizer: Christian Richter Papers not available for this session.

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TRACK IV – ELECTROLESS PLATING Monday Afternoon, June 13, 2005 Session Organizer: Ron Duncan

Electroless Nickel and the End-Of-Life Vehicle Directive Ronald Duncan, Palm International, Inc., LaVergne, Tennessee Converting to Lead-free, Cadmium free Electroless Nickel Kimberly Tress, Heatbath Corporation, Springfield, Massachusetts Wear and Friction Reduction Using Improved Ni-B Electroless Coatings1$ Y.W. Riddle & T.O. Bailer, Universal Chemical Technologies, Stuart, FL The EDEN system for Electroless Nickel Bath Life Extension and Consistent Quality Peter Longfield, Atotech USA, Inc., Rock Hill, SC & Graham Orgill, Atotech UK Ltd., West Bromwich, UK Effectively Problem Solving an Electroless Nickel Plating Operation Brad Durkin, MacDermid, Inc., Waterbury, CT. Lead and Cadmium Free Electroless Nickel Processes for the 21st Century D. Crotty, MacDermid, Inc., New Hudson, MI.

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TRACK I – NANO PLATING II

Tuesday, June 14, 2005 Session Chair: Melissa Klingenberg, Concurrent Technologies

Development of Nanostructured Chromium-Free Conversion Coatings and Nanostructured Coatings with Enhanced Properties1$ Dr. Julio GOMEZ , AVANZARE Innovación Tecnológica, Logroño (La Rioja) Spain Nickel and Cobalt-Based Nanocomposite and Nanostructured Alternatives to Chromium Coatings Dr. E. W. Brooman, Consultant, Materials & Manufacturing Directorate, Air Force Research Laboratory (AFRL/MLSC), WrightPatterson Air Force Base, Ohio Electroplating Nanocomposite Films with an Impinging Jet Wendi Sweet, Steven J. Osborne & Jan B. Talbot, Material Science & Engineering Program, University of California, San Diego, La Jolla, California Magnetotransport Studies in Co/Cu and Ag Nano-structure Films Prepared by Pulse Electrochemical Deposition C.L.S. Rizal, Advanced Electronic Materials Laboratory, Muroran Institute of Technology, Muroran-shi, Hokkaido, Japan Effects of Film Composition on the Properties of FeCoNi Electrodeposits1$ B.Y. Yoo1, S. Hernandez1, D-Y. Park2, and N.V. Myung1; 1 Department of Chemical and Environmental Engineering, University of California, Riverside CA; 2Department of Applied Materials Engineering, Hanbat National University, Daejeon, Republic of Korea

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TRACK II – MANAGEMENT Tuesday, June 14, 2005 Panel Discussion

“Not just surviving, succeeding in the surface finishing industry.” A panel discussion from mavericks in the industry.1$ David Marsh of Marsh Plating Jeff Brassard of MacDermid, Inc. - Far East “What it Takes to Succeed as a Supplier in the Far East Market Place.” Jaime Maliszewski of Reliable Plating Works, Inc. Moderated by William Saas of Taskem, Inc. Papers not available for this session.

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TRACK III – PROCESS & ENVIRONMENTAL I Tuesday, June 14, 2005 Session Chair: Kevin Klink, Integrated Technologies, Inc.

Zero Waste/ Zero Exposure Plating Process Control1$ Peter A. Gallerani, AESF Fellow, CEF 3, Integrated Technologies, Inc., Danville, VT Design and Retrofit Techniques to Reduce Process Tank Emissions1$ Kyle Hankinson, KCH Engineered Systems, Forest City, NC Optimization of a Nickel rack plating process using Integrated Simulation Software G. Nelissen, B. Van Den Bossche & L. Bortels, ELSYCA NV, Zellik, Belgium 3-D Simulation and Validation of a Nickel plating Process for Reflector Applications Bart Van den Bossche, Leslie Bortels & Gert Nelissen, ELSYCA NV, Zellik, Belgium; Chris Jensen, Karlheinz Strobl; eeleElectroforming, eele Laboratories, Bohemia, NY Model Development for Optimum Acid Usage and Production Efficiencies A. Telukdarie1 & C.J. Brouckaert2; 1Department of Chemical Engineering, Durban Institute of Technology, Durban, South Africa; 2School of Chemical Engineering, Pollution Research Group, University of Natal, Durban, South Africa

