DO NOT CITE THIS DOCUMENT AS A REQUIREMENT NOTICE 2 28 February 1995

NOTICE NOT MEASUREMENT OF CHANGE SENSITIVE k THIS HANDBOOK IS FOR GUIDANCE ONLY DO NOT CITE THIS DOCUMENT AS A REQUIREMENT 1 e MIL-HDBK-217F N...
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NOTICE

NOT MEASUREMENT

OF CHANGE

SENSITIVE

k

THIS HANDBOOK IS FOR GUIDANCE ONLY DO NOT CITE THIS DOCUMENT AS A REQUIREMENT

1 e

MIL-HDBK-217F

NOTICE 2 28 February 1995

MILITARY HANDBOOK RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT

To all holders of MIL-HDBK-217F 1.

. r

The following pagesofMIL-HDBK-217F New Page($) Front Cover ... Ml

r

have been revised and supersede the pagea Med. superseded Page(6) Front Cover ... 11! iv v vi

“Date

1

[ 2 December 199I

iv v vi vii

.,. Vlll 1-1

I

L

1-2 2-1 2-2 2-3 2-4 2-5 2-6

1

I 1 ,

vii

1

New Page 1-1

9.7

I

r v ,

New Page 5-3 5-4 5-5 5-6 5-9 5-1o 5-23 5-24

I 10 July 1992

2 December 1991

2 December

6-1

6-2 7-3 7-4

2 December

1991

6-1

~

~

1991

6-2 7-3 7-4

1

1991 1991 1991 1991 1991 1991

4

1 1

I

10 Ju~ 1992 Reprinted without change 2 December 1991 2 IxoWnber 1991 10 Ju& 1992 Reprinted without change 2 Deoember 1991 2Deoember1991 Reprinted without change 2 December 1991 2 Deoember 1991 Reprinted without change

11-4, 11-5

12-1

12-1

2 December

12-2

2

11-1

11-2 11-!? ..-

11-2 11-3

1

1~.p . .

.——

December Deoember Deoember Daoember December Deoember

11-4

11-1

,

1-

12 2 2 I2 12 12

2 December 2 December [ 2 C)ecember I 2 December ! 2 December 2 December

9-1 through 9-29 10-1 through 10-32

9-1 through 9-3 10-1 through 10-6

6

A

New Paae

2-8 5“3 54 5-5 5-6 5-9 5-1o 5-23 5-24

r

\

2 Deoember 1991

New Page ~ 2“1 2-2 2-3 . 2-4 2-5 2-6

1

Date 2 December 1991 Reprinted without charme 2 Deoember 1991 I 2 December 1991 I 2 Deoember 1991 I 10 Julv 1992

. . .

.

.

.

——

———-.—



December

1991 1991 1991 1991 1991 1991 1991 1991

I 4

A

,

, d

.—. 1

MI1-HDBK-217F NOTICE 2

*

New Page(s)

I

Superseded

Date

r

12-3

12-3

f

12-4 12-5 13-1 13-2 ---

12-4 12-5 13-1 13-2 ---

1

15-1 through 15-3 16-1 r 16-2 I # 16-4

I

A-1 through A-18

A

c-4

1991 1991 1991 1991 1991

z Uecember

1991

1

1

1

2 December 1991 2 December 1991 2 December 1991 i

New Page

17-1

17-1

1

10 JUIY 1992 I 2 December 2 December 2 December 2 December ‘ - ?ecember

14-1 mrougn 144 14-5 15-1 through 15-6 16-1 New Page —

14-1 through 14-2 14-3

Appendix C-3

Date

Page(s)

c-3 c-4

2 December 2 December 2 December ] 2 December

1991 1991, 10 July 1992 1991 1991

2.

Retain the pages of this notice and insert before the Table of Contents.

3.

Holders of MIL-HDBK-217F will verify that page changes and additions indicated have been entered. The notice pages will be retained as a check sheet. The issuance, together with appended pages, is a separate publication. Each notice is to be retained by stocking points until the military handbook is revised or canceled. Preparing Activity: Air Force -17

Custodians: Army - CR Navy - EC Air Force -17

Project No, RELI-0074

Review Activities: Army - Ml, AV, ER Navy - SH, AS, OS

Air Force-11,13,

15, 19,99

Army - AT, ME, GL Navy - CG, MC, YD, TD Air Force -85

AMSC NIA DISTRIBUTION

— — —

STATEMENT

----

1

A: Approved

1

1

1

for publlc release; dlstnbutlon

=,

unlimited.

I-

r____



I

I NOT MEASUREMENT SENSITIVE]

MIL-HDBK-217F 2 DECEMBER

1991

SUPERSEDING MIL-HDBK-217E, Notice 1 2 January 1990

MILITARY HANDBOOK RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT

THIS HANDBOOK IS FOR GUIDANCE ONLY -DO NOT CITE THIS DOCUMENT AS A REQUIREMENT ! FSC-RELI _—.

AMSC NIA DISTRIBUTION

STATEMENT

Ad Approved

for publlc release; drstrlbu!lcn

tinllmtted

:

MIL-HDBK-217F

DEPARTMENT OF DEFENSE WASHINGTONDC 20301

RELIABILITY

1, This standardization with the assistance 2.

3.

PREDICTION

OF ELECTRONIC

handbook was developed of the military departments,

Every effort has been prediction procedures. ensure its completeness

EQUIPMENT

by the Department of Defense federal agencies, and industry.

made to reflect the latest information It is the intent to review this handbook

on reliability periodically to

and currency.

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Laborato@ERSR, Attm Seymour F. Morris, 525 Brooks 13441-4505, by using the self-addressed Rd., Griffiss AFB, NY Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.



II ,.. .-.

.-— .. -...,

-—.-—- ___

__

..

.

--.—

.

.

— -----

al..

-A--

I-*A

A

-*..A;a-

MIL-HDBK-217F

TA8LE SECTION 1.1

1.2 1.3

OF CONTENTS

1: SCOPE Purpose ................... ..... .... .... .. .. ...... ... ... ......... .. .. .... .................. ......... .... ........ ... .... .. Application . ......... ....... ....... ...... .. ... ... ...... ........ ..... .............. ... .... .......... ............ ... .... .. Computerized Reliability Prediction .. .... .. ........ ... ..... ...... ........ .... ....... ....... ........... .... .. REFERENCE

..................... ................... ....... ....... ... ..... ... ......

2-1

SECTION

2:

SECTION 3.1 3.2 3.3 3.4

3: INTRODUCTION Reliability Engineering ... .... ...... . .... ... ....... ........ .... .. .... ............... .......... ... .... .... .... .... .. The Role of Reliability Prediction ........... ............................................................. .... .. Limitations of Reliability Predictions ....... ....................... ........................... .................

Part Stress Analysis Prediction ................................................................................

3-1 3-1 3-2 3-2

SECTION

4:

. ..... .......................... ................. ..

4-1

5.2 5.3 5.4 5.5 5.6 5.7 5.8

. .... ... ............ .... .................. ...... .... .... .. INTRODUCTION ......... ................................................... ........ Memories .... .... .... ...... ........ ...... ..........0..... .... ...... .... ........... .................. ...... ..... ........ . VHSIC/VHSIC Like ................. ..... .... .............. ..... ...... ... .................... ... ....... .... .. .. ...... GaAs MMIC and Digital Devices . .. ... .... ..... ........ .... .... ........... ....... .............. ....... .... .... .. Hybrids ... ... ............. ...... .... ........ ... ... ... ... .... .... .... .... ........... .......... ...... .... ........ .......... SAW Devices ........ ..... ............ ... .. .... ...... ........ ....... .... ..... ............. ..... ...... . ...... .. .. ...... Magnetic Bubble Memories ...... .. ...... ... ... ........ ... .... .... ..... ...... ................ ......... .. ........ XT Table for All ................ .......... ..... .................... .....................0... ........... ...., *.**...... .,

5-1 5-3 5-4 5-7 5-8 5-9 5-1o 5-11 5“13

5.9

C2 Table for All .......................................................................................................

5-14

5.10

XE, ~ and ZQ Tables for All ............. ................................................*.**................0.

5-15

5.11

TJ Determination,

(All Except Hybrids) ......................*.*... ............................ ...*.....*,.

5-17

5.12

TJ Determination,

(For Hybrids) ...................................................................... .*.......

5-18

5.13

Examples ...............................................................................................................

5-20

RELIABILITY

5:

SECTION

5.1

DOCUMENTS

1-1 1-1 1-1

ANALYSIS

EVALUATION

MICROCIRCUITS,



Gate/Logic Arrays and Microprocessors









6:

DISCRETE SEMICONDUCTORS Discrete Semiconductors, Introduction ... . ....... ... .. .. ......... ...... ................... ....00..... ... .. Diodes, Low Frequency ..... ..... .. .. ... .. .... ... ... ..... .... .. ............ ........... ...... .... ....... ........., Diodes, High Frequency (Microwave, RF) . ....... ..... .... ...... ..................... ... .... .... .... .... .. Transistors, Low Frequency, Bipolar ..... ... .... .... .... .. ....... ..... ..................... ....... .... . ..... Transistors, Low Frequency, Si FET ...... ........ ....... ...................0................................ Transistors, Unijunction ........... .. ............ ................ ................................. ....... .... ...... Transistors, Low Noise, High Frequency, Bipolar ........... ... O.*......**.*.. ....... ......... .... ... . Transistors, High Power, High Frequency, Bipolar .......0..... ....................... ................. Transistors, High Frequmcy, GaAs FET .. .... ..... .

