SHOW DIRECTORY

SMTA International

September 27– October 1, 2015 Donald E. Stephens Convention Center Rosemont, Illinois Technical Conference September 27 – October 1 Electronics Exhibition September 29 – 30

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2015 SMTA International

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Welcome to SMTA International 2015 and Our Chicago Venue The Surface Mount Technology Association is proud to present our annual surface mount technology and electronic assembly event. Collaboration is vital to the success of our industry — we are honored to have the IPC join us again this year for their Fall Committee Standards Development Meetings. SMTA International and the IPC meetings provide a unique opportunity to share and learn. The SMTA International conference is highly regarded because we attract an outstanding group of international authors, speakers and volunteers. The technical program includes technical papers and presentations from subject matter experts covering a wide range of surface mount and electronic assembly subjects. Our technical program includes the Evolving Technologies Summit, the Harsh Environments Symposium and the Lead-Free Soldering Symposium. Our main conference program includes sessions on Electronic Manufacturing Services (EMS), Flux, Solder and Adhesives (FSA), Manufacturing Excellence (MFX), Advanced Packaging Technology (APT), Inspection (INS) and Substrates (SUB). Be sure to check out the Poster Sessions, Tech Tours, the Solder Paste and Solder Joint Automatic Inspection Experience, Robotics Alley and the Listen, Learn, Lead (L3) Series.

Learning is a key element of professional growth and there certainly is a lot to learn at SMTA International. On Tuesday there is a special event for our Executive Administrator and my dear friend, JoAnn Stromberg. She is retiring after 29 years of outstanding service to the SMTA. JoAnn’s leadership transformed the SMTA into the industry leading organization it is today. Please join us at this special event to celebrate JoAnn’s remarkable legacy and wish her well on her retirement. I am honored to be the Conference Director. It gives me the opportunity to work with the outstanding individuals on the Technical Advisory Committee (TAC). Every TAC member is a highly respected industry professional. Their support, dedication and work ethic makes my job easy. Every TAC member is dedicated to the ongoing success of this conference; the SMTA is truly fortunate to have the support of this exceptional team. I want to extend my personal thanks and gratitude to every member of the TAC. I also want to extend my personal thanks to the all of the individuals and companies that support the SMTA and SMTA International. Their ongoing support and dedication to the SMTA is what makes SMTA International such an outstanding event. My sincere thanks to all of the authors, co-authors, speakers,

Letter from the President Welcome to Chicago for the Surface Mount Technology Association International Conference and Exposition (SMTAI), the world’s leading conference for the electronics assembly industry. Our Technical Committee has been tireless in the pursuit of the latest and greatest topics and authors and I’m certain even the most experienced professional will be exposed to new and valuable information. Please make sure your calendar includes our opening session and keynote speaker, Rozalia Beica, Chief Technology Officer at Yole Développment. SMTAI does not only cater to the highly technical and experienced professional. There are options for anyone involved in electronics assembly. There are programs and tutorials aimed at those just beginning in the industry and interested in jump-starting their understanding of critical assembly operations, quality, and optimization. The Technical Committee has continued to refine the event and expand ways to maximize participant value. Some of these include: • L3 — Listen, Learn, and Lead series of forward looking presentations. • Poster sessions with many great topics offer another avenue for attendees to learn and have direct interaction with the authors. • Symposia which on their own could be separate conferences focused on Alternate Alloys, Wearable Technology, Harsh Environments, and our ever popular Lead-Free Soldering program on Thursday. It is encouraging to see continued interest and growth in the Exhibition portion of SMTAI. Having suppliers of materials, services, and equipment part of the event extends the applicability of the knowledge attendees can obtain. These companies complement our technical sessions with practical experience that will allow participants to get direct SMTAssociation

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solutions to their real-world issues. The Exhibition Committee has developed a number of ways to enhance your interaction with exhibitors through lunch options, special Automatic Inspection Experience, Tech Tours, Robotics Alley, User Solution Lunch and Beer Tasting. The SMTA is rooted in networking and the noncommercial sharing of knowledge. We are proud of the inclusiveness offered by the Association which is evidenced by the various SMTA Committee meetings and events throughout the week. It is great to see such diversity and expansion in our reach with events like the Women’s Leadership Connection, Fun Run, Golf Outing, and Students and Young Professionals Night Out. To round out the experience we are pleased to colocate with IPC Standards Committees for the third year. We are hoping more people take advantage of participating in both events as it is guaranteed to provide a perspective no other venue can offer: Leading edge technology developments, practical supplier solutions, combined with the rigor and hard work to develop what was once new technology into standards. Lastly, but most importantly, the event will include a special celebration in recognition of JoAnn Stromberg’s remarkable career with the SMTA Tuesday evening. Please join me, the Association, and the Industry, in a once-in-a-lifetime salute to someone who has touched many lives, including mine, and made the SMTA the global, growing, world-leading organization and “family” it is today. The SMTA International Conference and Exhibition is always a highlight of the year but this year simply cannot be missed.

session chairs, co-chairs, instructors, volunteers and the SMTA staff and officers. This conference — and the continued success of the SMTA — would not be possible without their unwavering support and dedication. The mission of SMTA International is education and professional growth. We strive to create a meaningful, beneficial and enjoyable experience for every conference attendee. Your suggestions help us improve SMTA International and other SMTA programs. Please help us by completing and returning your speaker evaluation forms after each session. You can also submit additional comments to the SMTA via our web site at www.smta.org. The Technical Advisory Committee and the SMTA staff and Board sincerely hope that SMTA International is a beneficial and enjoyable experience for you and your company. Thank you for participating in our conference. Enjoy your visit to Chicago! Best Regards, Rob Rowland SMTAI Conference Director Axiom Electronics Operations Engineering Manager

Contents Conference at a Glance . . . . . . 4 Acknowledgments . . . . . . . . . . 6 General Information . . . . . . . . . 7 Sponsors . . . . . . . . . . . . . . . . . 8 IPC Meetings . . . . . . . . . . . 9-10 Special Events . . . . . . . . . 11-14 Opening/Keynote . . . . . . . . . . 11 Poster Session . . . . . . . . . . . . 12 Inspection Feature . . . . . . . . . 15 L3 Series . . . . . . . . . . . . . . . . . 16 Tutorials . . . . . . . . . . . . . . 17-19 Technical Sessions . . . . . . 20-28 Exhibitor Guide. . . . . . . . . . . . 29 Exhibitor Index . . . . . . . . . . . . 55 Exhibits Floor Plan . . . . . . . . . 62

Bill Barthel President, SMTA Plexus Corporation Manager, Quality Solutions

2015 SMTA International

SHOW DIRECTORY >> 3

SMTA International SUNDAY, SEPTEMBER 27

MONDAY, SEPTEMBER 28

TUESDAY, SEPTEMBER 29

TUTORIALS

TUTORIALS

OPENING KEYNOTE SESSION — FREE

T1 Advanced Closed Loop Process Control for Selective Soldering NEW!

T9 Failure Analysis: Analytical Techniques and What They Tell You About Your Failure

3D Technology Trends and Manufacturing Challenges

8:30am – 12:00pm (Room 50, Page 17)

8:30am – 12:00pm, (Room 53, Page 18)

8:00am – 10:00am, (Room 46, Page 11)

T10 3D Packaging for the SMT Specialist NEW!

T2 It is Time for Low Temperature: Low Temperature Solders, New Developments, and Their Applications NEW!

8:30am – 12:00pm, (Room 54, Page 18)

TECHNICAL SESSIONS

8:30am – 12:00pm (Room 51, Page 17) T3 Stencil Printing – A Practical Guide to Defect Prevention and Yield Improvement

8:30am – 12:00pm (Room 52, Page 17) T4 0201, 01005 Plus Smaller Chip Component Design and Assembly NEW!

8:30am – 12:00pm (Room 53, Page 17) T5 Solder Reflow Fundamentals — Understanding Thermal Profiles and Defect Mitigation NEW!

T11 Solder Joint Reliability — Principles and Applications NEW!

8:30am – 12:00pm, (Room 52, Page 18) T12 SMT and Through Hole Defect Analysis and Process Troubleshooting – Part 1 NEW!

8:30am – 12:00pm, (Room 55, Page 18) T13 ZEN and Science of Electronic Assembly — Best Practices in Electronic Assembly Processes— Part 1 NEW!

APT1 3D IC and PoP Assembly

11:00am – 12:30pm, (Room 44, Page 22) EMS1 Taking the Cost Out of EMS: Getting the Best Return for Lean Initiatives

11:00am – 12:30pm, (Room 54, Page 22) FSA1 Improved Area Array Component Solder Reliability Through the Use of Underfills, Edge Bonds and Encapsulants

11:00am – 12:30pm, (Room 47, Page 22)

8:30am – 12:00pm, (Room 51, Page 18)

MFX1 Pathways to Prolific Printing

T14 Reliability of Electronics — The Role of Intermetallic Compounds NEW!

HE4 Electronics Ruggedization Through Coating

11:00am – 12:30pm, (Room 49, Page 22)

1:30pm – 5:00pm, (Room 52, Page 18)

11:00am – 12:30pm, (Room 45, Page 22)

1:30pm – 5:00pm (Room 52, Page 17)

T15 “Tipping Point” Cleaning and Deflux NEW!

APT2 BGA Reliability

1:30pm – 5:00pm, (Room 54, Page 19)

2:00pm – 3:30pm, (Room 44, Page 23)

T6 Manufacturing Wrong: Case Studies in Non-Conformance NEW!

T16 Design for Manufacturing (DFM): Today’s Design Challenges Require New Assembly Methods

FSA2 New Developments in No Clean Solder Paste and Flux Technology and Reliability

1:30pm – 5:00pm (Room 50, Page 17) T7 SMT Design and Assembly Process Principles for Flexible and Rigid Flex Circuits NEW!

1:30pm – 5:00pm (Room 51, Page 18) T8 High-Temperature Electronics Manufacture Using Selective Laser and Robotic Point Alloys NEW!

1:30pm – 5:00pm (Room 53, Page 18)

Career Center September 29 – 30 Visit the SMTA Booth in the Registration Lobby Positions posted in the Career Center include: Production, Manufacturing, Process Engineers, Management, Support, Quality Control, Sales and Marketing, R & D. This is a free service provided to our SMTA members and industry colleagues.

1:30pm – 5:00pm, (Room 53, Page 19) T17 SMT and Through Hole Defect Analysis and Process Troubleshooting – Part 2 NEW!

1:30pm – 5:00pm, (Room 55, Page 19) T18 ZEN and Science of Electronic Assembly — Best Practices in SMT Assembly— Part 2 NEW!

1:30pm – 5:00pm, (Room 51, Page 19) EVOLVING TECHNOLOGIES SUMMIT ET1 Alternate Alloys

9:00am – 10:30am, (Room 48, Page 20)

2:00pm – 3:30pm, (Room 47, Page 23) MFX2 Challenges in Advanced Package on Package Applications

2:00pm – 3:30pm, (Room 49, Page 23) HE5 Thermal Management Get the Heat Out

2:00pm – 4:00pm, (Room 45, Page 23) APT3 Advances in WLP and CSP Interconnect Design and Assembly Processes

4:00pm – 5:30pm, (Room 44, Page 24)

ET2 Alternate Alloys (continued)

FSA3 The How’s and Why’s of Fluxes in Electronics Assembly

11:00am – 12:30pm, (Room 48, Page 20)

4:00pm – 5:30pm, (Room 47, Page 24)

ET Keynote Lunch

12:30pm – 1:30pm, (Room 48, Page 20)

L3 SESSIONS

1:30pm – 3:00pm, (Room 48, Page 20)

The sessions below spotlight some of today’s challenges and their solutions. These sessions are FREE to all SMTA International attendees and will be held in Room 55 (Conference Area).

ET4 Evolving Technologies Panel FREE!

L31 Come and See Where the Future Is Going

ET3 Wearable Electronics Technology Development

3:30pm – 5:00pm, (Room 48, Page 20) HARSH ENVIRONMENTS SYMPOSIUM HE1 Reliability of Components in Harsh Environments

8:00am – 10:00am, (Room 45, Page 21)

11:00am – 12:30pm (Room 55, Page 16) L32 Environmental Solutions Require Diligence

2:00pm – 3:30pm (Room 55, Page 16)

HE2 Electronics in Corrosive Environments

10:30am – 12:30pm, (Room 45, Page 21) HE Keynote Lunch

12:30pm – 1:30pm, (Room 45, Page 21) HE3 Materials for Harsh Environments

1:30pm – 3:00pm, (Room 45, Page 21)

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CERTIFICATION SMT Process Certification

8:30am – 5:00pm, (Room 56) SMT Six Sigma Certification

8:30am – 5:00pm, (Room 57)

Conference at a Glance WEDNESDAY, SEPTEMBER 30

CERTIFICATION SMT Process Certification

TECHNICAL SESSIONS

8:30am – 5:00pm, (Room 56)

FSA4 The Influence and Impact of Materials and Process Selection on Reliability

SMT Six Sigma Certification

8:00am – 9:30am, (Room 47, Page 24) INS1 X-Ray Inspections: The Growing Complexity Of Applications and Capability Needs for Tomorrow’s PCBs

8:30am – 5:00pm, (Room 57)

THURSDAY, OCTOBER 1

8:00am – 9:30am, (Room 51, Page 24)

TUTORIAL…FREE to SMTA Members! T19 LED, BGA, and QFN Assembly and Inspection NEW!

MFX3 Cleaning Parameters and Cleanliness Monitoring of Electronic Assemblies

8:30am – 12:00pm, (Room 48, Page 19)

8:00am – 9:30am, (Room 49, Page 24)

LEAD-FREE SYMPOSIUM LF1 Universal Instruments Consortium Pb-Free Project Update

SUB1 Investigating Surface Finish Reliability And Attributes Outside of Solderability

8:30am – 10:00am, (Room 47/49, Page 28)

8:00am – 9:30am, (Room 45, Page 25) APT4 Improvements in Voiding and Reliability of BTCs

8:00am – 10:00am, (Room 44, Page 25) FSA5 Solder Joint Reliability Assessment

10:30am – 12:00pm, (Room 47, Page 25)

LF2 Corrosion and Flux Residue Impacts of Lead Free Solders

10:30am – 12:00pm, (Room 47/49, Page 28) LF3 Research Challenges With Tin Whiskers And Mitigation

1:00pm – 2:30pm, (Room 47/49, Page 28) LF4 Lead-Free Solder Joint Reliability: Recent Advances

3:00pm – 4:30pm, (Room 47/49, Page 28)

INS2 PCB Quality Management

10:30am – 12:00pm, (Room 51, Page 25) MFX4 Ruggedization Technologies and Materials to Meet Today’s Electronics Requirements

CERTIFICATION SMT Process Certification

10:30am – 12:00pm, (Room 49, Page 25)

8:30am – 5:00pm, (Room 55)

APT5 Advances in Electronics Failure Analysis

SMT Six Sigma Certification

10:30am – 12:30pm, (Room 44, Page 26) SUB2 Emerging Topics on Design and Process Technologies of Printed Circuit Boards

8:30am – 5:00pm, (Room 57)

10:30am – 12:00pm, (Room 45, Page 26)

Important SMTA Meetings

APT6 Solder Joint Reliability

Monday, September 28

2:00pm – 3:30pm, (Room 44, Page 26) FSA6 Test Optimization for Improved Quantification of Material and Assembly Quality

2:00pm – 3:30pm, (Room 47, Page 26) INS3 Advances in Process Controls: From 3D Printing to 3D Inspection to Measuring Thermal Expansion Mismatch

2:00pm – 3:30pm, (Room 51, Page 27) MFX5 Innovation and Process Control for Liquid Soldering Processes

2:00pm – 3:30pm, (Room 49, Page 27) SUB3 Surface Finish Parameters that Impact Interconnect Reliability

2:00pm – 3:30pm, (Room 45, Page 27) APT7 Ceramic Column Grid Arrays-Applications, Materials and Optimization

4:00pm – 5:30pm, (Room 44, Page 27) SUB4 Influence of Finishes on PCB Reliability

4:00pm – 5:30pm, (Room 45, Page 27) L3 SESSIONS

The sessions below spotlight some of today’s challenges and their solutions. These sessions are FREE to all SMTAI attendees and will be held in Room 55 (Conference Area). L33 Factory Automation–Optimizing to Reduce Cost And Increase Reliability and Yield

Speaker Breakfast 7:00 am Marcom Committee 11:30 am Certification Committee 2:00 pm Chapter Leadership Committee 4:00 pm Women’s Leadership Connection 5:00 pm

Room 42 Boardroom Boardroom Boardroom Room 42

Tuesday, September 29 Speaker Breakfast 7:00 am Annual Meeting/Opening Keynote 8:00 am Chapter Officer Meeting 12:30 pm Training Committee 12:30 pm International Attendee Meeting 2:00 pm Great Lakes Chapter Meeting 3:00 pm MSD Council 3:00 pm Ambassador’s Meeting 4:00 pm JoAnn Stromberg’s 6:00 pm Retirement Party

Room 42 Room 46/48 Exhibit Hall Officer Lounge Boardroom Exhibit Hall Officer Lounge Exhibit Hall Officer Lounge Room 54 Exhibit Hall Officer Lounge Crowne Plaza

Wednesday, September 30 Speaker Breakfast

7:00 am

Room 42

Exhibitor Appreciation Breakfast

8:00 am

Exhibit Hall Courtyard

Membership Committee/S&YP

10:00 am

8:00am – 10:00am, (Room 55, Page 16)

User Solution Lunch

12:00 pm

L34

Technical Committee

5:30 pm

Room 42

10:30am – 11:30am, (Room 55, Page 16)

Thursday, October 1

L35

Speaker Breakfast

7:30 am

Room 42

Real World SMT Production Problems, Investigations and Solutions Product Life Cycle

Boardroom Chapter Officer Lounge

2:00pm – 3:00pm, (Room 55, Page 16) SMTAssociation

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2015 SMTA International

SHOW DIRECTORY >> 5

Thank You Sincere appreciation to the many individuals and companies listed below.

SMTA International Technical Advisory Committee The distinguished SMTA International Technical Advisory Committee includes electronics manufacturing and packaging experts representing all facets of the industry. The Committee designed the 2015 conference program to ensure that today’s latest trends and developments are fully addressed. Rob Rowland Axiom Electronics Conference Director Raiyo F. Aspandiar, Ph.D. Intel Corporation Organized Substrate and Alternate Alloy Sessions Elizabeth Benedetto Hewlett-Packard Company Organized Lead-Free Sessions Lars Böttcher Fraunhofer IZM Berlin Organized Substrate Sessions Mike Buetow Circuits Assembly Magazine Organized Lean Manufacturing Session William Cardoso, Ph.D. Creative Electron Organized Inspection Sessions Srinivas Chada, Ph.D. Schlumberger Organized Substrate Sessions

Marie Cole IBM Corporation Organized Advanced Packaging Sessions

Denis Jean Kester Organized Flux, Solder and Adhesives Sessions

Randy Schueller, Ph.D. DfR Solutions Organized Advanced Packaging Sessions

Richard Coyle, Ph.D. Alcatel-Lucent Organized Alternate Alloy Sessions

Matt Kelly, P.Eng., MBA IBM Corporation Organized Lead-Free Sessions

Chrys Shea Shea Engineering Services Organized Manufacturing Excellence Sessions

John Evans, Ph.D. Auburn University Organized Harsh Environment Sessions

Jeff Kennedy Celestica Inc. Organized Manufacturing Excellence Sessions

Trevor Galbraith Global SMT & Packaging Organized Factory Automation Session

Robert Kinyanjui, Ph.D. John Deere Electronic Solutions Organized Harsh Environment Sessions

Reza Ghaffarian, Ph.D. Jet Propulsion Laboratory Organized Evolving Technologies Sessions

Pradeep Lall, Ph.D., MBA Auburn University Organized Harsh Environment Sessions

Steve Greathouse Plexus Corp. Organized Evolving Technologies Sessions

Andrew Mawer Freescale Semiconductor Organized Advanced Packaging Sessions

Lenora Toscano MacDermid Inc. Organized Substrate Sessions Paul Vianco, Ph.D. Sandia National Laboratories Organized Lead-Free Sessions Bob Willis bobwillisonline.com European Support Charles G. Woychik, Ph.D. Invensas Corporation Organized Advanced Packaging Sessions

SMTA Board of Directors OFFICERS

PLANNING COMMITTEE

EXHIBITOR COMMITTEE

Bill Barthel, President Plexus Corp.

Matt Kelly, P.Eng., MBA, Chair IBM Corporation

Debbie Carboni, KYZEN Corporation, Committee Chair

Raiyo Aspandiar, Ph.D., Vice President Technical Programs Intel Corporation Michelle Ogihara, Vice President Communications Seika Machinery, Inc. Eileen Hibbler, Vice President Membership TEK Products Debbie Carboni, Vice President Expositions KYZEN Corporation

Martin Anselm, Ph.D. Rochester Institute of Technology Richard Coyle, Ph.D. Alcatel-Lucent

Mick Austin, Vitronics Soltec USA Jim Baker, Spectra Sales Corporation Jason Fullerton, Alpha Adrienne Gerard, Martin (a Finetech Company)

Tim Jensen Indium Corporation

Hal Hendrickson, Nordson DAGE

Scott Priore Cisco Systems Inc.

Michelle Ogihara, Seika Machinery Inc.

Rich Henrick, Secretary Sanmina Corporation Robert Kinyanjui, Ph.D., Treasurer John Deere Electronic Solutions

6 >> 2015 SMTA International SHOW DIRECTORY

Jay Hindersman, Accurate Carriers USA

Verena Salewski, Viscom Inc. Rick Short, Indium Corporation Sal Sparacino, ZESTRON America Sherry Stepp, KYZEN Corporation Ron Torenko, Torenko and Associates

General Information Registration Hours

Speaker Breakfast

Lunch

Sunday, September 27 7:00am – 5:00pm Hall G (second level)

Speaker Breakfasts will be held in Room 42/43. They begin promptly at 7:00am MondayWednesday, and Thursday at 7:30am.

Monday, September 28 7:00am – 5:00pm Hall G (second level)

SMTA Booth and Career Center

Lunch will be offered to all attendees and exhibitors on September 29th and September 30th. Vouchers worth $15 will be distributed in the Food Court in the Exhibit Hall. All food needs to remain in the Exhibit Hall. This is a small thank you from the SMTA for sharing your time with us at SMTA International.

Be sure to visit us in the Registration Lobby in Hall G on the upper level to learn about membership benefits and job opportunities.

Tuesday, September 29 7:00am – 5:00pm Hall G (second level) Wednesday, September 30 7:00am – 5:00pm Hall G (second level) Thursday, October 1 7:00am – 1:00pm Hall G (second level)

Internet Access

Bookstore Plan to visit the SMTA Bookstore in the Registration Lobby in Hall G on the upper level.

Social Activities

Conference Hours Sunday, September 27 through Thursday, October 1 8:00am – 5:30pm

Exhibit Hours September 29 9:00am – 5:00pm September 30 9:00am – 4:00pm

Cell Phone Usage As a courtesy to speakers we would ask that all cell phones be shut off while attending any portion of the technical conference. We appreciate your cooperation and respect for our speakers.

The concierge from the Visitor’s Bureau can be found in the Convention Center Lobby and can be helpful is suggesting local restaurants or activities.

Suitcasing Policy SMTA does not allow solicitation from non-exhibiting companies. This includes attempts to solicit or sell products to event attendees. Please help us by adhering to this policy.

For your convenience, meeting rooms, Exhibit Hall, and common areas have complimentary access to the Internet. Connect your Wi-Fi enabled device to the Wi-Fi signal “Boingo Hotspot”. Once connected, launch your web browser. A Boingo splash page will appear. Here you will find a link to connect to “Complimentary WiFi.”