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TRACK IV – LIGHT METALS FINISHING Tuesday, June 14, 2005 Session Chair: Angela Vawter CEF, Burns and McDonnell

OSHA Proposed Rule for Hexavalent Chromium Exposure: An Overview, Industry Impact and Control Measures for the Light Metals Finisher1$ Ira Donovan, MSF, Burns & McDonnell Engineering, Kansas City, Missouri Pulse Ramp Mixed Electrolyte Anodizing Automated & Practical - All Aluminum and Titanium Alloys Fred C. Schaedel, Alpha Process Systems, Westminster, CA General Considerations for Construction and/or Renovation of Anodizing Facilities: Part II1$ Angela M. Vawter, Burns & McDonnell, Kansas City. MO An RoHS Compliant Conversion Coating System For Aluminum and its Alloys John W. Bibber, Sanchem, Inc., Chicago, Illinois The Effect of Sealing Method on the Abrasion Resistance of Anodized and Hard Anodized Aluminum Dr. Xavier Albert Ventura, Laboratory of Electrochemical Research & Development, Integral Centre, Barcelona, Spain Batch and Spot Repairs for Color-Anodized Panels Hong- Hsiang (Harry) Kuo and Yar-Ming Wang, Materials & Processes Lab, General Motors R&D Center, Warren, Michigan

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TRACK I – NANOPLATING III Tuesday, June 14, 2005 Session Chair: Patrick Benaben, ENS Mines

Have You Checked Your Pulse Lately? A Look at the Most Recent Advances in Pulse Power Supply Technology David Osero, Dynatronix, Inc., Amery, Wisconsin Bi-polar (DC+AC) Pulse-Reverse Technique for the Deposition of Metal Coatings with Improved Properties M. Aroyo, N. Tzonev, Technical University of Sofia, Bulgaria Electroforming of Thick Layers from Sulfite Gold Alloys in the LIGA Process Nina Dambrowsky1, Klaus Bade1, Frank Köster2 and Joachim Schulz1; 1 Forschungszentrum Karlsruhe, Institut für Mikrostrukturtectnik (IMT), Karlsruhe, Germany; 2AMI DODUCO, Pforzheim, Germany Evaluation of Defect Structure in Pulse Plated Trivalent Chromium Layers by Small Angle Neutron Scattering Y. Choi1, Y.S. Hahn2, M. Kim3 & S.C. Kwon3; 1Sunmoon University, Chungnam, Korea; 2Korea Atomic Energy Research Institute, Daejeon, Korea; 3Korea Institute of Machinery and Materials, Changwon, Kyungnam, Korea A Study on Composite Electrodeposition of Nickel with α-Al2O3 Nanoparticles J. Liu, G. Zhao & C. Hu, Guangzhou Etsing Plating Research Institute, Guangzhou, P.R. China

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TRACK II – GLOBAL SUPPLY CHAIN Tuesday, June 14, 2005 Panel Discussion

“Thinking Globally” A panel discussion on how to “think globally” from the industry leaders that are successfully making it happen.1$ John Kinne of Atotech USA, Inc. Mike D’Angelo of Whyco Technologies, Inc. Eric Olander of EPI Moderated by Peter Gallerani CEF-3, AESF Fellow Papers not available for this session.

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TRACK III – PROCESS & ENVIRONMENTAL II Tuesday, June 14, 2005 Session Chair: John Fullen CEF, Boeing

Nickel Plating Air Emissions Study1$ Joelie Zak, CEF-4, Scientific Control Laboratories, Inc., Chicago, IL Functional Trivalent Chromium Plating: An Alternative to Hexavalent Chromium Plating R.P. Renz, CEF, J.J. Fortman, Ph.D. & E.J. Taylor, Ph.D., Faraday Technology, Inc., Clayton, OH Zero Chromium Electrolytic Surface Treatment for Metallic Surfaces- Part II: Aluminum and its Alloys1$ Ravi Chandran, Ph.D, CHEMIONIC Labs & Consulting, CHEMIONIC Technologies, New Brunswick, New Jersey & Nancy Heimann, Dennis Winn & Wayne Soucie, Elisha Technologies Co. LLC, Moberly, Missouri A Novel Approach to Deposit Modulated Zn-Ni Multilayer as a Replacement for Cadmium Coating1$ Prabhu Ganesan, Swaminatha P. Kumaraguru and Branko N. Popov, Department of Chemical Engineering, University of South Carolina, Columbia, SC Development of a Plating Process for the Deposition of Zn-Ni-X (X = Sn, Cd and SiO2) Alloys As a Replacement for Cadmium Coatings1$ Swaminatha P. Kumaraguru, Prabhu Ganesan and Branko N. Popov, Department of Chemical Engineering, University of South Carolina, Columbia, SC

