Design for Recycling focusing on LED lamps
Ruud Balkenende
Contents • Philips sustainability policy • Resource efficiency
– GreenElec ENIAC project on electronics resource efficiency • Recycling insights • Guidelines for Design for Recycling – Materials – Connections
– Electronics • Examples of redesigned LED lamps
• Conclusions
Ruud Balkenende - Philips Research
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Philips: A strong diversified industrial group leading in Health and Well-being Philips Businesses1, 2
Geographies1
Healthcare
Consumer Lifestyle
Lighting
Western Europe
North America
Other Mature Geographies
Growth Geographies3
41%
24%
35%
26%
31%
8%
35%
Since 1891 €24.8 Billion 118,000+
$9.1Billion
7% of sales invested
Headquarters in Amsterdam, the Netherlands
Brand value in 2012
in R&D in 2012 54,000 patent rights, 39,000 trademark rights, 70,000 design rights
1
Sales in 2012. Portfolio consists of ~65% B2B businesses 3
Full year 2012 Excluding Central sector (IG&S) Note - All figures exclude discontinued operations 2
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People employed worldwide in over 100 countries
Growth geographies are all geographies excluding USA, Canada, Western Europe, Australia, New Zealand, South Korea, Japan and Israel VTT Webinar - 3 September 2013
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Our innovation strength helped us attain leadership positions in many markets Healthcare Global Global Cardiovascular Cardiovascular X-ray X-ray
Global Patient Monitoring
Global Cardiac resuscitation
Global Sleep Therapy Systems
Regional Ultrasound
Consumer Lifestyle Global Male electric shaving
Global Garment Care
Global Rechargeable Toothbrushes
Regional Kitchen Appliances
Global Automotive Lighting
Global Professional Luminaires
Regional Electric Hair Care
Lighting Global Lamps
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Global LED Lamps
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Global High Power LEDs
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Philips EcoVision: a holistic approach
Improving the lives of 3 billion people a year by 2025
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Improving the energy efficiency of our total product portfolio with an average of 50% by 2015
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Doubling our global collection, recycling amounts and recycled materials in products by 2015
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Why Design for Recycling -
Environment / health - Avoid hazardous materials - Avoid environmental damage of mining - Limit loss of scarce/critical materials
-
Regulations - REACH / RoHS / Philips SVHC list - WEEE: recycling targets for electronic products - Individual Producer Responsibility
-
Economical / business perspective - Strengthen brand - Reduce EoL cost (incentive for Philips not trivial)
Design for Recycling (DfR) should be integral part of platform design guidelines
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Recycling insight is key to product design
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Required for impact: align product design and recycling
Develop green electronics to achieve more efficient use of resources by designing and manufacturing electronics that enable more effective recycling
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GreenElec To achieve a more efficient use of resources by designing and manufacturing electronics
that enable more effective recycling
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ENIAC project GreenElec (2012-2014) Materials and manufacturing
Use
Identification and recycling
Products
WP2 Design and manufacturing
Collection
detection Materials
Design WP5
WP3 Identification and sorting
Validation,
PCBA WP1 Materials and component selection
Components
Separation
Identification Value chain, Policy aspects
Separation Incentive compatibility
Re-use
WP4 Recycling and recovery
Recovery
Raw materials Ruud Balkenende - Philips Research
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Observations Relate design aspects to dismantling result: Recyclable materials Separable materials
Fixed connections keep parts connected: screws, glue, potting Ruud Balkenende - Philips Research
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Design rules for Sustainability not compromising performance • Efficacy • Off mode / stand-by mode • Energy Label
energy
• Energy savings compared to benchmark • External energy claims (e.g. Energy star, Eco flower)
• Additional energy saving controls • Carbon neutral • (Level of ) dimmability • Only use materials that can be recycled
materials building blocks
• Avoid the use of (non-compliant) coatings • Limit the number of different materials • Use preferred/pure materials • Get PCB out in one piece ( smelting)
resources
electronics
• Enable easy/fast detection of materials • Use SMD components • Avoid fixed connections
interfaces
connections
• Break-down (by shredding/disassembly) to o Pieces with uniform composition o Pieces of relatively large size (>1 cm)
identification end-of-life disassembly Ruud Balkenende - Philips Research
•
Visual marks • Visual instrcution
•
Extended use of NFC
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Guidelines on Building Block Materials materials
•
Use materials that can be recycled
•
Use of compliant coatings
•
Limit the number of different materials
Only those materials will be recycled, that are sufficiently pure and can be either reused or recovered. • Do not use materials that are on the Restricted Substances List (obligatory compliance)
• Use less material, i.e. strive for lower weight • Use materials that are recyclable, which often means relatively pure materials. ‘use of recycled materials’. • Check the preferred materials lists • Use coatings that are compatible with the building block material in recycling • Use a limited number of materials: make building blocks of the same material • Electronics should be considered as a homogeneous material for the purpose of recycling Ruud Balkenende - Philips Research
