FDC Implementation Strategy to High Volume Manufacturing

APC/FDC Implementation Strategy to High Volume Manufacturing Kyoung S. Jun and Myung K. Kim Samsung Electronics SEMI Workshop on e-manufacturing & AP...
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APC/FDC Implementation Strategy to High Volume Manufacturing Kyoung S. Jun and Myung K. Kim Samsung Electronics

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 1

Table of Contents ‰Motivation ‰APC Implementation Technology ‰APC overview ‰APC implementation approach ‰Suggestions

‰FDC Implementation Technology ‰FDC overview ‰FDC implementation approach ‰Suggestions SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 2

Why do we concern APC/FDC in High Volume Manufacturing? ‰ Tool cost and maintenance cost in 200 / 300mm manufacturing becomes increased and OEE more important. ‰ Process becomes more complicated and difficult to be controlled by operator and/or engineer in real-time basis. ‰ Fast new device and equipment setup will contribute to ramp-up. ‰ Wafer-to-wafer level process and equipment monitoring becomes more important. ‰ Human error results in wafer loss and increase of costs. ‰ Full Automation is a trend for future fab operation. ‰ Real-time process and equipment control is only way to speed up the throughput and prevent the fault and failure. SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 3

Key Issues in Implementing APC ‰ Type of lot (normal, engineering, dummy, test lot) ‰ Process plan (normal flow, rework flow, split / merge flow, reposition flow) ‰ Equipment type (chamber, furnace) and Data collection ‰ Materials (reticle, photo resist, etc.) ‰ PM (scheduled or unscheduled PM) ‰ MES integration – Open-architecture issue ‰ Confliction between scheduling and dispatching vs. APC ‰ Production behavior (control context matching, metrology data, rework, measurement skip etc.) ‰ Cost and investment

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 4

Recent APC/FDC Activity 1995~1997

1998 ~ 2000

2001 ~

Group/

Framework-

cell

based

control

control

Equipment with Framework control

Device Maker

S/W Vendor + Device Maker

S/W Vendor + Device Maker+Tool Vendor

TI APC solutions

Promis - SemiEngineering

Intelligent Tool with APC

Motorola APC

Brooks - MiTex, Patterns

+

AMD APC

KLA - ObjectSpace,

Intelligent Tool with

IBM APC

Triant ModelWare/RT

real time tool monitoring

Samsung APC etc.

Aspen Tech- Symphony

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 5

To Be

As Is SPC

SPC Metrology Data Interlock

DCOP Data Interlock

APC INTERLOCK

Standalone Process Control

PHOTO PHOTO

ETCH

T/F etc.

ETCH

DIFFUSION LPCVD CVD

CMP CMP Control

Open-Architectur e

APC Framework Equipment Control

SPUTTER

FDC

Alarm Control

Equipment Control Alarm Control

Recipe Control

Recipe Control

Trace Data Monitoring

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 6

Examples of Process Applying APC Systems Process

Controlled Variable

Manipulated Variable

Target

CMP

Thickness

Polish Time Down Force

Post-Thickness

Photo

Offset X,Y etc. ADICD Skew ACICD

Offset X, Y etc. Dose, time

Offset X, Y etc. ADICD

Etch Time

ACICD

LPCVD

Thickness Temperature

Temperature Deposition Time

Thickness

Sputter

RI

Deposition Time

RI

Thickness Temperature

Deposition Time

Thickness

Etch

Diffusion

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 7

LPCVD Problem LPCVD Thickness Target

+

Deposition Time

Master Controller

-

Estimated Thickness Deposition Time

Thickness

Model

-

+

Temperature Controller

Temperature deviations

Slave Controller

+ +

Temperature Set points

Temperatures

Thickness Target

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 8

Use Case of Furnace The procedure to calculate the deposition time and temperature set points z Selection of standard thickness zone z Calculation of standard zone's deposition time z Calculation of estimated deposition thickness on each furnace position z Calculation of temperature set points using estimated deposition thickness for each furnace zone.

Case I (Three Monitoring Wafer) P1

P2

M1

P3

P4

P5

M2

P6

Case II (Four Monitoring Wafer) P1

Lot Position M3

Monitoring Wafer M1 Position

P2

P3

P4

M2

P5 M3

P6

Lot Position Monitoring Wafer M4 Position

Standard U

CU

Standard

CL

L

Thermocouple Position

U

CU

CL

L

Thermocouple Position

Thickness Profile

Thickness Profile

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 9

Photo Problem Supervisory Controller

Virtual Model 1

Database

….

Evolutionary Algorithm

Virtual Model n

Stepper

Overlay

Virtual Plant SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 10

Adaptive LMS Predictor Y(n)

+

e(n) = Y(n) – P(n)

STEPPER -

FILTER

DATABASE

P(n)

NEURAL-NET PREDICTOR

D-N Feedback delay SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 11

Etch Problem ETCH

PH O TO

Fixed

A Pre

Rew ork

N orm al

EQ P Spec O ut

B

N orm al Fixed R ecipe

C

A D ICD

A CICD

V ariable O utput V ariable EQ P

A V ariable Post

Rew ork

N orm al

B

Spec O ut

N orm al

R ecipe

Fixed

C

O utput

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 12

CMP Problem PTACS Pre Metrology

Post Metrology

Polish Time

Measurement

Measurement

Pre-Metrology

Polisher

Post-Metrology

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 13

Factory wide APC H/W Integration Configuration LAN

Catalyst H/W Configuration(NT) Primary Node Int. Disk

SEC CIM

EXP 200 External

C: D:

Heartbeat line

HDD enclosure FC Raid Controller w/ Failsafe option

E:

Int. Disk C: D:

