Design for Recycling focusing on LED lamps

Ruud Balkenende

Contents • Philips sustainability policy • Resource efficiency

– GreenElec ENIAC project on electronics resource efficiency • Recycling insights • Guidelines for Design for Recycling – Materials – Connections

– Electronics • Examples of redesigned LED lamps

• Conclusions

Ruud Balkenende - Philips Research

VTT Webinar - 3 September 2013

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Philips: A strong diversified industrial group leading in Health and Well-being Philips Businesses1, 2

Geographies1

Healthcare

Consumer Lifestyle

Lighting

Western Europe

North America

Other Mature Geographies

Growth Geographies3

41%

24%

35%

26%

31%

8%

35%

Since 1891 €24.8 Billion 118,000+

$9.1Billion

7% of sales invested

Headquarters in Amsterdam, the Netherlands

Brand value in 2012

in R&D in 2012 54,000 patent rights, 39,000 trademark rights, 70,000 design rights

1

Sales in 2012. Portfolio consists of ~65% B2B businesses 3

Full year 2012 Excluding Central sector (IG&S) Note - All figures exclude discontinued operations 2

Ruud Balkenende - Philips Research

People employed worldwide in over 100 countries

Growth geographies are all geographies excluding USA, Canada, Western Europe, Australia, New Zealand, South Korea, Japan and Israel VTT Webinar - 3 September 2013

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Our innovation strength helped us attain leadership positions in many markets Healthcare Global Global Cardiovascular Cardiovascular X-ray X-ray

Global Patient Monitoring

Global Cardiac resuscitation

Global Sleep Therapy Systems

Regional Ultrasound

Consumer Lifestyle Global Male electric shaving

Global Garment Care

Global Rechargeable Toothbrushes

Regional Kitchen Appliances

Global Automotive Lighting

Global Professional Luminaires

Regional Electric Hair Care

Lighting Global Lamps

Ruud Balkenende - Philips Research

Global LED Lamps

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Global High Power LEDs

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Philips EcoVision: a holistic approach

Improving the lives of 3 billion people a year by 2025

Ruud Balkenende - Philips Research

Improving the energy efficiency of our total product portfolio with an average of 50% by 2015

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Doubling our global collection, recycling amounts and recycled materials in products by 2015

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Why Design for Recycling -

Environment / health - Avoid hazardous materials - Avoid environmental damage of mining - Limit loss of scarce/critical materials

-

Regulations - REACH / RoHS / Philips SVHC list - WEEE: recycling targets for electronic products - Individual Producer Responsibility

-

Economical / business perspective - Strengthen brand - Reduce EoL cost (incentive for Philips not trivial)

Design for Recycling (DfR) should be integral part of platform design guidelines

Ruud Balkenende - Philips Research

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Recycling insight is key to product design

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Required for impact: align product design and recycling

Develop green electronics to achieve more efficient use of resources by designing and manufacturing electronics that enable more effective recycling

Ruud Balkenende - Philips Research

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GreenElec To achieve a more efficient use of resources by designing and manufacturing electronics

that enable more effective recycling

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ENIAC project GreenElec (2012-2014) Materials and manufacturing

Use

Identification and recycling

Products

WP2 Design and manufacturing

Collection

detection  Materials

 Design WP5

WP3 Identification and sorting

Validation,

PCBA WP1 Materials and component selection

Components

Separation

 Identification Value chain, Policy aspects

 Separation  Incentive compatibility

Re-use

WP4 Recycling and recovery

Recovery

Raw materials Ruud Balkenende - Philips Research

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Ruud Balkenende - Philips Research

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Observations Relate design aspects to dismantling result:  Recyclable materials  Separable materials

Fixed connections keep parts connected: screws, glue, potting Ruud Balkenende - Philips Research

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Design rules for Sustainability not compromising performance • Efficacy • Off mode / stand-by mode • Energy Label

energy

• Energy savings compared to benchmark • External energy claims (e.g. Energy star, Eco flower)

• Additional energy saving controls • Carbon neutral • (Level of ) dimmability • Only use materials that can be recycled

materials building blocks

• Avoid the use of (non-compliant) coatings • Limit the number of different materials • Use preferred/pure materials • Get PCB out in one piece ( smelting)

resources

electronics

• Enable easy/fast detection of materials • Use SMD components • Avoid fixed connections

interfaces

connections

• Break-down (by shredding/disassembly) to o Pieces with uniform composition o Pieces of relatively large size (>1 cm)

identification end-of-life disassembly Ruud Balkenende - Philips Research



Visual marks • Visual instrcution



Extended use of NFC

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Guidelines on Building Block Materials materials



Use materials that can be recycled



Use of compliant coatings



Limit the number of different materials

Only those materials will be recycled, that are sufficiently pure and can be either reused or recovered. • Do not use materials that are on the Restricted Substances List (obligatory compliance)

• Use less material, i.e. strive for lower weight • Use materials that are recyclable, which often means relatively pure materials. ‘use of recycled materials’. • Check the preferred materials lists • Use coatings that are compatible with the building block material in recycling • Use a limited number of materials: make building blocks of the same material • Electronics should be considered as a homogeneous material for the purpose of recycling Ruud Balkenende - Philips Research

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Material choice material class metal

recyclability LCA-impact remark

++

-

glass

+

-

ceramics bulk polymers

+

-

alloys and strongly connected metals are less favourable currently not standard for electronics land-fill, but usually not harmful PE, PP, PS are separated based on density; presence of fillers decreases recyclability developments in detection and separation might improve future plastics recycling

engineering polymers bio-based: paper, cupboard, wood bio-based: from bio-polymers biodegradable