Plan your time at SMTA International by downloading the SMTA International mobile app at tiny.cc/smtai2015

Setting the Global Standards for Static Control!

First Aid First aid assistance is available by calling 911.

Lost and Found For lost and found items please contact the Registration Counter in Hall G on the upper level.

Press Companies wishing to leave information for media representatives may leave their literature in Room 40/41.

Speaker Lounge Conference speakers, chairs, co-chairs and instructors are invited to relax in Room 40/41. There are light refreshments and access to the Internet.

Speaker Ready Conference speakers are invited to use Room 58 to prepare for their presentation.

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EOS/ESD Standards Device Design Certification Device Stress Testing Certification ESD Program Manager Certification EOS/ESD Association, Inc. 7900 Turin Rd., Bldg. 3 Rome, NY 13440-2069, USA PH +1-315-339-6937 Email: [email protected] www.esda.org 2015 SMTA International

SHOW DIRECTORY >> 7

Thank You to Our Sponsors Premium Sponsor

Notepads/Pens

Luggage Tags

Women’s Networking

Mobile App

Pocket Guide Refreshment Breaks

Event Bags

Media and Association Sponsors

Chapter Sponsors Atlanta

Great Lakes

Long Island

Oregon

Space Coast

Central Texas

Guadalajara

Michigan

Rocky Mountain

Upper Midwest

Carolinas

LA/OC

Ohio Valley

Silicon Valley

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Fall Standards Development Committee Meetings Contribute to the industry standards and guidelines that your company, customers and suppliers rely on. All SMTAI registrants are welcome to attend IPC committee meetings excluding those designated as By Invitation. Registration is required.

Topics Assembly & Joining Base Materials Cleaning & Coating Electronic Documentation Technology Electronic Product Data Description Embedded Devices Environment, Health & Safety

Saturday, September 26 8:00 am – 5:00 pm 5-22A J-STD-001 Task Group, Room 21 10:00 am – 5:00 pm 2-18B/IEC TC 111 Joint Materials Declaration Task Group and IEC 62474 Committee Work, Room 22

Sunday, September 27 8:00 am – 9:00 am 2-30 Terms and Definitions Committee, Room 34 8:00 am – 12:00 pm 2-18B/IEC TC 111 Joint Materials Declaration Task Group and IEC 62474 committee work, Room 32 8:00 am – 3:00 pm 7-31B IPC-A-610 Task Group, Room 21 9:00 am – 4:30 pm 7-31A/D-33A Joint Meeting - IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups, Room 34 1:00 pm – 3:00 pm CMTEMGM Committee Management Session, Room 32 3:00 pm – 4:30 pm 5-20 Assembly & Joining Committee, Room 21 4:30 pm – 6:00 pm CCC Committee Chairman Council (By Invitation), Room 21 6:00 pm – 7:00 pm CHAIRMANREC IPC Committee Chairmen’s Reception, South Ballroom Foyer

Monday, September 28 8:00 am – 9:00 am 7-30 Product Assurance Committee, Room 21 8:00 am – 10:00 am D-35 Printed Board Storage and Handling Subcommittee, Room 32 8:00 am – 10:00 am D-36A IPC-PCQR2 DAUG - By Invitation Only, Room 33 8:00 am – 10:00 am E-21 EMS Intellectual Property Subcommittee, Room 60 8:00 am – 10:00 am 5-23B Component and Wire Solderability Specification Task Group, Room 22 8:00 am – 12:00 pm 2-18 Supplier Declaration Subcommittee, Room 59 8:00 am – 12:00 pm 2-41 Product Data Description Subcommittee, Room 50 8:00 am – 12:00 pm 3-11 Laminate/Prepreg Materials Subcommittee, Room 34 8:00 am – 12:00 pm 5-31G Stencil Cleaning Task Group, Room 23 9:00 am – 10:00 am 5-21E Solder Stencil Task Group, Room 21 10:00 am – 11:00 am 5-22F IPC-HDBK-001 Task Group, North Ballroom Foyer Near Room 21

Fabrication Processes Flexible and Rigid Flex Boards High Speed/High Frequency Interconnections Management Microelectronic Systems Technology Printed Board Design Technology Printed Electronics 10:15 am – 12:00 pm 5-22ARR J-STD-001/Conformal Coating Material & Application Industry Assessment Working Group, Room 21 10:15 am – 12:00 pm 5-23A Printed Circuit Board Solderability Specifications Task Group, Room 22 10:15 am – 12:00 pm 7-32C Electrical Continuity Testing Task Group, Room 32 10:15 am – 12:00 pm D-36 Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee, Room 33 10:15 am – 12:00 pm D-64a Printed Electronics Terms and Definitions Task Group, Room 60 11:00 am – 12:00 pm 5-22A/7-31BCELEB Joint Meeting - J-STD-001 & IPC-A-610, North Ballroom Foyer Near Room 21 12:00 pm – 1:30 pm ML IPC Committee Awards Luncheon, Room 46 1:30 pm – 3:00 pm 1-10C Test Coupon and Artwork Generation Task Group, Room 33 1:30 pm – 3:00 pm 2-18F Declaration of Shipping, Pack and Packing Materials Task Group, Room 59 1:30 pm – 3:00 pm 2-19A(MON) Critical Components Traceability Task Group, Room 34 1:30 pm – 3:00 pm 3-12D Woven Glass Reinforcement Task Group, Room 32 1:30 pm – 3:00 pm 5-32B SIR and Electrochemical Migration Task Group, Room 23 1:30 pm – 3:00 pm 5-33G Low Pressure Molding Task Group, Room 47 1:30 pm – 3:00 pm D-61 Printed Electronics Design Subcommittee, Room 60 1:30 pm – 5:00 pm 5-22A/7-31B Joint Meeting - J-STD-001 & IPC-A-610 Task Groups, Room 21 1:30 pm – 5:00 pm 2-16 Product Data Description (Laminar View) Subcommittee, Room 50 1:30 pm – 5:00 pm D-21 High Speed/High Frequency Design Subcommittee, Room 22 3:00 pm – 5:00 pm 7-31AT IPC-A-600 Technical Training Committee, Room 47 3:15 pm – 5:00 pm 2-15F Obsolete and Discontinued Product Task Group, Room 34 3:15 pm – 5:00 pm 2-18J Laboratory Report Declaration Task Group, Room 59 3:15 pm – 5:00 pm 3-12E Base Materials Roundtable Task Group, Room 32

Process Control Product Assurance Product Reliability Rigid Printed Boards Terms and Definitions Testing

3:15 pm – 5:00 pm 5-31J Cleaning Compatibility Task Group, Room 23 3:15 pm – 5:00 pm D-62 Printed Electronics Base Material/Substrates Subcommittee, Room 60 5:00 pm – 6:30 pm TAEC Technical Activities Executive Committee (By Invitation), Room 21

Tuesday, September 29 8:00 am – 10:00 am 3-12A Metallic Foil Task Group, Room 23 8:00 am – 10:00 am 6-10C Plated-Through Via Reliability-Accelerated Test Methods Task Group, Room 32 8:00 am – 10:00 am D-63 Printed Electronics Functional Materials Subcommittee, Room 59 8:00 am – 12:00 pm 2-18H Conflict Minerals Data Exchange Task Group, Room 52 8:00 am – 12:00 pm 2-40 Electronic Documentation Technology Committee, Room 50 8:00 am – 12:00 pm 5-22BT J-STD-001 Technical Training Committee, Room 34 8:00 am – 12:00 pm 5-33A Conformal Coating Task Group, Room 22 8:00 am – 5:00 pm 7-31J IPC-A-630 task group meeting, Room 21 8:00 am – 10:00 am D-24A TDR Test Methods Task Group, Room 33 10:15 am – 12:00 pm 4-33 Halogen-Free Materials Subcommittee, Room 23 10:15 am – 12:00 pm D-24B Bereskin Test Method Task Group, Room 33 10:15 am – 12:00 pm D-32 Thermal Stress Test Methods Subcommittee, Room 32 10:15 am – 12:00 pm D-64 Printed Electronics Final Assembly Subcommittee, Room 59 11:00 am – 12:00 pm 7-23 Assembly Process Effects Handbook Subcommittee, Room 53 1:30 pm – 3:00 pm 5-22AS Space Electronic Assemblies J-STD-001 Addendum Task Group, Room 23 1:30 pm – 3:00 pm E-30 Conflict Minerals Due Diligence Committee, Room 52 1:30 pm – 3:00 pm 5-24A Flux Specifications Task Group, Room 22 1:30 pm – 3:00 pm 7-31BC IPC-A-610 Telecom Addendum, Room 32 1:30 pm – 3:00 pm D-24C High Frequency Test Methods Task Group: FrequencyDomain Methods, Room 53

Continued on page 10 SMTAssociation

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2015 SMTA International

SHOW DIRECTORY >> 9

IPC Fall Standards Development Committee Meetings, continued 1:30 pm – 3:00 pm D-55 Embedded Devices Process Implementation Subcommittee, Room 50 1:30 pm – 3:00 pm D-65 Printed Electronics Test Method Development and Validation Subcommittee, Room 59 1:30 pm – 5:00 pm 7-31FT IPC/WHMA-A-620 Technical Training Task Group, Room 33 1:30 pm – 5:00 pm D-31B IPC-2221/2222 Task Group, Room 34 3:15 pm – 5:00 pm 3-11F UL/CSA Task Group, Room 23 3:15 pm – 5:00 pm 5-21G Flip Chip Mounting Task Group, Room 50 3:15 pm – 5:00 pm 5-24C Solder Alloy Task Group, Room 22 3:15 pm – 5:00 pm 5-32A Ion Chromatography/Ionic Conductivity Task Group, Room 32 3:15 pm – 5:00 pm 7-11 Test Methods Subcommittee, Room 53

Wednesday, September 30 8:00 am – 10:00 am 4-34B Marking, Symbols and Labels for Identification of Assemblies, Components & Devices Task Group, Room 52 8:00 am – 10:00 am 5-24B Solder Paste Task Group, Room 34 8:00 am – 10:00 am 5-33AWG Conformal Coating Requirements Working Group, Room 22 8:00 am – 10:00 am D-15 Flexible Circuits Test Methods Subcommittee, Room 23 8:00 am – 10:00 am D-22 High Speed/High Frequency Board Performance Subcommittee, Room 33 8:00 am – 12:00 pm 7-31BT IPC-A-610 Technical Training Committee, Room 32

8:00 am – 12:00 pm B-11 3-D Electronic Packages Subcommittee, Room 50 8:00 am – 5:00 pm 2-18B Materials Declaration Task Group, Room 53 8:00 am – 5:00 pm 7-31F IPC/WHMA-A-620 Task Group, Room 21 10:00 am – 12:00 pm 7-34 Repairability Subcommittee, Room 33 10:15 am – 12:00 pm 1-14 DFX Standards Subcommittee, Room 52 10:15 am – 12:00 pm 4-14 Plating Processes Subcommittee, Room 34 10:15 am – 12:00 pm 5-45 Reflow Oven Process Control Subcommittee, Room 22 10:15 am – 12:00 pm D-12 Flexible Circuits Specifications Subcommittee, Room 23 1:30 pm – 2:00 pm 7-31H/7-31K Joint Meeting - IPC-D-620 Wire Harness Design and IPC-HDBK-620, Handbook Task Groups, North Ballroom Foyer Near Room 21 1:30 pm – 3:00 pm D-11 Flexible Circuits Design Subcommittee, Room 23 1:30 pm – 3:00 pm D-33AT IPC-6012 Technical Training Committee, Room 32 1:30 pm – 3:00 pm D-52 Embedded Component Materials Subcommittee, Room 34 1:30 pm – 3:00 pm 5-32E Conductive Anodic Filam –ent (CAF) Task Group, Room 22 1:30 pm – 5:00 pm V-SPVC Solder Products Value Council (SPVC), Room 33 1:30 pm – 5:00 pm 1-13/5-21A Joint Meeting - Land Pattern Subcommittee and IPC-7070 Task Group Meeting, Room 50 1:30 pm – 5:00 pm 7-12 Microsection Subcommittee, Room 52 3:15 pm – 5:00 pm 5-32C Bare Board Cleanliness Assessment Task Group, Room 22 3:15 pm – 5:00 pm 5-11C Electronic Assembly Adhesives Task Group, Room 32

10 >> 2015 SMTA International SHOW DIRECTORY

3:15 pm – 5:00 pm D-13 Flexible Circuits Base Materials Subcommittee, Room 23 3:15 pm – 5:00 pm D-54 Embedded Devices Test Methods Subcommittee, Room 34 4:00 pm – 4:45 pm 5-21H Bottom Termination Components (BTC) Task Group, Room 59 4:45 pm – 5:30 pm 5-21F Ball Grid Array Task Group, Room 59 5:30 pm – 6:15 pm 5-22H Thermal Profiling Guide Task Group, Room 59

Thursday, October 1 8:00 am – 10:00 am 3-11G Corrosion of Metal Finishes Task Group, Room 23 8:00 am – 12:00 pm 2-18K AEG Data Exchange Task Group, Room 32 8:00 am – 12:00 pm 7-31H/7-31K Joint Meeting - Wire Harness Design Task Group and Wire Harness Handbook Task Group, Room 22 8:00 am – 12:00 pm 8-41 Technology Roadmap Subcommittee, Room 33 8:00 am – 5:00 pm 5-22AD Requirements for Military Systems Working Group, Room 21 12:00 pm – 1:30 pm RL IPC Luncheon, Room 34 1:30 pm – 5:00 pm 7-24 Printed Board Process Effects Handbook Subcommittee, Room 23 1:30 pm – 5:00 pm 7-31M Fiber Optic Cable Acceptability Task Group, Room 22 1:30 pm – 5:00 pm 8-70 Coalition for Advancement of MicroElectronic Systems Technology (CAMEST), Room 33

Friday, October 2 8:00 am – 12:00 pm 2-18K AEG Data Exchange Task Group, Room 32

Special Events The opportunity to gain new skills and update your technical knowledge is in every session at SMTA International. From the Electronics Exhibition to the Conference to Special Events, you are sure to find valuable information that will prepare you to compete and succeed in today’s highly competitive market. Some events require fees and advance registration. See the registration form for complete information.

Evolving Technologies Summit Organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories; Richard Coyle, Ph.D., Alcatel-Lucent; Steve Greathouse, Plexus Corp. Monday, September 28 | 9:00am – 5:00pm Room 48

FREE with a VIP or Technical Conference Registration! See page 20 for full details.

Harsh Environments Symposium Organized by Robert Kinyanjui, Ph.D., John Deere Electronic Solutions; John Evans, Ph.D. and Pradeep Lall, Ph.D., Auburn University Monday, September 28 l 8:00am – 3:00pm Tuesday, September 29 | 11:00am – 4:00pm Room 45

FREE With a VIP or Technical Conference Registration. See page 21 for full details.

Women’s Leadership Connection Monday, September 28 | 5:00pm – 6:00pm Room 42/43

We extend a cordial invitation to all women attending SMTAI to join us for a wine and appetizer reception. This is a great opportunity for you to get together with other women in our industry for networking and socializing. Marie Cole, IBM, will share “Power Up-Ignite Your Career.” We look forward to seeing you!

Keynote Session/SMTA Annual Meeting Tuesday, September 29 | 8:00am – 10:00am Room 46/48

Join us for coffee and breakfast treats. A terrific presentation from Yole Développement, will kick off SMTA International! FREE to All Attendees!

3D Technology Trends and Manufacturing Challenges Rozalia Beica Chief Technology Officer, Yole Développement Rozalia Beica, Chief Technology Officer with Yole Développement, will share the industry’s 3D technology trends and implications on assembly and manufacturing. The semiconductor industry continues to be driven by miniaturization, increased performance and functionality as well as further reduction in cost. If leaded packages were, for many years, the primary package of choice, the industry has evolved over the years into a wide range of different packaging technologies, including vertically integrating the devices. Significant developments have been made in further reducing the pitch size and thickness of both silicon device as well as organic substrates (PCB and IC substrates) to enable higher number of I/Os, shorter connections, therefore faster speeds within smaller and lower profile products. However, this miniaturization trends have raised several challenges, for handling and assembling such devices and substrates. Warpage, higher stresses, solder defects, tighter accuracies, contamination, higher cost due to more challenging processes, etc. — are some of the major challenges that industry has to address. The presentation will provide an overview of the packaging technologies, highlighting the miniaturization trends and future roadmaps. Impact of new packaging technologies on assembly needs and rework, highlighting new advancements in materials and equipment as well as assembly and manufacturing processes needed to address these challenges will be presented.

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Rozalia has 24 years of experience across various industries, from industrial to electronics and semiconductors. For more than 17 years, she was involved in the research, application and strategic marketing of Advanced Packaging and 3D Interconnect, with global leading responsibilities at specialty materials (Rohm and Haas Electronic Materials), equipment (Semitool, Applied Materials, Lam Research), device manufacturing (Maxim IC) and OEM (NCR) organizations. In 2013 she joined Yole Développement to lead and further grow the Advanced Packaging and Semiconductor Manufacturing activities within Yole.

The 2014 SMTA International Conference Award Winners Will Be Recognized: Rich Freiberger Best of Conference Presentation “The Effects of Stencil Alloy, Tension and Cut Quality on Solder Paste Performance” Chrys Shea, Shea Engineering Services and Ray Whittier, Vicor Corporation Best of Proceedings Paper “Sensitivity of Cooper Dissolution to the Flow Behavior of Molten Sn-Pb Solder” Paul Vianco, Ph.D., Sandia National Laboratories Best International Paper “Strategic Environmental Research and Development program Tim Whisker Testing and Modeling: Tin Whisker growth on SAC305 Assemblies” Polina Snugovsy, Ph.D., Celestica Inc. and Stephan Meschter, Ph.D., BAE Systems Best Student Paper “Non-Destructive Evaluation of Solder Bump Quality Under mechanical Bending Using Laser Ultrasonic Technique” Jie Gong, Ph.D., Georgia Institute of Technology (now at KLA-Tencor)

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Poster Session Tuesday, September 29 | 12:00pm – 2:00pm Perimeter of Exhibit Hall Courtyard

Solder Paste Inspection with Component M03015 Pads Christian Biederman, Flex Recent Advances In X-Ray Technology Keith Bryant, SMT Solutions Combined Indentation and FEM Analysis to Determine the Crystal Plasticity Constitutive Parameters of Beta-Sn Aritra Chakraborty and Philip Eisenlohr, Ph.D., Michigan State University Understand Cleaning Parameters Barbara Kanegsberg, BFK Solutions, LLC Achieving Higher Speed, Accuracy in Next-Generation SMT Printers Mike Martel, MMC, Inc. Cyanide Free Immersion Gold Suitable for PCB Surface Finishing Jun Nable, Ph.D., Emely Able-Tatis, Ernest Long, Ph.D., John Swanson and Martin Bunce, MacDermid, Inc.

Retirement Celebration for JoAnn Stromberg Tuesday, September 29 6:00pm

Calling All International Attendees! Tuesday, September 29 | 2:00pm Chapter Officer’s Lounge

Please join us for a celebration Tuesday evening as we honor JoAnn Stromberg for her 29 years of SMTA leadership, and wish her well on her retirement as SMTA Executive Administrator.

Come to a special meeting for our international chapter officers and attendees on Tuesday afternoon at 2:00pm in the Chapter Officer’s Lounge. We are looking for your input on how we can help you gain the most for your chapter and better serve you.

This very special celebration will be held Tuesday night, September 29, 2015 during SMTA International. The evening starts with a hosted reception at 6:00pm, followed by dinner and program at 6:45pm. The cost is $35 per person. The party will be held at the Crowne Plaza Hotel in Rosemont.

Tuesday, September 29 | 3:00pm Chapter Officer’s Lounge

OFFERED WITH VERY GENEROUS SUPPORT FROM...

Greg and Denyse Evans

Effects of Board Design Parameters on Failure Mechanisms of PCB/BGA Assemblies under Drop Impact Mathias Nowottnick, University of Rostock A Three-Dimensional Packaging Platform with Integrated Microfluidic Cooling Hanju Oh, Georgia Institute of Technology Reflow Effect on Immersion Tin Solder Wetting Cherry Santos, Ph.D., Tyler Banker, Ernest Long, Ph.D., Jun Nable, Ph.D., MacDermid, Inc. Fracture Mechanics and Stress Based Failure Analysis of BGA Solder Joints: Identifying the Critical Areas of Solder Joint Prone to Cracking. A R Nazmus Sakib, University of Texas at Arlington Introduce a Girl to Engineering Day: A How-To Guide Julie Silk, Keysight Technologies Integrated Solution for SMT Assembly Inspection Ondrej Simecek, Test Research, Inc.

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Great Lakes Chapter Meeting

The Great Lakes Networking/Informational Chapter Meeting at SMTA International will be on Tuesday, Sept 29 at 3:00pm in the Chapter Officer’s Lounge. Anyone from the Great Lakes Chapter area can attend this networking event, which will be a casual environment to meet chapter officers and fellow members. Hear about what the officers are planning for 2016 and offer your opinion on topics, speakers and venues for the upcoming meetings.

“Pick & Taste” Beer Tasting Tuesday, September 29 3:30pm – 5:00pm Exhibit Hall Courtyard

Come “Pick & Taste” craft beers and root beer from several chapter regions on Tuesday from 3:30pm-5:00pm. Try them all while meeting new friends at the multiple bars in the Exhibit Hall Courtyard.

SMTA Fun Run Wednesday, September 30 | 7:00am

Get your run on! You don’t have to skip your run just because you are traveling. Join us for a casual run on Wednesday, September 30th at 7:00am. We will be meeting in the lobby of the DoubleTree Hotel which is across the street from the Convention Center. You can choose to take a 2 or 5 mile run.

8th Annual SMTAI Golf Tournament White Pines Golf Club | Bensenville, Illinois Thursday, October 1, 2015 | 8:30am shotgun start Join us for the 8th Annual SMTA International Golf Tournament at the White Pines Golf Club, a favorite among Chicago area golfers since 1928 and just ten minutes from O’Hare Airport and the Convention Center.

GOLF SPONSORS

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2015 SMTA International

SHOW DIRECTORY >> 13

“USER” Members Solution Lunch For SMTA “USER” Members only

TECH TOURS: Unique to SMTA International

Wednesday, September 30 | 11:45am Chapter Officer Lounge in the Exhibit Hall

Tuesday, September 29 and Wednesday, September 30

Share a Manufacturing Challenge and What You Are Doing About It!

A great chance to meet “as a group” and learn all of the latest technology right on the exhibit floor. Tours related to placement and inspection provides demos and technical application support. There is no cost, no sales pitches, and no obligation. Companies participating on the TOUR are listed below. Tour groups should meet in the registration area at the entrance to the Exhibit Hall 5-10 minutes prior to the start of your tour.

“Learn what your peers are experiencing” No presentations necessary… just an open forum networking lunch. This session is only open to USER Members. Please order your lunch at the Food Court using your $15 voucher and join us for an open forum discussion.

Students and Young Professionals Night Out Wednesday, September 30 | 6:00pm – 9:00pm

Open to those 30 and under. Ready for some fun? This special event offers a great networking opportunity mixed with an evening of entertainment! Dust off your bowling skills and head to Kings Bowling & Entertainment for a chance to connect with fellow students and other “millennial” young professionals in the industry. Food, beverages, bowling and shoe rental is provided at no charge. If you have not yet registered, please do so at the registration counter. Kings Rosemont 5505 Park Place Rosemont, IL 60018

Lead-Free Symposium Organized by Paul Vianco, Ph.D., Sandia National Labs; Matthew Kelly, P.Eng., MBA, IBM Corporation; and Elizabeth Benedetto, Hewlett-Packard Company

Tour 1 — Inspection Tuesday | 10:30am – 12:00pm Tour Guide: Martin Anselm, Ph.D., Rochester Institute of Technology Tour 2 — Placement Tuesday | 1:30pm – 3:30pm Tour Guide: Marie Cole, Ph.D., IBM Corporation Tour 3 — Placement Wednesday | 10:00am – 12:00pm Tour Guide: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions Tour 4 — Inspection Wednesday | 1:30pm – 3:00pm Tour Guide: Scott Priore, Cisco Systems

PLACEMENT COMPANIES

INSPECTION/REWORK COMPANIES

Thursday, October 1 l 8:30am – 5:00pm Room 47/49

FREE With a VIP or Technical Conference Registration. See page 28 for full details.