SECTION 6.0 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 6.12 6.13 6,14

Laser Diode ... . ....... ....... ........... .. ......... .................. .... ... ... .... . ........ . ................ ..... ... .... .. ... ... ........ .... .. ..... ....... .............. ... ........... ..........

6-1 6-2 6-4 6-6 6-8 6-9 6-10 6-12 6-14 6-16 6-17 6-19 6-20 6-21 6-23

Example ...... ........................ .... ..... .... ... ... ....... .. .... ................ .................. . ...... . .........

6-25



. . . . . . . ...0.

Transistors, High Frequency, Si FET .......................... Thyristors and SCRS .....................**......................... ●

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . .

. . . . . . ...0...

Optoelectronics,

Detectors,

Isolators,

6.15

. . . . . . . . . . . . .

Emitters ... .... ........ .............

Optoelectronics, Alphanumeric Displays .........0.................. Optoelectronics, TJ Determination





. . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



. . . . . ..*......

,,

.,

. 0......,,

,

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

...

Ill

m

m

T

I

1

--I

MIL-HD8K-217F NOTICE

TABLE

OF

2

CONTENTS 7-1

TUBEs 7: ................ .......... ............. .. .................. .... ..... All Types Except ?WT and Magnetron Traveling Wave ................................... ............... ......... .................... ........ ................ Magnetron ............ ... ............ .............. ....... ................. .. ....!..... ... ....... ....... ...............

sECTION 7.1 7.2 7.3

7-3 7-4 8-1 8-2 8-3 8-4 8-5

LASERs 8: introduction ............ ..... ....... ...... .............. ............... ..... ........ ... .... .. .... ........ ....... ...... . ......... ....... ....... ..... ....... ....... .................. .. ..............” ........” ... ....”” ... Helium and Argon .. ........ ....... .. ........ ............ ...... ... .......... .. .................. ......... .. Carbon Dioxide, Sealed ............ .... ....... ......................................... ...... ....... .......... Carbon Dioxide, Flowing ........ ..... ..................... .... ... ............ .............. ... Solid State, ND:YAG and Ruby Rod

SECTlON 8.0 8.1 8.2 8.3 8.4 sECTION 9.1

RESISToRs 9: Resistors . ... .......... ..... ........ ...... ........ ....... .................... ....... .... ...”. .. ......o=~... ...-..”..” “”

9-1

sECTION

CAPACITORS 10: Capacitors ............ .... ... ...... .. ............... ... ...... ................ ......... ....*.... ......0...”. ....... ...”. .. ...... ... ...... ........ ............... ......... ........... ........... .....” . .... ........... . Capacitors, Example

10-1 10-6

sECTIO~ 11.1 11.2 11.3

INDUCTIVE DEVICES 11: ........ ..... ..... ...... .... .... ....... ....... .............. ..................... ................. ...... . Transformers Colh,.. . . ....... ..... ... .................... ........ ............ .................. .................................. ..........”” ............. ......... ...... .......... ... ......”... ... .. . Determination of l-lot Spot Temperature

11-1 11-3 11-4

sECTlol 12.1 12.2 12.3

ROTATING DEVICES 12: Motors . .. ............. .... ............. ... .... .. ...... ..................... ............*.* ... .. ...”... ................”.

12-1



10.1 10.2

12-4 12-5

.......................................................” ......*....”.” .........””.”” .*.* Synchros and Resolvem ............................................ ...............................$................. Elapsed lime Meters ●

sECTIO 13.1 13.2

RELAys Mechanical .. ............. ........ ...... .... ... ..................... ..... ................. ...........0..... ..... ........ .......... ........ ................ ................ ... .......................... ... ... Solid State and Time Delay

13-1 13-3

sECTlc )N 14.1 14.2

SWITCHEs 14: Sw[tche . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...*.”.. ....o.”..~” . . . . . . . . . . . . . . . Circuit Breakers ................. ..... ..... ...........0..,,..,.. . ..........” ....... ....” ... ......””” .........””. ... ..

14-1 14-2

SECTI( )N 15.1

CONNECTORS 15: ...... ........ ........ .... ...... ................. ... .......... ..... ....” .. .........” .... .. .... Connectors, General . ..... ...... .... ... ...... .............. .............. .......*....” ...*...**”* .. *..*.*.*. ..... Connectors, Sockets

13:

15.2 )

15-1 15-3

16-1 16-2

INTERCONNECTION ASSEMBLIES ......... .................. ........ .. ..... sECTl~ ON 16: Interconnection Assemblies with Plated Through Holes ................... ...................... 16.’ I Interconnection Assemblies, Suflace Mount Technology 16.: ~

17-1

SECTI ON 17. 1

CONNECTIONS 17: ...... ............ ....... ....... .... ........................ ................. Connections

SECT! ION 18. 1

METERS Meters, Panel .................................!....... .................................................................

18-1

SECT ION 19 .1

QUARTZ CRYSTALS 19: ................................................. Quartz C~sta\s .....................................................

19-1

. . ..0......

. . . . . . . . . . . . . . . . . .

18:

Supersedes

page w of Revtslon

F

Iv >

--1

.

-----

--

- -

——-—

--

-n

l-l

--l

,

--,

..*

.

.T”c ,

MIL-HDBK-217F NOTICE 2

TABLE

OF

CONTENTS

SECTION 20.1

LAMPS 20: Lamps .. . ..... .. .......... .............. ........... .... .... .... ....................... .. ...... ... .... .... ... .............

20-1

SECTION 21.1

ELECTRONIC FILTERS 21: Electronic Filters, Non-Tunable ........ ... ........ ......... ................................................... .

21-1

SECTION 22.1

FUSES 22: Fuses. . .... .. .... ...... ................ ......... .. ... ........ ..... .... ......... .... .... ..... ....... .... .... .............

22-1

SECTION 23.1

MISCELLANEOUS PARTS 23: Miscellaneous Parts ............. ... .......... .. ............... .... ........ ..... ....... .... .... .... ... .. ........ ....

23-1

. .. .... .. ..... .... ...*.. ... .. ...*... ... ...

A-1

APPENDIX

A:

PARTS

COUNT

RELIABILITY

APPENDIX

B:

VHSIC/VHSICOLIKE

APPENDIX

C:

BIBLIOGRAPHY

AND

3-1: 3-2: 4-1: 6-1: 6-2:

CMOS

(DETAILED

MODEL)

.. ..... .... ...

OF

B-1 c-1

TABLES

Parts with Mu)ti-Level Quality Specifications ......................... ............................... Environmental Symbol and Description ........................................*. ....................

3-3

3-4 4-1

Reliability Analysis Checklist ...... ....................................................................... Defautt Case Temperatures for All Environments (°C) . ..... ............ ... ..... . ............ ...

6-23

Approximate Thermal Resistance for Semicond@or Devices Sk= .......*.*.......**......*...................*...*..*........................... in Various Pa*@

6-24

LIST Figure 5-1: Figure 8-1:

VLSI

. .................. ... .... ... ................. ........ ...... .... .... ...... ...............

LIST Table Table Table Table Table

PREDICTION

OF

FIGURES

Cross Sectional View of a Hybrid with a Single Multi-Layered Substrate .......... .... .. Examples of Active Optical Suffaces . ........... ... ................ ............ ..... ... ....... ..... ...

5-18 8-1

V Supersedes ,.. . -

I

r—acinclucl

page v of Revision I VLRY

I rlmllllulk

F I IWUIIIICIIIICLIL

I

~ a IVusw

M! L-HDBK-217F

NOTICE 2

FOREWORD 1.0 THIS HANDBOOK NOT BE CITED AS A HAVE TO COMPLY.

IS FOR GUIDANCE IF REQUIREMENT.

MIL-HDBK-217F, Notice 2 provides the study (see Ref. 37 listed in Appendix C): b

Revised

resistor

and capacitor

IT

changes based

following

models,

THIS HANDBOOK SHALL CONTRACTOR DOES NOT

ONLY. IS, THE

including

upon a recently completed

new models to address



Updated failure rate models for transformers, connectors, printed circuit boards (with connections.

.

A new model to address

.

A revised Traveling Wave Tube model based upon data supplied by the Electronic Industries Association Microwave Tube Division. This further lowers the calculated failure rates beyond the earlier modifications made in the base document (MIL-HDBK-217F, 2 December 1991).



Revised the Fast Recove~ reevaluation of Ref. 28.

surface

Notice 2.0 MIL-HDBK-217F, errors in the basic F Revision.

mounted

Power

1, (10 July

coils, motors, relays, and without surface

chip devices.

switches, circuit breakers, mount technology) and

technology solder connections.

Rectifier

1992)

base

was

failure

issued

rate

downward

to correct

minor

based

New failure rate prediction models are provided for the following

a

typographical

document), (2 December 1991) provided the MIL-tiDBK-217F, (base 3.0 changes based upon recently completed studies (see Ref. 30 and 32 listed in Appendix C): 1.

on

nine major

following

classes

of

microcircuits: ●

Monolithic

Bipolar

Digital and Linear Gate/Logic



Monolithic

MOS Digital and Linear



Monolithic (including

Controllers)



Monolithic

Bipolar and MOS Memory Devices



Monolithic

GaAs Digital Devices



Monolithic

GaAs



Hybrid

9

Magnetic



Surface

Bipolar

and MOS Digital

MMIC

Gate/Logic

Array Devices Array Devices

Microprocessor

Devices

Devices

Microcircuits Bubble Acoustic

Memories Wave Devices

new prediction models for bipolar and MOS The 2 December 1991 revision provided up to 60,000, linear microcircuits with up to 3000 microcircuits with gate counts and co-processors up to 32 bits, transistors, bipolar and MOS digital microprocessor memory devices with up to 1 million bits, GaAs monolithic microwave integrated circuits (MMICS) with up to 1,000 active elements, and GaAs digital ICS with up to 10,000 The C, factors have been extensively revised to reflect new technology transistors. dewces with Improved reliability, and the activation energies representing the temperature sensltwlty of the dice (nT) have been changed for MOS devices and ‘or memories The

Supersedes wlBaiaKa

Ufi

II M1iw

~av~

page VII of Revision

F, NotIce 1

Vll

MIL-HDBK-217F

NOTICE 2

FOREWORD

C2 factor remains

unchanged

from the prewous

Handbook

version,

but includes

pin grid

arrays and surface mount packages using the same model as hermetic, solder-sealed dual New values have been included for the quality factor (XQ), the learning in-hne packages. factor

(~~), and the environmental!

factor

(nE).