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TRACK IV – PLATING FOR ELECTRONICS Tuesday, June 14, 2005 Session Chair: Bob Srinivasan, A Brite Company

Tin-Bismuth Finishes and Phenomenon of Whiskers Sudarshan Lal & Thomas D. Moyer, FCI, USA, Inc., Etters, Pennsylvania Alloy Film Production of Tin-Copper Through Heat Treatment of Stacked Layers Hideyuki Kanematsu, Suzuka National College of Technology, Suzuka, Japan, Hisakazu Ezaki. Naoko Yanagi & Takeo Oki Electrochemical Microfabrication for High-Aspect Ratio 3-D Microstructures Gang Zhang, eChemics, Monterey Park, California, USA Modern Trends & Developments in Plating with Platinum Group Metals Steven Burling, Metalor Technologies, Birmingham, UK Pulsed Electrodeposited Sn-Cu Alloys for Use as Pb-Free Component Finishes in Microelectronic Applications Kristian Olsen and Douglas G. Ivey, Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta, Canada Palladium and its Alloys – A Revival? Dr. C. A. Dullaghan and S. Daniels, Metalor Technologies USA, N. Attleboro, MA, S. Burling, Metalor Technologies (UK) Ltd., Birmingham, UK, J. Gonzalez, Metalor Technologies (France) SAS, Paris, France, Stewart J. Hemsley, Metalor Technologies Singapore Pte. Ltd., Singapore

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TRACK I – RESEARCH I

Wednesday, June 15, 2005 Session Chair: James Lindsay AESF Fellow

BLUM LECTURE AESF Scientific Achievement Award 2005 William Blum Memorial Lecture Some Reflections on the Results of Past AESF Projects and Some New Directions1$ Howard W. Pickering, Department of Materials Science and Engineering, Pennsylvania State University, University Park, PA Antifungal Characteristics of Some Metal Plating Hideyuki Kanematsu & Hajime lkigai, Suzuka National College of Technology, Suzuka, Japan; Kensuke Kuroda & Akira Ohmori, Nagoya University, Nagoya, Japan Antibacterial Activity by Alloying of Tin & Copper Plating Hajime lkigai & Hideyuki Kanematsu, Suzuka National College of Technology, Suzuka, Japan; Kensuke Kuroda & Akira Ohmori, Nagoya University, Nagoya, Japan Calculating Plating Thickness Distribution on Resistive Electrodes: Electrolytic Copper Plating over Electroless Plated Copper and Nickel on Plastics Katsuhiko Ohara, C. Uyemura & Co., Ltd., Osaka, Japan

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TRACK II – AIRLINE / AEROSPACE I Wednesday, June 15, 2005 Session Chair: Gary Smith, Burns and McDonnel

Planning for Metal Finishing Shop Transformation1$ Peter A. Gallerani, AESF Fellow, CEF-3/Integrated Technologies; Kevin L. Klink, P.E./Integrated Technologies, Dave Bury/WRAFB Implementing Green Metal Finishing Processes1$ Kevin L. Klink, P.E./Integrated Technologies, Kristen Jenkins, P.E./ CH2M HILL, Steve Battle WRAFB Trivalent Brush Plated Hard Chromium1$ C.M. Mance, OC-ALC/MADLI, Tinker AFB, Oklahoma City, OK Design of a Paint Hangar to Meet the Proposed Hexavalent Chrome Worker Exposure Standard1$ Jerry P. Bauer, P.E., Burns & McDonnell Engineering Company, Kansas City, MO Toward Elimination of Cyanide Processes in the Airline Finishing Industry J. Durnford, United Airlines Process Engineering, San Francisco, CA

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TRACK III – PROCESS AND ENVIRONMENTAL III Wednesday, June 15, 2005 Session Chair: Greg Arneson, ASC Process Controls

This track will consist of presentations from suppliers and users of ERP, MES, and Control Systems. Presentations will consist of a small subset of control system software and management techniques (ABC Analysis, Brainstorming, Kaizen, Kanban, OEE, Six Sigma, TPM, Poka Yoke, Pull, etc.) Presentations can cover the range from overall plant operations to specific work cell controllers. An overview by the Chairman followed by introduction to the speakers and their papers will start the proceedings. The last 20 minutes will consist of the speakers sitting as a panel to answer any audience questions.