14 >> 2015 SMTA International SHOW DIRECTORY

Robotics Alley: Robotics, Sensors, and Advanced Manufacturing

September 29 and 30 | In the Exhibit Hall

This year’s SMTA International Conference and Exhibition will feature a special “Robotics Alley” area that will provide a glimpse into the amazing advances that are occurring in robotics, sensors and advanced manufacturing. This interactive space will feature information on the latest technological developments, hands-on demos and — of course — robots! Industries highlighted will include health care, manufacturing, transportation, agriculture and others. The “Robotics Alley” area is organized by the creators of the Robotics Alley Conference & Expo, an annual gathering in Minnesota’s Twin Cities that is on pace to become one of the world’s leading conferences on robotics and automation.

Solder Paste and Solder Joint Automated Optical Inspection Experience

Meet the Experience Team Right on the Show Floor! September 29 and 30 at the entrance to the Exhibit Hall This year’s special feature area, supported by SMTA & NPL, will include live printing ultrafine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly. It will also include AOI inspection of printed board assemblies for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show machines’ capabilities. The feature will also include “NPL Defect Database Live,” where you can get free process support on all of the printing and inspection defects. Bob Willis, feature organizer, will be on hand to inspect and provide feedback on any assembly or soldering issues that you may have to solve at SMTA International.

SPECIAL THANKS TO OUR EQUIPMENT AND MATERIAL SUPPLIERS LISTED BELOW:

Booth 518

Booth 225

Booth 335

Booth 313

Booth 313 Booth 219

Booth 131

Booth 313

Booth 606

Booth 606

Booth 224 Booth 219

Booth 506

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2015 SMTA International

SHOW DIRECTORY >> 15

COMPLIMENTARY to all SMTA International attendees. Additional technical sessions spotlighting interesting and timely topics.

THE

L3 Series: Listen, Learn, Lead L3 1 Come and See Where the Future is Going! Chair: Steve Greathouse, Plexus Corp. Co-Chair: Eddie Kobeda, Ph.D., IBM Corporation (Retired) Tuesday, September 29 | 11:00am – 12:30pm Room 55

that require management. Likewise the quest for environmentally friendly flame retardants in device packaging has once again raised reliability questions and challenges. >>

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FREE to All Attendees!

When you take a long road trip into unfamiliar territory, you need some type of roadmap to know which highway to travel and which turns to take to get to your final destination. Life in the electronics world is very much the same. None of us have been down this pathway before, so having indicators that show us where to take your future products or capability and what areas to avoid are critical to your personal and companies’ success. This session will address different areas and the forecast for their specific product directions in Aerospace/Defense, Medical, Automotive, Handheld/Wireless, Portable, and High Performance products. Keep in mind that technology roadmaps are a prediction of the technology options that currently exist and how they will change, technologies that will soon exist, and what things to look forward to some years in the future. >>

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European Union RoHS Leaded Solder Exemption Update Curtis Grosskopf, *Marie S. Cole, and Pam Lembke, IBM Systems; Jeff Lagler, IBM Transformation and Operations; Kurt Van der Herten, IBM Corporate Environmental Affairs 2015 iNEMI Roadmap Highlights; Forecasting Business/Technology Gaps Over A Ten Year Horizon Chuck Richardson, iNEMI 2015 IPC International Roadmap: Changing with the Times Marc Carter, SAIC

L3 2 Environmental Solutions Require Diligence Chair: Rich Henrick, Sanmina Corporation Co-Chair: Michelle Ogihara, Seika Machinery Tuesday, September 29 | 2:00pm – 3:30pm Room 55

FREE to All Attendees!

In taking efforts to be more environmentally friendly in our manufacturing processes, sometimes unforeseen issues arise and require increased awareness and diligence. Solder recycling is a great idea, but not without pitfalls

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Solder Waste Revisited: The Compelling Argument for Recycling Jack Scott, Conecsus, LLC In House Dross Recovery- Do You Know What You Are Putting Back in Your Solder Bath? Mitch Holtzer and Jason Fullerton, Alpha, an Alent plc Company The Return of the Red Retardant Dock Brown, CRE, DfR Solutions

L3 3 Factory Automation – Optimizing to Reduce Cost and Increase Reliability and Yield Chair: Trevor Galbraith, Global SMT & Packaging Co-Chair: Greg Vance, Rockwell Automation

L3 4 Real World SMT Production Problems, Investigations and Solutions Chair: Chrys Shea, Shea Engineering Services Co-Chair: Greg Wade, Indium Corporation Wednesday, September 30 | 10:30am – 11:30am Room 55

FREE to All Attendees!

Problems occur on a daily basis on an SMT assembly line and it’s often the job of the process engineer to contain them, investigate their root causes and implement solutions. This session presents several case studies of SMT production issues encountered in both CEM and OEM environments, and how they were resolved. Discussions include problem troubleshooting, process improvements, new technology assessments, impacts of material selection, and design considerations. >>

Wednesday, September 30 | 8:00am – 9:30am Room 55

FREE to All Attendees!

Industry 4.0 (Europe), Factory 1.0 (China) and SMLC (USA) all form a backbone from which factories can communicate externally with their vendors and all companies involved in their supply chain. It also communicates internally through the factory MES system and down to a machine level to control inventory and optimize the process. This results in significant cost savings through reduced labor and increased reliability and yield. This session will present a number of case studies and presentations from those companies at the leading edge of this data driven revolution. >>

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On the Smart Move: Industry 4.0 in Electronics Production Günter Schindler, ASM Assembly Systems GmbH & Co. KG Using “Manufacturing Analytics” as a Competitive Strategy Farid Anani, M.S.E.E., MBA and *Jay Gorajia B.Sc.E.E., MBA, Mentor Graphics Reducing Labor Content as a Strategy to Improve Competitiveness - An Analysis that Addresses the Value of Designing for Automation and an Empirical Analysis That Exploits the Automation Using META Process Control Tom Borkes, The Jefferson Project and Lawrence Groves, Trans-Tec Yamaha

16 >> 2015 SMTA International SHOW DIRECTORY

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Key Technical Challenges and Process Improvements for an Electronics Manufacturing Service Provider *Robert Farrell, Bruce Tostevin, Rick Wyman, and Paymon Adl-zarabi, Benchmark Electronics, Inc. Influence of PCB Surface Features on BGA Assembly Yield Satyajit Walwadkar, Todd Harris, Bite Zhou and Alan McAlister, Intel Corporation

L3 5 Product Life Cycle Chair: Roy Starks, LogiSync LLC Co-Chair: Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc. Wednesday, September 30 | 2:00pm – 3:00pm Room 55

FREE to All Attendees!

This session examines two key topics that can give your next project a competitive edge. Learn how to manage the entire life cycle of a product development project using the Agile Scrum methodology, including software and hardware through to manufacturing. Understand the benefits and the value of Unit Level Traceability throughout the supply chain, logistics and your customer’s operations. >>

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Agile Scrum Methods for Cross Functional Product Development Scott Gleason, Plexus Engineering Solutions Are You Leveraging Unit Level Traceability Fully? James Trego and Kirk Griffin, Trego Integrated Systems

Tutorials Half day (3.5 hours) educational courses are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Tutorials are application oriented and structured to combine field experience with scientific research to solve everyday problems. Registration includes breaks, course materials and a Certificate of Attendance.

Sunday, September 27 T1

Advanced Closed Loop Process Control for Selective Soldering NEW!

Bob Klenke, ITM Consulting Sunday, September 27 | 8:30am – 12:00pm Room 50

Topics Covered >> Automatic fiducial location >> Automatic board warpage compensation >> Advanced drop-jet flux deposition >> In-process flux verification/ and calibration >> Mitigation of no-clean flux residues >> Combined wave soldering capability 0.5mm ultra-fine pitch selective soldering >> Graphics-based programming and machine operating software >> Advances in solder nozzle design to reduce intermetallic buildup >> Striations in solder nozzle design to ensure laminar molten solder flow >> Selective soldering with high melting point (HMP) solder alloys

T2

It is Time for Low Temperature: Low Temperature Solders, New Developments, and Their Applications NEW!

Ning-Cheng Lee, Ph.D., Indium Corporation Sunday, September 27 | 8:30am – 12:00pm Room 51

Topics Covered >> Market demand & tentative binary alloys options >> SnIn >> BiSn >> BiSn + Ag + Proprietary Dopants >> BiSn+In, Ni >> BiSn + Sb, Zn, Ag >> SnInAg and applications

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T3

Stencil Printing — A Practical Guide to Defect Prevention and Yield Improvement

Chrys Shea, Shea Engineering Services Sunday, September 27 | 8:30am – 12:00pm Room 52

Topics Covered >> Solder paste >> Mechanics of the printing process >> Troubleshooting process problems >> Stencil design >> Stencil materials and manufacturing processes >> Automatic Solder Paste Inspection (SPI) >> Stencil underwiping >> Review and Q&A

T4

0201, 01005 Plus Smaller Chip Component Design and Assembly NEW!

T5

Fred Dimock, BTU International and Karl Seelig, AIM Solder Sunday, September 27 | 1:30pm – 5:00pm Room 52

Topics Covered >> Recipe and profiles >> Properties of solder paste >> Metals and flux >> Profile shapes >> Defect identification and mitigation >> Solder balls >> Opens >> Voids >> Tombstoning

T6

Bob Willis, bobwillisonline.com Sunday, September 27 | 8:30am – 12:00pm Room 53

Topics Covered >> Component technology for 0201, 01005 and beyond >> Packaging issues >> Soldering small passives with Lead-Free >> PCB design requirements >> Pad sizes spacing >> Solder joints strength and reliability >> Printing process >> Stencil and paste implications >> Chip component placement requirements >> Packaging tolerances >> Reflow soldering defects & prevention >> Profiling boards >> Advantages and disadvantages of nitrogen >> Defects caused by reflow using visual and X-ray inspection >> Rework and repair methods >> Types of tools and procedures

Solder Reflow Fundamentals — Understanding Thermal Profiles and Defect Mitigation NEW!

Manufacturing Wrong: Case Studies in Non-Conformance NEW!

David Hillman, Rockwell Collins Sunday, September 27 | 1:30pm – 5:00pm Room 50

Topics Covered >> Case Study 1: But It’s Just Packaging! >> Case Study 2: Look At The Pretty Finish! >> Case Study 3: Stupid Coupons >> Case Study 4: Never Trust the Salesman >> Case Study 5: White Residues >> Case Study 6: Barney Boards >> Case Study 7: Sanitizers, Lotions & Bears Oh My! >> Case Study 8: What’s a Tin Whisker? >> Case Study 9: The Bigger the Glob, the Better the Job >> Case Study 10: Fried Connectors >> Case Study 11: I Swear, It’s the Same Process >> Case Study 12: I Have A “Secret” Technique

2015 SMTA International

SHOW DIRECTORY >> 17

T7

SMT Design and Assembly Process Principles for Flexible and Rigid Flex Circuits NEW!

Monday, September 28 T9

Vern Solberg, Solberg Technical Consulting

Failure Analysis: Analytical Techniques and What They Tell You About Your Failure

Sunday, September 27 | 1:30pm – 5:00pm Room 51

Martin Anselm, Ph.D., Rochester Institute of Technology

Topics Covered >> Applications >> Establishing end use criteria >> Commercial/Consumer >> Industrial/Automotive >> Medical/Aerospace >> Material and SMT component >> Standards for flex and rigid-flex materials >> Metallization technologies >> Flex and rigid flex fabrication >> Circuit routing design rules >> Designing flexible and rigid-flex circuits >> Flex circuit outline planning >> Selection criteria for SMT components >> SMT land pattern development >> Surface finish variations >> Assembly processing of flex and rigid-flex circuits >> Dimensioning and tolerance criteria >> Palletized layout for in-line assembly processing >> SMT assembly process methodologies >> Alternative joining techniques for flexible circuits

Monday, September 28 | 8:30am – 12:00pm Room 53

T8

High-Temperature Electronics Manufacture Using Selective Laser and Robotic Point Alloys NEW!

Bob Willis, bobwillisonline.com and NPL National Physical Laboratory Sunday, September 27 | 1:30pm – 5:00pm Room 53

Topics Covered >> Oil, gas, space, automotive and military applications reference books, specification and standards >> Product temperature range >> Component compatibility >> PCB substrate choices and specifications and design >> Soldering alloy choices >> Assembly & soldering options >> Setting up and assessment of soldering systems >> Critical choice in the selection of cored wire for automated assembly >> Reliability assessment & testing results >> Failure modes >> Inspection of solder joints and new defect types

Topics Covered >> Analytical testing techniques >> Root causes of production failures >> Failure analysis studies - analytical techniques used for determining root cause for defects in fine-pitch printing, PoP, and high Tg laminate failures

T10 3D Packaging for the SMT Specialist NEW! Charles Bauer, Ph.D., TechLead Corporation Monday, September 28 | 8:30am – 12:00pm Room 54

Topics Covered >> 3D history, trends, and drivers >> 3D packaging strategies >> Package on package >> PoP failure analysis >> PoP applications >> Economics of 3D >> 3D intellectual property landscape

T11 Solder Joint Reliability — Principles and Applications NEW! Jennie Hwang, Ph.D., H-Technologies Group Monday, September 28 | 8:30am – 12:00pm Room 52

Topics Covered >> Solder joint fundamentals & thermomechanical behavior and degradation – fatigue and creep interaction >> Solder joint failures modes - interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surfacecrack, and others >> Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture >> Solder joint strengthening metallurgy >> Intermetallic compounds – different types and effects, at-interface vs. in-bulk, Pb-free vs. Sn-Pb >> Illustration of microstructure evolution vs. strengthening in Sn Cu+x,y,z and SnAgCu+x,y,z systems >> Solder joint voids vs. reliability — causes, effects, criteria >> Solder joint surface-crack — causes, effects >> Distinctions and commonalties between Pb-free and SnPb solder joints >> Thermal cycling conditions — effects on test results and test results interpretation

18 >> 2015 SMTA International SHOW DIRECTORY

>> Testing solder joint reliability – discriminating tests and discerning parameters >> Life-prediction model vs. reliability >> Solder joint performance in harsh environments >> What are on the horizon and what impact will be on reliability? >> Best practices and Ultimate reliability

T12 SMT and Through Hole Defect Analysis and Process Troubleshooting — Part 1 NEW! S. Manian Ramkumar, Ph.D., Rochester Institute of Technology Monday, September 28 | 8:30am – 12:00pm Room 55

Topics Covered >> SMT and THT Process >> Assembly types and processes >> Process defects and definitions >> Identifying different defects >> Factors influencing the process defects >> PCB related >> Component related >> Materials related >> Equipment related >> Process related >> Supplier related >> Employee/Knowledge related >> Environment related

T13 ZEN and Science of Electronic Assembly — Best Practices in Electronic Assembly Processes — Part 1 NEW! Phil Zarrow and Jim Hall, ITM Consulting Monday, September 28 | 8:30am – 12:00pm Room 51

Topics Covered >> Introduction >> Definition of “best practices” >> Best practices in the assembly process >> Solder paste printing process best practices >> Stencil >> Solder paste >> Printing >> Pick and place best practices >> Reflow soldering best practices

T14 Reliability of Electronics — The Role of Intermetallic Compounds NEW! Jennie Hwang, Ph.D., H-Technologies Group Monday, September 28 | 1:30pm – 5:00pm Room 52

Topics Covered >> Intermetallic compounds — definition, fundamentals, characteristics >> Phase diagrams of Pb-free solders in contrast with SnPb

>> Intermetallic compounds in the intrinsic material — Pb-free vs. SnPb >> Formation and growth during production process and in product service life >> Different types of intermetallic compounds — effects on solder joint reliability >> Intermetallic compounds — at-interface vs. in-bulk >> Effects from substrate compositions (hybrid module thick film pads, PCB surface finish) + component surface coating >> SAC alloys incorporated with various doping elements — characteristics, performance >> Effects on failure mode >> Effects on reliability

T15 “Tipping Point” Cleaning and Deflux NEW! Barbara Kanegsberg and Ed Kanegsberg, BFK Solutions Monday, September 28 | 1:30pm – 5:00pm Room 54

Topics Covered >> Cleaning and defluxing — why you need both >> How soils stick; how to remove them >> When to use your current cleaning process; when you need something different >> How to get a problematic supply chain to support effective cleaning >> Cleaning for high value applications like medical devices and aerospace/military >> How regulations affect cleaning options >> New developments in cleaning agents and processes >> Identify important tests for both ionic and non-ionic residues >> How to use successful cleaning and defluxing as a marketing tool

T16 Design for Manufacturing (DFM): Today’s Design Challenges Require New Assembly Methods Dale Lee, Plexus Corp. Monday, September 28 | 1:30pm – 5:00pm Room 53

Topics Covered >> Elements of Global Product Design Process >> Printed Circuit Board design impacts on soldering process/quality >> SMT solder process design impacts: thermal balance, trace routing, process tooling design, assembly equipment limitation/tolerance, industry standards, PCB finishes, BTC-low stand-off components (LGA, QFN) >> Through hole component solder process design impacts: thermal connection, hole size, pad design, lead free solder impacts, PCB finishes >> Cleaning Impacts SMTAssociation

@SMTAorg #SMTAI

T17 SMT and Through Hole Defect Analysis and Process Troubleshooting — Part 2 NEW!

Thursday, October 1

S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

SMTA’s GIFT to YOU!

Monday, September 28 | 1:30pm – 5:00pm Room 55

Topics Covered >> Creating a problem statement >> Initial problem definition >> Ideal vs. actual >> Data collection >> Questioning to the void (data collection) >> Process flow mapping >> What? Where? When? Extent? >> Final problem definition (object and defect) >> Organizing the data related to the problem >> “Is” and “Is Not” comparison >> Differences influencing the “Is” and “Is Not” >> Changes influencing the differences >> Identifying probable root cause(s) >> Testing the possible root causes >> Selecting the most probable cause >> Verifying the most probable cause >> Finding a fix for the root cause >> Developing and classifying the objectives (Must and Want) >> Identifying and evaluating the alternatives >> Identify the risks with alternatives >> Final decision for a fix >> Testing the fix

T18 ZEN and Science of Electronic Assembly — Best Practices in Electronic Assembly Processes — Part 2 NEW! Phil Zarrow and Jim Hall, ITM Consulting

To thank you for 30 years of support for the SMTA, we are offering SMTA members a FREE half day course! On Thursday, October 1st, Dr. Bill Cardoso from Creative Electron will teach a course on “LED, BGA and QFN Assembly and Inspection”. Full details are below. You are required to register to receive a handout and a Certificate of Completion, but there is no charge for the course. (Non-member rate applies)

T19 LED, BGA, and QFN Assembly and Inspection NEW! Bill Cardoso, Ph.D., Creative Electron Thursday, October 1 | 8:30am – 12:00pm Room 48

Topics Covered >> How LED material handling and storage impact assembly performance >> LED x-ray inspection: How voids cost you money >> Case study: How lack of quality killed a successful LED company >> Process design for BGA and QFN assembly and rework >> BGA and QFN x-ray inspection: How to see what often goes wrong >> X-Ray as a tool for quality process design and control

Monday, September 28 | 1:30pm – 5:00pm Room 51

Topics Covered >> Best practices in the assembly process — continued >> Wave and selective soldering best practices >> Cleaning vs No-Clean considerations and best practices >> Best Practices concerning “challenging technologies” >> QFNs >> Ultra-miniature components (0201s, 01005s, ultra-fine pitch BGAs and CSPs) >> Q&A

2015 SMTA International

SHOW DIRECTORY >> 19

Technical Sessions Monday, September 28 FOCUSED SYMPOSIUM I Evolving Technologies Summit Organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory; Lars Böttcher, Fraunhofer IZM Berlin; and Steve Greathouse, Plexus Corp. Monday, September 29 l 8:30am – 5:00pm

FREE with a VIP or Technical Conference Registration!

ET1 Alternate Alloys Chair: Richard Coyle, Ph.D., Alcatel-Lucent Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd. Monday, September 28 | 9:00am – 10:30am Room 48

Near-eutectic, high Ag SAC305 solder is the accepted choice for most electronic assembly applications, but some concerns have been raised over the performance of SAC305 in harsh thermal cycling environments, particularly if vibration and shock loading are involved. Additionally, there are problems associated with the high temperature processing required for SAC305, and the cost of high Ag alloys is an issue in some market segments. These recent observations and findings indicate that high Ag alloys are not an optimum or even acceptable solution for other applications. Further, it appears unlikely that a single-alloy solution may not exist across all electronic applications. These sessions share recent process and reliability work done on alloys being considered as alternatives to high Ag SAC305. >> Comprehensive Report on Low Temperature Solder Alloys for Portable Electronics Morgana Ribas, Ph.D., Anil Kumar, Ranjit Pandher, Rahul Raut, Sutapa Mukherjee, Siuli Sarkar and Bawa Singh, Alpha India Research Centre >> Development and Characterization of Solder Pastes Based on Two Alternative Alloys: Bismuth-TinSilver (BiSn42Ag0.4-1%) for Low Temperature and Tin-Antimony (SnSb5-8.5) for High Temperature Emmanuelle Guene, P.E., Inventec Performance Chemicals >> Effect of Bi Content on Properties of Low Silver SAC Solders Mehran Maalekian, Ph.D., Yuan Xu, and Karl Seelig, AIM Metals & Alloys

ET2

ET3

Alternate Alloys (Continued)

Wearable Electronics Technology Development

Chair: Richard Coyle, Ph.D., Alcatel-Lucent Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd. Monday, September 28 | 11:00am – 12:30pm Room 48

>> Long Term Aging Effects on the Reliability of Lead Free Solder Joints In Ball Grid Array Packages With Various Pitch Sizes and Ball Alignments Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, M.J. Bozack, and J. L. Evans, Ph.D., Auburn University >> Factors Impacting the Reliability of Ultra-Low Silver Lead-Free Alloys Neil Poole, Ph.D., *Brian Toleno, Ph.D. and Mark Curie, Ph.D., Henkel Electronic Materials, LLC >> Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups Formed by Reflow Soldering SAC Solder Balls BGAs with BiSnAg and Resin Reinforced BiSn Based Solder Pastes Olivia H. Chen, Al Molina, Ph.D., Kevin Byrd, Scott Mokler, Raiyo Aspandiar, Ph.D. and Kok Kwan Tang, Intel Corporation

ET Keynote Lunch Chair: Reza Ghaffarian Ph.D., Jet Propulsion Laboratory Monday, September 29 l 12:30pm – 1:30pm Room 48

>> Wearables Technology - The Next Manufacturing Wave Murad Kurwa, Flex A new wave of wearables brings with it plenty of manufacturing process development concerns. Kurwa will discuss advances like stretchable conductives, fabrics, interconnects, substrates and the integration of new sensor technology in fabrics. He will also cover assembly methodologies for new stretchable conductives and encapsulation techniques. The presentation will include a manufacturing oriented DOE, FEA and will also address many reliability issues for electronics and sensors on fabrics like acceleration factor (AF), stretchability testing and sweat testing.

