CLD-AP54 Rev 11A

soldering & handling

Cree® XLamp® XM Family LED

Introduction

Table of Contents

This application note applies to XLamp® XM Family LEDs, which

Handling XLamp® XM Family LEDs.............................................. 2

have order codes in the following fomat:

Circuit Board Preparation & Layouts............................................ 4

XMxxxx-xx-xxxx-xxxxxxxxx

Notes on Soldering XLamp® XM Family LEDs............................ 5

Case Temperature (Ts) Measurement Point................................ 5 Moisture Sensitivity...................................................................... 7 This application note explains how XLamp XM Family LEDs and

Low Temperature Operation......................................................... 7

assemblies containing these LEDs should be handled during

XLamp® XM Family LED Reflow Soldering Characteristics........ 8

manufacturing. Please read the entire document to understand

Chemicals & Conformal Coatings................................................ 9

how to properly handle XLamp XM Family LEDs.

Assembly Storage & Handling.................................................... 10 Tape and Reel.............................................................................. 11

www.cree.com/Xlamp

Packaging & Labels.................................................................... 12

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/ or vendor endorsement, sponsorship or association.

Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 1

XLamp ® XM Family LED Soldering & Handling

Handling XLamp® XM Family LEDs Manual Handling Use tweezers to grab XLamp XM Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not push on the lens.

P

CORRECT

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Cree recommends the following at all times when handling XLamp XM Family LEDs or assemblies containing these LEDs: •

Avoid putting mechanical stress on the LED lens.

•

Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect the optical performance of the LED.

•

Cree recommends always handling XM family LEDs with appropriate ESD grounding.

•

Cree recommends handling XM family LEDs wearing clean, lint‑free gloves.

Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XM Family LEDs from the factory tape and reel packaging.

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 2

XLamp ® XM Family LED Soldering & Handling

Handling XLamp® XM Family LEDs (continued) Pick & Place Nozzle The following diagram shows an example of a pick & place tool to remove XM family LEDs from the factory tape and reel packaging. For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of non‑metallic materials. All dimensions in mm Tolerance: + 0.01 mm

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 3

5.00

5.00

XLamp ® XM Family LED Soldering & Handling

Circuit Board Preparation & Layouts C

R2.26

C

R2.26

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or soldering XLamp XM Family LEDs onto the PCB. The diagrams below show the recommended PCB solder pad layout for XLamp XM Family LEDs. All dimensions in mm Tolerance: + 0.13 mm

XM-L, XM-L2, XM-L EZW, XM-L2 EZW, XM-L HVW .50

.50 .50

.50

.80

.80

.25

.25 B

B

4.78

.50

.50

.80

.80

4.78

4.78

4.78 .25

2.78 4.78 A

A

2.78

.97

.97

4.78

ALL DIMENSIONS A ALL DIMENSIONS ARE ±

4.78

4.78

RECOMMENDED STENCIL PATTERN RECOMMENDED STENCIL PATTERN Pattern Recommended (HATCHED AREA ISStencil OPENING) (HATCHED AREA IS OPENING)

Recommended PCB Solder Pad

RECOMMENDED PCB SOLDER PAD RECOMMENDED PCB SOLDER PAD

(Shaded Area Is Open)

XM-L Color

6

6

Recommended PCB Solder Pad

5

5

4

.25

4

UN UNLESS OTHERWISE S DIMENSIONS AR MILL MILLIMETERS AND AFT TOL TOLERANCE UNLESS S .XX ± .XXX ± X° ± THIRD ANGLE PROJECTION FO THIRD ANGLE PROJECTION FOR SHEET METAL PA .X ± .XX ± .XXX ± X° ± SU SURFACE FINISH:

3

Recommended Stencil Pattern (Shaded Area Is Open)

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 4

3

XLamp ® XM Family LED Soldering & Handling

Case Temperature (Ts) Measurement Point XLamp XM Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This measurement point is shown in the picture below.

XM-L, XM-L2, XM-L EZW, XM-L2 EZW, XM-L HVW XM-L Color

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XM Family LED itself. In testing, Cree has found such a solder pad to have insignificant impact on the resulting Ts measurement.

Notes on Soldering XLamp® XM Family LEDs

Notes on Soldering XLamp XP Family LEDs

XLamp XM Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the XLamp XP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or PCB on a hotplate and following the reflow soldering profile listed on page 8. by placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page. Do solder not wave solder XLamp XP Family LEDs. Do not hand Do not wave XLamp XM Family LEDs. Do not hand solder XLamp XMsolder FamilyXLamp LEDs. XP Family LEDs.

