Data Sheet. AMGP GHz 4W SMT Packaged Power Amplifier. Features. Description. Applications. Functional Block Diagram

AMGP-6434 28-31 GHz 4W SMT Packaged Power Amplifier Data Sheet Description Features The AMGP-6434 is a surface mount packaged 4-Watt power amplif...
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AMGP-6434

28-31 GHz 4W SMT Packaged Power Amplifier

Data Sheet

Description

Features

The AMGP-6434 is a surface mount packaged 4-Watt power amplifier that operates from frequencies between 28 to 31 GHz. In the operational frequency band from 29.5 to 30 GHz, it provides 35.5 dBm of typical output power (P1dB)/36 dBm Psat and 19 dB of small-signal gain. This PA is also suitable for high linear application where the PA demonstrates greater than than -40 dBc of third order output inter modulation (OIM3) at +20 dBm/tone output power level.

• 5 x 5 mm surface mount package

Functional Block Diagram

• Satellite Up/Down Link

1

2

3

8

4

7

6

5

Pin

Function

1

Vg

2

Vd1

3

Vd2

4

RF_OUT

5

Vd2

6

Vd1

7

Vg

8

RF_IN

• High +36 dBm Output Power from 28 to 31 GHz • 50 Ω input and output match • -40° C to +85° C operation

Applications • VSAT • Microwave Radio System Note: This part is not rated for high-moisture environments.

Package Diagram

RF_IN

Vg

Vd1

Vd2

1

2

3

8

4

Attention: Observe Precautions for handling electrostatic sensitive devices.

ESD Machine Model (Class A): 50 V ESD Human Body Model (Class 1A): 250 V Refer to Avago Application Note A004R: Electrostatic Discharge Damage and Control.

7

6

5

Vg

Vd1

Vd2

RF_OUT

ELECTRICAL SPECIFICATIONS Table 1. Absolute Minimum and Maximum [1] Ratings Parameter

Specifications

Description

Pin

Drain Supply Voltage

Vd1 Vd2

Gate Supply Voltage

Vg

RF Input Power (Pin) [2]

RFIN

Min.

-2

Comments

Max.

Unit

6.5

V

0

V

24

dBm

CW

Power Dissipation (Pdiss)

20

W

Pdiss = Vd1 x Id1 + Vd2 x Id2 + Pin - Pout

MSL

MSL2 150

°C

Channel Temperature

150

°C

Storage Temperature

TCH TSTG

-65

Notes: 1. Operation of this device above any one of these maximum parameters may cause permanent damage 2. With the DC (typical bias) and RF applied to the device at board temperature Tb= 25° C

Table 2. Recommended Operating Range Parameter

Specifications

Description

Pin

Drain Supply Voltage

Vd1 Vd2

Gate Supply Voltage

Vg

Gate Current @ 17dBm Pin Gate Current @ SS [-20dBm Pin] Quiescent Drain Supply Current (Idq)

Vd1 Vd2

600 800

mA

Idq = Id1 + Id2

RF Output Power (Pout)

RFOUT

36

dBm

CW

Frequency Range

Min.

2

Max.

6.0 -1

-0.68

Unit

V

Ig

1.2

mA

Ig

650

uA

28

31 4.5

-40

Comments

V -0.35

Thermal Resistance, θch-b Base Plate Temperature

Typical

GHz °C/W

+85

°C

Channel to board

Electrical Specifications All data measured on a 2.4 mm connectorized production contactor board (Rogers 4350B) at Vdd1 = Vdd2 = 6 V, Idd = 3 A (Idd1 + Idd2), Tc = 25° C, and 50 Ω at all ports unless otherwise stated

Table 3. RF Electrical Characteristics Performance Parameter

Min.

Frequency Range (GHz)

28

Typical

Max.

Unit

31

GHz

Comments

Input Return Loss (dB)

-8

dB

Small Signal

Output Return Loss (dB)

-10

dB

Small Signal

dB

Vdd = 6 V, Idd = 3 A Vdd = 6 V, Idd = 3 A

-40

dB

Small Signal

37.3 36.1

dBm

Vdd = 6V , Idd = 3 A Vdd = 6 V, Idd = 3 A

35.8 35.3

dBm

Vdd = 6 V, Idq = 1.4 A Vdd = 6 V, Idq = 1.4 A

IM3 Level

-40

dBc

Δf = 20 MHz, Pout = 20 dBm/tone

Total Drain Current

3

A

Idd

Gain (dB) [1] @ Freq = 29.5 GHz (Pin = -20 dBm) @ Freq = 30 GHz

21 21

Reverse Isolation (dB) Pout [1] (Pin = 17 dBm)

@ Freq = 29.5 GHz @ Freq = 30 GHz

P1dB

@ Freq = 29.5 GHz @ Freq = 30 GHz

35.25 35.25

23.3 22.1

27 27

Note: 1. Pout and Gain measurement accuracy is subjected to the tolerance of ±0.5 dBm respectively.