The model

for hybrid

microcircuits

has

been revised to be simpler to use, to delete the temperature dependence of the seal and interconnect failure rate contributions, and to provide a method of calculating chip junction temperatures. 2.

A new model for Very High Speed Integrated Circuits (VHSIC/VHSiC Large Scale Integration (VLSI) devices (gate counts above 60,000).

3.

The reformatting

4.

A reduction

5.

A revised

6.

Rewsed models for Industries Association

of the entire handbook

in the number failure

and

Very

to make it easier to use.

of environmental

rate model for Network

Like)

factors

(zE) from 27 to 14.

Resistors.

TWS and Klystrons based Microwave Tube Division.

on data

supplied

by the

Electronic

MIL-HDBK-217F NOTICE 2 1.0

SCOPE

- This handbook Is for guidance only and shall not be cited as a Purpose 1.1 requirement. ff it la, the contractor does not have to comply (see Page 1-2). T he purpose of this handbook is to establish and maintain consistent and uniform methods for estimating the inherent reliability (i.e., the reliability of a mature design) of military electronic equipment and systems. It provides a common basis for reliability predictions during acquisition programs for military It also establishes a common basis for comparing and evaluating electronic systems and equipment. The handbook is intended to be used as a tool reliability predictions of related or competitive designs. to increase the reliability of the equipment being designed. 1.2 Appllcatlon - This handbook contains two methods of reliability prediction - “Part Stress Analysis” in Sections 5 through 23 and ‘Parts Count” in Appendix A. These methods vary in degree of information needed to apply them. The Parl Stress Analysis Method requires a greater amount of detailed information and is appl”=ble during the later design phase when actual hardware and circuits are being designed. The Parts Count Method requires less information, generally part quantities, quallty level, and the application environment. This method is applicable during the early design phase In general, the Parts Count Method will usually result in a more and during proposal formulation. consewative estimate (i.e., higher failure rate) of system reliability than the Parts Stress Method.

Supersedes

page

1-1

of Revision

F

1-1

MI L-I-IDBK-217F

NOTICE 2 1.0

SCOPE

COMMANDER,

to s~ printing

Prior

Point

for be made:

the

ACrOSS

“EZIS ●

lat.

the

in

cover

HAZUX)BOOK

subject

aotico

the

ard tistrtitia,

BIG

to

BOLD BLACK LZITERS

XS FOR ~

tha

follas

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s.

mm=

Redictim

DoD

- Au

of

Six@O

Stock

additions

nwt

bert

CAM:

mm’rm~s

-Y.

mcunENT~A~”” xn the FOREWORD (Page vii of Notice 2 ) , ~agr~h ‘THIS HANDBOOK 1S POR GUIDAN= ONLY. msEANDBoox~~ ~R IFrrxs, m BE CXTZD AS A ~. HAVE



RL/ERsR,

“-li~ili~ Notice 2 to ~-xDBK-217F, Elecwodc lz@gX=t” , EOjact REU-0074

SUBJECT:



LABORA~RY (AFMC), AlTN:

R-

1.0:

M mEs NOT

COMPLY. ”

“MS

entry for the SCOPE* pua4m@ 1.1 (~e) : handbook is for guibce only and shall not be citd as a the contrmtor &e8 not have to If it ia, requir~t. coa@y . “

Add

an

If YOU have anY uuestim contact Ma. Carla J~ .

thb

r~

Waltez

B.

Be%

+ Chaiman, Defense Standada

reQueat , plea-

, 11

=mrQV’--t

Council cc :

OVSD(A&T)~~&E/SE,

Mr. M. Zsak

New Page

1-2 ■

-.

Ma

1

I

1

1

MIL-HDBK-217F NOTICE 2

2.0

REFERENCE

DOCUMENTS

This handbook cites some specifications which have been cancelled or which describe devices that are not to be used for new design. This information is necessary because some of these devices are used in so-called “off-the-shelf” equipment which the Department of Defense purchases. The documents cited in this section are for guidance and information.

TITLE

SECTION #

SPECIFICATION

10.1

MIL-C-5

Capacitors, Fixed, Mica Dielectric, General Specification for

M! L-R-l 1

9.1

Resistor, Fixed, Composition (Insulated), General Specification for

MIL-R-19

9.1

Resistor, Variable, Wirewound (Low Operating Temperature) General Specification for

MIL-C-20

10.1

MIL-R-22

9.1

Resistor, Variable, Wirewound (Power Type), General Specification for

MIL-C-25

10.1

Capacitor, Fixed, Paper-Dielectric, Direct Current (Hermetically Sealed in Metal Cases), General Specification for

MIL-R-26

9.1

MIL-T-27

11.1

Transformer and Inductors (Audio, Power, High Power Pulse), General Specifiition for

MIL-C-62

10.1

Capacitor, Fued

MIL-G81

10,1

Capacitor, Variable, Ceramic Dielectric, General Specification for

MIL-C-92

10.1

Capacitor, Variable, Air Dielectric (Trimmer), General Specification for

MIL-R-93

9.1

MIL-R-94

9.14

Resistor, Variable, Composition, General SpecMcation for

MIL-V-95

23.1

Vibrator, Interrupter and Self-Rectifying, General Specification for

W-L-1 11

20.1

Lamp, Incandescent Miniature, Tungsten Filament

W-C-375

14.5

Circuit Breaker, Molded Case, Branch Circuit and Sewice

W-F- 1726

22.1

Fuse, Cartridge, Class H (this covers renewable and nonrenewable)

W-F-1814

22.1

Fuse, Cartridge, High Interrupting Capacity

MIL-C-3098

9.1

MIL-C-3607

5!1

Capacitor, Fwed, Ceramic Dielectric (Temperature Compensating), Established Reliability and Nonestablished Reliability, General Specification for

Resistor, Ftxad, Wirewound (Power Type), General Specif~ation for

Electrolytic (DC, Aluminum, Dry Ekctrotyte, Poladzad), General Specification for

Resistor, Fixed, Wirewound (Accurate), General Specification for

Cqmtal Unit, Quartz, General Specification for Connector, Coaxial, Radio Frequency, Series Pulse, General

Specifications MIL-C-3643

Supersedes

51

Connector, Coaxial, Radio Frequency, Series HN and Associated Fittings, General Specification for

page 2-1 of Revision F

--— 3..

for

tiz~

2-1 a

u

MIL-HDBK-217F

NOTICE 2

2.0

REFERENCE

DOCUMENTS

MIL-G3650

15.1

MIL-C-3655

15.1

Connector, Coaxial, Radio Frequency, Series LC

Cormector, PIIJg and Receptacle, Electrical (Coaxial Series Twin) and Associated Fittings, General Specification for

2-2

MIL-S-3786

14.3

Swrtch, Rotary (Circuit Selector, Low-Current (Capacity)), General Specification for

MIL-S”3950

14.1

Switch, Toggle, Environmentally Sealed, General

MIL-G3965

10.1

Capacitor, Fixed, Electrolytic (Nonsolid Electrolyte), Tantalum, General Specification for

MIL-C+O15

15.1

Connector, Electrical, Ckoular Threaded, AN Type, General Specification for

MIL-F-5372

22.1

Fuse, Current Limiter Type, Akcraft

MIL-S-5594

14.1

Switches, Toggle, Electrically Held Sealed, General Specification for

MIL-R-5757

13.1

Relays, Electromagnetic,

MIL-R-6106

13.1

Relay, Electromagnetic (Including Established Reliability (ER) Types), General Specification for

ML-L-6363

20.1

Lamp, Incandescent,

Specification for

General Specification for

Aircraft Service, General Specification for

Switches and Swttch Assemblies, Sensitive and Push (Snap Action), General Spedkatiin for

MIL-S-8805

14.1, 14.2

MIL-S-8834

14.1

Switches, Toggle, Positive Break General Specification for

MIL-S-8932

14,1

Switches,

MIL-S-9395

14,1

Switches, Pressure, (Absolute, Gage, and Differential), General Specification for

MIL-S-9419

14.1

Switch, Toggle, Momentary Four Position On, Center Off, General Specification for

MIL-M-10304

18.1

Meter, Electrical Indicating, Panel Type, Ruggedized, General Specificat”mn for

MIL-R-10509

9.1

MIL-GI0950

10,1

Capacitor, Fixed, M’ka Dielectric, Button Style, General Specification for

MIL-C-11OI5

10.1

Capacitor, Fixed, Ceramic Dielectric (General Purpose), General Specification for