PP

CORRECT CORRECT

XX

WRONG WRONG

PP

CORRECT CORRECT

Solder Paste Type

Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after reflow soldering is not required. Cree uses the following solder paste internally: Indium Corporation of America® Part number 82676

• •

Sn62/Pb36/Ag2 composition Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty Flux: NC-SMQ92J information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 5 Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg.

XLamp ® XM Family LED Soldering & Handling

Notes on Soldering XLamp® XM Family LEDs (Continued) Solder Paste Type Cree strongly recommends using “no clean” solder paste with XLamp XM Family LEDs so that cleaning the PCB after reflow soldering is not required. Cree uses Kester® R276 solder paste internally. Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).

Solder Paste Thickness The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil (102-μm) bond line, i.e., the solder joint thickness after reflow soldering.

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CORRECT

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WRONG

After Soldering After soldering, allow XLamp XM Family LEDs to return to room temperature before subsequent handling. Premature handling of the device, especially around the lens, could result in damage to the LED. Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB.

Cleaning PCBs After Soldering Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA). Do not use ultrasonic cleaning.

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 6

XLamp ® XM Family LED Soldering & Handling

Moisture Sensitivity Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp XM Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP.

Low Temperature Operation The minimum operating temperature of these XLamp LED components is -40  °C. To maximize lifetime, Cree recommends avoiding applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C.

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 7

XLamp ® XM Family LED Soldering & Handling

XLamp® XM Family LED Reflow Soldering Characteristics In testing, Cree has found XLamp XM Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

tP

TP

Critical Zone TL to TP

Temperature

Ramp-up

TL

tS

Tsmax Tsmin

Ramp-down

ts Preheat

25

t 25˚C to Peak

Time

Profile Feature Average Ramp-Up Rate (Tsmax to Tp)

Lead-Free Solder 1.2 °C/second

Preheat: Temperature Min (Tsmin)

120 °C

Preheat: Temperature Max (Tsmax)

170 °C

Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp)

65-150 seconds 217 °C 45-90 seconds 235 - 245 °C

Time Within 5 °C of Actual Peak Temperature (tp)

20-40 seconds

Ramp-Down Rate

1 - 6 °C/second

Time 25 °C to Peak Temperature

4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface. Note: While the high reflow temperatures (above) have been approved, Cree’s best practice guideline for reflow is to use as low a temperature as possible during the reflow soldering process for these LEDs.

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 8

XLamp ® XM Family LED Soldering & Handling

Chemicals & Conformal Coatings Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer.

Recommended Cleaning Solutions Cree has found the following chemicals to be safe to use with XLamp XM Family LEDs. •

Water

•

Isopropyl alcohol (IPA)

Chemicals Tested as Harmful In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to XLamp XM Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XM Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs. •

Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)

•

Methyl acetate or ethyl acetate (i.e., nail polish remover)

•

Cyanoacrylates (i.e., “Superglue”)

•

Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether)

•

Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)

Hermetically Sealing Luminaires For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically sealing LEDs in an enclosed space is not recommended.

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 9

XLamp ® XM Family LED Soldering & Handling

Assembly Storage & Handling Do not stack PCBs or assemblies containing XLamp XM Family LEDs so that anything rests on the LED lens. Force applied to the LED lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XM Family LEDs should be stacked in a way to allow at least 1-cm clearance above the LED lens. Do not use bubble wrap directly on top of XLamp XM Family LEDs. Force from the bubble wrap can potentially damage the LED.

P

CORRECT

P

CORRECT

X

WRONG

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 10

6

5

4

3

2.00[.079]

4.00[.157]

1

2 REVISIONS

NOTICE E CONFIDENTIAL. THIS PLOT AND THE INFORMATION NTAINED WITHIN ARE THE PROPRIETARY AND NFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT Y NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UTHORIZED PERSON WITHOUT THE WRITTEN CONSENT CREE INC.