* distinguished speakers 20 >> 2015 SMTA International SHOW DIRECTORY

Chair: Alex Chen, Celestica, Inc. Co-Chair: Brian Toleno, Ph.D., Microsoft Corporation Monday, September 28 | 1:30pm – 3:00pm Room 48

Wearable electronics devices are expanding from fitness and wellness applications to almost anything, including health-tech and medical industry, automotive industry, security and defense industry. This brave new sector is propelled by technology advances and experiencing some growing pains – technological challenges, such as selecting the right interconnect technology, how to make textiles smart, or how to manufacture new and innovative high-mix products at high volume but low cost. The session on wearable electronics will bring insights on some exciting technological advances and ways of managing the challenges. >> Smart Textiles for Wearable Technology *Chris Hunt, Ph.D., Roya Ashayer-Soltani and Kathryn Wills, National Physical Laboratory >> Connector Design for Wearables *Randy Schueller, Ph.D., DfR Solutions >> Wearable Electronics & Big Data = High Volume, High Mix SMT! *Charles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D., TechLead Corporation

ET4 FREE! Evolving Technologies Panel: Covering Key Technologies Including: 3D Packaging Technology Trends, Emerging Technologies, Renewable Energy, Optics and Photonics, Wearable Electronics, and Next Generation PCBs for Embedded Technologies COMPLIMENTARY BEER AND PRETZELS! Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Lab Co-Chair: Paul Wang, Ph.D., Mitac International Monday, September 28 | 3:30pm – 5:00pm Room 48

Panelists include: >> Lars Böttcher, Fraunhofer IZM Berlin >> Richard Coyle, Ph.D., Alcatel-Lucent Steve >> Greathouse, Plexus Corp. >> Irene Sterian, P.E., Celestica, Inc. >> Chuck Woychik, Ph.D., Invensas Corporation

FOCUSED SYMPOSIUM II Harsh Environments

HE2

(Note: this symposium continues on Tuesday)

Electronics in Corrosive Environments

Organized by John Evans, Ph.D. and Pradeep Lall, Ph.D., Auburn University; Robert Kinyanjui, Ph.D., John Deere Electronic Solutions

Monday, September 28 | 10:30am – 12:30pm Room 45

Monday, September 28 l 8:00am – 5:00pm

FREE with a VIP or Technical Conference Registration!

HE1 Reliability of Components in Harsh Environments Chair: Matt Kelly, P.Eng., MBA, IBM Corporation Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions Monday, September 28 | 8:00am – 10:00am Room 45

Reliability of Lead-Free assembled hardware continues to be a focus item for a variety of harsh environment applications including deep well drilling, automotive under the hood, and avionics. This session examines hardware reliability performance including mirrored memory with underfill configurations, isothermal fatigue of doped lead-free alloys, and mechanical vibration conditions. Application needs, field use simulation conditions, and resulting failure analysis will be discussed. >> Thermal Shock Reliability Test on Multiple-Doped Low-Creep Lead-Free Solder Paste and Solder Ball Grid Array Packages Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, John Evans, Ph.D., Michael Bozack, Ph.D. and Wayne Johnson, Ph.D., Auburn University >> Solder Joint Fatigue Characterization of DDR3 SDRAMs and Other Advanced BGA Packaging Memory Types Arnaud Grivon, Damien Baudet, Michel Brizoux, Aurélien Lecavelier and Wilson Maia, Thales Global Services >> Avionics Vibration Durability Between Sn-Pb and Lead-Free Solder Interconnects *Joseph Juarez, Ph.D., Honeywell International >> Isothermal-Fatigue of HighTemperature Solder Joints Harry Schoeller, Ph.D., Universal Instruments Corporation

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Chair: Marie Cole, IBM Corporation Co-Chair: John Evans, Ph.D., Auburn University

Electronics in data centers that may have harmful environments resulting from the ingress of outdoor particulate and/or gaseous contamination can be at risk for corrosion. Supplying robust hardware for these data centers, mostly in emerging markets, can be a challenge if the risk of corrosion failures is not well understood. In this session, you will learn about the corrosion risk associated with various PCB finishes and memory module components, how to mitigate corrosion risks for electronics. and methods to predict field performance in high sulfur environments through accelerated laboratory testing. >> Sulfur Corrosion of Printed Circuit Board Surface Finishes in Three Different Sulfur-Rich Environments Matthew Weeks, Ph.D. and David J. Zueck, Western Digital Technologies, Inc. >> Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2 Haley Fu, iNEMI; Prabjit Singh, IBM Corporation; Aamir Kazi and Wallace Ables, Dell Corporation; Dem Lee and Jeffrey Lee, iST-Integrated Service Technology, Inc.; Karlos Guo and Jane Li, Lenovo (Beijing) Limited Corporation; Simon Lee and Geoffrey Tong, The Dow Chemical Company >> The Corrosion Failure Risk Assessment of Memory Module at Data Center in Harsh Environmental Conditions Sungwon Han and Yuchul Hwang, Samsung Electronics; Biao Cai and Marie Cole, IBM Corporation >> An Attempt to Study the MFG Test Pollutant Chemistry Effect to Match Filed Data Vasu Vasudevan, Karumbu Meyyappan, Anil Kurella, Karl Pazdernik, and Balu Pathangey, Intel Corporation

HE Keynote Lunch Chair: Pradeep Lall, Ph.D., Auburn University Monday, September 28 | 12:30pm – 1:30pm Room 45

To feed the world population in 2050 it is estimated the current agricultural production must double. Technology is critical to increasing agricultural equipment’s utilization and output leading to more efficient farming methods and improved yields. The quality and reliability of electronics used for precision guidance, sensing, controlling engines and other key technologies is essential to optimizing equipment performance. Improving reliability in electronics used in farming is challenging, both in electronic design and manufacturing as well as material selection. This has become more apparent following the global transition of electronic manufacturing from the conventional leaded component technology to lead-free technology. This presentation will provide a genesis and the evolution of electronics designed for use in harsh physical and electrical environments, particularly those used in farming and automotive industries. Examples of ruggedization protocols will be discussed.

HE3 Materials for Harsh Environments Chair: Raiyo Aspandiar, Ph.D., Intel Corporation Co-Chair: Iulia Muntele, Ph.D., Sanmina Corporation Monday, September 28 | 1:30pm – 3:00pm Room 45

The requirements and demands placed on heat sinking and soldering materials for applications in aerospace, automotive, defense and telecommunication electronic products are far more stringent than other industries. This session will describe newly developed solder alloys, solder pastes and evaluate promising thermal pastes for use in harsh environments prevalent for these industries. >> Assessment of Thermal Pastes for Use in Space Electronics Jeffrey Marcus Jennings, Susan M. Marlowe and Peter F. Ruggiero, Harris Corporation >> Novel Lead-Free Solder Alloys Development for Automotive Applications Weiping Liu, Ph.D. and *Ning-Cheng Lee, Ph.D., Indium Corporation >> Low Voiding, High Reliability Solder Paste for Automotive, LED and Other Demanding Applications Rahul Raut, Westin Bent and Michael Liberatore, Alpha, an Alent plc Company

>> Extreme Environment Electronics — Where We’ve Been, Where We Are Going and What Could Be Next Jim Springer, John Deere Electronic Solutions

2015 SMTA International

SHOW DIRECTORY >> 21

Tuesday, September 29 APT1 3D IC and PoP Assembly Chair: Lars Böttcher, Fraunhofer IZM Berlin Co-Chair: Vern Solberg, Solberg Technical Consulting Tuesday, September 29 | 11:00am – 12:30pm Room 44

Package on Package and 3DIC has become widely spread in today’s mobile applications. Both need to address reliable and cost efficient technology and assembly. This session will address both PoP and TSV methods and, in addition, will look into the reliability performance of new interconnect materials like copper wire bonds. >> High-Volume-Manufacturing (HVM) of BVA Enabled Advanced Package-onPackage (PoP) Rajesh Katkar, Ashok S. Prabhu, and *Wael Zohni, Invensas Corporation >> Assembly Challenges for 2.5D and 3D IC Packaging *Charles G. Woychik, Ph.D., Guilian Gao, Cyprian Uzoh, Hong Shen, Liang Wang, Sangil Lee, Roseann Alatorre, Scott McGrath, Mohamed Elassar and Sitaram Arkalgud, Invensas Corporation >> Corrosion and Contaminant Diffusion Multi-Physics Model for Copper-Aluminum Wirebonds in High Temperature High Humidity Environments *Pradeep Lall, Ph.D. and Yihua Luo, Auburn University; Luu Nguyen, Ph.D., Texas Instruments, Inc.

EMS1 Taking the Cost out of EMS: Getting the Best Return for Lean Initiatives Chair: Susan Mucha, Powell-Mucha Consulting, Inc. Co-Chair: Mike Buetow, Circuits Assembly Magazine Tuesday, September 29 | 11:00am – 12:30pm Room 54

In today’s world of variable demand and higher mix product, electronics manufacturing services (EMS) companies need to be flexible and agile to respond to changing customer needs. At the same time, EMS companies also need to address efficiency and cost reduction in an environment characterized by razor thin margins. Does a more holistic approach to implementing Lean manufacturing philosophy hold the answers to best addressing these challenges? Join us as a regional EMS provider and supplier of manufacturing shop floor control solutions discuss how a Lean, yet agile EMS operation can be created by rethinking

how customers, the supply chain, support functions and manufacturing operations work together in an interconnected Lean environment. Following the presentations, there will be a panel discussion with the audience focused on ways this type of holistic approach can eliminate the common constraints to effective Lean implementation found in the EMS environment. >> Lean Flow On The SMT Factory Floor Michael Ford, Mentor Graphics >> Applying Lean Philosophies to Supply Chain Management in EMS Wally Johnson, Firstronic, LLC >> Panel Discussion

FSA1 Improved Area Array Component Solder Reliability Through Use of Underfills, Edge Bonds and Encapsulants Chair: Dale Lee, Plexus Corp. Co-Chair: Morgana Ribas, Ph.D., Alpha India Research Centre Tuesday, September 29 | 11:00am – 12:30pm Room 47

With increased use of area array components in high reliability and harsh environment applications, the need for solder connection reliability enhancement materials has increased. This session will share recent work done to improve reliability of solder connections through use of solder joint encapsulant, edge bond and underfill materials. >> WLCSP and BGA Reworkable Underfill Evaluation and Reliability Fei Xie, Ph.D., Han Wu, Daniel F. Baldwin, Ph.D., Swapon Bhattacharya, Ph.D. and Kelley Hodge, Engent, Inc.; Qing Ji, Ph.D. and Ben Bo, H.B. Fuller >> Evaluation of High Reliability Reworkable Edge Bond Adhesives for BGA Applications Fei Xie, Ph.D., Han Wu, *Daniel F. Baldwin, Ph.D., Swapan Bhattacharya, Ph.D. and Kelley Hodge, Engent Inc.; Qing Ji, Ph.D., H.B. Fuller >> A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications Mary Liu, Ph.D. and Wusheng Yin, Ph.D., YINCAE Advanced Materials, LLC

22 >> 2015 SMTA International SHOW DIRECTORY

MFX1 Pathways to Prolific Printing Chair: Jeff Schake, ASM Assembly Systems - DEK Co-Chair: Ray Whittier, Vicor Corporation Tuesday, September 29 | 11:00am – 12:30pm Room 49

Although the SMT stencil printing process is conceptually simple, it is governed by a complicated network of interrelated variables. Detangling these variables leads to different investigation paths that ultimately converge to improve overall printing process understanding. This session explores a diverse range of printing research interests, from managing print process control in unfavorable production conditions to controlled experiments pursuing low area ratio printing characterization and visualization. >> Evaluation of the Stencil Printing for Highly Miniaturized SMT Components With 03015mm in Size *Stefan Härter and Jörg Franke, Institute for Factory Automation and Production Systems (FAPS), Freidrich-AlexanderUniversity Erlangen-Nürnberg (FAU); Carmina Läntzsch, LaserJob GmbH >> Video Analysis of Solder Paste Release from Stencils *Chrys Shea, Shea Engineering Services; Mike Bixenman, DBA and Wayne Raney, KYZEN Corporation; Ray Whittier, Vicor Corporation >> A Different Perspective on Solder Paste Printing: Perfecting the Print Process with Practical Solutions Michael J. Cieslinski and Brent A. Fischthal, Panasonic Factory Solutions Company of America

HE4 HARSH ENVIRONMENTS Continued from Monday

Electronics Ruggedization Through Coating Chair: Chair: Iulia Muntele, Ph.D., Sanmina Corporation Co-Chair: Pradeep Lall, Ph.D., Auburn University Tuesday, September 29 | 11:00am – 12:30pm Room 45

Whether it is protection from hostile environments (temperature and/or pressure extreme values, humidity, corrosive atmosphere, UV light, shock and/or vibration), or to aid in the electrical design parameters of a PCBA, conformal coating has been the method of choice for designers. Despite a wide range of coating materials availability, ongoing research efforts continue to close gaps and expand the quest for lighter, easier application

and reworkable materials. Both consumer and high-reliability electronics benefit from the results of these research efforts. This session’s presentations bring forth the data acquired in recent investigations of epoxy, silicone, parylene, fluoropolymer coatings, and highlight their applicability in harsh environments with hard to control temperature and moisture levels. >> Performance, Application and Process Monitoring of Liquid Applied Ultrathin Fluoropolymer Coatings for Protection of Electronics Erik Olson, Molly Smith, Greg Marszalek and Karl Manske, 3M Company; Nikesh Dhar, Google >> Characterization of Conformal Coatings Prabjit Singh, Ph.D., IBM Corporation >> Ensuring Performance and Reliability of High Temperature Electronics Through Thermally Stable Parylene HT at Nano/Micro Levels Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.

APT2 BGA Reliability Chair: Randy Schueller, Ph.D., DfR Solutions Co-Chair: Derrick Herron, Indium Corporation Tuesday, September 29 | 2:00pm – 3:30pm Room 44

Area Array Packages continue to be pushed to higher levels of reliability to meet the demands of the industry. The papers in this session do an excellent job of determining, through modeling and experimentation, the critical variables of both the package and PCB that most impact the reliability. >> Solder-Joint Reliability of 0.8mm BGA Packages for Automotive Applications Burton Carpenter, Freescale Semiconductor, Inc.; Thomas Koschmieder, Cirrus Logic, Inc. >> Board, Package and Die Thickness Effects Under Thermal Cycling Conditions *Jean-Paul Clech, EPSI, Inc. >> Bending Strength of Solder Joints as a Function of Joint Length Saeed Akbari, Amir Nourani and Jan K. Spelt, University of Toronto

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@SMTAorg #SMTAI

FSA2 New Developments in No-Clean Solder Paste and Flux Technology and Reliability Chair: Eric Bastow, Indium Corporation Co-Chair: Renzhe Zhao, Huawei Technologies Co., Ltd. Tuesday, September 29 | 2:00pm – 3:30pm Room 47

This session will focus on new developments and reliability challenges in the no-clean solder paste and flux arena. Special attention will be given to electrical reliability challenges associated with partially activated flux residues. This will be incorporated with an overview of the ongoing evolution of flux technology driven by miniaturization and new component designs and soldering challenges. >> Evolution of the Performance and Reliability Requirements of Soldering Fluxes Karl Seelig and Timothy O’Neill, AIM >> “Partially-Activated” Flux Residue Influence on Surface Insulation Resistance of Electronic Assembly Xiang (Shawn) Wei, Ph.D., Kyle Loomis, Jennifer Allen and Bruno Tolla, Kester, Inc. >> The Risk and Solution for No-Clean Flux Not Fully Dried Under Component Terminations Fen Chen and *Ning-Cheng Lee, Ph.D., Indium Corporation

MFX2 Challenges in Advanced Package on Package Applications Chair: John McMahon, P.E., Celestica, Inc. Co-Chair: Greg Wade, Indium Corporation Tuesday, September 29 | 2:00pm – 3:30pm Room 49

“Package on Package” (PoP) is the dominant configuration for mobile processors. It enables processor/cache memory interaction using industry generic packages and represents the lowest cost solution by maintaining supply chain options until final assembly. Continuing miniaturization is driving component height reductions in direct competition to increasing functionality. This session highlights some challenges and solutions associated with the advances in PoP applications.

>> Advanced Analysis of Package-onPackage Interconnect Gaps During Reflow Assembly Ken Chiavone, Akrometrix, LLC >> Assembly Process Development for a 14mmx14mm Bond Via Array (BVA) Package-on-Package (PoP) Shane M. Lewis, Ph.D. and Tushar Tike, Sanmina Corporation; Charles Woychik, Ph.D. and Ashok Prabhu, Invensas Corporation; Vineeth Bastin, Nordson DAGE >> Challenges for SMT Assembly of PoP Packages Lilia May, Ph.D., Rajen S. Sidhu, Chang Lin Pubudu Goonetilleke, Huiyang Fei, Satyajit S. Walwadkar and Katherine J. Downes, Intel Corporation

HE5 Thermal Management (Get the Heat Out!) Chair: Robert Kinyanjui, Ph.D., John Deere Electronic Solutions Co-Chair: Raiyo Aspandiar, Ph.D., Intel Corporation Tuesday, September 29 | 2:00pm – 4:00pm Room 45

Efficient thermal relief is required in order to obtain expected performance of electronic components, especially those operating in high temperature environments. The Get the Heat Out session presents works on different heat management technologies as well as the unintended consequences of some thermal relief methods to the reliability of electronic components. >> Design Considerations in the Use of Phase Change Materials in Data Center Cooling Jeff Luttrell, Abhishek Guhe and Dereje Agonafer, Ph.D., University of Texas - Arlington >> Peak Temperature Limitation of Electronic Assemblies with Phase Change Materials Mathias Nowottnick, Andrej Novikov and Daniel Lexow, University of Rostock >> High Efficient Heat Dissipation on Printed Circuit Boards Markus Wille, Schoeller-Electronics GmbH >> Defining Mechanical Load Limits for Thermal Solutions on High Performance FCBGA Packages *Brian Roggeman, Jintao Zheng, Mark Schwarz and Ahmer Syed, Qualcomm Technologies, Inc.

2015 SMTA International

SHOW DIRECTORY >> 23

APT3 Advances in WLP and CSP Interconnect Design and Assembly Processes Chair: Chuck Woychik, Ph.D., Invensas Corporation Co-Chair: Mike Bixenman, DBA, KYZEN Corporation Tuesday, September 29 | 4:00pm – 5:30pm Room 44

As WLP component pitches decrease, it becomes more difficult to assemble these packages. A systematic approach has been used to develop a robust stencil printing process for 0.3 mm pitch packages. Data will be presented along with conclusions on how the stencil printing process affects the ultimate reliability of 0.3 mm pitch CSP assemblies. Also, in this session the use of polymer cored balls was evaluated on CSP packages which resulted in a 70% improvement in drop testing and 25% improvement in thermal cycle testing. The process used to assemble these polymer core assemblies will be discussed along with the reliability data. Finally, a novel dip encapsulant was evaluated to improve board level reliability on CSP packages. This dip encapsulant is a polymer adhesive which encapsulates the BGA joints after reflow. Thermal cycling was performed using -40 to 125º C temperature range. This work reveals that dip encapsulation can be used as an alternative to solder paste printing, while also improving board level reliability. >> The Development of a 0.3mm Pitch CSP Assembly Process, Part 2: Assembly & Reliability *Mark Whitmore and Jeff Schake, DEK Printing Solutions, ASM Assembly Systems >> Development of Low Cost and High Pin Count Wafer Level Packaging Karthik Thambidurai, Viren Khandekar, Tiao Zhou, Ph.D. and Kaysar Rahim, Maxim Integrated >> Improved SMT and BLR of 0.35mm Pitch Wafer Level Packages *Brian Roggeman and Beth Keser, Qualcomm Technologies, Inc.

FSA3 The How’s and Why’s of Fluxes in Electronics Assembly Chair: Scott Priore, Cisco Systems, Inc. Co-Chair: Rod Howell, Libra Industries Tuesday, September 29 | 4:00pm – 5:30pm Room 47

There have been some key advances in the fluxes that are used in electronic assemblies. Fluxes are the most critical element in soldering and these three papers will look at the advances in flux for solder paste, wave solder, and the use of epoxy fluxes for some applications. >> Rosin vs. Non-Rosin Wave Flux- Which Creates More Reliable Electronic Assemblies? Adam Murling and *Ron Lasky, Ph.D., P.E., Indium Corporation >> Formulation of a New Liquid Flux for High Temperature Soldering *Tony Lentz, FCT Assembly >> Epoxy Flux Material and Process for Enhancing Electrical Interconnections Neil Poole, Ph.D., Elvira Vasquez and *Brian Toleno, Ph.D., Henkel Electronic Materials, LLC

Wednesday, September 30 FSA4 The Influence and Impact of Materials & Process Selection on Reliability Chair: David Hillman, Rockwell Collins Co-Chair: Ursula Marquez de Tino, Plexus Corp. Wednesday, September 30 | 8:00am – 9:30am Room 47

An electronic assembly is the sum of its materials and processes — a detailed balance of material combinations and design parameters which done correctly produces today’s modern electronics or when done incorrectly, causes process engineers headaches. This technical session will provide a deep dive into three distinct materials and process topics: the use of SIR testing to characterize electrochemical reliability; the interaction of component diversity and product reliability; the role of phosphorus in evolution of today’s lead-free solder alloys. >> SIR and ECM Testing of Soldering Materials vs. Soldering Processes Karen Tellefsen, Ph.D., Alpha, an Alent plc Company >> Reliability Improvements by the Creation of Intermetallic Connections *Joerg Trodler, Dipl.-Ing, Heraeus Deutschland Gmb&Co.KG and Heinz Wohlrabe, Ph.D., Technical University Dresden >> The Effects of Phosphorus in Lead-Free Solders *Keith Sweatman, Takatoshi Nishimura and Takuro Fukami, Nihon Superior Co., Ltd.

24 >> 2015 SMTA International SHOW DIRECTORY

INS1 X-Ray Inspection: The Growing Complexity of Applications and Capability Needs for Tomorrow’s PCBs Chair: States Mead, Navitas Systems, LLC Co-Chair: Terry Munson, Foresite, Inc. Wednesday, September 30 | 8:00am – 9:30am Room 51

This session covers the evolving level of detail inspection requirements being asked of X-Ray equipment. Learn about how this is being achieved through development of enhanced algorithms, optimization techniques, and added capabilities of X-Ray inspection for components like solder charge and press-fit connectors. We will also explore how X-Ray technology is even being pushed to establish measurements of deformation and strain in operational electronics which is currently limited to cut-plane techniques. >> New X-Ray Algorithms to Improve the Detection of Counterfeit Components *Bill Cardoso, Ph.D., Glen Thomas, Ph.D., Griffin Lemaster, Carlos Valenzuela, Brian Wagner, Tom Gasaway, and Jesse Squire, Creative Electron, Inc. >> Optimization of X-Ray Inspection for Solder Charge Connectors David Geiger, Zhen (Jane) Feng, Ph.D., Jennifer Nguyen, Weifeng Liu, Ph.D., Anwar Mohammed, Murad Kurwa, Golden Xu and Lea Su, Flextronics International; George Tint, Ph.D., HDI Solutions, Inc. >> Deformation and Strain Measurements in Operational Electronics Using X-Ray Micro-CT and Digital Volume Correlation *Pradeep Lall, Ph.D. and Junchao Wei, Auburn University

MFX3 Cleaning Parameters and Cleanliness Monitoring of Electronics Assemblies Chair: Barbara Kanegsberg, BFK Solutions, LLC Co-Chair: Mike Havener, Benchmark Electronics, Inc. Wednesday, September 30 | 8:00am – 9:30am Room 49

Increased complexity and miniaturization of electronic assemblies along with demanding end-use requirements mean that we must clean in situations where cleaning was previously not required. Presenters will explore their studies of how variables in the assembly process impact efficacy of the cleaning process. Attendees will gain tools to increase product reliability.