MlL-C-l 1272

10.1

Capacitor, Fixed, Glass Dielectric, General Specification for

Pressurer Aircraft, General Specification for

Resistor, Fixed Film (High Reliability), General Specification for

Supersedes

page 2-2 of Revision F

MIL-HDBK-217F NOTICE 2

2.0

10.1

MlL-C-l 1693

REFERENCE

DOCUMENTS

Capacitor, Feed Through, Radio Interference Reduction AC and DC, (Hermetkally Sealed in Metal Cases) Estabiishd Reliability, General Specificatbn for

and Nonestablished

MlL-R-l 1804

9.1

MIL-S-12211

14,1

Switch, Pressure

MlL-S-l 2285

?4.1

Switches, Thermostatic

MIL-S-12883

15.3

Sockets and Accessories for Plug-h Electronic Components, General Specification for

MIL-G12889

10.1

Capacitor, By-f%ss, Radio - Interference Reduction, Paper Dielectric, AC and DC, (Hermetically Sealed in Metaiiic Cases), General Specificatbn for

Resistor, Fixed, Film (Power Type), General Specificat”mn for

M!L-R-12934

9.1

MIL-S-13484

14.1

Switch, Sensitive:

MIL-C-13516

14.2

Circuit Breakers, Manual and Automatic (28 Voits DC)

MIL-S-13623

14.1

Switches, Rotary: 28 Voit DC

MIL-R-13718

13.1

Reiays, Electromagnetic

MIL-S-13735

14.1

Switches, Toggle: 28

MIL-G14409

10.1

Capacitor, Vadable (Piston Type, Tubuiar Trimmer), General Spectfioatbn for

MIL-F-15160

22.1

Fuse, instrument, Power and Teiephone

MIL-S-1S291

14.1

Switches, Rotary, Snap Action and DetenVSpring Return Action, General Specification for

MIL-C-15305

11.2

Coils, Electrical, Fixed and Variable, Radio Frequency, Generai Specification for

MIL-G15370

15.1

Couplers, Directional, Generai Specification for

MIL-F-15733

21.1

Fiiters and Capacitors, Radio Frequency Interference, Generai Specification for

MIL-S-15743

14.1

Switches,

MIL-G18312

10.1

Capacitor, Fixed, Metallized (Paper, Paper Piastic or Piastic Film) Dielectric, Direct Current (Hermetically Sealed in Metal Cases), General

Resistor, Variabie, Wirewound, Precision, General Specification for

Supersedes

21.1

page 2-3 of Revision

24 Volt DC

volt DC

Rotary, Enclosed

Specification for MIL-F-18327

30 Votts Direct Current Maximum, Waterproof



Filter, High Pass, Low Pass, Band Pass, Band Suppression and Dual Functioning, General Specification for

F

2-3

tvllL-HDBK-217F NOTICE 2

2.0

REFERENCE

DOCUMENTS —

ML-R-18546

9.1

Resistor, Fixed, Wkewound (Power Type. Chassis Mounted), General Specification for

MlL-S-l 9500

6.0

Semiconductor Device, General Specification for

MIL-R-19523

13.1

Relays, Control

MIL-R-19648

13.1

Relay, Time, Delay, Thermal, General Specif”~at”kmfor

MIL-G19978

10.1

Capacitor, Fixed Plastic (or Paper-Plastic) Dielectric (Hermetically SeaJed in Metal, Ceramic or Glass Cases), Established and Nonestablished ReliaMlity, General Specificat”bn for

MIL-T-21038

11.1

Transformer, Puke, Low Power, General Specification for

MIL-G21097

15.1

Connedor, Electrical, Printed Wking Board, General Purpose, General Specification for

MIL-s-212n

14.1

Switches, L“quid Level, General Specification for

MIL-G21617

15.1

Ccmnectors, Plug and Receptacle - Electrical Rectangular, Polarized Shell, Miniature Type

MIL-R-22097

9.1

MIL-S-22614

14.1

MIL-R-22664

9.2

MIL-S-2271O

14.4

Resistor, Variable, Nonwirewmnd Specification for

(Adjustment Types), General

Switches, Sensitive Resistor, FMed, Film, Insulated, General Specifioatiin Switches, Code Mcating

for

Wheel (Printed Circuit), (Ttwmbwheel,

In-1ine

and Pushbutton), General Specification for

2-4

MIL-S-22865

14,1

Switches, Pushbutton, Illuminated, General Specif”ution for

MIL-G22992

15.1

Connectors, Plugs and Receptacles, Electrical, Water-ProOf, Quick HeavyDutyType, General Specification for Di-nnect,

MIL-C23163

10.1

Capacitors, Fixed or Specification for

MIL-CX23269

10.1

Capacitor, Fixed, Glass Dielectric, Established Reliability, General Specification for

MIL-R-23285

9.1

Resistor, Variable, Nonwirewound, General Specificat”mn for

MIL-F-23419

22.1

Fuse, Caflridg8, Instrument Type, General Specification for

MIL-T-23648

9.1

Variable, Vacuum or Gas Dielectric, General

Resistor, Thermal, (Thermally Sensitive Resistor), Insulated, General Specification for

MS-24055

15.1

Connector, Plug-Receptacle, Female, 7.5 Amps

Electrical, Hexagonal, 9 Contacts,

MS-24056

15.1

Connector, Plug-Receptacle, 7.5 Amps

Electrical, Hexagonal, 9 Contacts, Male,

Supersedes

page 2-4 of Revision F

MIL-HDBK-217F NOTICE 2

2.0

REFERENCE

DOCUMENTS

MIL-C-24308

15.1

Connectors, Eiectric, Rectangular, Nonerwironmental, Miniature, Polarized Shell, Rack and Panel, General Specdicatbn for

MIL-S-24317

14,1

Switches, Mu!tistation, Pushbutton (Illuminate General Specification for

MIL-C-25516

15.1

Connector, Electrical, Miniature, Coaxial, Environment Resistant Type, General Specification for

MIL-C-26482

15.1

Connector, Electrical (Wcular, Miniature, Quick Disconnect, Environment Resisting), Receptacles and Plugs, General Specificat”bn for

ML- C-26500

15.1

Connectors, General Purpose, Electrical, Miniature, Ckcular, Environment Resisting, General Spedficat’bn for

9.1

MIL-R-27208

and hlon-l!luminated),

Resistor, Variable, Wlrewound, Nonprecis”on, General

Specificat’mn for MIL-C-28731

15.1

Connectors, Electrical, Rectangular, Removable Contact, Formed Blade, Fork Type (For Rack and Panel and Other Applicat”bns), General Specification for

MIL-C28748

15.1

Connector, Plug and Receptacle, Rectangular, Rack and Panel, Solder Type and Crimp Type Contacts, General Specifiiion for

MIL-R-28750

13.2

Relay, Sol”d State, General Specification for

MIL-C-28804

15.1

Connectors, Plug and Receptacle, Electrio Rectangular, High Density, Polarized Center JackScrew, General Specification for, Inactive for New Designs

MIL-G28840

15.1

Connector, Electrical, Circular Threaded, High Density, High Shock Shipboard, Class D, General Specification for

MIL-M-3851O

5.0 15.3

MIL-S-385=

Microcircuits, General Specification for Sockets, Chip Carrier, Ceramic, General Specification for

MIL-H-38534

5.0

Hybrid Micmcirdts,

MIL-I-38535

5.0

Integrated Wcuits SpedficatiOn for

General Specification for (Microcircufis) Manufacturing, General

MIL-G38999

15.1

Connector, Ekctrical, Circular, Miniature, High Density, Quick Disconnect, (Bayonet, Threaded, and Breech Coupling) Environment Resistant, Removable Crimp and Hermetic Solder Contacts, General Specification for

MIL-G39001

10.1

Capacitor, Fixed, Mica-Dielectric, Established Reliability, General Specification for

MIL-R-39002

9.1

MIL-C-39003

10.1

Supersedes

page 2-5 of Revision

Resistor, Variable, Wkewound, Semi-Precision, for

General Specification

Capacitor, Fixed, Electrolytic, (Solid Electrolyte), Tantalum, Established Reliability, General Specification for

F

2-5

MIL-HDBK-217F NOTICE 2

2.0

REFERENCE

DOCUMENTS



2-6

Resistor, Fixad, Wirewound (Accurate), Established Reliability, General Specification for

MIL-R-39005

9.1

MIL-G39006

10.1

MIL-R”39007

9.1

Resistor, Fixed, Wkewound (Power Type), Established Reliability, General Specification for

MIL-R-39008

9.1

Resistor, Fixed, Composition (Insulated), Established Reliability, General Specification for

MIL-R-39009

9.1

Resistor, Fixed, WmMVOund (Power Type, Chassis Mounted) Established Reliabiiii, General Specification for

MIL-G3901O

11.2

Coils, Electrical, FMed, Radio Frequency, Molded, Established Reliability, General Specification for

MIL-C-39012

15.1

Connector, Coaxial, Radio Frequency, General Specification for

MIL”C-39014

10.1

Capacitor, Fixed, Ceramic Dielectric (General Purpose), Established Reliability, General Specification for

MIL-R-39015

9.1

MIL-R-39016

13.1

MIL-R-39017

9.1

MIL-C-39018

10.1

Capacitor, Fwed, Ekctrofytic (Aluminum Oxide), Established Reliability and Nonestablished Reliability, General Specification for

MIL-G39019

14.5

Circuit Breakers, Magnetic, Low Power, Seaied, Trip-Free, General Specification for

MIL-C-39022

10.1

Capacitors, Fixed, Metaiiued, Paper-Plastic Film or Piastic Film Dielectric, Direct and Alternating Current (Hermetically Sealed in Metal or Ceramic Cases), Established Reliability, General Specification for

MIL-R-39023

9.1

Resistor, Variabie, Nonwirewound, Precision, Generai Specification for

MIL-R-39035

9.1

Resistor, Variable, Nonwirewound (Adjustment Type), Established Rel.&ility, General Specification for