3

Product Consistency Distribution Charts at 29.5 GHz and 30 GHz, Vdd = 6 V, Idq = 3 A LSL

-1

USL

-0.9

-0.7

-0.5

-0.3

LSL

-0.1

0

Vg @ Vdd = 6 V, Idq = 3 A (Pin = 17 dBm), Mean = -0.68 V, LSL = -1 V, USL = -0.1 V

LSL

35

USL

35.5

36

36.5

37

37.5

38

LSL

21

23

24

25

26

38.5

27

35

-0.5

-0.3

-0.1

USL

35.5

36

36.5

37

37.5

38

38.5

Pout @ 30 GHz (Pin = 17 dBm), Mean = 36.51 dBm, LSL = 35.25 dBm, USL = 38.5 dBm

LSL

28

Gain @ 29.5 GHz (Pin = -20 dBm), Mean = 23.37 dB, LSL = 21 dB, USL = 27 dB

4

-0.7

LSL

USL

22

-0.9

Vg @ Vdd = 6 V, Idq = 3 A (Pin = -20 dBm), Mean = -0.42 V, LSL = -1 V, USL = -0.1 V

Pout @ 29.5 GHz (Pin = 17 dBm), Mean = 36.83 dBm, LSL = 35.25 dBm, USL = 38.5 dBm

20

-1

USL

20

21

USL

22

23

24

25

26

27

28

Gain @ 30 GHz (Pin = -20 dBm), Mean = 22.09 dB , LSL = 21 dB, USL = 27 dB

Selected Performance Plots

21 20 19 18 17 16 15 14 13 12 11 10

0 -5 S11 [dB]

S21 [dB]

All data measured on a 2.4 mm connector based evaluation board at Vdd1 = Vdd2 = 6 V, Idq = 1.4 A (Id1 + Id2), TA = 25° C, and 50 Ω at all ports.

25

26

27

28

29 30 31 Frequency [GHz]

32

33

34

-25

35

27

28

29 30 31 Frequency [GHz]

32

33

34

35

32

33

34

35

24

26

28

30

-10 -20

-10

S12 [dB]

S22 [dB]

26

0

-5

-15

-30 -40 -50 -60

-20 -25

25

Figure 2. S11 (dB) Frequency Sweep

0

-70 25

26

27

28

29 30 31 Frequency [GHz]

32

33

34

28

28.5

29

29.5 30 Frequency [Ghz]

Figure 5. P1dB (dBm) Frequency Sweep

25

26

27

28

29 30 31 Frequency [GHz]

Figure 4. S12 (dB) Frequency Sweep

IM3 Level [dBc]

37 36.8 36.6 36.4 36.2 36 35.8 35.6 35.4 35.2 35

-80

35

Figure 3. S22 (dB) Frequency Sweep

P-1 [dBm]

-15 -20

Figure 1. S21 (dB) Frequency Sweep

5

-10

30.5

31

-10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65

IM3 (28 GHz) IM3 (29 GHz) IM3 (29.5 GHz) IM3 (30 GHz) IM3 (31 GHz)

10

12

14

16

18 20 22 Pout [dBm]

Figure 6. IM3 level (dBc) vs. Output power/tone

Selected Performance Plots over Operating Temperature Range 25

0

20

-5

15

-10

S11 [dB]

10 -40° C 25° C 85° C

5 0

25

26

27

28

29 30 31 Frequency [GHz]

32

33

34

-25

35

27

28

29 30 31 Frequency [GHz]

32

33

34

35

-0.75 -0.76 -0.77

-10

Vgs [V]

S22 [dB]

26

-0.74

-5

-15

25

26

27

28

29 30 31 Frequency [GHz]

32

33

34

-0.78 -0.79 -0.80

-40° C 25° C 85° C

-20

-0.81 -0.82 -60

35

Figure 9. S22 (dB) Frequency Sweep over Temperature

-40

-20

0 20 40 Temperature [°C]

60

80

100

Figure 10. Typical Vgs for Idq = 1.4 A over Temperature

38

45

0

37

40

-5

36

35

-10

30

-15

25

-20

35

OIP3 [dBm]

P-1 [dBm]

25

Figure 8. S11 (dB) Frequency Sweep over Temperature

0

34 33 32 30

28

28.5

29

29.5 30 Frequency [GHz]

Figure 11. P-1 (dBm) Frequency Sweep over Temperature

30.5

20 15 5

31

0

-25

OIP3 -40° C OIP3 25° C OIP3 85° C IM3 -40° C IM3 25° C IM3 85° C

10

-40° C 25° C 85° C

31

6

-40° C 25° C 85° C

-20

Figure 7. S21 (dB) Frequency Sweep over Temperature

-25

-15

28

28.5

-30 -35 -40 29

29.5 30 Frequency [GHz]

30.5

31

Figure 12. OIP3(dBm) and IM3 level (dBm) Frequency Sweep over Temperature @ Po = 20 dBm/tone

-45

IM3 Level [dBm]

S21 [dB]

All data measured on a 2.4 mm connector based evaluation board at Vdd1 = Vdd2 = 6 V, Idq = 1.4 A (Id1 + Id2), and 50 Ω at all ports. Idg has been maintained at 1.4 A under different temperature conditions.