>> Impact of Multiple Thermal Cycles on the Cleaning Process *Umut Tosun, M.S.Ch.E. and Jigar Patel M.S.Ch.E., ZESTRON Americas >> Determining the Effect of Water Quality on Cleaning Effectiveness *Eric Camden, Foresite, Inc. >> Cleanliness Makes a Difference When Miniaturization Kicks In *Mike Bixenman, DBA and David Lober, KYZEN Corporation; Mark McMeen and Jason Tyne, STI Corporation

SUB1 Investigating Surface Finish Reliability and Attributes Outside of Solderability Chair: Lenora Toscano, MacDermid, Inc. Co-Chair: Don Banks, St. Jude Medical Wednesday, September 30 | 8:00am – 9:30am Room 45

Market needs and environmental changes push the industry for advances in surface finishing. Though solderability is always the primary goal for final finishes, many other critical attributes must also be considered. This session will review alternative surface finishes and speak to performance characteristics for areas left unsoldered. It will also review the latest revisions to the IPC 4552 standard as attention to the core surface finishes is a responsibility of this industry. >> Final Finish Specifications Overview IPC Plating Subcommittee 4-14 George Milad, Uyemura International Corporation >> Eliminating False Positive ICT Response Through the Use of Organic-Metal Final Finish *Rita Mohanty, Ph.D., John Fudala and Sathiya Narayana, Enthone Inc. >> Comparing PCB Surface Finishes and Their Assembly Process Compatibility Rob Rowland, Axiom Electronics, LLC; Ray Prasad, Ray Prasad Consultancy Group

APT4 Improvements in Voiding and Reliability of BTCs Chair: Brian Roggeman, Qualcomm, Inc. Co-Chair: Fei Xie, Ph.D., Engent, Inc. Wednesday, September 30 8:00am – 10:00am Room 44

The primary focus on BTCs continues to be voiding, especially on the large thermal pads, while secondary focus is on the field reliability. Improvements in voiding control will be shared using novel preform technology. Finite element modeling and empirical testing investigate the

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effects of PCB design, underfills and other types of encapsulants as a means to improve reliability. >> Voiding Control Beneath Bottom Terminated Components Using Solder Fortification Preforms Derrick Herron, Christopher Nash, Raymond Luo and Andy Wei, Indium Corporation >> Impact of Layer Thickness of QFN Mounted PCBs During Drop Testing Sayalee Sabne, A.R. Nazmus Sakib and Alok Lohia, University of Texas at Arlington >> Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat No-lead (PQFN) Package *Paul Vianco, Ph.D. and Michael K. Neilsen, Ph.D., Sandia National Laboratories >> Board Level Reliability Comparison of BGA and LGA Packages Mounted to an LGA Footprint Motherboard *Robert Darveaux, Howard Chen, Shaul Branchevsky and Bhuvaneshwaran Vijayakumar, Skyworks Solutions Inc.; Christopher J. Berry, Wyatt Huddeston and Ben Zarkoob, Amkor Technology, Inc.; Fenimore Chen, Integrated Service Technology, Inc.

FSA5 Solder Joint Reliability Assessment Chair: Tim Jensen, Indium Corporation Co-Chair: Joerg Trodler, Heraeus Deutschland GmbH & Co. KG Wednesday, September 30 10:30am – 12:00pm Room 47

Assessing the reliability of a finished solder joint can be a complex exercise. With the continued move toward Pb-Free, additional challenges that impact reliability have arisen. In this session, some of these reliability challenges related to Pb-Free transition will be discussed and ways to assess reliability will be reviewed. >> Assessing Backward Compatible Solder Joint Reliability Under Standard and Mildly Accelerated Test Conditions *Richard Coyle, Ph.D., Peter Read, Richard Popowich and Debra Fleming, Alcatel-Lucent; Vasu Vasudevan, Raiyo Aspandiar and Steve Tisdale, Intel Corporation; Iulia Muntele, Sanmina Corporation >> Quantifying Qualitative Attributes of Cored Solder Wire in LED Luminaire Soldering — Part 1 Amit Patel, Steve Prokopiak, Nicholas Herrick, Bin Mo, Rahul Raut and Ranjit Pandher, Ph.D., Alpha, an Alent plc Company

>> The Quantitative Assessment of Mixed BGA Joint With the Elimination of Low-Melting Point Alloy Re-Melting Process Hongqin Wang, Guanghui He and Daojun Luo, China Electronic Product Reliability and Environmental Testing Institute

INS2 PCB Quality Management Chair: Randy Bird, Plexus Corp. Co-Chair: Sang Liu Ph.D., Huawei Technologies Co., Ltd. Wednesday, September 30 10:30am – 12:00pm Room 51

Build, Ship, Repeat. That’s what you hope for. Regardless of your manufacturing discipline, you strive to deliver defect-free products to your customers. This session will offer process control solutions to help you do just that. >> Multi-array PCB Traceability System Christoph Wimmer, Microscan >> Man vs. Machine Keith Bryant, SMT Solutions; Thorsten Rother, YXLON International GmbH >> There is No Instant Pudding” Understanding the Roles Test Plays in Managing the Quality of Electronic Printed Circuit Board Assemblies Alan Albee, Teradyne, Inc.

MFX4 Ruggedization Technologies & Materials to Meet Today’s Electronic Requirements Chair: Jason Keeping, P.E., Celestica Inc. Co-Chair: Timothy O’Neill, AIM Wednesday, September 30 10:30am – 12:00pm Room 49

Ruggedization is not a new concept; however the materials and processes used to implement these quality improvements are a crucial part of quality developments. Without a viable total ruggedization solution; even your additional processes that are added to increase quality may still not meet the production/field yields and costs objectives of the total project. This session shares recent work done on upstream processes as well as material and application developments for ruggedization.

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>> The Future of Nanotechnology in Electronics Assembly and the Investigation of Nano-coating Materials for Water Resistant Applications *Jennifer Nguyen, David Geiger, Anwar Mohammed and Murad Kurwa, Flex >> Evaluating the Effects of Plasma Treatment Prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage John D. Vanderford, MSEE and Ann E. Paxton, Desich SMART Center; David Selestak, Nordson MARCH >> The Impact of Improper Conformal Coating Processes on BGA Solder Joint Integrity Ross Wilcoxon, *Dave Hillman, Doug Pauls and Dan White, Rockwell Collins

APT5 Advances in Electronics Failure Analysis Chair: Andrew Mawer, Freescale Semiconductor Co-Chair: Glen Herzog, Fairfield Industries, Inc. (Retired) Wednesday, September 30 10:30am – 12:30pm Room 44

This informative session will cover some of the latest techniques used to analyze a variety of failure modes in electronics assemblies. The first paper outlines a novel method for real-time detection of BGA solder joint opens. Next, a technique to detect cratering during board bending will be described followed by a discussion of an acoustic method to detect pad cratering resulting from PCB bending. Lastly, a review of several improved methods of cross-sectioning will be outlined. >> Innovative BGA Defect Detection Method for Transient Discontinuity *Steven Perng, Weidong Xie, Tae-Kyu Lee and Cherif Guirguis, Cisco Systems, Inc. >> Detection of Pad Crater Initiation in Shock Using Acoustic Emission Detection W. Carter Ralph, Southern Research Institute; Gregory N. Morscher, The University of Akron, Elizabeth Elias Benedetto, Keith Newman and Aileen Allen, Hewlett-Packard; Julie Silk, Keysight Technologies >> On-Board Package Decapsulation Techniques for Failure Analysis Priyanka Dobriyal, Ph.D., Anil Kurella, Ph.D., and Suzi Southwick, Intel Corporation >> Alternative Methods for Cross-Sectioning of SMT and PCB Related Architectures Manuel J. “Paco” Solis, Foresite, Inc.

SUB2 Emerging Topics on Design and Process Technologies of Printed Circuit Boards Chair: Raiyo Aspandiar, Ph.D., Intel Corporation Co-Chair: Don Banks, St. Jude Medical Wednesday, September 30 10:30am – 12:00pm Room 45

Printed Circuit Board Technology continues to evolve to meet densification, miniaturization and power requirements of new products and new markets. This session will discuss novel PCB design, materials and process technology developments. >> Development of Advanced Embedded Die Modules for Power Electronics Applications *Lars Boettcher, Stefan Karaszkiewicz and Andreas Ostmann, Fraunhofer Institute for Reliability and Microintegration (IZM); Dionysios Manessis, Technical University Berlin >> Direct Metallization System for Flexible Printed Circuit Board *Rita Mohanty, Ph.D., Albert Angstenberger, Melanie Rischka and Han Verbunt, Enthone, Inc. >> Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware *Matt Kelly, Mark Jeanson, Timothy Younger, Jim Bielick, Theron Lewis and Mitch Ferrill, IBM Corporation

APT6 Solder-Joint Reliability Chair: Burt Carpenter, Freescale Semiconductor Co-Chair: Jeff Jennings, Harris Corporation Wednesday, September 30 | 2:00pm – 3:30pm Room 44

Solder-joint reliability is an important aspect which can determine the useful lifetime of a component mounted to a PCB. This session will explore the effects of a variety of package types (including PBGA, CBGA, and Super-BGA), package sizes and solder alloy composition on the solder-joint lifetime in temperature cycle testing. Data from drop shock, component shear, and vibration tests will also be shown.

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>> Development of Lead-Free Alloys With Ultra-High Thermal-Mechanical Reliability Pritha Choudhury, Ph.D., Morgana Ribas, Ph.D., Ranjit Pandher, Ph.D., Anil Kumar, Sutapa Mukherjee, Siuli Sarkar, Ph.D. and Bawa Singh, Ph.D., Alpha, an Alent plc Company >> A Selected Comparison from ATC Test: Industry Progress from 2005 to Present Day *John McMahon, P.E., Russell Brush and Brian Standing, Celestica Inc. >> Component Level Reliability for High Temperature Power Computing With SAC305 and Alternative High Reliability Solders Thomas Sanders, Sivasubramanian Thirugnanasambandam, John Evans, Ph.D., Michael Bozack, Ph.D. and Jeff Suhling, Ph.D., Auburn University; Wayne Johnson, Ph.D., Tennessee Tech University

FSA6 Test Optimization for Improved Quantification of Material and Assembly Quality Chair: Martin Anselm, Ph.D., Rochester Institute of Technology Co-Chair: William Capen, SAIC Wednesday, September 30 | 2:00pm – 3:30pm Room 47

Defects in manufacturing are inevitable. Incoming device electrical defects, underreported halogen content and Head in Pillow failures are some of the most elusive defects to quantify. This session investigates improvements evaluating these conditions and proposes new methodologies to improve detection. >> A Packaging Physics of Failure Based Testing Methodology for Semiconductor IC Part Reliability Assessment Jingsong Xie and Ming Sun, Ph.D., RelEng Technologies, Inc.; Fei Xie, Engent, Inc. >> Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively-Coupled Plasma and Some Limitations of Ion Chromatography Christopher J. Pontius, George Kraeger and *Ron Lasky, Ph.D., P.E., Indium Corporation >> Measurement Systems Analysis Techniques for Head in Pillows Ayman Fayed and Donna Schnell, Intel Corporation

INS3 Advances in Process Controls, From 3D Printing to 3D Inspection to Measuring Thermal Expansion Mismatch Chair: Michael Newman, Harris Corporation Co-Chair: Christoph Wimmer, MICROSCAN Wednesday, September 30 | 2:00pm – 3:30pm Room 51

Process controls for modeling, manufacturing inspection and electronic assembly reliability can save valuable product development time and money. 3D Printing technology is quickly becoming a necessity in various manufacturing disciplines. The ability to model the process effectively can be a real time saver. With the advent of smaller and smaller electronic components 3D vision systems are becoming the norm and to accomplish this in a timely and reliable manner can add to manufacturing success. Understanding Coefficient of Thermal Expansion (CTE) between SMT components and the substrate is fundamental in understanding the reliability of electronic assemblies whether it be a cell phone or a communication module in a lunar landing module. Using a process to actually measure the differences can provide insight to this phenomena. >> Digital Image Correlation Using High Magnification Optical Microscopy W. Carter Ralph, Cheri B. Moss and Kevin B. Connolly, Southern Research Institute >> Addressing High Precision Automated Optical Inspection Challenges With Unique 3D Technology Solution Todd Liberty and Tim Skunes, CyberOptics Corporation >> Thermo-Mechanical Warpage and Stress Simulation for 2.5D and 3D IC Packaging Akash Agrawal, Guilian Gao, Bongsub Lee, Laura Mirkarimi and Sitaram Arkalgud, Invensas Corporation

MFX5 Innovation and Process Control for Liquid Soldering Processes Chair: Ursula Marquez de Tino, Plexus Corp. Co-Chair: Denis Barbini, Ph.D., Universal Instruments Wednesday, September 30 | 2:00pm – 3:30pm Room 49

This session addresses implementation of process controls on selective soldering equipment and alternative flux deposition method. All these proposals aim to obtain a repeatable and reliable process. By controlling machine parameters and flux application, it is possible to reduce the number of defects from wave and selective soldering processes.

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>> Plasma Based VOC-free Fluxing for Selective and Wave Soldering Andreas Reinhardt, Ph.D. and Sonja Wege, Ph.D., SEHO Systems GmbH >> Advanced Closed Loop Process Control for Selective Soldering Bob Klenke, ITM Consulting >> Achieving Repeatable, Consistent Control Over the Selective Production Process Gerjan Diepstraten, Vitronics Soltec B.V.

SUB3 Surface Finish Parameters that Impact Interconnect Reliability Chair: Norman Armendariz, Ph.D., Raytheon Systems Company Co-Chair: Viswam Puligandla, Ph.D., Nokia (Retired) Wednesday, September 30 | 2:00pm – 3:30pm Room 45

Several parameters that are part of the surface finishes on PCBs as well as the choice of surface finish itself have a profound impact on the formation and subsequently the reliability of the interconnect, whether it be on the wire bond or the solder joint. In this session we explore some of these variables from surface finish chemistry vendor perspective. This session investigates solder joint reliability based on the choice of the surface finish and solder alloy combination, the impact of copper roughness on surface finish and the effect of P content on the solder and wire bond reliability. >> Influence of Surface Finishes and Solder Alloys on Solder Ball Joint Reliability Yoshinori Ejiri, Takaaki Noudou, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu and Kiyoshi Hasegawa, Hitachi Chemical Co., Ltd. >> Controlling Copper Roughness to Enhance Surface Finish Performance *Lenora Toscano and Ernest Long, Ph.D., MacDermid, Inc. >> The Impact of P Content in Pd Deposit for Solder Joint Reliability and Wire Bonding Reliability of ENEPIG Deposits Tsuyoshi Maeda, Shinsuke Wada, Katsuhisa Tanabe, Yukinori Oda and Shigeo Hashimoto, C. Uyemura & Corporation Co., Ltd. Central Research Laboratory; *Donald Gudeczauskas and George Milad, UIC Technical Center;

APT7 Ceramic Column Grid Arrays — Applications, Materials and Optimization Chair: Marie Cole, IBM Corporation Co-Chair: Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory Wednesday, September 30 | 4:00pm – 5:30pm Room 44

Ceramic Column Grid Array packages are a good alternative to BGA packages for high I/O, high performance and/or high reliability applications. Learn more about the challenging applications that can benefit from CCGA interconnections and the variety of available CCGA structures. In addition, this session will share best practices for CCGA package and card assembly processes for high yield and reliability. >> CCGA - Solder Column Attachment for Absorbing Large CTE Mismatch Martin Hart, Topline Corporation >> CGA Trends and Capabilities Marti McCurdy, Silicon Turnkey Solutions, Inc.; Isabel de Sousa, Robert Martel and Alain Lessard, IBM Canada >> Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages Minerva M. Cruz and Russell T. Winslow, Six Sigma

SUB4 Influence of Finishes on Printed Circuit Board (PCB) Reliability Chair: Norman Armendariz, Ph.D., Raytheon Stystems Company Co-Chair: Robert Farrell, Benchmark Electronics, Inc. Wednesday, September 30 | 4:00pm – 5:30pm Room 45

Either as plated layers within a through-hole or as thin films on a LTCC, surface finish selection is critical for the survival of PCB. Stresses imparted during exposure to real-life operating conditions create failures within these surface finish layers to eventually lead to loss of interconnectivity in electronics. The two papers in this session deal with TH hole plating impact on PWB reliability and investigation of a thin film material used in LTCC for harsh environments, respectively. >> Fatigue Life Estimation of Electroplated Through Hole in PWB by FEM with Thin Cu Material Properties Yoshiyuki Hiroshima, Shunichi Kikuchi and Akiko Matsui, Fujitsu Advanced Technologies Limited; Yoshiharu Kariya, Ph.D., Naoyuki Yajima and Kizuku Obinata, Shibaura Institute of Technology; Hiroshi Shimizu, Hitachi Chemical Co.Ltd; Kazuhiko Nakamura, HDP User Group International, Inc.

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>> Establishing a Ti-Cu-Pt-Au Thin Film – on – Low Temperature Co-Fired Ceramic (LTCC) Technology for High-Temperature Electronics *Paul Vianco, Ph.D., J. Rejent, M. Grazier, A. Kilgo, B. McKenzie and A. Allen, Sandia National Laboratories; E. Guerrero and W. Price, Nuclear Security Complex, Honeywell, Inc.

Thursday, October 1 FOCUSED SYMPOSIUM III Lead-Free Soldering Technology Organized by Paul Vianco, Ph.D., Sandia National Laboratories, Matt Kelly, P.Eng., MBA, IBM Corporation , and Elizabeth Benedetto, Hewlett-Packard Company Thursday, October 1 l 8:00am — 5:00pm Room 49

FREE with a VIP or Technical Conference Registration!

LF1 Universal Instruments Consortium Pb-Free Project Update Chair: Paul Vianco, Ph.D., Sandia National Laboratories Co-Chair: Matt Kelly, P.Eng., MBA, IBM Corporation Thursday, October 1 | 8:30am – 10:00am Room 47/49

Consortia activities continue to fill the gaps in Pb-free technology and, in particular, long term reliability. This session begins with the results of a study to examine the effects of surface finishes on the reliability of Pb-free interconnections used with wafer-level, chip-scale packages (WLCSPs). The second presentation investigates the role of conformal coatings on the survivability of quad flat pack, no lead (QFN) packages when the latter are targeted for harsh environments applications. The session is rounded out with an analysis of new Pb-free die attach materials and their performance in thermo-mechanical conditions. >> Metallization and Surface Finish Effects on Pb-free WLCSP Thermal Cycle Reliability Michael Meilunas and *Jim Wilcox, Universal Instruments Corporation >> Thermo-Mechanical Evaluation of Alternative Pb-free Die Attach Materials Harry Schoeller, Ph.D., Universal Instruments Corporation; Sandeep Mallampati and Junghyun Cho, Ph.D., Binghamton University >> Harsh Environment Reliability of MicroLeadframe (QFN) Components and Conformal Coating Effects *Jim Wilcox and Michael Meilunas, Universal Instruments Corporation; Martin Anselm, Ph.D., Rochester Institute of Technology

LF2 Corrosion and Flux Residue Impacts of Lead-Free Solders Chair: Matt Kelly, P.Eng., MBA, IBM Corporation Co-Chair: Richard Coyle, Ph.D., Alcatel-Lucent Thursday, October 1 | 10:30am – 12:00pm Room 47/49

Today, electronic systems must operate in a wide variety of field conditions. These systems are now generally built using lead-free no-clean solders per EU RoHS regulations. Understanding environmental corrosion and surface electromigration failure mechanisms is critical in ensuring reliable system performance. This session reports the latest research in better understanding corrosion and flux residue impacts relating to surface electromigration failure mechanisms. >> Electronic Assembly Pitting/Crevice Corrosion Research *Mike Bixenman, DBA, KYZEN Corporation; Wallace Ables, Dell Computer; Richard Kraszewski, Plexus Corporation; Chin Siang Kelvin, Julie Silk, Keysight Technologies; Keith Howell and Takatoshi Nishimura, Nihon Superior; Jim Hartzell, Enthone; Karl Sauter, Oracle; Robert Smith, HDPug >> Critical Parameters of a No-Clean Process Terry Munson, Foresite, Inc. >> Reactivity of No-Clean Flux Residues in Electronic Assemblies: A Systematic Study Bruno Tolla, Ph.D., Denis Jean, Hemal Bhasvar, Yanrong Shi, Xiang (Shawn) Wei, and Kyle Loomis, Kester, Inc.

LF3 Research Challenges with Tin Whiskers and Mitigation Chair: Jeff Kennedy, Celestica, Inc. Co-Chair: Elizabeth Benedetto, HewlettPackard Thursday, October 1 | 1:00pm – 2:30pm Room 47/49

This session will explore the latest research initiatives in the areas of Tin Whiskers and mitigation. Continued examination from last year’s presentation of what promotes the Tin Whisker growth and the related risk associated with these fine metallic filaments for products in the high reliability products will be covered. Mitigation of the risk associated with these Tin Whiskers will also be discussed as well as some novel material developments using nanoparticles in conformal coating. A presentation of what is required to use coating as a Tin Whisker mitigation method and how to perform the required material study to support this new performance objective for conformal coatings will conclude the session.

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>> SERDP Nanoparticle Enhanced Conformal Coating Project: Modeling for Tin Whisker Mitigation *Stephan Meschter, Ph.D. and S. McKeown, BAE Systems; P. Snugovsky, Ph.D., J. Kennedy, Z. Bagheri, J. Keeping, P.E. and E. Kosiba, Celestica Inc.; J. Cho, Binghamton University; David Edwards, Henkel, LLC; K. Elsken, Bayer Material Science >> Long Term Monitoring and Failure Detection of Tin Whiskers Bridging Adjacent Leads on SOIC Components Owen Thomas, *Chris Hunt, Ph.D., Martin Wickham and Kate Clayton, National Physical Laboratory >> Innovating the Microstructure of Polyurethane Conformal Coatings for Tin Whisker Mitigation Junghyun Cho, Ph.D. and Suraj Maganty, Binghamton University; Stephan J. Meschter, Ph.D., BAE Systems Electronic Systems

LF4 Lead-Free Solder Joint Reliability: Recent Advances Chair: Jean-Paul Clech, Ph.D., EPSI, Inc. Co-Chair: Kola Akinade, Ph.D., Cisco Systems, Inc. Thursday, October 1 | 3:00pm – 4:30pm Room 47/49

Material and reliability experts will share recent findings on lead-free alloys and solder joint reliability characterization. Topics to be discussed include: the impact of test specimens on fracture properties; the effect of bismuth additions to SnCu alloys on solder joint reliability; and the effect of pre-conditioning and thermal cycling profiles on the reliability of test vehicles assembled with varied SAC solder compositions. >> Effect of Test Specimen on Fracture Behavior of Lead-free Solder Joints Amir Nourani, Saeed Akbari and Jan K. Spelt, University of Toronto >> A New Method of Increasing the Reliability of Lead-free Solder Takatoshi Nishimura, Keith Sweatman, Akira Kita and Shuhei Sawada, Nihon Superior Co., Ltd. >> iNEMI Pb-Free Alloy Characterization Project Report: Part IX – Summary of the Effect of Isothermal Preconditioning on Thermal Fatigue Life *Richard Coyle, Ph.D. and Joe Smetana, Alcatel-Lucent; Richard Parker, iNEMI; Elizabeth Benedetto and Aileen Allen, Hewlett Packard; Keith Howell and Keith Sweatman, Nihon Superior Co.; Weiping Liu, Indium Corporation; Michael Osterman, CALCE; Julie Silk, Keysight Technologies; Rafael Padilla and Tomoyasu Yoshikawa, Senju Metal Industry Co.; Mitch Holtzer, Alpha, an Alent plc Company

Exhibitor Guide 5N Plus Micro Powders

Accurate Carriers USA

ACL, Inc.