MIL-S-45885

14.1

Switch, Rotary

MIL-C-49142

15.1

Connectors, Piugs and Receptacle, Eiectricai Triaxiai, Radio Frequency, Generai Specification for

MIL-G55074

15.1

Connectors, Plug and Receptacle, Teiephone, Eiectrcal, Subassembly and Accessories and Contact Assembiy, Electrical, General Specification for

MIL-P’55110

15.2

Printed Wiring Board, General Specifi~tion

MIL-R 55182

91

Capacitor, Fixed, Electrolytic (Nonsolid Electrolyte) Tantalum Established Reliability, General Specification for

Resistor, Variable, Wlrewound (Lead Screw Actuated), Established ReliatWty, Genera! Specification for Relay, Electromagnetic, for

Established Reiiabiiity, General Specification

Resistor, Fued, Fiim (Insulated), Established ReiiabNty, General Specif.kdon for

Resistor,

FIxd,

for

Film, Es!abl(shed Reliability, General Specification for

Supersedes

page 2-6 of Revision

F

MII--HDBK-217F

NOTICE 2

2.0

REFERENCE

DOCUMENTS

MIL-C-55235

15.1

Connectors, Coaxial, Radio Frequency, Series TPS

MIL-C-55302

15.1

Connector, Printed Circuit, Subassembly

MIL-A-55339

15.1

Adaptors, Connector, Coaxial, Radio Frequency, (Between Series and Within Series), General Specification for

MIL-R-55342

9.1

MIL-C-55365

10.1

Capacitor, Fixed, Electrolytic (Tantalum), Chip, Established Reliability, General Specification for

MIL-S-55433

14.1

Swhches, Reed, General Specification for

MIL-C-55514

10.1

Capacitors, Freed, Plastic (or Metallized Plastic) Dielectric, DC or DCAC, In Non-Metal Cases, Established Reliability, General Specification for )

MIL-G55629

14.5

Circuit Breaker, Magnetic, Unsealed, or Panel Seal, Trip-Free, General Specification for

MIL”T-55631

11.1

Transformer, Intermediate Frequency, Radio Frequency and Discriminator, General Specification for

MIL-G55681

10,1

Capacitor, Chip, Multiple Layer, Fixed, Unencapsulated Ceramic Dielectric, Established Reliability, General Specification for

15.1

Connedor, Electriil,

MIL-S-81551

14.1

Switches; Toggle, Hermetically Sealed, General Specification for

MIL-C-81659

15.1

Connectors, Electrical Rectangular, Crimp Contact

MIL-S-82359

14.1

Switch, Rotary, Variable Resistor Assembly Type

MIL-(X3383

14.5

Circuit Breaker, Remote Control, Thermal, Trip-Free, General Specification for

MIL-G8151

1

and Aaessories

Resistors, Fixed, Film, Chip, Established Reliability, General Specification for

Circular, Hgh Densky, Ouick Disconnect, Environment Resisting and Accessories, General Specification for

MIL-R-83401

9.1

MIL-C-83421

10,1

Capacitors, Freed Metallued Plastii Film Dielectric (DC, AC or DC and AC) Hermetically sealed in Metal or Ceramic Cases, Established Reliabil”~, General Specification for

11.2

Coils, Radio Frequency, Chip, Fixed or Variable, General Specification for

MIL-C-83500

10,1

Capacitor, Fixed, Electrolytic (Nonsolid Electrolyte), Tantalum Cathode, General Specification for

MIL-S-83504

14,1

Switches, Dual In-Line Package (DIP), General Specification for

MIL-C-83513

15.1

Connector, Electrical, Rectangular, Microminiature, Polarized Shell, General Specification for

MIL-C+3446

New Page



Resistor Networks, Fixed, Film and Capacitor-Resistor Networks, Ceramic Capacitors and Fixed Film Resistors, General Specification for

2-7 _-e_-.— ----— —..— --— --=—=—a=—==.—a .-A._...._. - .. ___ . ____ ____ —————

MIL-HDBK-217F

NOTICE 2

2.0

REFERENCE

DOCUMENTS

MIL-C-83515

15.1

Connectors, Telecommunication, for

MIL-R-83516

13.1

Relays, Reed, Dry, General Specification for

MIL-C-83517

15.1

Connectors, Coaxial, Radio Frequency for Coaxial, Strip or Microstrp Transmission Line, General Specification for

MIL-R-83520

13.1

Relays, Electromechanical, General Purpose, Non-Hermetically Sealed, Plastic Enclosure (Dust Cover), General Specification for

MIL-G83527

15.1

Connectors, Plug and Receptacle, Electrical, Rectangular Muttiple

Polarized Shell, General Specification

Insert Type, Rack to Panel, Environment Resisting, 15~C Total Continuous Opemting Temperature, General Specification for MIL-R-83536

13,1

Relays, Electromagnetic, for

Established Reliability, General Specification

MIL-C-83723

15.1

Connector, Electrical (Circular Environment Resisting), Receptacles and Plugs, General Specification for

M!L-R-83725

13.1

Relay, Vacuum, General Specification for

MIL-R-83726

13.1, 13.2, 13.3

MIL-S-83731

14.1

Switch, Toggle, Unsealed and Sealed Toggle, General Specification

MIL-G83733

15.1

Connector, Electrical, Miniature, Rectangular Type, Rack to Panel,

Relays, Hybrid and Solid State, Time Delay, General Specification for

for

Envhnment Resistkg, XKY’C Total Continuous Operating Temperature, General Specifiiion for MIL-S-83734

15.3

Sockets, Plug-In Electronic Components, Dual-In-Line (DIPS) and Single-In-Line Packages (SIPS), General Specification for

MIL-M5028

15.1

Connector, Electrical, Rectangular, Individual Contact Sealing, Polarized Center JackScrew, General Specification for

STANDARD MIL-STD-756

Reliability Modeling and Prediction

MIL-STD-683

Test Methods and Procedures for Microelectronics

MIL-STD-975

NASA Standard Electrical, Electronic and Electromechanical (EEE) Parts List

MIL-STD-1547

Electronic Parts, Materials Technical Requirements for

MIL-STD-1772

Certification Requirements for Hybrid Microcircuit Facilities and Lines

Copies

of specifications

and standards required should be obtained from the contracting

and Processes

by Contracbrs activity or as

for Space and Launch Vehicles,

in connection

with specific

acquisition

directed by the contracting officer. Single copies are also available (without charge) upon written request to:

functions

Standardization Oocument Order Desk, 700 Robim AVe , Wilding ~, section D, Ph(ladelphla, PA 19111-5094, (215) 697-2667

2-8

New Page

,-- -----

MIL-HDBK-217F

NOTICE

MICROCIRCUITS,

5.1

2

GATE/LOGIC

ARRAYS

AND

MICROPROCESSORS

DESCRIPTION 1. Bipolar Devices, Digital and Linear Gate/Logic Arrays 2. MOS Devices, Digital and Linear Gate/Logic Arrays 3. Field Programmable Logic Array (PLA) and Programmable Array Logic (PAL) 4, Microprocessors kp = (cl fi~ + C2fiE)

~QfiL

‘ailures~l

06

Hours

-

Digital and Linear Gate/Logic Array Die Complexity Failure Rate - Cl PLA/PAL Linear Digital No. Gates c, No. Transistof$ No. Gates I c,

T I t

~

101

to

v

c,

1

.010

100

to to to to

101 301 1,001

.020 .040 .080 .16 .29

1,000

1,001 to 3,000 3,001 to 10,000 10,001 to 30,000 30,001 to 60,000

‘NOTE:

Linear No, Transistor

I

.010 .020 .040 .060

100 300 1,000 10,000

\

E=F==7 Up to 8

.060

,14

Up to 16

.12

.28

Up to 32

.24

,56



c,

up to 500

.00085

501 to 1,000 2,001 to 5,000 5,001 to 20,000

.0017 .0034 .0068

For CMOS gate counts above 60,000 use the Vi+ SIC/VHSIC-Like

rocm Die Complexi~ Failure Rate - Cl MO.S c,

.021 .042

PLA/PAL No. Gates

c,

I

.010

up to 200 201 to 1,000 1,001 to 5,000

.010 .020 .040 .060

100 300 1,000 10,000

Linear and Digital Gate/Logic Array Die Gomplex~ Failure Rate -Cl

Digital No. Gates 1 to

1 to 101 to 301 to 1,001 to

.0025 .0050 .010 .020 .040 .080

100 to 101 to 1,000 1,001 to 3,000 3,001 to 10,000 10,001 to 30,000 30,001 to 60,000 1

c,

modei In Section

5.3

All Other Model Parametef’s Refer to Parameter 1 XT

Section 5.8

C2

section 5,9

7tE, flQ, XL

Section 5.10

,

A

L

Supersedes - —_=...= ------

page

_____ -_ ——_ _

5-3

of Revision .

5-3 F All GAQ =*Q AW -w......-.

baw. -“ -....-=

--

----

MIL-HDBK-217F

5.2

MEMORIES

MICROCIRCUITS,

— DESCRIPTION 1. Read Only Memories (ROM) 2. Programmable Read Only Memories (PROM) 3. Ultraviolet Eraseable PROMS (UVEf’ROM) 4. “Flash,” MNOS and Floating Gate Electrically Eraseable PROMS (EEPROM). Includes both d floating gate tunnel oxide (FLOTOX) and texture polysilicon type EEPROMS 5. Static Random Access Memories (SRAM) R ~vnamic Random Access Memories (DRAM) _=.

w.