DESCRIPTION

REV

+.10 +.0039 .0591 -.00 -.0000 [ ]

Do1.50

P2

1.75[.069] E1

Po

Tape and Reel

BY

DATE

APP'D

Ao -

POCKET SIZE XLamp ® XM Family LED Soldering & Handling 5.40mm [.213"] D

Bo -

5.40mm [.213"]

Ko -

3.35mm [.132"]

3.0°

5.40[.213] Bo

All Cree carrier tapes conform to EIA-481D, Automated Handling Systems Standard. 12.00[.472] Component 6 5 4 3 5.50[.217]F

6

NOMINAL

NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION NOTICE CONTAINED WITHIN ARE THETHIS PROPRIETARY ANDINFORMATION CREE CONFIDENTIAL. PLOT AND THE CONFIDENTIAL INFORMATION CREE, INC. THIS PLOT CONTAINED WITHIN AREOF THE PROPRIETARY AND MAY NOT BE COPIED, INFORMATION REPRODUCEDOF ORCREE, DISCLOSED TO PLOT ANY CONFIDENTIAL INC. THIS UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY OF CREE INC. UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC.

D

D

8.00[.315] P

5

4

C

REV

REVISIONS REVISIONS DESCRIPTION DESCRIPTION

REV

3.0°

B 6

7.0°

5

NOTICE NTIAL. THIS PLOT AND THE INFORMATION HIN ARE THE PROPRIETARY AND NFORMATION OF CREE, INC. THIS PLOT PIED, REPRODUCED OR DISCLOSED TO ANY PERSON WITHOUTTHE WRITTEN CONSENT

5.40[.213]

C

5.50[.217]F 5.50[.217]F REV A B

CREE REFERENCE DRAWING FOR TEK-PAK DRAWING Ao

5

4

B

UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .01 .XXX ± .005 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± .06 .XX ± .03 .XXX ± .010 X° ± .5 ° SURFACE FINISH:

DATE 8.00[.315] TITLE 8.00[.315] P P XM

APPROVED

MATERIAL

SIZE FINAL PROTECTIVE FINISH

User Feed Direction

A

ALoaded Pockets (1000 Lamps)

BY

DATE

DDS

11/8/10

6

D

DC

2/26/12

C

APP'D

C

BS

D

A

5050 CARRIER TAPE

A

REV.

DRAWING NO.

2402-00011

SCALE

A

SHEET

7.0°

OF

7.0° 1 4

2

1.75 3 3.35[.132] 3.35[.132] Ko Ko

START

.36[.014] T .36[.014] T

12

B

3.35 2

1

2400-00009 INDEX

QTY

ITEM

COMMENTS

2

2

2400-00009-REEL

CREE REFERENCE DRAWING FOR TEK-PAK DRAWING 018275 1 1 2400-00009-CORE CREE REFERENCE DRAWING FOR TEK-PAK DRAWING 018275 C DRAWN BY

DATE

UNLESS OTHERWISE SPECIFIED DATE DRAWN BY D. CRONIN 4/23/10 UNLESS ARE OTHERWISE SPECIFIED DIMENSIONS IN INCHES D. CRONIN 4/23/10 DATE DIMENSIONS ARE IN INCHESCHECK AND AFTER FINISH. CHECK DATE AND AFTERSPECIFIED: FINISH. TOLERANCE UNLESS TOLERANCE .XX ± UNLESS .01 SPECIFIED: APPROVED DATE TITLE ± .01 .XXX .XX ± .005 APPROVED DATE TITLE X° ±.XXX .5± ° .005 LeaderTHIRD ANGLE PROJECTION MATERIAL X° ± .5 ° 400mm (min.) of THIRD ANGLE PROJECTIONFOR SHEET METAL PARTS ONLY MATERIAL FOR.XSHEET ± METAL .06 PARTS ONLY DRAWING NO. empty pockets with SIZE .XX .X ± ±.03 .06 DRAWING NO. SIZE FINAL PROTECTIVE FINISH at least 100mm ± .03 .XXX .XX ± .010 FINAL PROTECTIVE FINISH X° ±.XXX .5± ° .010 sealed by tape SCALE X° ± .5 ° SURFACE FINISH: 63 SCALE (40 empty pockets min.) DRAWING SCALE SURFACE FINISH: 63 DRAWING SCALE

Ao

4600 Silicon Drive Durham, N.C 27703 4600 Silicon Drive Durham, N.C 27703 Phone (919) 313-5300 Phone (919) 313-5300 Fax (919) 313-5558 Fax (919) 313-5558

XMXM 5050 CARRIER TAPE 5050 CARRIER TAPE 2402-00011 A 2402-00011 A

5

4

5

B

1 /1

3

4

2

3

A D

REV.