Michael Benson 4385 Garand Street Montreal, QC H4R 2B4 Canada PHONE: 514-856-0644 FAX: 514-856-9611 EMAIL: [email protected] WEB: www.5nplus.com

Jay Hindersman 500 Mitchell Road Glendale Heights, IL 60139 PHONE: 800-830-3771 FAX: 630-790-6105 EMAIL: [email protected] WEB: www.accuratecarriersusa.com

Tony Banks 840 W. 49th Place Chicago, IL 60609-5151 PHONE: 847-981-9212 FAX: 847-981-9278 EMAIL: [email protected] WEB: www.aclstaticide.com

Accurate Carriers is a global, one-stop source for electronic packaging media and equipment. With locations in North America and Europe, our staff is experienced in finding expedited solutions for custom and every day Tape and Reel Requirements. Accurate Carriers’ sister company Link Marketing, is the exclusive sales office for Q-Corporation Tape and Reel and parts handling equipment. Whether the requirement is services, supplies, or equipment, Accurate Carriers has you covered for custom turn-key media or equipment.

ACL Staticide® — Specialists in Static Control Products and PCB Cleaning and Repair Chemicals

Booth No: 327

5N Plus Micro Powders, invested significantly in developing a high performance atomizing technology to efficiently manufacture fine metallic powders — down to the 1 to 25 micron range. This proprietary technology allows for the dedicated production of spherical powders with low oxygen content and uniform size distribution. We have recently established a new production facility at our Montreal headquarters to serve the electronic powders markets focusing on Type 5 to Type 8 products. Our parent company, 5N Plus Inc., is the leading producer of high purity specialty metals and chemical products with 11 manufacturing operations globally and 16 sales offices in Europe, Asia and the Americas.

Acculogic, Inc. Booth No: 800

Greg LeBlonc 175 Riviera Drive Markham, ON L3R 5J6 Canada PHONE: 905-475-5907 FAX: 905-475-5415 EMAIL: [email protected] WEB: www.acculogic.com Acculogic manufactures and markets a broad range of systems and instruments for testing electronic devices, circuit boards and systems.

Booth No: 717

Booth No: 331

ACE Production Technologies Booth No: 426

Alan Cable 3010 N. First Street Spokane Valley, WA 99216 PHONE: 509-924-4898 EMAIL: [email protected] WEB: www.ace-protech.com Selective soldering systems ranging from batch mode machines to in-line systems for high-speed selective soldering. All systems feature graphics-based software for easy programming, auto fiducial alignment, board warp compensation and remote machine diagnostics as standard. Multiple preheat options plus interchangeable solder pots and nozzles for tin-lead, lead-free and HMP solders. Options include the world’s only fully maintainable drop-jet fluxer compatible with water- soluble fluxes and high solids content fluxes up to 33%. Selective soldering workshops are taught by independent industry specialists.

ACL’s fine family of products includes: • Anti-static coatings • Dissipative floor paint and ESD polishes • Anti-static workbench products including dissipative mats • Static detection and measurement instruments PCB cleaning, rework and repair chemicals • These innovative products are developed and produced to meet and exceed industry standards. Our brand names, Staticide®, Dualmat™, and ESD Safety Shield, in addition to our static detection meters, are distributed and highly regarded throughout the world. At ACL, Inc. we are dedicated to the highest level of customer satisfaction: • Friendly, knowledgeable sales staff for quick answers to your static control questions • Large inventory — most orders ship within 24-72 hours Over 40 years of experience in static control and prevention • ISO 9001:2008 certification for our quality management system • ACL’s total commitment to quality products combined with our high performance standards and the integrity of our employees has established us as a world leader in static control products and solutions.

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2015 SMTA International

SHOW DIRECTORY >> 29

Aegis Industrial Software Corporation Booth No: 440

Lynette Penecale 5 Walnut Grove Drive Suite 320 Horsham, PA 19044 PHONE: 215-773-3571 FAX: 215-773-3572 EMAIL: [email protected] WEB: www.aiscorp.com Aegis Software is a leading provider of innovative software solutions to improve speed, control, and visibility throughout manufacturing operations. The Company’s integrated suite of software modules manage the entire manufacturing information environment: from product launch, to material logistics, through manufacturing execution, to operations analytics and real-time dashboard systems. This holistic solution yields unprecedented product, process, and materials traceability as well as the data fulfillment and visibility manufacturers need for competitive improvement.

AGI Corporation Booth No: 738

Todd Gilmore 177 Nick Fitcheard Road Huntsville, AL 35806 PHONE: 256-858-3300 FAX: 256-858-3304 EMAIL: [email protected] WEB: www.AGIcorp.com AGI Corporation has ITAR certified locations in Alabama and Florida! Providing state of the art Laser Cut Stencils using a new DEK Fiber Laser. AGI is an internationally known supplier of Wave Solder Pallets and SMT Assembly Pallets from simplest to most complex. We offer Titanium Insert Pallets, Screen Printer Tooling, Wash Baskets, Feeder Carts, Tray Carts, Stencil Carts, Build-to-Print capabilities and many other types of fixtures. We have the most aggressive design/ machining techniques available.

AIM

Alltemated, Inc.

Alana Grear 25 Kenney Drive Cranston, RI 02920 PHONE: 401-463-5605 EMAIL: [email protected] WEB: www.aimsolder.com

3353 N. Ridge Ave. Arlington Heights, IL 60004 PHONE: 847-394-5800 FAX: 847-394-5805 EMAIL: [email protected] WEB: www.allemated.com

AIM is a leading global manufacturer of solder assembly materials for the electronics industry. Our full-line of assembly materials includes solder paste, liquid flux bar, wire, preforms, adhesives, cleaners, chemicals, plating anodes, and indium and gold-based specialty alloys. AIM is ISO 9001 and ISO 14001 certified with manufacturing, distribution, and support facilities located throughout the Americas, Asia-Pacific, and Europe.

Since 1993, Alltemated has been the electronics industry’s preferred choice for one-stop component- preparation services. Alltemated sets the standard for tape and reel packaging, custom carrier tape design, carrier tape manufacturing, IC programming, bake and dry-pack services, Place N Bond (our trademarked product), and assembly services.

Booth No: 413

Akrometrix, LLC Booth No: 134

Dorothy Garvey 2700 Northeast Expy N.E. Suite B 500 Atlanta, GA 30345 PHONE: 404-486-0880 FAX: 404-486-0890 EMAIL: [email protected] WEB: www.akrometrix.com Akrometrix is the worldwide leader of PCB and component warpage management systems and services for the electronics industry. We measure flatness and strain of electronic components at critical reflow temperatures. Akrometrix equipment is capable of providing graphical, statistical and tubular results to prove compliance to industry standards.

30 >> 2014 SMTA International SHOW DIRECTORY

Booth No: 940

We provide turnkey engineering, documented and managed solutions for our global customer list of top distributors, EMS providers, and OEM’s. These top-tier companies depend on our proven quality and reliability. We pride ourselves on our commitment to quality, delivery, and price. Our goal is total customer satisfaction. We offer aggressive same day service, on-demand capacity, and superior performance every time.

Alpha

Booth No: 321 Laurie Kneller 300 Atrium Drive Somerset, NJ 08873 PHONE: 908-791-3045 EMAIL: [email protected] WEB: www.alpha.alent.com Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products.

THE LEADING PROVIDER OF INNOVATIVE MATERIALS & SOLUTIONS FOR ELECTRONICS ASSEMBLY

Alpha is a leading materials supplier to various industries, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, and automotive. For years, our expert engineering and process excellence has served our customers well. By providing the most innovative product solutions on the market today, Alpha is skilled at building powerful partnerships that enable companies to deliver reliable products in an efficient and sustainable way. alpha.alent.com Visit us at SMTAI Alpha, Booth #321 Alpha Recycling Services, Booth #1006 SMTAssociation

@SMTAorg #SMTAI

2015 SMTA International

SHOW DIRECTORY >> 31

Alpha Recycling Services

Amitron Corporation

Apollo Seiko

Laurie Kneller 300 Atrium Drive Somerset, NJ 08873 PHONE: 908-791-3000 EMAIL: [email protected] WEB: www.alphaalent.com

Thomas Massman 2001 Landmeier Road Elk Grove Village, IL 60007 PHONE: 847-290-9800 x752 FAX: 847-290-9823 EMAIL: [email protected] WEB: www.amitroncorp.com

Stacey Barajas 3969 West Lemon Creek Road Bridgeman, MI 49106 PHONE: 269-465-3400 FAX: 269-465-3441 EMAIL: [email protected] WEB: www.apolloseiko.com

Amitron, located in the Chicago area, is one of the largest privately held circuit board manufacturers in the USA. Capabilities include prototyping, unlimited production quantities, 1 to 20 layers, .003” line and space (inner layer), blind/buried via, FR4, specialty and thermal materials/aluminum, up to 20 oz. copper. Certifications include; ISO9001-2008, Mil-P-55110, ITAR and Minority. Aside from our 72,000 sq. ft. facility in Illinois, we operate a second facility in India, certified to ISO/TS 16949: 2009.

Apollo Seiko is the inventor & world-wide leader of selective soldering solutions. Our technologies include 130 & 200 watt contact soldering systems, laser diode & Micro-Laser machines as well as selective fountain soldering. We offer desktop & In-Line solutions, and four different Apollo controllers to meet both price and capability requirements. Our patented iron tip & solder feeding technologies set us apart from the competition.

AOI Systems

Booth No: 518

Booth No: 1006

Alpha, a business unit of Alent plc, provides electronics assemblers safe, efficient solder recycling services which will help them meet environmental and legislative requirements while maximizing the return on their solder dross, scrap and solder paste waste. With facilities located in the Americas and European Regions, Alpha continues to invest and expand their capabilities to take back metal waste streams and responsibly recycle that waste into high purity raw materials for reuse.

American Hakko Products Booth No: 534

Rick Richards 28920 Ave. Williams Valencia, CA 91355-4182 PHONE: 661-294-0090 FAX: 661-294-0096 EMAIL: [email protected] WEB: www.HakkoUSA.com American Hakko Products, Inc. is a manufacturer and supplier of soldering, desoldering, hot air and BGA rework systems, smoke and fume extraction systems, CHP brand hand tools and technical sales training. For more information, including product demonstration videos, please visit: www.HakkoUSA.com

American Standard Circuits, Inc. Booth No: 801

Anaya Vardya 475 Industrial Drive West Chicago, IL 60185-1891 PHONE: 630-639-5440 FAX: 847-453-4415 EMAIL: [email protected] WEB: www.asc-i.com ASC is a total solutions provider, of manufacturing quality rigid, metalbacked, flex and rigid-flex PCBs, as well as RF/microwave PCBs, to the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide all technologies in a time- critical environment. Company qualifications include ISO9001:2008, MILPRF 31032, and ITAR registration. It holds a number of key patents for metal bonding processes as well.

Booth No: 536

Booth No: 444

Vinny Carrigan Minerva Works Miller Street Unit P Johnstone, PA5 8HP United Kingdom PHONE: 440-141-416-5113 EMAIL: [email protected] WEB: www.aoisystems.com Automation is the key to success in today’s PCB production environment. With increasing demand to drive down costs and maintain high quality, AOI provides you with the cost effective solution. AOI Systems offer a range of solutions to meet the requirements of every production facility and has put AOI within the reach of all manufacturers.

Apex Factory Automation TT Booth No: 735

William Crist 14526 Lee Road Suite 400 Chantilly, VA 20151 PHONE: 240-293-2419 EMAIL: [email protected] GENERAL INQUIRY: [email protected] SERVICE AND PARTS: [email protected] WEB: www.apexfa.com ApexFA is the distributor in USA and North America for the these manufacturers: 1. Mirae Pick and Place 2. SJ Inno Tech Stencil Printers 3. Xavis X-Ray 4. Norsdon-DIMA SMT Service and parts are all based in USA at Chantilly, VA facility. We provide turn-key service and installation. Your Peace of Mind is Our Commitment.

32 >> 2015 SMTA International SHOW DIRECTORY

Booth No: 411

ASC International

Jon Arneson 830 Tower Drive Medina, MN 55340 PHONE: 763-479-6210 FAX: 763-478-6206 EMAIL: [email protected] WEB: www.ascinternational.com ASC International is a leading supplier of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) solutions globally. Providing both offline and inline options, ASC International is focused on being the price to performance leader in all categories. The featured product for this year’s SMTA International show will be the recently released LineMaster DM with Dual Mode AOI/SPI capabilities for the most cost effective method for achieving quality assurance. In addition, ASC will be providing hands-on demonstrations of its market leading VisionPro M500 and VisionPro AP500 SPI systems along with the VisionPro AV862 AOI system.

Ascentech, LLC

ASYS Group Americas, Inc.

BEST, Inc.

Randy Allinson 127 Goose Hill Road Chester, CT 06412 PHONE: 860-526-8903 FAX: 860-526-1003 EMAIL: [email protected] WEB: www.ascentechllc.com

Astrid Wilkens 140 Satellite Blvd. NE Suite B1 Suwanee, GA 30024 PHONE: 770-246-9706 FAX: 770-246-9866 EMAIL: [email protected] WEB: www.asys-group.com

Alex Conley 3603 Edison Place Rolling Meadows, IL 60008 PHONE: 847-797-9250 FAX: 847-797-9255 EMAIL: [email protected] WEB: www.solder.net

Booth No: 219

Booth No: 127

Booth No: 835

Ascentech LLC is North American Distributor for GEN3 SYSTEMS Ltd. and Optilia Instruments AB products. Distribution Products GEN3 Systems, Ltd: • Auto-SIR – Surface Insulation Resistance Test System • CM-Series – Ionic Cleanliness (ROSE) Test Systems DC- Series - Conformal Coating application, Precision Dip Coaters • SB2900 – Conformal Coating, Spray Booth Systems Gensonic Ultra Sonic Stencil Cleaner • MUST III – Solderability Test System (wetting balance) SPA1000 – Solder Paste Analyzer • SolderSaver – Solder Recovery System • Z-Check – Solder Paste Measurement Systems Optilia Instruments AB: • High definition (HD) inspection cameras used both in- line and off-line • Flexia BGA Inspection systems for inspection of low clearance areas beneath BGA assemblies • OptiPix Software for image capture, video and image analysis

ASM Assembly Systems (SIPLACE & DEK)

TT

Booth No: 225

Tom Foley 3975 Lakefield Court Suwanee, GA 30005 PHONE: 770-797-3475 EMAIL: [email protected] WEB: www.siplace.com Leading electronics manufacturers around the globe select ASM Assembly Systems for Screen Printing and SMD Placement Solutions. DEK Screen printers, SIPLACE Placement Machines, Software for fast line changeover, and process expertise are on display at the ASM Assembly Systems booth.

ASYS Group provides high quality equipment and excellent support worldwide. The product range includes SMD Board Handling, Marking Systems (Laser/Label/ Inkjet), Depaneling Systems (In-/Offline), Final Assembly and EKRA Screen Printers for the SMT, Semi-Pack, Solar, and Hybrid markets. Transforming Ideas into Solutions.

ATV Technologie GmbH Booth No: 841

Siegfried Kowalsky 85591 Vaterstetten Germany PHONE: +49-8106-305023 WEB: www.atv-tech.de ATV manufactures: • Batch type VACUUM REFLOW Soldering OVENS/RTAs: Void free solder joints, IGBT, CSP, Flip Chip, CPV, MMIC • In Line VACUUM REFLOW Soldering OVENS MEMMS cap/Package lid sealing with GETTER activation • THERMO COMPRESSION BONDER up to 450°C: • Transient Liquid Phase Soldering/Bonding QUARTZ TUBE Furnaces: LPCVD, CNT/ graphene, oxidation, diffusion • LTCC SINTERING FURNACE/PRESS/ THERMO • COMPRESSION BONDER up to 1 100°C:Constrained LTCC sintering/ hot embossing • Manual DIAMOND SCRIBERS: to 200 mm IR LPCVD/ALD System, 50°C-1050°C, • temperature/pressure alternation

Aven, Inc.

Booth No: 235 Tim Nelson 4330 Varsity Drive Ann Arbor, MI 48108 PHONE: 734-973-0099 EMAIL: [email protected] WEB: www.aveninc.com Aven specializes in stereo zoom and digital microscopes, video inspection systems, specialty high-resolution digital and video cameras, lenses, illuminated magnifiers, software for image analysis and tools for precision assembly.

BEST Inc. is your BEST resource for PCB rework/repair, solder training, and soldering tools. Our company is composed of highly trained IPC-certified soldering technicians that can perform the most complex BGA repair/reballing and PCB rework/repair. In addition, our large variety of state-of-the art equipment insures the rework done on your PCBs and BGAs will be completed correctly. 100% guaranteed. Additionally, BEST is a professional solder training company that certifies technicians in various IPC certification programs. We also offer custom BEST courses that include hand soldering and PCB rework. Our mobile training center is the only solder training center on wheels that can come to your area with a professional instructor and all of the proper training tools. Moreover, several unique PCB repair products have been developed by BEST: • StencilQuik provides for the fast, simple placement of BGAs. • StencilMate provides a simple method for the rework of leadless devices • EzReball is a unique reballing perform system for even the smallest of devices • HeatShields are flexible, effective materials for shielding components

BOFA Americas Booth No: 1000

John Podwojski 303 S. Madison Street Staunton, IL 62088 PHONE: 618-205-5007 FAX: 866-707-2632 EMAIL: [email protected] WEB: www.bofaamericas.com The World Leader in Fume Extraction Technology Designing and Manufacturing fume extraction solutions for a variety of Industrial Applications. Knowledge of the electronics assemble sector has enabled BOFA to develop product solutions for manual and automated soldering, conformal coating, and potting and gluing applications.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 33

BTU International

CMK America Corporation

Conductive Containers, Inc.

Rob DiMatteo 23 Esquire Road N. Billerica, MA 01862 PHONE: 978-667-4111 FAX: 978-667-9068 EMAIL: [email protected] WEB: www.btu.com

Tony Spinelli 175 Handley Road Suite 300 Tyrone, GA 30290 PHONE: 770-632-7174 FAX: 770-632-7175 EMAIL: [email protected] WEB: www.cmk-corp.com

Zach Burton 4500 Quebec Ave. N. New Hope, MN 55428 PHONE: 763-746-9774 EMAIL: [email protected] WEB: www.corstat.com

Booth No: 734

BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

CalcuQuote

Booth No: 1046 Chintan Sutaria 414 Englewood Drive Murphy, TX 75094 PHONE: 909-278-8233 EMAIL: [email protected] WEB: www.calcuquote.com CalcuQuote is an online quoting tool specifically designed for small-mid sized PCB Assembly companies. It improves the speed and accuracy of your quoting process through a proprietary algorithm and simplified user interface. Talk to us about how to improve your RFQ process!

CIRCUITS ASSEMBLY Booth No: 601

Frances Stewart 180 Woodsong Drive Fayetteville, GA 30214 PHONE: 678-817-1286 EMAIL: [email protected] WEB: www.circuitsassembly.com UP Media Group Inc. (UPMG) (upmediagroup.com) serves the global PCB community through print, digital and online products, as well as live and virtual events. UPMG publishes PRINTED CIRCUIT DESIGN & FAB (pcdandf.com) and CIRCUITS ASSEMBLY (circuitsassembly.com), as well as the PCB UPdate (pcbupdate.com) e-newsletter. UPMG also produces trade shows and conferences, including PCB West (pcbwest.com), the CIRCUITS ASSEMBLY Directory of EMS Companies and the annual Service Excellence Awards and NPI Awards.

Booth No: 745

CMK is a World Class PCB manufacturer.

Cogiscan

Booth No: 1038 Mitch De Caire 211 Waterloo Street Winnipeg, MB R3N 0S4 Canada PHONE: 450-578-1644 EMAIL: [email protected] WEB: www.cogiscan.com Cogiscan is the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry. The scalable Cogiscan platform perfectly integrates with all major equipment types, and is highly configurable to enable a personalized solution to each customer’s specific production needs. Since 1999 Cogiscan has attained several international patents for TTC hardware and software, and has won multiple awards throughout the years.

Computrol, Inc. Booth No: 938

Jeff Yturbe 499 East Corporate Drive Meridian, ID 83642 PHONE: 208-887-1000 x231 EMAIL: [email protected] WEB: www.computrol.com Computrol Inc. is a full service Electronics Contract Manufacturing Services Provider, specializing in full turnkey, high technology electronic manufacturing and test. We are AS9100/ISO9001, ISO13485, IPC class II and III and J-Std certified company and we are ITAR registered. We also do complete box and system level assembly as well. We utilize AOI, X-Ray, XRF and Selective Soldering.

34 >> 2015 SMTA International SHOW DIRECTORY

Booth No: 317

CCI is the premiere manufacturer of ESD safe packaging solutions. As the only charter member in the ESD Association who deals solely in static protective packaging, CCI has been involved in the protection of static sensitive electronic components for more than 20 years. Our sales engineers have an average of more than 10 years experience in combination with their continuous training, making CCI one of the most knowledgeable companies in the ESD industry.

Conecsus, LLC Booth No: 110

Tom Mitchell 106 Tejas Drive Terrell, TX 75160 PHONE: 859-250-5847 EMAIL: [email protected] WEB: www.conecsusllc.com Conecsus, LLC recycles solder dross, spent solder pastes, and contaminated trash such as wipes, gloves, and rags. With our world class laboratory, state of the art technology, and the largest rotary furnace of its kind in North America, we’re the best choice in recycling.

Creative Electron, Inc. Booth No: 516

Glen Thomas 253 Pawnee Street San Marcos, CA 92078 PHONE: 760-212-0170 EMAIL: [email protected] WEB: www.creativeelectron.com Creative Electron is the largest US manufacturer of X-ray inspection systems for electronics. We proudly design and manufacture the award winning TruView™ X-Ray family of products. Powered by proprietary algorithms and state of the art hardware, TruView™ will enable you to rethink x-ray inspection.

Crystal Mark, Inc.

CyberOptics Corporation

DIVSYS International

Chris Romero 613 Justin Ave. Glendale, CA 91201 PHONE: 818-240-7520 FAX: 818-247-3574 EMAIL: [email protected] WEB: www.crystalmarkinc.com

Sy Creed 5900 Golden Hills Drive Minneapolis, MN 55416 PHONE: 408-677-1816 EMAIL: [email protected] WEB: www.cyberoptics.com

Nicholas Mates 8110 Zionsville Road Indianapolis, IN 46268 PHONE: 317-405-9427 FAX: 317-663-0729 EMAIL: [email protected] WEB: www.divsys.com

Booth No: 319

Crystal Mark, Inc. specializes in all aspects of micro abrasive processing as automaters, manufacturers and end users. We offer manual, automated and custom micro sandblasting systems, as well as Job Shop services to accommodate a variety of diverse applications. From surface prep and conformal coating removal, to spot cleaning, surface etching, cleaning, deburring, texturing and more. We are the recognized leader and innovator in micro abrasive processing.

CTI Systems Booth No: 226

Daniel Gray 5313 Womack Road Sanford, NC 27330 PHONE: 919-776-7227 EMAIL: [email protected] WEB: www.conveyor-technologies.com CTI Systems, the Advanced Automation Division of Conveyor Technologies Inc. is a world class manufacturer of PCB Assembly Equipment / Laser Marking / Routers / Automatic Component Inspection / Custom Robotic Automation (Odd Form). In addition we also manufacture state of the art PCB transport equipment with advanced features such as automatic change over management systems and bar code verification. Visit CTI and let us share with you our world class engineering, equipment and support.