.—

Acyc) XQ XL

kp=(C1XT+C2YCE+

Die Complex~

Failure Rate - Cl MOs

Memory

Size, B (Bits)

UVEPROM* EEPROM, mPROM

DRAM

(MOS & BiMOS)

.00085 .0017 .0034 .0068

.0013 .0025 .0050 .010

.0078 .016 .031 .062

.00065

up to 16K 16 K< BSWK 64K_

page

11-2 of Revision F

._ .

e-—

~.

_—_. __

.

—————————..— _

MIL-HDBK-217F

NOTICE 2

11.2

COILS

Quality Factor - ~ —

Base Failure Rate - ~ + ~

Inductor Type

DEVICES,

DESCRIPTION Fixed and Variable, RF Fixed and Variable, RF, Chip Molded, RF, Est. Rel.

STYLE

SPECIFICATION MIL-C-15305 MIL-C-83446 MIL-C-3901O

INDUCTIVE

Quality

F/lo6 Ms.

IIQ

,

Fixed Inductor or Choke

.000030

Variable Inductor

.000050

Temperature

Factor - XT

TH@)

s

.03

R

.10

P

.30

M

1.0

MIL-SPEC

1.0

Lower

3.0

XT

20

.93

30

1.1

40

1.2

50

1.4

60

1,6

70

1.8

GB

1.0

80

1.9

GF

6.0

90

2.2

GM

100

2.4

110

2.6

120

2.8

130

3.1

140

3.3

150

3.5

160

3.8

170

4.1

*UF

180

4.3

*RW

190

4.6

sF

XT = e)(p

(

-.11

8.617x

10

-5

Environment Factor - XE Environment

Ns Nu *IC

‘IF *UC

1 1 TH~ + 273 -=

(

~E

12 5.0 16 6.0

8.0 7.0 9.0 24 .50

MF

13

ML

34

CL

610

))

‘HS = Hot Spot Temperature (“C), See Section 11.3

Supersedes

page 11-3 of Revision

11-3

F L1

MIL-HDBK-217F

NOTICE 2

INDUCTIVE

11.3

DEVICES,

DETERMINATION

OF

HOT

SPOT

TEMPERATURE

l-lot Spot temperature can be estimated as follows:

THS=TA+

1.1 (Am

where: -$+s

=

Hot Spot Temperature

TA

=

Inductive

AT

=

Average Temperature

(“C)

Device Ambient Operating

Temperature

(“C)

Rise Above Ambient (“C)

Rise” Test Method paragraph in the device base AT can either be determined by the appropriate “Te~erature specification (e.g., paragraph 4.8.12 for MI L-T-27E), or by approximation using one of the procedures described below. For space environments a dedicated thermal anatysis should be performed. AT&p mximation (Non-spaoe Environments) Information .— - Known 1.

MIL-C-3901 O Slash Sheet Number MIL-C-39010/l C-3C, 5C, 7C, 9A, lOA, 13, 14

AT Armoximation

I

AT= 15°C AT= 35°C

MIL-C-39010/4C, 6C, 8A, 11, 12

AT= 125 WL/A

2.

Power Loss Case Radiating Surface Area

3.

Power Loss Transformer Weight

AT= 11.5 wL/(wt.)”6766

4.

Input Power Transformer Weight

AT= 2.1 W~(Wta)06766

(Assumes

W’

=

A=

I

800/0 Efficiency)

Power Loss (W) Radiating Surface Area of Case (in2). See below for MIL-T-27 Case Areas

Wt.

=

Transformer

w,

= Input Power

Weight

(lbS.)

(W)

NOTE: Methods are listed in prefemd order (i.e., most to least accurate). MIL~-3901 O are microminiature devices with surface areas less than 1 in2. Equations 2-4 are applicable to devices with surface areas from 3 in2 to 150 in2. Do not include the mounting surface when determining radiating swface area.

MIL-T-27 Case Radiati nq Areas (Excludes Mounting Surface) Case AF AG Al-1 AJ EB EA

I

Case

Area (in2)

Case

4 7 11

GB GA H5

33 43 42

LB LA MB

Area (in2)

18

HA

53

MA

21 23

JB JA

58 71

NB NA

FB

25

KB

72

OA

FA

31

KA

84

17-4

Supersedes #,. –

Area @2) 82 98 98 115 117

139 146

pages 11-4 and 11-5 of Rev[sion F

MIL-HDBK-217F NOTICE 2

12.1

ROTATING

DEVICES,

MOTORS

The following failure-rate model applies to motors with power ratings below one horsepower. This model is applicable to pcdyphase, capacitor start and run and shaded pole motors. h’s application may be extended to other types of fractional horsepower motors utilizing rolling element grease packed bearings. The model is dictated by two failure modes, bearing failures and winding failures. Application of the model to D.C. brush motors assumes that brushes are inspected and replaced and are not a failure mode. Typical applications include fans and blowers as well as various other motor applications. The mode! is based on References 4 and 37, which contain a more comprehensive treatment of motor life The references should be reviewed when bearing loads exceed 10 percent of rated load, speeds prediction methods. ‘ exceed 24,000rpm or motor loads include motor speed slip of greater than 25 percent. The instantaneous failure rates, or hazard rates, experienced by motors are not constant but increase with time. The over time wrid T. This time period is failure rate model in this section is an average failure rate for the motor op-ting either the system design life cycle (LC) or’ the time period the motor must last between complete refurbishment (or replacement). The model assumes that motors are replaced upon faifure and that an effective constan! failure rate is achieved after a given time due to the fact that the effective ~ime zero- of replaced motors becomes random after a , can be treated as a constant failure rate and significant portion of the population is replaced. The average faikuO rate,

$

added to other part failure rates from this Handbook.

x,

Lz

l.p= — [

A(xB

— BaW

+

x 106 Failures/l 08 I-iours 1

Bearing & Winding Characteristic Life - c%Rand aw.~

‘A (“c)

E 30 40 50 60

55000 35000

2.534-

TA2~:73

10 (

-

(Hr.)

6.49+06 3.2e+06 1.W+06 8.9e+05 5.oe+05 2.9e+05 1.8e+05

3600 13000 39000 78000

o

aB

~

(Hr.)

aB (Hr.)

70 80 90 100 110 120 130 140

22000 14000 9100 6100 4200 2900 2100 1500

1 4500 10 (

-

~

(Hr.)

1.1Q+05 7.09+04 4*6e+04 3.le+04 2.19+04 1.5e+04 1.09+04 7.5e+03

1 -1

+ )

[ 2357 ,0 [ TA + 273

TA (=)

20-~

)

+300

1.83]

%/” aB

=

Weibull Characteristic Life for the Motor Bearing Weibull Characteristic Life for the Motor Windings

w“ TA

Ambient Temperature

=

NOTE:

See page 12-3 for method to cakulate aB and ~

Supersedes .—__

__

——— —______ __

(“C)

when temperature is not @nstant.

12-1

page 12-1 of Revision F —-.____ —



—..-_

_

MIL-HDBK-217F NOTICE 2

ROTATING

12.1

DEVICES,

MOTORS

L —--— and L c Determination .. 1

A and B Determinatbn

A

Motor Type

B

1

k,

aw

aB

1.1

1.9

Electrical (General)

Lcw&

or Q

0-.10

.13

.11 -.20

.15

.21 -.30

.23

.31 -.40

.31

.41 -.50

.41

.51 -.60

.51

55000 Hrs.

.61 -.70

.61

2,9e + 5 Hrs.

,71-.80

.68

.81 -.90

.76

.29

.48

Sensor Servo

2.4

1.7

Stepper

11

5.4

Example Calculathn A general purpose elecltial motor is operati~ at 50”C in a system with a 10 year desgn life (876W hours) expedancy,

87600

~fS.

55000

I+rs.

87600

=

I-trs.

for

(

.23 (

1.0

>1.0

2.9e + 5 Hrs. =

1.0

1 .e

L& . aB

f.rg= aw

.3

LC is the system design Me cycle (in hours), or the motor preventive rnaintename intewal, if motom will be periodidly

1.6

replaced or

refutished.

Determine kl and ~ separately LC am — LC ratios. based on the respedive — UB aw

) .3 )

1.9 1.1

%=

[*+

‘P

=

~9.9 ILL

.23 (1. V(2.9e

+ 5)

1

6

x‘0

10.3 Failures/l 06 Hours

Supersedes

I

I

page 12-2 of Revision

F

MIL-1-iDBK-217F NOTICE 2

12.1 ‘Calculation

ROTATING

DEVICES,

MOTORS

for Cycled Temperature

The following equation can be used to calculate a weighted characteristic life for both bearings and windings

(e.g., for bearings substitute aB for all a’s in equation). h1+h2+h3+------hm a=

hl

hz

—+ al

—+ a2

h3 — +-------— a3

h~ a

m

where: a

either ~

h,

Time at le~erature

h*

Time to Cycle From Temperature

h3

Time at Temperature

T3

hm

mme at Temperature

Tm

al

Bearing (or Winding)

Liie at T1

Bearing (or Whaling)

Life at T2

‘2

or aw T1 T, to T3

T3 + T,

T, + T3 T~=2$T4=2

4

T3

T2

TI .