Plating Lines and Controls - Concepts for Continuous Improvement of Productivity and Quality1$ R. Freund, Aucos, Germany Using Wireless PDAs for Surface Finishing Operations1$ Craig Pierce, ASC Process Systems, Sylmar, CA Integrated Process Control for the Modern Surface Finishing Facility Jeffrey R. Lord, CEF 4 & Glenn A. Zinkus, Integrated Technologies, Inc., Danville, VT Evaluating Process Control Test Methods in Establishing Process Limits3DUW, Jeffrey R. Lord, CEF 4 and Kevin L. Klink, P.E., Integrated Technologies, Inc., Danville, VT. Building Your Own “HMI SCADA”™ Process Control System John P. Bougneit & Craig A. Henry

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TRACK IV – EMERGING TRENDS IN DECORATIVE PLATING I

Wednesday, June 15, 2005 Session Chair: John B Newman CEF, Superior Industries International

Twenty-six Year Corrosion Study Comparing Decorative Hexavalent and Trivalent Chromium Dr. Donald Snyder, Atotech GMF, Rock Hill, South Carolina The Electrochemical Deposition of Tin-Nickel Alloys and the Corrosion Properties of the Coating Per Møller & Morten Jellesen, The Technical University of Denmark, Lyngby, Denmark Decorative and Functional Finishes by Low Temperature Arc Vapor Deposition Klaus Brondum, Vapor Technologies, Inc., Longmont, Colorado Vibratory Finishing Optimization by Proper Mechanical Set-up and the Use of Chemical Accelerators to Virtually Eliminate Hand Polishing of Hardened Steel Parts William Nebiolo, REM Chemicals, Inc., Southington, CT A New Zinc Chloride Electroplating Bath R. Painter, CEF, PAVCO, Inc., Warrensville Heights, OH Electrochemical Treatment of Jewelry Alloys of Gold in an Acidified Solution of Thiourea S. Nersisyan, Yerevan State University, Yerevan Factory of Art Watches, Yerevan 375025, Armenia

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TRACK I – RESEARCH II

Thursday, June 16, 2005 Session Chair: Ken Newby, Atotech USA, Inc.

New Electrodeposited Rubber-bonding Alloy Coatings Sergey S. Kruglikov, Valery I. Kharlamov & Tigran A. Vagramyan, S.S. Kruglikov Consultants, Moscow, Russia Elastic Copper- and Nickel-based Composite Coating. Sergey S. Kruglikov, Elena A. Tuzhilkina, S.S. Kruglikov Consultants, Moscow, Russia Emerging Boron-Doped Diamond Electrode Technology in Wastewater Treatment Ravi Chandran, Ph.D, CHEMIONIC Labs & Consulting, CHEMIONIC Technologies, New Brunswick, New Jersey Electrochemical Analysis of Platinum and Diamond Filmed Titanium Substrates – Assessment of Cyclic Voltammetry (CV) for Use as a Screening Device1$ Ravi Chandran, Ph.D, CHEMIONIC Labs & Consulting, CHEMIONIC Technologies, New Brunswick, New Jersey Overview of the MIDOS Process for Spontaneous Metal Deposition Jingye Li, Matthew O’Keefe and Thomas O’Keefe, Department of Materials Science and Engineering, University of Missouri-Rolla, Rolla, Missouri

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TRACK II – AIRLINE / AEROSPACE II Thursday, June 16, 2005 Session Chair: Steve Gaydos, Boeing

Surviving a Chem Process Nadcap Audit L. Fostveit & M. Stevenson, Jr., Anoplate Corporation, Syracuse, NY LEEDing The Way in Facility Design and Operation W. Allen, The Austin Company, Largo, FL A Chem Process Nadcap Audit from the Auditor View Point1$ Fred Mueller, CEF, General Magnaplate Corp., Linden, NJ

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TRACK III – PROCESS & ENVIRONMENTAL IV Thursday, June 16, 2005 Session Chair: Lyle Kirman, Kinetico