Selected Performance Plots Over Operating Supply Voltage Range All data measured on a 2.4 mm connector based evaluation board at TA = 25° C, and 50 Ω at all ports. 0

20

-5

15

-10

S11 [dB]

10 5 V 1700 mA 6 V 1400 mA 6.5 V 1300 mA

5 0

25

26

27

28

29 30 31 Frequency [GHz] Figure 13. S21 (dB) Frequency Sweep

32

33

34

35

-25

29 30 31 32 Frequency [GHz] Figure 14. S11 (dB) Frequency Sweep

-10

P-1 [dBm]

S22 [dB]

-5

-15 5 V 1700 mA 6 V 1400 mA 6.5 V 1300 mA

-20

27

35

28

28.5

29

31

31.5

25

40 39 38 37 36 35 34 33 32 31 30 28

26

27

28

28.5

29

29.5 30 30.5 Frequency [GHz] Figure 16. P1dB (dBm) Frequency Sweep

34

35

31

31.5

32

45

0

40

-5

35

-10

30

-15

25

-20

20

OIP3 5 V OIP3 6 V OIP3 6.5 V IM3 5 V IM3 6 V IM3 6.5 V

15 5

32

33

P-1, 5 V P-1, 6 V P-1, 6.5 V

10

P-1, 5 V P-1, 6 V P-1, 6.5 V

29.5 30 30.5 Frequency [GHz] Figure 17. P3dB (dBm) Frequency Sweep

7

33

OIP3 [dBm]

P-3 [dBm]

29 31 Frequency [GHz] Figure 15. S22 (dB) Frequency Sweep

40 39 38 37 36 35 34 33 32 31 30

25

-15 -20

0

-25

5 V 1700 mA 6 V 1400 mA 6.5 V 1300 mA

0

-25 -30 -35 -40

-45 29.5 30 30.5 31 Frequency [GHz] Figure 18. OIP3 and IM3 level vs. Frequency Sweep @ Po = 20 dBm/tone 28

28.5

29

IM3 Level [dBm]

S21 [dB]

25

Application Circuit Ferrite Bead

Vg

22uF 10R 47R

0.1uF

10R Vg

10R

0.1uF

Vd1

22uF 0.1uF

Vd2

Vd

Vg 0.1uF

Vd1

47R

Vd2 0.1uF

10R

10R

0.1uF 22uF

Ferrite Bead

Figure 19. Application Circuit

Table 3. Typical Test Conditions:

Table 4. Pin Description

PIN Vd1, 2

6V

Idsq=Id1+Id2

1400mA

Vg

-0.79

Pin No.

Function

Drain Supply Voltage

1

Vg

Quiescent Drain Current

2

Vd1

Gate Supply Voltage

3

Vd2

4

RF_OUT

5

Vd2

6

Vd1

7

Vg

8

RF_IN

Demo-board GND

NC

NC

VG

VDD

GND

Table 5. Recommended Passive Components C1

C2

C6

R1

R2

1 2 3

AMGP 6434

8

4

7 6 5 R8

C1-C4

22mF

TDK C1608X5R0J226M DigiKey 445-8028-1-ND

0.1mF

0402 ANY

R5 L2

C8 C9

C3

VG

C4

NC

NC

VDD

L1, L2

Ferrite Bead

Murata BLM18HG471SN1

R1-R6

10W

0402 ANY

R7, R8

47

0402 ANY

Bias Sequence:

C10

R6 R4

8

Part Number

C5-C10

C7

R3

R7

Figure 20. Demo-board

Value

L1

C5

GND

Ref Designator

GND

• • • • • •

Apply Vg = -1.5V Apply Vdd = 0V Increase Vdd to 6V Increase Vg to obtain Idsq = 1.4A Apply RF Turn off in reverse order

Reliability Data Please contact Avago Technical and/or Customer supports for more detail www.avagotech.com

Package Dimension, PCB Layout and Tape and Reel information Please refer to Avago Technologies Application Note 5521, AMxP-xxxx production Assembly Process (Land Pattern B).

Part Number Ordering Information Part Number

Devices per Container

Container

AMGP-6434-BLKG

10

antistatic bag

AMGP-6434-TR1G

100

7” Reel

AMGP-6434-TR2G

500

7” Reel

For product information and a complete list of distributors, please go to our web site:

www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. AV02-3204EN - September 24, 2013

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