/

h4

-f

hl

II 1

h3

hz I

Hours Thermal

Supersedes

page 12-3 of Notice

1

(h) Cycle

12-3

MIL-HDBK-217F NOTICE 2

12.2

ROTATING

DEVICES,

SYNCHROS

AND

RESOLVERS



DESCRIPTION Rotating Synchros and Resolvers Failures/l

kp = &S~NXE

NOT E:

06 Hours

Synchros and resolvers are predomiwtely used in service requiting only slow and infrequent motion. Mechan~al wearoti problems are infrequeti so that the electrical failure mode dominates, and no mechankal mode failure rate is required in the model above. Number of Brushes Factor - ~

Base Failure Rate - ~

%N

Number of Brushes ~

=

40

.0083 .0088 .0095

45 50 55 60 65

.010 .011 .013 .014 .016

70 75 80

.019 .022 .027

30 35

% TF

I

.

.

85 90 95 100 105 110 115 120 125 130 ~

+ Atiieti

2.5

4

3.2

Environment

I

(z)

2.0

%

‘IF

*UC ‘UF

w

Size 8 or smaller

Size 10-16

Size 18 or Larger

Synchro

2

1.5

1

Resolver

3

2.25

1.5

DEVICE TYPE

‘RW

1

A

GF

AC

Size Factor - x~

r fiE

1.0

N“

Tempenture

Factor - ZE

GB

N~

If Frame Temperature is Unknown Assume TF=40“C

3

Environment

.oo535expf-)8”’ Frame Ternpwatum

1.4

52

.032 .041 .052 .069 .094 .13 .19 .29 .45 .74 ,1.3

12 7.0 18 4.0 6.0 16 25 26

.50

SF

MF

14

ML

36

CL

680

I

\

Supersedes

12-4

//”-

.>.

\NaaA\

page 12-4 of Notice 1

MIL-HDBK-217F NOTICE 2

12.3

ROTATING

DEVICES,

ELAPSED

TIME

METERS

DESCRIPTION Elapsed Time Meters

kp =&p~Fai

Hours

Environment Factor - xc

Base Failure Rate - ~ Type

lures/106

L

Lb

I

A.C.

20

Invefier Driven

30

Commutator D.C.

80

Environment GB

1.0

GF

2.0

% Ns Nu

Temperature Stress Factor - XT Operating T (°C)/Rated T (~)

[ ‘

XT

Supersedes

18

‘IF

8.0

.5

‘UF

.6

.6

‘RW

.8

.8

1.0

1.0

F

7.0

5.0

.5

page 12-5 of Revision

12

*IC

‘Uc o to

~E

16 25 26 .50

SF MF

14

ML

38

CL

N/A

12-5

MIL-HDBK-217F NOTICE 2 RELAYS,

13.1

DESCRIPTION Mechanical Relay

SPECIFICATION M\L-R-5757 MIL-R-6106 MIL-R-13718 MIL-R-19646 MIL-R-19523 MIL-R-390~6

MIL-R-83516 MIL-R-83520 ML-R-83536 MIL-R-83725 MIL-R-83726 (Except Class C, Solti State Type)

)bP=

T. (%) n’



&Lncxc&xQn

.0067 .0075 .0064 .0094 .010 .012 .013 .014 .016

.017

75

.019 .021

80 65 90 95 100 105

110 115 120 125 -.0059 exp (

2“ %

-.0059 exp

~A



8.617

(

X 10-5

~bant

X

.U3

1

.10

.20 .30 .40 .50 .60 .70 .80 .90

1.02 1.06 1.15 1.28 1.48 1.76 2.15 2.72 3.55 4.77

~ 1.

y--

~-zm1) 1

)

298

q

,I

Contad Fom Factor - nc

1

/ r

b

%Yc

10 0.1 ‘CYC

Rate

100

>1OOO

.

10-1000 .5t05

2.0

>5t050

3.0

> 50 ●One cycle includes both connect and disconnect.

Quality Factor - XQ

I

Quality

I

I

Contacts

MIL-SPEC

1

Contacts

Lower

2

Contacts Contacts

Environment Factor - XE

Contacts

Environment

Contacts

~E

Contacts

GF

1.0

12 Gauge Contacts

GM

8.0

Ns

5.0

i

Amperes per Contact

Contacts

Rise

Nu 4

RF Coaxial Connectors (High Power Applications)

o to .05

1.0

Insert Temperature

RF Coaxial Connectors

~K

GB

AT = =

Mating/Unmating Cycles* (per 1000 hours)

16 1 2 4 5 8 10 13 16 19 41 70 106

3.256(i)’ “85 2.856(i)’ “85 2.286(i)’ ●85 1.345(i)l “85 0.989(i)’ ●85 0.640(i)’ “85 0.429(i)’ ’85 0.274(i)’ ’85

Factor - nK

AT = 5°C

Alc ‘IF

‘Uc

AT= 50°C

13 3.0 5.0 8.0

‘UF

12

‘RW

19 .50

SF

15-2

Supersedes

MF

10

ML

27

c,

490

page 15-2 through

15-5 of Revision

F

MIL-HDBK-217F NOTICE 2

15.2

Lp = ++CP7CQ7CEFailures/l

Dual-In-Line Package

Active Pins Factor - np

Spec. httlL-S

Lb

83734

.00064

83734

.00064

Chip Camier

38533

.00064

NIA

.00064

Relay

12883

.037

Transistor

12883

.0051

Electron Tube, CRT

12883

.011

.3

MIL-SPEC.

1.0 Environment Factor - ~E fiE

Environment GB

1.0

GF

3.0

55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 130 13.5 140

1.5 1.7

H 2.1 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 4.1 4.5 5.0 5.5 5.9 6.4

;$ 155 160 165 170 175 180

Ns

6.9 7.4 7.9

8.4 8.9 9.4 9.9

10 11 12 12 13 13 14 14 15 16 16

17 18 18 19 20 20 21 22

6.0 18

Nu AC

N

8.0

11

*UC

=

Number of Active Pins

An active contact is the conductive element which mates with another element for the purpose of transferring electrical energy.

12

‘IF

13

*UF

25

*RW

.50

SF MF

14

ML

36

c,

650 15-3

page 15-6 of Revision F I

7tp

14

%

Supersedes

1.0

1 2 3 4 5 6 7 8 9 10 11 12 13

16 17 18 19 20 25 30 35 40 45 50

~Q

Lower

Act ive

Contacts

14 15

Quality Factor - ~ Quality

Number of “

Number of Active Contacts

Single-In-Line Package

Pin Grid Array

SOCKETS

06 Hours

Base Failure Rate - ~ Description

CONNECTORS,

I

I

l.-

I

----

1

I

-.

MIL-HDBK-217F NOTICE 2

INTERCONNECTION

16.1 Ap =kb

[

ASSEMBLIES

WITH

PLATED

1

13)

Nptc+N2(~c+

7tQnEFaillJre@

THROUGH

HOLES

Hours

APPLICATION NOTE: This model applies to board configurations with leaded devices mounted into the plated through holes and assumes failures are predominately defect related. For beads using surface mount technology, use Section ~6.2” For a mix of leaded devices mounted into plated through holes and surface mount devices, use this model for the leaded devices and use Section 16.2 for the surface mount contribution.

A discrete wiring assembly with electroless deposit plated through holes is basidly a pattern of insulated wires The primary cause of failure for both printed wiring and discrete laid down on an adhesive coated substrate. wiring assemblies is associated with plated through-hole (PTH) problems (e.g., barrel crackng). Quality Factor - ~ Base Failure Rate - ~

Printed Wiring Assemb!yFtinted Circuit Boards with PTHs

Quality

.000017

MIL-SPEC or Comparable Institutefor Interconnecting, and Packaging Electronic Circuits (lPC) Standads (IPC Level 3)

1

Lower

2

Discrete Wiring with Electroless A Deposited PTH (< 2 Levels of Circuit@

.00011

of PIWs Factor - N1 and N2

Nu~r

Quantity

Factor I

Envimnmti

Automated Techniques: Quantity of Wave Infrared (IR) or Vapor Phase Soldered Functional PTlis

N,

Quantity of Hand Soldered PTHs Complex”~ Factor - ~

Number of Circuit Planes, P S2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

=

b

Environment

~E

GB

1.0

GF

I

2.0

GM

7.0

&s

5.0 13

Nu

I

5.0

%c

I

I

‘IF

8.0 16

%c

28

‘UF

19

%w

.50

SF MF

10

ML

27

cL

500

.

1

Discrete Wwng w/PTH xc

I

xc

1.3 1.6 1.8 2.0 2.2 2.4 2.6 2.8 2.9 3.1 3.3 3.4 3.6 3.7 3.9 4.0



I

L 1.0

Factor -xc

1

I

N2

ltQ

kb

Technology

.65P 63 Ifj-1

Supersedes --1-

I

page

16-1

of Revision

F ,

.“..

~.

.

Jr--

-----------

.

MIL-I+DBK-217F NOTICE 2

INTERCONNECTION ASSEMBLIES, SURFACE MOUNT TECHNOLOGY

16.2

APPLICATION NOTE: The SMT Model was ctevelopecf to assess the life integfiiy of leadless and leaded devices. It provides a relative measure of circuit card wearout due to thermal cycling fatgue failure of the “weakest link- SMT device. An analysis shouti be periorrned on all circuit board SMT components. The component with the largest failure rate value (weakest link) is assessed as the overall board failure rate due to SMT. The model assumes the board is completely renewed upon failure of the weakest link and the results do not consider solder or lead marwfacturi~ defects. This model is based on the techniques developed in Reference 37.

ASMT

=

Average failure rate over the expected equipment life cycle due to surface mount device This failure rate wearout. contr’butbn to the system is for the Surface Mount Device on each board exhibiting the highest absolute value of the strain range:

where: CR

Nf

I ( % AT -ucc(dT+TRIsE)) ECF )LSMT = ~ ECF

=

-..._._”,.”