Booth No: 814

Booth No: 1008

CyberOptics Corporation (NASDAQ: CYBE) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical segments. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Dimation, Inc. Booth No: 934

Edward Knutson 505 W. Travelers Trail Burnsville, MN 55337 PHONE: 952-746-3030 EMAIL: [email protected] WEB: www.dimation.com Design/layout, Quik-turn™ prototype, low volume production, die level services, and custom microelectronic assembly and packaging. At Dimation, we are dedicated to providing our customer with the highest level of service possible. We provide exceptionally quick-turn, walk-in, weekend and evening service to help meet your deadlines. We are AS9100 Certified and ITAR Registered. We are so fast WEFLP4U!

DIVSYS International is a woman-owned company in the business of selling Printed Circuit Boards and verifying them in our in-house Product Assurance Lab. DIVSYS is made up of Engineers and Technicians who all came from PCB fabrication and assembly facilities. Knowledge and handson experience of both worlds gives DIVSYS the advantage in assisting customers in the OEM and CM arenas with PCB issues. Our laboratory is used by companies in many industries to understand board and assembly related problems that they are experiencing. Our Engineers work with your engineers to solve problems. DIVSYS is not a broker. DIVSYS is the front end of a fabricator, the engineering support for your company, your check and balance for product assurance (in-house lab), and your supply chain manager for PC Boards that meet your expectations and specifications. We are data-driven technical resources for Printed Circuit Boards. We review every lot that we order before it is shipped to our customer. We do not sort bad product. We reject it. Our suppliers are audited by experts in PCB fabrication. Anyone can attain a quality certification… we audit their processes, equipment, materials, review their SPC charts and watch the product on the lines. Each supplier is given only the technology of product that we qualify them to make, and nothing else. We then bring everything back to Indianapolis for our own product assurance testing. We do not take chances with your business. Laboratory services for hire include XRF, BBT, cleanliness, thermal shock, environmental stress, complex routing, non-contact CMM, delamination and cross-sectioning.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 35

ELANTAS PDG

Electrotek Corporation

EPTAC Corporation

Dana Roschnafsky 5200 N. Second Street St. Louis, MO 63417 PHONE: 314-622-8748 FAX: 314-436-1030 EMAIL: [email protected] WEB: www.elantas.com

Larry Robinson 7745 S. 10th Street Oak Creek, WI 53154 PHONE: 317-753-3606 FAX: 414-762-1390 EMAIL: [email protected] WEB: www.boards4u.com

Cheryl Fisher 8025 S. Willow Street Suite 207 Manchester, NH 03103-2311 PHONE: 603-296-0887 FAX: 603-296-2377 EMAIL: [email protected] WEB: www.eptac.com

A premier global manufacturer of liquid electrical insulation products including potting compounds, conformal coatings, adhesives, specialty epoxy products used in hi-temp applications. The Epoxylite®, ELAN- Tron®, ELAN-Cast®, Pedigree®, and Sterling® brands are used for coating, sealing and potting electronic components, sensors, PCBs and other applications. Registered ISO 9001:2000 and ISO/TS 16949.

Electrotek is a bare board manufacturer focused on the high reliability and high technology markets. Electrotek is ITAR and ISO 9001-2008 registered, AS9100 certified as well as MIL-PRF-31032 / 55110 qualified. Electrotek manufactures a wide range of technologies including blind and buried vias, high layer count, mixed material constructions, heavy copper and controlled impedance boards. Electrotek caters to the medical, military, aerospace, planar transformer, communications and memory marketplaces as well as others. Electrotek supports proto and quick turn requirements down to three days as well as volume production in three weeks.

Booth No: 318

Electronic Assembly Products, Ltd. Booth No: 807

John Johnson 1220 Runnymede Road Dayton, OH 45419 PHONE: 937-414-6652 FAX: 408-228-0665 EMAIL: [email protected] WEB: www.electronic-assembly-products.com Fancort Industries, Japan Unix, Depaneling equipment, PCB routers, Soldering robots, TechWear ESD garments.

Electronics World Publishing Booth No: 929

Donal McDonald #3 Inishkeen Kilcoole Wicklow Ireland PHONE: 353-086-2485842 EMAIL: [email protected] WEB: www.electronicsproductionworld.com Electronic World Publishing is one of the largest online publishers for the electronics manufacturing sector. Between its various publications, it strives to cover the entire of the market. Our outbound product is the EPW weekly report, bringing news and product information along with technical articles to the reader. To round all of this out there is also Electronics Industry Update, with a digital circulation of over 100,000 copies each month, this magazine is available on PC in a flash based format, or by iPad or Android App.

Booth No: 420

ELTEK, Ltd.

Booth No: 140 Jim Barry 25 Orchard View Drive Unit 207 Londonderry, NH 03053 PHONE: 603-421-0020 FAX: 603-421-0023 EMAIL: [email protected] WEB: www.eltekglobal.com Eltek is a global supplier of High-Density Rigidflex and PCB Technologies. Established in 1970, the company’s primary facility located in Israel is known for its innovative high technology manufacturing solutions and its commitment to exceptional customer service. Eltek’s products support some of the most demanding application around the world.

36 >> 2015 SMTA International SHOW DIRECTORY

Booth No: 746

EPTAC provides IPC Certification along with comprehensive training and consulting to the electronics manufacturing industry. We certify industry professionals to IPC-A-610, J-STD-001, IPC-A-600, IPC-WHMA-620, IPC-7711/7721 as well as offer exclusive training in Counterfeit Component Inspection & Mitigation to the IDEA-STD-1010 for OEM’s and Component Brokers. Additional training offerings include J-STD-002/003 Solderability Testing, Wires/Terminals, Through Hole, SMT, Rework/Repair, ESD, Component Identification, Defect Prevention, and more… Training can be conducted onsite, and can be customized and performed within your production constraints; satisfies ISO 9000 requirements or, classes are available in over 30 cities in the United States and Canada.

ERSA North America Booth No: 539

Lance Larrabee 1779 Pilgrim Road Plymouth, WI 53073 PHONE: 920-892-9263 FAX: 920-893-1562 EMAIL: [email protected] WEB: www.ersa.com ERSA is a leading global supplier of selective solder systems, reflow ovens, wave solder systems, rework systems, inspection and hand soldering stations and more. ERSA has global locations in Germany, USA, Mexico, France, Korea and China.

TT

EVS International Sales Limited

Finetech/Martin

Steve Pollock 816N Delsea Drive Suite 308 Glassboro, NJ 08028 PHONE: 856-218-1131 FAX: 856-218-1134 EMAIL: [email protected] WEB: www.essemtec-usa.com

Helen Norman Unit 17 Broadfield Park Seaview Road Cowes, Isle of Wright United Kingdom P0317US EMAIL: [email protected] WEB: www.solderrecovery.com

Adrienne Gerard 560 E. Germann Road #103 Gilbert, AZ 85297 PHONE: 480-893-1630 EMAIL: [email protected] WEB: www.finetechusa.com

Essemtec is a leading designer, manufacturer & distributor of electronic manufacturing equipment for electro-mechanical assembly and semiconductor packaging with production facilities in Switzerland.

World Leaders in Solder Recovery, EVS provide cost effective solutions for onsite recovery of solder from wave solder dross. Our system supports both lead and lead free solder. The technology built into the range of EVS machines is based upon world-wide patents. The EVS Systems are simple to use, ISO14001 compatible, and provide rapid payback. Our new EVS500, is smaller footprint with new unique technology, but with the same rapid payback.

ESSEMTEC

Booth No: 335

We specialize in high speed fluid dispensing equipment as well as flexible high-mix SMT assembly solutions. Essemtec has had the privilege to serve our loyal customer base since 1991.

Europlacer Americas TT Booth No: 637

John Perrotta 519 US Highway 301 South Tampa, FL 33619 PHONE: 267-884-6560 OFFICE: 813-246-9500 FAX: 813-246-9595 EMAIL: [email protected] WEB: www.europlacer.com A manufacturer of market-leading flexible SMT placement machines will showcase the IINEO-II in Booth# 637 at SMTA Int’l 2015. We are demonstrating the award-winning IINEO-II. This multifunctional assembler is widely configurable for numerous assembly requirements, including item level traceability, electrical test and much more. The IINEO platform offers the industry’s largest board size (24”W x 63”L) along with expansive feeder capacity up to 264 x 8 mm + trays, 2- placement heads, 24 nozzles active/120 nozzle storage, odd-form capability and enough capacity for a broad range of presentation media including tape-and-reel, trays, tubes, cut tapes and POP.

Booth No: 142

FCT Assembly Booth No: 313

Jeremy Glanzer 1309 N. 17th Ave. Greeley, CO 80631 PHONE: 970-214-4854 EMAIL: [email protected] WEB: www.fctassembly.com

Booth No: 417

Finetech and Martin supply rework equipment for a wide range of applications: 01005s, BGAs, shields, LEDs, connectors, flip chip, PoP, memory devices, chip-onflex. The Core provides precise temperature and convection flow control, outstanding placement accuracy, and robust process development including extensive recipe libraries. The Expert 10.6 delivers automated component alignment, large board handling, and productivity features including noncontact residual solder removal and solder paste/flux dispensing. A standalone BGACSP reballing unit is available to compliment these systems. Finetech also supplies high-accuracy bonders for microelectronics packaging.

FKN Systek Booth No: 933

FCT Assembly manufactures several core products including leaded and lead-free solder paste, wire solder, bar solder, flux, laser cut SMT Stencils, nano coatings and also offers high precision custom laser cutting services. We are a one stop shop for Contract Manufacturers and Original Equipment Manufacturers who are seeking high quality chemistry that performs in the market.

Klaus Heimann 115 Pleasant Street Millis, MA 02054 PHONE: 508-935-2282 FAX: 508-935-2286 EMAIL: [email protected] WEB: www.fknsystek.com FKN Systek is a US manufacturer of Depanelizers used for singulating pre-scored and tab routed Printed Circuit Cards. Our broad line of depaneling equipment ranges from low cost benchtop tools such as the N100 PCB Nibbler for singulating tab routed panels, to high volume production systems such as the K5000 In-line Multiple Blade Depanelizer for singulating pre-scored boards. We also supply PCB racks and crimp tools and equipment.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 37

FlexLink Systems, Inc.

Geib Refining Corp.

GPD Global

Emily Travis 6580 Snowdrift Road Allentown, PA 18106 PHONE: 610-973-8268 FAX: 610-973-8345 EMAIL: [email protected] WEB: www.flexlink.com

Laura Soper 399 Kilvert Street Warwick, RI 02886 PHONE: 516-768-5747 FAX: 401-732-2841 EMAIL: [email protected] WEB: www.geibrefining.com

Christian Vega 611 Hollingsworth Street Grand Junction, CO 81505 PHONE: 970-245-0408 FAX: 970-245-9674 EMAIL: [email protected] WEB: www.gpd-global.com

Based on our unique application experience and global network, we provide innovative, profitable, and quality automation solutions to demanding world-leading customers. FlexLink’s specialty is Production Logistics, defined as ensuring that each machine and workstation is fed with the right product, quantity, and quality at the right time. The solution considers intelligent value adding processes and elimination of non-value adding ones. We offer custom solutions, standard modules, and software that allows for efficient, variable, and progressive production flow throughout the process. See more at: www.flexlink.com.

Refiner of precious metals from thin & thick film production scrap, i.e. solder paste jars, wipes, gold wire, solder dross,chamber scrapings,gold targets & shields. Geib Refining Corp. reclaims Gold, Platinum, Palladium, Iridium, Rhodium & Silver. We are EPA & ITAR compliant, therefore all scrap is destroyed and disposed of accordingly.

Manufacturer of automated and semiautomated fluid dispensing equipment for solderpaste, conductive epoxy, underfills, encapsulation (COB), SMT Adhesive for double-sided pc boards, thermal and UV materials. Pumps/ Valves include NCM5000 Jet; PCD Volumetric Series; Precision Servo Controlled Augers; Nano-Piston for micro volumes and Time Pressure. Witness our patent-pending FPC Fluid Pressure Control system for real-time control of fluids over the entire level of a syringe.

Booth No: 107

FSInspection Booth No: 946

Pauline Damery 11800 31st Court N. St. Petersburg, FL 33716 PHONE: 877-256-9847 FAX: 727-471-7931 EMAIL: [email protected] WEB: www.fsinspection.com FSInspection offers high-magnification visual inspection systems for industrial market. Our high-quality visual work stations are easy to use and more ergonomic and cost-effective than traditional microscopes.

Fuji America Corporation TT Booth No: 107

Scott Wischoffer 171 Corporate Woods Pkwy. Vernon Hills, IL 60061 PHONE: 847-913-0162 FAX: 847-913-0186 EMAIL: [email protected] WEB: www.fujiamerica.com The innovative world leader in surface mount technology. Our modular, flexible and easy to use placement systems are configured to support any production environment from high mix/low volume to ultra-high volume. Easy to program, simple to maintain and unsurpassed quality make Fuji the perfect choice for all your PCB assembly needs.

Booth No: 1033

Glenbrook Technologies, Inc. Booth No: 819

Steven Zweig 11 Emery Ave. Randolph, NJ 07869 PHONE: 973-361-8866 FAX: 973-361-9286 EMAIL: [email protected] WEB: www.glenbrooktech.com Glenbrook Technologies introduces the Jewel Box Ultra Compact X-ray System. A full featured microfocus X-ray system small enough to fit on a desk.

Global SMT & Packaging Booth No: 919

Trevor Galbraith PO Box 7579 Naples, FL 34102 PHONE: 239-245-9264 FAX: 239-245-9268 EMAIL: [email protected] WEB: www.trafalgarmedia.com Global SMT & Packaging is the world’s leading B2B magazine for the EMS industry. Featuring solution led technical and market information, it is published as US, European, China and SE Asia editions. The magazines are supported by international daily newsletters and weekly regional newsletters to China, SE Asia, Germany, UK/Ireland and Latin America. GlobalSMT TV is the industry’s most viewed video channel featuring new products, how-to’s and corporate videos related to electronics manufacturing. Trafalgar Business Solutions (TBS) is the consultancy division, specializing in mergers, acquisitions, market research and development.

38 >> 2015 SMTA International SHOW DIRECTORY

Booth No: 305

Heller Industries Booth No: 107

Keith Virden 8307 High Oak Drive Austin, TX 78759-8132 PHONE: 512-454-4057 EMAIL: [email protected] WEB: www.hellerindustries.com Heller Industries is a manufacturer of convection reflow & IR curing ovens. Heller’s new heating and cooling advances delivery up to 40% reduction in nitrogen and electrical consumption. This makes the Heller ovens not only the premier reflow soldering system, but the best overall value in the industry.

Henkel Electronic Materials, LLC Booth No: 701

Elaine Kyle 14000 Jamboree Road Irvine, CA 92606 PHONE: 714-368-8000 EMAIL: [email protected] WEB: www.henkel.com/electronics Henkel is focused on developing nextgeneration materials for electronics assembly applications. A broad portfolio of materials including potting materials, sealants, low pressure molding systems and conformal coatings that span through multiple markets, including automotive, industrial, medical, lighting and consumer electronics. A leader in die attach, underfill, solder, molding, printable ink and thermal management materials, Henkel has developed some of the industry’s most innovative and enabling electronic material solutions. Learn more at www.henkel.com/electronics.

HEPCO, Inc.

I-Connect007

iLink Electronics, Inc.

Tim Hoffman 150 San Lazaro Ave. Sunnyvale, CA 94086 PHONE: 408-738-1880 FAX: 408-732-4456 EMAIL: [email protected] WEB: www.hepcoblue.com

Barbra Hockaday PO Box 50 Seaside, OR 97138 PHONE: 916-608-0660 EMAIL: [email protected] WEB: www.iconnect007.com

Ismael Pulido 28120 Ridgethorne Court Rancho Palos Verdes, CA 90275 PHONE: 310-318-4428 EMAIL: [email protected] WEB: www.ilinkae.com

Watch video interviews with industry leaders, read show articles, view our extensive photo gallery and more. Real Time with…SMTA International is produced by I-Connect007, home of SMT Magazine, SMT Week, SMT Online, Flex007, MilAero007, PCBDesign007, The PCB Magazine and PCB007. Produced by the industry’s most experienced digital media publisher, these global online resources are the electronics manufacturing industry’s most comprehensive source for news, articles and original content.

Making a Difference in the Automation, Design, Manufacture of FA Equipment, BHU & Facilities for SMT& SMD Lines.

Booth No: 416

Booth No: 104

Manufacturer of Equipment and Tooling for BGA Reballing and Component Lead Trimming and Forming Equipment.

Heraeus Electronics Booth No: 845

Ryan Herrmann 24 Union Hill Road Conshohocken, PA 19428 PHONE: 610-825-6050 EMAIL: [email protected] WEB: www.heraeus.com/en/home.html Heraeus Electronics – a Global Business Unit of the Heraeus Group – is one of the leading R&D partners and manufacturers of materials in the electronics industry. The company deals with sophisticated material solutions and sub-systems for the semiconductor and automotive industry, the communications and telecommunications industry, energy and power electronics, industrial electronics, and consumer goods. Heraeus Electronics’ core capabilities include bonding wires, thick film pastes, DBC substrates, roll clad strips, stamped lead frames, and assembly materials (such as solder pastes, fluxes, sinter pastes, solder powders, and conductive/non-conductive adhesives).

Hi-Rel Laboratories Booth No: 909

Adam Mortensen 6116 N. Freya Spokane, WA 99217 PHONE: 509-325-5800 EMAIL: [email protected] WEB: www.hrlabs.com Hi-Rel Laboratories is an independently owned and operated corporation whose main concentration of activity is in the materials evaluation of the micro-electronic aspects of commercial, aerospace and defense industries. We specialize in solutions for process, production and application problems requiring knowledge and experience in microelectronics and materials technology. Using techniques such as metallography, light and scanning electron optics coupled with energy dispersive spectroscopy, and FTIR, we are able to isolate and solve your materials issues.

Booth No: 1041

IDENTCO

Booth No: 1030 Dave Mondek 28164 W. Concrete Drive Ingleside, IL 60041 PHONE: 815-385-0011 EMAIL: [email protected] WEB: www.identco.com With over 29 years of experience, IDENTCO is your preferred global source for high performance UL/CSA electronic component & circuit board labels. IDENTCO’s durable labels endure harsh environments such as high heat, aggressive fluxes and caustic cleaners commonly used in the PCB manufacturing process. IDENTCO’s TT433 Ultra Durable Polyimide labels are the most versatile on the market performing equally well in both reflowed and non-reflowed environments. TT433 performs where others fail.

IKEUCHI USA, INC. Booth No: 902

Shogo Yamaguchi 8110 Beckett Center Drive West Chester, OH 45069 PHONE: 513-942-3060 EMAIL: [email protected] WEB: www.ikeuchiusa.com Ikeuchi USA provides a versatile system that can achieve ideal humidity in any environment with our patented technology, “Dry Fog” (non-wetting fog). Our advantages are non-wetting fog, low-pressure system, very low maintenance. IKEUCHI’s Fog Engineers can help you avoid the pitfalls that occur after installation of other ‘mindless’ humidifiers. Please visit our booth and feel the Dry Fog!

Indium Corporation Booth No: 430

Colleen Bierstine 34 Robinson Road Clinton, NY 13323 PHONE: 315-853-2052 EMAIL: [email protected] WEB: www.indium.com Indium Corporation is a premier materials supplier to the global electronics assembly, semiconductor fabrication and packaging, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. Factories are located in the PRC, Singapore, South Korea, the United Kingdom, and the USA.

Infinite Graphics Booth No: 925

Suzi McDonough 4611 E. Lake Street Minneapolis, MN 55406 PHONE: 612-728-1321 FAX: 612-721-3802 EMAIL: [email protected] WEB: www.igi.com Infinite Graphics’ game-changing Generate Solder Paste Stencil software advances the process of editing geometry for stencils from hours to minutes. Identification of a component is done once and applied to every angled component globally. Components are then automatically recognized for all future jobs, saving time and increasing throughput. Rules can be set up to edit solder paste geometry to create the desired stencil apertures instantly upon recognition of components, based on customer or engineering specifications. Infinite Graphics Incorporated (www.IGI.com) is a photolithography solutions provider with over 40 years experience in solving challenges with precision phototools, editing software, photomasks, and 3D/sculptured microstructures. Stop by booth #925 to see how IGI can help you.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 39

Inovaxe Corporation Booth No: 713

Margy Khoshnood 260 SW 12th Ave. Deerfield Beach, FL 33442 PHONE: 954-531-1363 FAX: 954-697-2362 EMAIL: [email protected] WEB: www.inovaxe.com Inovaxe is a provider of innovative SMART and PASSIVE material storage and handling systems. Our Ultra Lean Total Material Handling and Storage Solutions address the challenges of dealing with SMT components and kits within the manufacturing stockroom and WIP locations. The product offering includes SMART & PASSIVE Two Bay and One Bay Storage Carts (InoAuto), ambient air (InoCarts and InoKits), Moisture Sensitive Device Material Storage System (InoMSD), a stockroom management software tool (InoView), and an inventory locator software tool (InoAuto Locator).

InsulFab PCB Tooling Booth No: 512

Candice Simpkins 834 Hayne Street Spartanburg, SC 29301 PHONE: 864-582-7506 FAX: 864-527-1066 EMAIL: [email protected] WEB: www.insulfabtools.com InsulFab is your primary source for all types of tooling in the PCB industry, including engineering solutions for your most complicated tooling and process issues. We would welcome the opportunity to earn your business with quick turnaround, innovative design, quality products, competitive pricing and a sincere desire to provide the best customer service available. We look forward to demonstrating our experience and knowledge by assisting you with your PCB Tooling needs.

Inspection Feature Area Booth 1050

This year’s special feature area will focus on Solder Paste and Solder Joint Automated Optical Inspection. Be sure to stop by to view live printing of ultrafine pitch components, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus key inprocess inspection steps to make a process perform correctly.

Inventec Performance Chemicals Booth No: 230

Rodrigo Aguilar 26 Avenue du Petit Parc 94683 Vincennes Cedex France PHONE: +33143987540 EMAIL: [email protected] WEB: www.inventec.dehon.com More than 40 years of leadership supporting high reliability applications with soldering, cleaning and coating materials for electronics assembly and semiconductor packaging. Since December 2014, AMTECH materials is now part of Inventec. Solder paste for SMT, Package on Package, Jet Printing, wafer Bumping and die attach. Solder fluxes for Wave Soldering, Package on Package and flip chip. Cleaning chemistries for PCBA defluxing and maintenance cleaning. Coatings for protection of PCBA.

IPC

Booth No: 744 Susan Storck 3000 Lakeside Drive Bannockburn, IL 60015 PHONE: 847-597-2872 EMAIL: [email protected] WEB: www.ipc.org IPC (www.IPC.org) is a global industry association based in Bannockburn, IL., dedicated to the competitive excellence and financial success of its 3,500 member companies which represent all facets of the electronics industry, including printed board design and manufacturing, electronics assembly and test.

Ironwood Electronics Booth No: 818

Ila Pal 1335 Eagandale Court St. Paul, MN 55121-1353 PHONE: 952-229-8212 FAX: 952-229-8201 EMAIL: [email protected] WEB: www.ironwoodelectronics.com Ironwood Electronics offers high performance test sockets and adapters for both engineering and production use. IC packages covered include QFN, BGA, SOIC, QFP, and other SMT packages. Our GHz line of sockets supports up to 75 GHz bandwidth and the smallest footprint in the industry. We also provide customized adapters to the semi industry requiring intricate SMT interfaces for emulation, test, and prototype functions.

40 >> 2015 SMTA International SHOW DIRECTORY

iTAC Software, AG Booth No: 1027

Michael Fischer Aubachstr. 24 Montabaur 56410 Germany PHONE: +49-2602-1065 EMAIL: [email protected] WEB: www.itacsoftware.com iTAC Software, AG is a leading provider of enterprise MES solutions, specializing in the electronics, automotive, and medical markets. Our modular product portfolio includes solutions for delivering traceability, quality control, production management, planning and scheduling, and real-time business intelligence. Headquartered in Germany, iTAC Software has a global support organization and worldwide customer base that includes several top-tier multinational manufacturers. Our cloud-based enterprise MES offering is a leading enabler of Industry 4.0 and the industrial internet.