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-

-

-

+

-

+

-

-

presence of fillers like flame retardants makes recycling unattractive The origin of the biological source is largely determining the impact The origin of the biological source is largely determining the impact Not useful in electronics due to incompatibility with electronics recycling

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Composition determination example: MR16 shell MR16_Shell

methodology: • IR • SEM/EDX • ICP-MS

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moulding polybutylene terephthalate; glass fiber reinforcement, 25%; organic particles (50-300nm); flame retardant coating

HEMA-polymer with Al-flakes

ink

???, Cl-rich with TiO2 and SiO2

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Overview of materials composition MR16 polymers

metals

ceramics other

ZnFe2O4

RuO

BaTiO

other Cr Zn Ag Sn Ni Cu Fe Mg Al other organic Al Caco3 Org-P BFR AsO3 Al2O3 TiO2 SiO2 carbon glass

other

PDMS

HEMA

epoxy

PMMA

PC PA46

PBT

part

fillers

housing Shell pins

screw ring lens heat sink

97 3

.5

thermal pad led PCB driver PCB screws

   

Many different polymers used (>10) Various filler materials and additives Coatings (other polymer + filler) Electronic components: many elements mixed at micron-scale epoxy (+filler + flame retardant) encapsulation

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Materials composition: PCBA of LED lamp Metals

202

333 7.68 79.3

162 0.06

45

72.3 91.1

5.6 0.57

0.2 0.18

0.1 0.64 0.09 1.49 0.06 0.02 0.02 0.09 0.26 0.19 0.01

0.01

862 86.9

162 0.06 68.3

87.8 91.1

5.6 0.57

0.2 0.18

0.1 0.64 0.09 1.49 0.06 0.02 0.02 0.09 0.26 0.19 0.01

0.01

100

100

100

100

Ag Au Bi Cu Ni Pb Pd Sn Zn Al(2O3) As(O3) Ca(O) Cu2O Fe (FeOx) Mg (MgO) Mn(O) Sb(2O3) Si(O2) SiO2 Sr(O) Ba Dy(oxide) Na Ti(O2) TiO2 W(O3) Y(O3) Zr/ZrO2

Metallurgical compatibility of compounds with Ni/Cu refinery materials in PCBA from lamp

other3

ZnFe2O4

RuO

BaTiO

other

Bi1

Mn1

B

Ca

Si

Au1

W

Hf

Dy

Sb

Pd

Zr

Y1

Sr

Al1

Na1

Ti

15.54

15.46

0.1 1.35 185 2999 92.8

Ba

92.75

Pb

2999

23.31

Cr

528.4

Zn

Ag

Sn

Ni

Cu

Fe

12329.6 3069.9 1238.8 777.1 2848.4 3091.5 274.5 1502.6 3155.8 264.2 5035.9 33588.3

Mg

Housing Socket Screw ring Pins Lens Heat sink Thermal pad LED PCB driver (partly analyzed) Screws Potting material total

Al

Mass (mg) 4

Part

Ceramics

Cu/Ni smelting, refining Input: A. van Schaik, MARAS

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Dealing with combinations of materials

smelter

Input: A. van Schaik, MARAS

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Guidelines on interfaces connections



Avoid fixed connections



Break-down (by shredding/disassembly) to o Pieces with uniform composition o Pieces of relatively large size (>1 cm)

Only separable materials can be recycled with sufficient yield. •

Connections must break down under recycling conditions (shredding or smashing for small electronic appliances)



To enable repair/maintenance connections should be reversible



Further break-down of parts can be controlled using fracture lines



Avoid folding of compliant parts by controlling stiffness (in part itself or using other building blocks)

Ruud Balkenende - Philips Research

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Connection choice Connection

preferable remark

clamp

+

click

+

strong interlocking

+/-

screw

-

strong adhesive

--

weak adhesive

+

weld, solder

Ruud Balkenende - Philips Research

--/+

usually connects dissimilar parts permanently, fracture lines through or near screw hole will enable release

If used for dissimilar parts, no problem when connecting similar materials

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Electronic PCB design rules • Use SMD components

• Use click connections for the PCB

Electronics PCB

• Avoid press-fit connectors • Avoid thermo-hardening (conductive) adhesives • Avoid clinching of through-hole components • Avoid combined connection technology

Recyclers classify PCBs in two classes: Low value

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( IMEC)

High value

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MR16 with fracture lines MR16 with fracture lines

fracturing along fracture lines (in brittle materials) most PCBs detached, inspite of screws

random fracturing PCB and shell often still attached

Assist and guide fracture in the case of brittle housing Ruud Balkenende - Philips Research

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MR16 stacked redesign heat sink top / fixation

 Pure materials

collimators

 90% recyclable

LED PCB

 Less weight

heat spreader LEDs heat spreader driver driver

 Single connection

 PCBs removed as single piece

contact pins driver clamp shell

One recyclable main material, thinner design, single connection Ruud Balkenende - Philips Research

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C2C MR16: recycling result bottom part of lamp folds into Al parts

unless potting is used:  mechanical toughness needed in shredding

Increase rigidness of structure in the case of ductile housing Ruud Balkenende - Philips Research

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Concluding  Materials:

recyclable

 Connections: break product down in large recyclable fragments

 Electronics:

get out as a recognizable (single) piece

 Consider options for repair/reuse: reversible connections

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Ruud Balkenende - Philips Research

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