To Compliance and Beyond: One Company’s Journey to Zero Discharge1$ Ray Lucas, Valley Chrome Plating, Inc., Clovis, California Chromium Recovery and Minimization in Industrial Surface Treatment Processes Dr. Xavier Albert Ventura, Laboratory of Electrochemical Research & Development, Integral Centre, Barcelona, Spain Electrochemical Removal of Beryllium from Acid Process Solutions Sergey S. Kruglikov, Dmitri Yu Turaev, Nadezhda S. Kolotovkina & Natalia A. Andrianova, S.S. Kruglikov Consultants, Moscow, Russia The Do’s & Don’ts of Trivalent Passivation Processes (Thick & Thin Film) Mike Wyrostek, MacDermid Inc., Waterbury, CT Hazmat Regulation in the Post 9/11 World1$ Adam Cramer, Cramer Law Group PLLC, Washington, DC Plating Shop Bath Life Extension for Removing Solids Paul Brezovec and Leanne Debias, Concurrent Technologies Corporation, Johnstown, Pennsylvania

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TRACK IV – DECORATIVE & FUNCTIONAL PLATING: CLINIC ON TROUBLESHOOTING Thursday, June 16, 2005 Session Chair: Ralph Dixon, Basically Nickel Incorporated

Troubleshooting of the Unkwnown Ralph Dixon, Basically Nickel Inc., East Berlin, PA Troubleshooting of Electrolytic Color Anodizing of Aluminum Bob Srinivasan, A Brite Company, Brookfield, WI Troubleshooting Decorative Chromium Plating Solutions Anthony J. Varuolo, MacDermid Inc., Waterbury, CT Running Alloy Zinc Processes1$ Tony Rowan, MacDermid Inc., Birmingham, England, UK Trouble Shooting Filters In Plating Shops Mel Siska, Industrial Filter & Pump Mfg. Co., Cicero, IL Servicing a Hard Chromium Plating Operation Ray Kern, MacDermid Inc., New Hudson, MI Why Your Waste Treatment System Does Not Work J.C. Welkie, J&T Technologies, Inc., Pottstown, PA

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TRACK II – AIRLINE/AEROSPACE III Thursday, June 16, 2005 Session Chair: Serge Labbe CEF-4, Heroux Devtek, Inc.

Surface Finishing Facility Commissioning: Bridging Facility Design and Construction with Facility Operations and Maintenance Jeffrey R. Lord, CEF 4; Peter A. Gallerani, AESF Fellow, CEF 3; and Glenn A. Zinkus, Integrated Technologies, Inc., Danville, VT Overview of the U.S. Army Technology Demonstration for Prevention of Material Degradation Program Lawrence A. Gintert, Robert B. Mason & Mark F. Singleton, Concurrent Technologies Corporation, Largo, Florida & Don Skelton, U.S. Army Corrosion Center, Picatinny Arsenal, New Jersey Evaluation of Advanced Coatings for Improved Performance On Military Hydraulic Equipment Robert B. Mason, Martin Konrad, Paul Galbraith & Mark F. Singleton, Concurrent Technologies Corp., Largo. Florida & Don Skelton, U.S. Army Industrial Ecology Center, Picatinny Arsenal, New Jersey Impact of Surface Preparation and Tank Maintenance on Nickel Corrosion Resistance1$ Danielle Miousse, Héroux Devtek, Longueuil, Québec, Canada Boric Acid - Sulfuric Acid Anodizing (BSAA) Salt Spray Failure Troubleshooting W.J. Fullen, Boeing, Seattle, WA

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TRACK III – PROCESS & ENVIRONMENTAL V Thursday, June 16, 2005 Session Chair: Yinlun Huang, Wayne State University

P3EP: A Tool Set for Profitable Pollution Prevention in Electroplating Plants1$ Y. Huang & Q. Xu, Wayne State University, Detroit, MI & H.H. Lou, Lamar University, Beaumont, TX What Your Chemical Supplier Should Tell You But Doesn’t J.H. Berg, Serfilco, Ltd., Northbrook, IL A Practical Understanding of Today’s Plating Power Supply1$ Enrique Gutierrez, TecNu, Inc. Things to Review Before Your Next Rectifier Purchase W. Boddison, American Plating Power, LLC, Fort Myers, FL

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