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Material choice material class metal
recyclability LCA-impact remark
++
-
glass
+
-
ceramics bulk polymers
+
-
alloys and strongly connected metals are less favourable currently not standard for electronics land-fill, but usually not harmful PE, PP, PS are separated based on density; presence of fillers decreases recyclability developments in detection and separation might improve future plastics recycling
engineering polymers bio-based: paper, cupboard, wood bio-based: from bio-polymers biodegradable
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-
-
-
+
-
+
-
-
presence of fillers like flame retardants makes recycling unattractive The origin of the biological source is largely determining the impact The origin of the biological source is largely determining the impact Not useful in electronics due to incompatibility with electronics recycling
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Composition determination example: MR16 shell MR16_Shell
methodology: • IR • SEM/EDX • ICP-MS
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moulding polybutylene terephthalate; glass fiber reinforcement, 25%; organic particles (50-300nm); flame retardant coating
HEMA-polymer with Al-flakes
ink
???, Cl-rich with TiO2 and SiO2
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Overview of materials composition MR16 polymers
metals
ceramics other
ZnFe2O4
RuO
BaTiO
other Cr Zn Ag Sn Ni Cu Fe Mg Al other organic Al Caco3 Org-P BFR AsO3 Al2O3 TiO2 SiO2 carbon glass
other
PDMS
HEMA
epoxy
PMMA
PC PA46
PBT
part
fillers
housing Shell pins
screw ring lens heat sink
97 3
.5
thermal pad led PCB driver PCB screws
Many different polymers used (>10) Various filler materials and additives Coatings (other polymer + filler) Electronic components: many elements mixed at micron-scale epoxy (+filler + flame retardant) encapsulation
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Materials composition: PCBA of LED lamp Metals
202
333 7.68 79.3
162 0.06
45
72.3 91.1
5.6 0.57
0.2 0.18
0.1 0.64 0.09 1.49 0.06 0.02 0.02 0.09 0.26 0.19 0.01
0.01
862 86.9
162 0.06 68.3
87.8 91.1
5.6 0.57
0.2 0.18
0.1 0.64 0.09 1.49 0.06 0.02 0.02 0.09 0.26 0.19 0.01
0.01
100
100
100
100
Ag Au Bi Cu Ni Pb Pd Sn Zn Al(2O3) As(O3) Ca(O) Cu2O Fe (FeOx) Mg (MgO) Mn(O) Sb(2O3) Si(O2) SiO2 Sr(O) Ba Dy(oxide) Na Ti(O2) TiO2 W(O3) Y(O3) Zr/ZrO2
Metallurgical compatibility of compounds with Ni/Cu refinery materials in PCBA from lamp
other3
ZnFe2O4
RuO
BaTiO
other
Bi1
Mn1
B
Ca
Si
Au1
W
Hf
Dy
Sb
Pd
Zr
Y1
Sr
Al1
Na1
Ti
15.54
15.46
0.1 1.35 185 2999 92.8
Ba
92.75
Pb
2999
23.31
Cr
528.4
Zn
Ag
Sn
Ni
Cu
Fe
12329.6 3069.9 1238.8 777.1 2848.4 3091.5 274.5 1502.6 3155.8 264.2 5035.9 33588.3
Mg
Housing Socket Screw ring Pins Lens Heat sink Thermal pad LED PCB driver (partly analyzed) Screws Potting material total
Al
Mass (mg) 4
Part
Ceramics
Cu/Ni smelting, refining Input: A. van Schaik, MARAS
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Dealing with combinations of materials
smelter
Input: A. van Schaik, MARAS
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Guidelines on interfaces connections
•
Avoid fixed connections
•
Break-down (by shredding/disassembly) to o Pieces with uniform composition o Pieces of relatively large size (>1 cm)
Only separable materials can be recycled with sufficient yield. •
Connections must break down under recycling conditions (shredding or smashing for small electronic appliances)
•
To enable repair/maintenance connections should be reversible
•
Further break-down of parts can be controlled using fracture lines
•
Avoid folding of compliant parts by controlling stiffness (in part itself or using other building blocks)
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Connection choice Connection
preferable remark
clamp
+
click
+
strong interlocking
+/-
screw
-
strong adhesive
--
weak adhesive
+
weld, solder
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--/+
usually connects dissimilar parts permanently, fracture lines through or near screw hole will enable release
If used for dissimilar parts, no problem when connecting similar materials
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Electronic PCB design rules • Use SMD components
• Use click connections for the PCB
Electronics PCB
• Avoid press-fit connectors • Avoid thermo-hardening (conductive) adhesives • Avoid clinching of through-hole components • Avoid combined connection technology
Recyclers classify PCBs in two classes: Low value
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( IMEC)
High value
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MR16 with fracture lines MR16 with fracture lines
fracturing along fracture lines (in brittle materials) most PCBs detached, inspite of screws
random fracturing PCB and shell often still attached
Assist and guide fracture in the case of brittle housing Ruud Balkenende - Philips Research
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MR16 stacked redesign heat sink top / fixation
Pure materials
collimators
90% recyclable
LED PCB
Less weight
heat spreader LEDs heat spreader driver driver
Single connection
PCBs removed as single piece
contact pins driver clamp shell
One recyclable main material, thinner design, single connection Ruud Balkenende - Philips Research
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C2C MR16: recycling result bottom part of lamp folds into Al parts
unless potting is used: mechanical toughness needed in shredding
Increase rigidness of structure in the case of ductile housing Ruud Balkenende - Philips Research
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Concluding Materials:
recyclable
Connections: break product down in large recyclable fragments
Electronics:
get out as a recognizable (single) piece
Consider options for repair/reuse: reversible connections
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