Lc

Nf=

0-.1 .11 -.20 .21 -.30 .31 -.40 .41 -.50 .51 -.60 ,61-.70 .71 -.80 .81 -.90 > .9

=

Average number of thermal cycies to failure

, (1

3.5 &

where: d=

.13 .15 .23 .31 .41 .51 .61 .68 .76 1.0

(as AT- Cfcc(AT+TRIsE))

h=

Solder joint height in miis for Ieadiess devices. Default to h = 8 for ali leaded configurations.

w=

Circuit board substrate thermai coefficient of expansion (TCE)

AT

Use environment temperature extreme difference

=

material thermal Package coefficientof expansion (TCE)

w%= TRISE =

LC

=

Design iife cycle of the equipment in which the circuit board is operating

Temperature rise due to power dissipation (Pal)

Pd

=

USMT = The Weibull characteristic life.

8JC

=

USMT is a function of device and substrate material, the manufacturing methods, and the application environment used.

P=

16-2

Ix 10 +)-’qn,c)

Distance from center of device to the furthest solder joint in miis (thousandths of an inch)

ral~ u w------ ~r~~- FCF --ECF

-MT

Temperature cycling rate in cycles per calendar hour. Base on a thermal analysis of the circuit board. Use table default values if other estimates do not exist.

lx 10-6

Effective cumulative number of the Weibull failures over ctwacte~ic life.

Ffi*iVGI _ k..””...- ~llmldat~~

=

~Lc

=

eJcp

Thermal resistance ‘/Watt Power Dissipation (Watts)

Lead configuration factor

New Page



MIL-HDBK-217F NOTIGE 2

16.2

INTERCONNECTION ASSEMBLIES, SURFACE MOUNT TECHNOLOGY as - Default TCE Substrate Values

CR - Cycling Rate Defau~ Values Number Of Equipme~ TYPe Cycles/Hour

.0042

Telecorn~~”~t’~ns

.25 .021

Commercial Alrcrati INustrial

Miliiafy Ahcnti

~pper Clad Invar

d

1

Corw@e

3 1

@artz Fiber

Lead Configuratbn

L

5

Glass Fiber

XLC - Lead Configuration Factor

LeadlesS J or S Lead Gull WIW

5 K

I

Cafbon-Fibr/EpOW Kevlar Fiber

.5

(FigMer)

7

Copper Clad Mol@@mm

.03 .12

MilfiarY Gwti Appl”=tbm Miliia~ Aircraft (Caf90)

11

FR-4 Multilayer Board w/Copper [ Clad Invar I ?ramicMuttilayer Bead

.17

computer

20

FR-4 Multilayer 60ard

.08

:onsumer (television, radio, recorder)

18

FR4 Laminate

1.0

l~omotive

as

Substrate Material

%C 1 150 5,000

15

Epoxy/Glass Laminate Polyamtie/Glass

13

Laminate

Polyam”~/Kevlar

6

Laminate

8

Po&amtie/Wa~ LamiMte @oxy/Kevkr Laminate

.

7 7

Alumina (Ceramk)

c - TCE Package Values

7

@mxy Ararnkf Fiber , ,

7 6

Plastic Ceramic

v

21

GF

26

GM

26

hJs

61

Nu

31

%c AIF %c ‘UF %lw Sc M’F ML CL

~

20 7

var Porcelainked Copper Clad In

Difference AT 7

Environment GB

9

Fiberglass Tefbn Laminates

AT -Use Envimnmeti Default Te~erature

6

PolyamM Aramti Fitwr Epoxy-Quafiz

31 57 57 31

1

Fiberglass Ceramk Fibw

1

7



A large plastic encapsulated E)cAMPLE: Ieadless chip canier is mounted on a epoxyglass printed Wiring assetily. The $esign ~ns”~erations are: a square pa*age is 1480 roils on a side, solder height is 5 roils, power dissipation is .5 watts, thermal resistance is 20 °C/wati, the design life is 20 years and envkOnmti is military grouti application. The failure rate cfevebped is the impad of SMT for a single circuit board and accounts for all SMT devices on this board. This failure rate is added to the sum of all of the component failure rates on the circuti board.

7 N/A NIA hJIA

Nf

(xsMT

=

c–fi 16-3

New Page

MIL-HDBK-217F NOTICE 2

16.2

INTERCONNECTION ASSEMBLIES, SURFACE MOUNT TECHNOLOGY

d ~f

=

(asAT-ucc(A~+TRlsE)) I “0 -6)-226@Lc)

3“5 (. R

For d:

d = ~ (1480) = 740 roils

For h:

h s 5 roils

For as:

as = 15 (Table - EPOXYGlass)

ForAT:

AT_ 21 (Table - GF)

For WC:

~.

For TRISE:

TRISE = eJC p = 20(.5) = 10°C

For XLC:

ZLC = 1 (Table - Leadless)

For CR:

CR = .03 cycle~our

7 (Table - PlastiC)

(1

740 (.65)(5)

(Table - Milita~ Gmun@

(W2V

- 7W+1O)) 1)x 104

Nf

=

3“5

Nf

=

18,893 theml

.

629,767 hOu~ 18,893 cycles .03 cyiedbur =

WMT

1-c

W= *

“2”26 (1)

cycles to failure

.

28

aSMT



ECF

=

.23 failures (TaMe - Effedive Cumulative Failures)

~SMT

=

ECF ~T

XSMT =

-

I

.23 faiiures .0000004 failure~~ur = 629,767 kNJrS =

.4 failures/106 hours

,

New Page 16-4

MIL-HDBK-217F

NOTICE 2 17.1

CONNECTIONS

used on all assemblies Use the Intermnnedion Assembly APPLICATION NOTE: The failure rate model in this section applies to connedions except those using plated through holes or surface mount technology. connections to a circuit board using either plated through hole technology Model in Sectbn 16 to account for The failure rate of the strudure which supports Soldefless the connedions and parts, e.g., are wrap connections or surface mount technology. non-plated-through hole boards and terminal straps, is considered to be zero. chara~erized by SOIMwire wrapped under tenshn around a rrmdel post, whereas hati soldeting The following is for a single connedion.with wrapping does not depend on a tension induced connedion.

L = LX= Ub

06 Hours

Failures/l

P

Envimnmnt Factor-Xc

&

Base Faihm Rate - ~ Connedion

Type

Hand Solder, w/o Wrapping Hand Solder, w/Wrapping

Soldeffess Wrap

Spfing Contad Terminal Block

Environment I

GB .0013

GF

.000070

GM .. . Ns

.000015

Weld

Reflow Solder

~ (F/106 hm)

.00026

crimp

Clip Termin~bn

1

.0000068

I

~E .-

1 .U

1A I 2.0

7.0

4.0

u

AC .00012

4.0 6.0

.000069

‘IF AN

.17 ‘UF

.062

6.0 8.0

I

16 ‘RW

.50

SF

MF ML CL

9.0 24 420

17-1

Supersedes

page 17-1 of Revision

F

MIL-I-IDBK-217F

APPENDIX

A:

PARTS

COUNT

RELIABILITY

PREDICTION

Parts Count Reliablllty Predlctlon - This prediction method is applicable during bid proposal and early design phases when insufficient information is available to use the part stress analysis models shown in the main body of this Handbook. The information needed to apply the method is (1) generic part types (including complexity for microcircuits) and quantities, (2) part quality levels, and (3) equipment environment. The equipment failure rate is obtained by looking up a generic failure rate in one of the following tables, multiplying it by a quality factor, and then summing it with failure rates obtained for other components in the equipment. The general mathematical expression for equipment failure rate with this met hod is: i=n ‘EQUIP

=

Z

i=l

‘i

@g@i

Equation 1

for a given equipment environment where:

=

Total equipment failure rate (Failures/1 06 Hours)

=

Generic failure rate for the i ‘h generic part (Failures/1 06 Hours)

7tQ

=

Quality factor for the i ‘h generic part

Ni

=

Quantity of i ‘h generic part

n

=

Number of different generic part categories in the equipment

~EQulP

‘9

Equation 1 applies if the entire equipment is being used in one environment. If the equipment comprises several units operating In different environments (such as avionics systems with units in airborne inhab~ed (Al) and uninhabited (AU) environments), tmn Equat~n 1 shou~ ~ aPPlied to the potiions of the equipment in each environment. These “environment-equipment” failure rates should be added to determine total equipment failure rate. Environmental symbols are defined in Section 3. The quaMy factors to be used with each part type are shown with the applicable ~ tables and are not necessarily the same values that are used in the Part Stress Analysis. M“crocircuits”have an additional rnuttip~ing factor, ~L, which aOCOuntsfor the matudty of the manUfaCt@ng process. For devices in productiontwo years or more, no modif’mtbn Is needed. For those in production less than two years, h should be multipliedby the appropriate XL faotor (See page A-4). It shouldbe noted that no generic failure rates are shown for hybrid microcimuits. Each hybrid is a fairly unique device. Since none of these devices have been standardized, their complexity cannot be determined from their name or function. Identically or similarfy named hybrids can have a wide range of complexitythat thwarts categorization for pufposes of this prediction method. If hybrids are anticipated for a design, their use and construction should be thoroughly investigated on an individual basis with application of the prediction model in Section 5. The failure rates shown in this Appendix were calculated by assigning model default values to the failure rate models of Section 5 through 23. The specific defautt values used for the model parameters are shown with the kg Tables for microcircuits. Defautt parameters for all other part classes are summarized in

the tables stafling on Page A-12. For parts with characteristics which differ significantly fmm the assumed defaults, or parts used in large quantities, the underlying models in the main body of this Handbook can be used.

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