A

6

D

5.40[.213] 5.40[.213] Bo Bo

3.0° 1

12.00[.472] REVISONS 12.00[.472] NOMINAL NOMINAL DESCRIPTION

12.30 [.484] pocket count was 750 10.25 Loaded 12.30 [.484] MAXANODE [.404]10.25 MADE CATHODE AND NOTE LARGER [.404] W MAX E2 W 018275 E2

Phone (919) 313-5300 1.50[.059] Fax (919) 313-5558 D1 1.50[.059] D1

DRAWING SCALE

5.40[.213] 5.40[.213] Ao

ANODE SIDE

APP'D DATE APP'D

4600 Silicon Drive Durham, N.C 27703

4/23/10 DATE

CATHODE SIDE 4

5

Trailer 160mm (min) of empty pockets sealed with tape (15 pockets min.)

D. CRONIN CHECK

3

8

6

BY

DATE

DRAWN BY

63

NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTANED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC.

D

2

3.35[.132] Ko

B

END

3

C

THIRD ANGLE PROJECTION

6

4

1

DATE

BoBo - - 5.40mm [.213"] 5.40mm [.213"] KoKo - - 3.35mm [.132"] 3.35mm [.132"]

1.75[.069] E1 1.75[.069] E1

.36[.014] T

BY

POCKET SIZE POCKET SIZE AoAo - - 5.40mm [.213"] 5.40mm [.213"]

+.10 +.0039 Do1.50 .0591 +.0039 -.00 +.10 .0591 -.0000 [] Do1.50 -.00 -.0000 [ ]

2.00[.079] 2.00[.079] P2 P2 1.50[.059] D1 4.00[.157] 4.00[.157] Po Po

1

2

Except as noted, all dimensions in mm.

12.30 [.484] MAX W

10.25 [.404] E2

2

3

SHEET

OF

SHEET

1

2

1OF / 1

1

REV.

A

1 /1

B

12.4 +.2 .0 MEASURED AT HUB

C

C

330 +.25 -.75

16.4 +0.2 .0 MEASURED AT HUB

THIRD ANGLE PROJECTION

6

B

UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° SURFACE FINISH:

5

4

1.6

3

1.9±.4

DATE

DRAWN BY

D. CRONIN CHECK

21 ±.4

4600 Silicon Drive Durham, N.C 27703

06/08/10 DATE

--

Phone (919) 313-5300

--

Fax (919) 313-5558

A

DATE

APPROVED

--

TITLE

13.1 ±.2

--

MATERIAL

--

SIZE

FINAL PROTECTIVE FINISH

--

SCALE

XM LOADING SPEC REV.

DRAWING NO.

C

2402-00012 SHEET

3.000

2

B OF

B

1 /1

1

12.4 +1.0 -.5 MEASURED AT EDGE 60°

60°

REVISONS REV

A

DESCRIPTION

BY

DATE

APP'D

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and XLamp are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, the data sheets available at www.cree.com. For warranty UNLESSplease OTHERWISEsee SPECIFIED 4600 Silicon Drive D. CRONIN 09/29/09 DIMENSIONS ARE IN INCHES Durham, vendor N.C 27703 information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective AND AFTER FINISH. owners and do not imply specific product and/or Phone (919) 313-5300 TOLERANCE UNLESS SPECIFIED: --Fax (919) 313-5558 endorsement, sponsorship or association. 11 .XX ± .01 ®

THIRD ANGLE PROJECTION

®

.XXX ± X° ±

.005 .5 °

FOR SHEET METAL PARTS ONLY

DRAWN BY

DATE

CHECK

DATE

APPROVED

-MATERIAL

DATE

--

TITLE

REEL, 13" X 12MM, 3 PIECE SNAP

A

A

XLamp ® XM Family LED Soldering & Handling

Packaging & Labels The diagrams below show the packaging and labels Cree uses to ship XLamp XM Family LEDs. XLamp XM Family LEDs are shipped in Humidity Indicator Dessicant tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Card (inside bag) (inside bag)

Unpackaged Reel

Label with Cree Bin Code, Quantity, Reel ID

Packaged Reel

Label with Cree Bin Code, Qty, Lot #

Vacuum-Sealed Moisture Barrier Bag Label with Cree Order Code, Quantity, Reel ID, PO #

Label with Cree Bin Code, Quantity, Reel ID

Label with Custom Code, Qty, Reel ID

Boxed Reel

Label with Cree Order Code, Quantity, Reel ID, PO #

Patent Label

Label with Cree Bin Code, Quantity, Reel ID

Patent Label

Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 12