Backup Node GB DLT Tape

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 14

MES & APC S/W Integration Configuration

LOT Manager

Data Manager

Engineering GUI

Equipment Manager

JDBC

Scheduler

SPC

MES Extender

Operation GUI

Tracking Manager

AAS (oracle)

APC Adapter

TCL Script (CMP prepolish)

API Document

Control

Manager

Executor

CEM Dispatcher

APC

Equipment Server

AMHS

CORBA Control

Application

Sensor

Database

Interface

Interface

CDB (oracle)

DLL Third-party tool

Equipment/AGV

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 15

APC Suggestions ‰ Fab-wide APC solution has to be a proven solution in many process area. (Solution should be easy to implement and be standardized !!!). ‰ APC solution has to be open-architecture wired with CIM environment. ‰ Third party S/W usability (e.g., real-time monitoring, other process analysis tools) has to be extended more. ‰ APC must have flexible functionalities under various production environment. ‰ APC Systems should guarantee the stability and performance. SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 16

Why is FDC Important to a Device Maker? ‰ Needs for a systematic FDC solution which keeps various manufacturing equipment monitoring capabilities. ‰ Real time multivariate chart support ( System health must be monitored ). ‰ Real time Lot/Equipment alarm/holding function interfaced with MES. ‰ Real time feedback solution support for engineer's reaction.

‰ Lot to lot processing with the currently equipment information does not give the exact status of tool. One value such as max, min, and average from the tool does not give the informative prediction to process engineers. ‰ Equipment monitoring based on wafer level is critical to reduce the wafer loss and preventive monitoring time. ‰ Process in equipment has to be monitored in real-time basis with the same order of signal gathering. ‰ For future 300mm wafer production under full automation, FDC will be a critical component. SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 17

Benefits of FDC • Process Technology Innovation  Wafer level monitoring and optimum equipment status modeling  300 mm production and process technology early setup

• Equipment Monitoring

 Prevention of accident, enhancement of throughput, reduction of TestWafer, enhanced OEE  Real-time monitoring  PM, effective equipment monitoring after long-term equipment down

• Yield Enhancement  Reduction of rework/scrape and minimize the cost  Treatment of current step of abnormal wafer (EDS Yield enhancement and cost reduction)

• CIM Technology Infra  APC Framework infra  Applications infra

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 18

Key Issues Implementing Real-Time FDC ‰ Wafer-level trace data has to be obtained for practical equipment monitoring. ‰ Connection between tool and FDC system should be simple and network traffic load should be minimal. ‰ Additional hardware and software usage for FDC should be excluded in Fab because of maintenance costs and time. ‰ FDC system has to have enough hardware capacity for handling huge amount of wafer-level trace data. ‰ SECS and HSMS is necessary for easy connectivity between tool and FDC system. ‰ For future e-diagnostics, FDC system has to have open-architecture and TCP/IP compatible. SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 19

System Requirements ‰ Unix server based architecture (AE) ‰ Data collection via SECSII using Equipment Controller (EC) ‰ Tool Data Server (TDS) ‰ Data Conditioner (DCond) ‰ Huge shared data storage - High usability ‰ Samba based inter process-communication ‰ Networked operation - Anywhere on the network ‰ Various report and chart support - Real-time & archived ‰ MES integration – Lot-Wafer / Equipment

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 20

System Configuration ¥° ¥° . Data Co lle c tio n Gro up T o o l/ Ch amb e r 1

Re al- time data colle ction from proce s s e quipme nt and add/re move de taile d configuration parame te r.

T o o l/ Ch amb e r N

E/ C E/ C

T DS

¥±. Analy s is Gro up

Dat a Co n d it ion e r

Analyze and s tore input s tre ams .

¥± Ge ne rate command me s s age s to give MES by the re s ult of analys is .

An aly s is En g ine

¥² . Equipme nt/ Lo t/ Wafe r Ho lding Gro up En g ine e r in g

Ar e a

Dat a Bas e

Co n t r o ller 1

Dy n amic ch ar t

¥²

¥³

Re p o rt Mo d e l Vie w

De live r command me s s age to MES s ys te m and pe rform e quipme nt/lot/wafe r le vel inte rlock

¥³ . Ex te rnal Inte rfac e Gro up Support re al- time or archive d SPC chart, cre ate & vie w mode l, and various re port for e nd us e rs

Mo d e l Mak e r :

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 21

System Architecture (Phase – I) M ES

FD C System

SPC

TCP/IP

Equipm ent C ontrol(online) ToolD ata Server SECSII/H SM S

D ata C ollection GUI

Equipm ent Equipm ent Fab A rea SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 22

System Architecture (Phase – II) FD C System

M ES

D ata C ollection

SPC

TCP/IP

Equipm ent C ontrol(online) ToolD ata Server SECSII/H SM S

GUI

Equipm ent Equipm ent Fab A rea SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 23

FDC GUI

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 24

Sample GUI (Cont.)

SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 25

FDC Suggestions ‰ Tool has to be stable for sending trace data to equipment server. w Minimizing network load and storage, but maximizing sensitivity and archiving. ‰ It is difficult to monitor the tool with variable list type SVIDs ‰ Equipment server with limited CPUs and memory has a limit for using number of tools for monitoring. Various input and output data handling methods are required (file, socket, middle-ware, DCOM, or other API). ‰ Fab-wide installation should be simple and capability, stability, and usability will be the first consideration. ‰ Tool modeling effort should be minimal for reducing engineer’s time consuming. ‰ FDC has to be open-architecture wired with CIM environment. ‰ Not only tool data analysis but also metrology data related analysis will be welcomed. ‰ Best thing for device maker is to get equipment with real-time FDC functionality. SEMI Workshop on e-manufacturing & APC/FDC— Kyoung S. Jun — Slide 26