JBC Tools USA, Inc. Booth No: 636

Kathy Morrow 9296 Dielman Industrial Drive St. Louis, MO 63132 PHONE: 866-429-5753 EMAIL: [email protected] WEB: www.jbctools.com More than 80 years experience has placed JBC at the technological forefront of tools for soldering and rework operations in electronics. Innovation, efficiency and reliability are the key features of a wide range of products that have been designed to satisfy the most demanding requirements. JBC’s global organization of local offices and a distributor network spanning five continents enables the company to provide quick and efficient service.

Jovy Systems Limited Booth No: 646

Moataz Munier ElRaddaf 1B Area on 2nd Fl., # 48 Factory Workshop, Hexi Village Concept Of Ring Rd. Guan Lan Town 518110 Guangdong, Shenzhen China PHONE: 86-755-26068658 FAX: 86-755-26068658 EMAIL: [email protected] WEB: www.jovy-systems.com Jovy Systems is a global Manufacturer of BGA Rework stations, soldering stations, bench Tools and a wide range of soldering consumables that are specially designed for the electronics industry, and a stellar distribution network that covers more than 30 countries across all five continents.

JTAG Technologies

Kester

Koh Young America, Inc.

Grover Craig 111 West Street N. Suite A Easton, MD 21601 PHONE: 410-770-4415 EMAIL: [email protected] WEB: www.jtag.com

Michelle O’Brien 800 W. Thorndale Ave. Itasca, IL 60143 PHONE: 630-616-6806 EMAIL: [email protected] WEB: www.kester.com

Ashley Hughes 6150 W. Chandler Blvd. Suite 39 Chandler, AZ 85226 PHONE: 480-403-5000 EMAIL: [email protected] WEB: www.kohyoungamerica.com

Booth No: 939

With our products, customers world-wide have increased the quality of their products, reduced costs and improved time-tomarket. With more than 8,000 installations, a continuous track record of product breakthroughs, and the industry’s largest network of providers, JTAG Technologies is proud to lead the industry in boundaryscan solutions and services. Boundary-scan technology helps overcome the test and programming challenges of comples PCBs.

Juki Automation Systems TT Booth No: 716

Geron Ryden 507 Airport Blvd. Suite 101 Morrisville, NC 27560 PHONE: 919-460-0111 FAX: 919-469-0480 EMAIL: [email protected] WEB: www.jukiamericas.com Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, recently celebrated their 76th anniversary. Having shipped more than 29,000 machines worldwide, Juki continues to be an industry leader, promoting a global image that combines top-quality and high-reliability machines with a reputation for world-class service and support that result in the lowest production costs for its customers. The pioneer of the modular assembly system in 1993, Juki offers flexible solutions designed for both high-volume and high-mix environments and has offices in Morrisville, NC and Fremont, CA. Additionally, JAS, Inc. offers selective solder and stamp soldering machines backed by the largest field service group in the industry. The company recently introduced a complete line solution to include screen printers, reflow ovens and wave solder systems. For more information, visit www.jukiamericas.com.

Booth No: 307

Booth No: 131

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces. Our products include an array of basic and high-tech attachment materials including traditional soldering chemicals, bar and wire solder, and paste products. We serve a worldwide customer base with facilities in North America, Germany and Singapore. We are an Illinois Tool Works (ITW) Company. ITW is a leading diversified manufacturing company with more than 100 years of history and over 800 decentralized business units in nearly 60 countries. Kester offers the following solutions: LeadFree Solutions, Solder Paste, Liquid Solder Flux, Solder Wire, Bar Solder, Tacky Solder Flux (TSF), Preforms, SECURE® advanced materials and a full spectrum of global customer technical support. Throughout the world, Kester’s products are known for their high quality and advanced technology. Kester’s ISO-14001 and ISO-9001 certifications ensure Kester’s partners of this dedication to quality and environmental responsibility. Our goal is to provide product solutions for the electronics assembly, semiconductor and automotive industries across the world.

KIC

What we do: Design, manufacture, sales and service of industry leading 3D measurement & inspection solutions for process optimization on highly innovative manufacturing environment. Koh Young Applications: • In-line/off-line Solder Paste Inspection In-line Pre-reflow/Post-reflow AOI • Inspection Solutions for Semiconductor Flip-Chip Packaging • Inspection Solutions for Semiconductor 3D Packaging

KOKI Solder America Booth No: 135

Shantanu Joshi 4916 Strathmore Drive Unit 4 Cincinnati, OH 45227 PHONE: 760-504-2544 EMAIL: [email protected] Roberto Segura 18510 Pasadena Street Unit E Lake Elsinore, CA 92530 PHONE: 951-245-8755 EMAIL: [email protected] WEB: www.ko-ki.co.jp Established in 1964, KOKI have developed and introduced numbers of cutting edge soldering materials ever since.

Booth No: 338 MB Allen 16120 W. Bernardo Drive San Diego, CA 92127 PHONE: 858-673-6050 FAX: 858-673-0085 EMAIL: [email protected] WEB: www.kicthermal.com

Today, amid rapidly the evolving electronics industry, we, as a manufacturer of soldering materials, are requested of technological advancement, environmental friendliness, and compliance.

Discover efficient oven setup with KIC’s Auto-Focus Power. Auto-Focus Power leads to much faster oven setup for new assemblies and it lowers the risk of damaging the PCB during the first profile run. A manual profile can still be performed to verify an in-spec profile or for further fine-tuning. This easy-to-use product enables technicians of all levels to achieve expert process results and quickly solve that oven setup puzzle.

With that in mind, we are actively advancing soldering technologies of next generation, such as halogen-free flux, anti-cracking, and low melting point solder alloy, in addition to existing high quality soldering materials. We KOKI, as a group of professionals specialized in soldering technologies, are eager to contribute to the development and advancement of the global soldering industry with latest technologies, quality excellence, and valuable services to provide.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 41

Krayden, Inc.

KwikTic, Ltd.

MacDermid

Patrick Gurak 1491 W. 124th Ave. Denver, CO 80234 PHONE: 303-280-2800 FAX: 303-280-0178 EMAIL: [email protected] WEB: www.krayden.com

Dave Pickavance Suite 5, Northern Diver Building Appley Bridge Wigan, WN6 9AE United Kingdom PHONE: 44-0-1257-369320 EMAIL: [email protected] WEB: www.kwiktic.com

Deanna Cullen 245 Freight Street Waterbury, CT 06702 PHONE: 203-575-5743 FAX: 203-575-7916 EMAIL: [email protected] WEB: www.electronics.macdermid.com

Booth No: 931

Krayden is a stocking distributor of adhesives and sealants for North America, including the USA, Canada, and Mexico. Dow Corning Distributor of Year 2011 (4th yr in row), Certs- AS9120, ISO9001:2008

Kulicke & Soffa Industries, Inc. Booth No: 136

Sheila Frese 1821 E. Dyer Road #200 Santa Ana, CA 92705 PHONE: 949-660-0440 FAX: 949-660-0444 EMAIL: [email protected] WEB: www.kns.com Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacturing of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, advanced SMT (acquired from Assembléon Netherlands B.V.), wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor, LED devices and high quality printed circuit board assembly.

Booth No: 445

Booth No: 927

Within manufacturing environments controlling and monitoring data on the shop floor efficiently is critical to producing high quality product on time and to budget. Using paper documents, basic office tools and verbal communication inevitably leads to delays, errors and is costly. With KwikTic the entire process, including Test, Inspection, AOI, Assembly, shipping, can be easily controlled and monitored through simple interfaces and comprehensive reporting.

MacDermid Electronics Solutions is a leading supplier of specialty chemicals for PCB fabricators, assemblers, and original equipment manufacturers and supplies innovative, environmentally sound products to a rapidly changing electronics marketplace. We specialize in the areas of final finishes, through-hole metallization, and circuit formation providing a critical component for maintaining the finished product’s overall performance. We are a proven innovator in the field of chemical processing, providing application-specific solutions and unsurpassed technical support.

KYZEN Corporation

MANEX ERP, Inc.

Sherry Stepp 430 Harding Industrial Drive Nashville, TN 37211 PHONE: 615-983-4562 EMAIL: [email protected] WEB: www.kyzen.com

David Sharp 7026 Sitio Corazon Carlsbad, CA 92009 PHONE: 814-806-1261 EMAIL: [email protected] WEB: www.manex.com

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Celebrating 25 years in 2015, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards.

Custom ERP system designed for the Electronic Manufacturing Services (EMS) industry. Designed by and for EMS companies to meet the current and future needs of the evolving industry. Come experience the difference the right tool makes when running your business.

KwikTic is a scalable MES, Work Instruction and Quality Software Suite.

Booth No: 117

LaserJob, Inc. Booth No: 125

Carmina Laentzsch Liebigstrasse 14 Fuerstenfeldbruck, DE 82256 Germany PHONE: 49-8141-52778 22 FAX: 49-8141-52778-69 EMAIL: [email protected] WEB: www.laserjob.de Specialist for lasercut SMD-stencils for more than 20 years. We offer step sencils, nanocoated stencils (NanoWork) since 2008, repair- and reballing stencils, wafer bumping stencils, via fill stencils, and stencils for all tensioning systems. Our stencils show a tensioning force >40N/cm, with an aperture size accuracy of +-3µm and an aperture position accuracy of +-10µm.

42 >> 2015 SMTA International SHOW DIRECTORY

Booth No: 339

Materials Evaluation and Engineering, Inc. Booth No: 1023

Dieter Scholz 13805 1st Ave. N. Suite 400 Plymouth, MN 55441 PHONE: 763-449-8870 FAX: 763-449-8699 EMAIL: [email protected] WEB: www.mee-inc.com MEE assists electronics manufacturers with failure analysis, materials characterization, product development, and quality assurance. Available services include precision microsectioning, SEM/EDS, Field Emission SEM, light microscopy, and mechanical testing. Please stop by booth #1023 to learn about our latest addition to the lab: broad beam ion milling. Advanced analytical methods combined with sound engineering provide our customers practical, cost effective solutions to materials-related problems.

Mek

Metcal

MicroScreen

John Rider 5550 Painted Mirage Road Suite 320 Las Vegas, NV 89149 PHONE: 714-402-6031 EMAIL: [email protected] WEB: www.marantz-electronics.com

Jerry Simmons 12151 Monarch Street Garden Grove, CA 92841 PHONE: 714-799-9910 EMAIL: [email protected] WEB: www.metcal.com

Holly Wallace 1106 S. High Street South Bend, IN 46601 PHONE: 574-232-4358 FAX: 574-234-7496 EMAIL: [email protected] WEB: www.microscreen.org

Booth No: 1040

Booth No: 816

Marantz Electronics, your supplier of Automated Optical Inspection (AOI) technologies for advanced PCB inspection and test and measurement.

Mentor Graphics Corporation, Valor Division Booth No: 634

Lisa Hartman 8005 S. W. Boeckman Road Wilsonville, OR 97070 PHONE: 720-494-1246 EMAIL: [email protected] WEB: www.mentor.com/vlaor The Valor PCB Manufacturing Software Division of Mentor Graphics is the leading global provider of software solutions for the fabrication, design, and assembly segments of the printed circuit boards (PCB) manufacturing industry. Our software solutions simulate, optimize, monitor and control the PCB production lifecycle, enabling our customers to manufacture PCBs for electronic products more efficiently, cost effectively and with better quality.

MET Stencil Booth No: 329

Greg Starrett 140 Mount Holly Bypass Unit 10 Lumberton, NJ 08048 PHONE: 609-261-2670 FAX: 609-261-4007 EMAIL: [email protected] WEB: www.metassocs.com MET is ready to meet your stencil requirements. We manufacture Electroformed Stencils, Laser Cut Stencils, and Chemically Etched Stencils for various solder paste and glue printing applications. We have the technology to provide stainless steel, nickel, step down, or step up solder masks. If you’re looking for tube, cast, Vector Guard, Wizard or any other type of stencil mounting system; we have it.

Booth No: 535

Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. As part of OK International, Metcal’s industry-leading position addressing advanced technology in conduction soldering and rework/repair, has and will continue to broaden to a full electronics bench tool single-source solution. Metcal product lines currently include: hand soldering and desoldering, convection rework products, fume extraction and fluid dispensing tools.

MicroScreen LLC offers laser cut and electroformed stencils for solder paste deposition. All stencils are 100% inspected using ScanCheck AOI. Options include Nano Coating, Fine Grain Metal, Invar Metal, MicroWeld step stencils, and Wizard frame and Space Saver frame systems. MicroScreen also manufactures thick film screens and large format screens, and MicroScreen is ITAR Registered.

Mid-America Taping & Reeling

Metro SMT, Ltd.

Booth No: 540

Booth No: 344

Barbara Pauls 121 Exchange Blvd. Glendale Heights, IL 60139 PHONE: 630-629-6646 FAX: 630-871-1502 EMAIL: [email protected] WEB: www.matr.com

David Cotton Cherry Tree House Henfield Road Small Dole, BN5 9XJ United Kingdom PHONE: 866-789-7841 FAX: 44-87-1246-4982 EMAIL: [email protected] WEB: www.metrosmt.com From the start of the Company in 1999 Metro SMT was launched as a specialist nozzle manufacturer and we became one of the leading suppliers of specialist nozzles in the SMT industry. As the business expanded we became more involved in the supply of consumable parts for SMT lines to the point where this became the mainstay of our business. The company focus on the sourcing and supply of excellent used SMT machines, and using our team of agents and engineers we set about becoming the one stop facility for all SMT needs.

Mid-America Tape and Reel specializes in Surface Mount, Axial and Radial Taping, Forming, Programming and 3-D Coplinarity Inspection. We design and manufacture thermoformed custom carrier tape pockets and trays. We provide a CAD drawing of the proposed pocket, to the finished product. As well as provide the service to fill the parts into the pockets. We also manufacture injection molded reels used in this process. We distribute cover tape, static and dry pack bags, desiccant, HIC cards and Vacuum Sealing machines. All products are made in the USA, since 1983. ISO- 9001-2008 Certified. We are a Woman Owned and Operated company Certified by the WBNC.

Now in 2015, we are able to source, supply, install and commission the most popular types of machines as well as supply a 12 month warranty on all parts.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 43

Mirtec Corporation

Nihon Superior Company, Ltd.

Nitto Kohki U.S.A., Inc.

Robert Horowitz 3 Morse Road Unit 2A Oxford, CT 06478 PHONE: 203-881-5559 FAX: 203-881-3322 EMAIL: [email protected] WEB: www.mirtecusa.com

Keith Howell 1395 Hawk Island Drive Osage Beach, MO 65065 PHONE: 573-280-2357 EMAIL: [email protected] WEB: www.nihonsuperior.co.jp

Ryoji Takahashi 46 Chancellor Drive Roselle, IL 60172 EMAIL: [email protected] PHONE: 630-924-9393 WEB: www.nittokohki.com

With the success of its SN100C lead-free solder alloy, now in its 15th year, Nihon Superior Co. Ltd. has become a global player. The company continues its leadership in the development of lead-free solders with the introduction of SN100CV P506 solder paste. The newly developed SN100CV alloy although silver-free matches the strength of SAC305 while maintaining high impact resistance. Alconano Nano-Silver die attach paste for high operating temperature power modules will also be displayed.

Nitto Kohki U.S.A., Inc. was founded in 1969 to provide sales and services of machine tools and electric screwdrivers and quick-connecting fluid couplings that are designed and manufactured by Nitto Kohki Co., Ltd. located in Tokyo, Japan. Through our products, Nitto Kohki has consistently offered customers advantages in terms of labor savings, improved working environments and efficient manufacturing.

Booth No: 407

MIRTEC is a Leading Global Supplier of 3D & 2D Automated Optical Inspection (AOI) and Solder Paste Inspection Systems (SPI) to the Electronics Manufacturing Industry. Our company invests heavily in Research & Development, persistently focused on using state-of-the-art optics, lighting and laser technology to advance the industry.

MYCRONIC, Inc. Booth No: 825

John McMahon 320 Newburyport Turnpike Rowley, MA 01969-2002 PHONE: 978-948-6919 FAX: 978-948-6915 EMAIL: [email protected] WEB: www.mycronic.com/smt MYCRONIC designs and builds SMT placement machines and stencil-free jet printers. MYCRONIC solutions are designed with lean manufacturing in mind saving substantial time in your production. With unique machine concepts and advanced software tools, MYCRONIC represent the intelligent factory of the future. Our mission is to always be innovating in order to satisfy the electronic industry’s need for surface mount technology and services that meet the highest demands in terms of productivity and quality.

National Technical Systems Booth No: 1035

Pamela MacDonald 24007 Ventura Blvd. Suite 200 Calabasas, CA 91302 PHONE: 661-259-8184 EMAIL: [email protected] WEB: www.nts.com NTS provides test, inspection and certification services to help clients build better, stronger, safer, more reliable products. Our engineers and technicians serve a wide range of industries such as aerospace, defense, telecom and energy. With a nationwide network of laboratories, we bring a unified solution to a global market.

Booth No: 419

Nikon Metrology Booth No: 340

Meghan Meinert 12701 Grand River Road Brighten, MI 48116 PHONE: 810-220-4360 EMAIL: [email protected] WEB: www.nikonmetrology.com Nikon Metrology offers the broadest range of metrology solutions for applications ranging from miniature electronics to the largest aircraft. Nikon Metrology’s innovative measuring and precision instruments contribute to a high performance designthrough- manufacturing process that allows manufacturers to deliver premium quality products in a shorter time. These products include: • Coordinate Measuring Machines • Laser Scanners • Portable Measuring • Video & Microscope Measuring • Semiconductor Systems • X-Ray and CT Inspection Systems • Microscope Systems • Large Volume Applications with Laser Radar • Motion Measurement and Robotics • Inspection and Imaging Software Further information is available on www.nikonmetrology.com.

44 >> 2015 SMTA International SHOW DIRECTORY

Booth No: 917

Nordson ASYMTEK Booth No: 706

Jerry Frost 2747 Loker Avenue West Carlsbad, CA 92010 PHONE: 760-431-1919 EMAIL: [email protected] WEB: www.nordsonasymtek.com Automated fluid dispensing, jetting and conformal coating systems from Nordson ASYMTEK are ideal for precision assembly processes for PCBs, LEDs, flat panel displays, automotive products, medical/ biotech products, semiconductor packaging, MEMS, and other electro-mechanical devices. Popular dispensing and conformal coating products include the Spectrum™ and Quantum™ dispensers, NexJet® valve, and Select Coat® conformal coating platforms, all supported by an award-winning global support network. The company is ISO 9001:2008 certified.

Nordson DAGE

Booth No: 606

TT

Hal Hendrickson 2370 Oak Ridge Way Vista, CA 92081 PHONE: 949-361-2714 EMAIL: [email protected] WEB: www.nordson.com Nordson DAGE manufactures Industry leading Test and Inspection equipment for the PCBA and Semiconductor industries. The Nordson DAGE XD7600NT Diamond FP X-ray inspection system with Quick View CT, utilizes the latest technology, flat panel detector and proven feature recognition capability to provide the ultimate choice for the highest quality in X-ray imaging on the market today. Nordson EFD, the world’s leading designer and manufacturer of precision dispensing systems will also exhibit in the booth.

Nordson YESTECH Booth No: 606

Hal Hendrickson 2370 Oak Ridge Way Vista, CA 92081 PHONE: 949-361-2714 EMAIL: [email protected] WEB: www.nordson.com Nordson YESTECH is a worldwide leader in the design, development and manufacture of automated optical (AOI) inspection solutions for the PCBA and semiconductor packaging industries. The new FX-940 with advanced megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 3D inspection, the FX-940 inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

North Dakota Department of Commerce Booth No: 1028

Laura Willard 1600 E. Century Ave. Suite 2 Bismarck, ND 58503 PHONE: 701-328-5337 EMAIL: [email protected] WEB: www.NDBusiness.com The North Dakota Department of Commerce leads the state’s efforts to attract new business to the state. We can assist businesses with financing, incentive packaging and site selection. North Dakota’s favorable position as one of the lowest cost states for operating a business are driving top companies to establish operations here. An opportunity within a HUB zone featuring a regional workforce trained in electronics manufacturing could be the answer your company is looking for. Visit our booth to learn more.

Omron Inspection Systems

Northern Electronics Automation

Booth No: 436

Krissy Sorensen 2895 Greenspoint Pkwy. Hoffman Estates, IL 60169 PHONE: 847-285-7257 FAX: 847-285-8257 EMAIL: [email protected] WEB: www.omron247.com

Booth No: 708

Shannon Allard 19 Park Ave. Hudson, NH 03051 PHONE: 603-881-5253 FAX: 603-881-5304 EMAIL: [email protected] WEB: www.nea-llc.com NEA LLC is a global leader in PCB assembly and test equipment. We deliver certified re-manufactured equipment with the most comprehensive warranties in the industry. We also offer service contracts, training for your operators or technicians and a wellstocked parts department for your immediate equipment requirements.

O.C. White Company Booth No: 1001

Omron’s PCB inspection systems lead the AOI market with the fastest production speeds, 3D imaging, and patented technology, providing increased productivity and high quality inspection capability. As a company with more than 40 years experience in both factory automation and the printed circuit board production environment, Omron is able to use this knowledge to deliver the right AOI solution for today’s ever demanding market.

Oxford Instruments

Richard May 4226 Church Street Thorndike, MA 01079-0644 PHONE: 413-289-1751 EMAIL: [email protected] WEB: www.ocwhite.com

Booth No: 537

The World Leader in inspection products for the electronic bench. Easy to use head’s up HD video systems with measurement and archiving of images, allowing easy soldering and re-work along with state of the art LED magnifiers, Microscope systems and all bench top lighting specialized lighting needs. Exclusive UV inspection systems for conformal coated boards. Bonkote ESD Flux dispening pens with New tips displayed also. These world renown inspection products lead the industry in LED design with ergogenic functionality and ESD safety at the top of the product designs.

Jason Pham 300 Baker Ave. Suite 150 Concord, MA 01742 PHONE: 978-369-9933 FAX: 978-369-8287 EMAIL: [email protected] WEB: www.oxinst.com Oxford Instruments is a leading provider of high- technology X-Ray Fluorescence (XRF) instruments used around the world for quality control. These instruments provide critical and non-destructive analysis of metals and coating thickness gauging during all phases of the manufacturing process. Come see Oxford Instruments at booth 537 to speak to one of our specialist about your application needs or email [email protected] to set up an on-site demo.

PACE, Incorporated Booth No: 945

John Romanowicz 255 Air Tool Drive Southern Pines, NC 28387 PHONE: 910-695-7223 EMAIL: [email protected] WEB: www.paceworldwide.com PACE is recognized as the world leader in the development of solutions for the assembly and repair of highly advanced electronics. Providing innovative solutions, products and training for the rework, repair and inspection of printed circuit boards, PACE offers solder, desolder, rework, fume extraction and BGA rework systems, all made in the U.S.A!

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 45

Panasonic Factory TT Solutions of America Booth No: 213

Jeff Malek 1701 Golf Road Suite 3-1200 Rolling Meadows, IL 60008 PHONE: 847-637-9689 FAX: 847-637-9601 EMAIL: [email protected] WEB: www.panasonicfa.com

PPG Industries, Semco Packaging & Application Systems Booth No: 641

Jim Enochs 12780 San Fernado Road Sylmar, CA 91342 PHONE: 818-362-6711 EMAIL: [email protected] WEB: www.ppgaerospace.com PPG Industries, Semco Packaging & Application Systems manufactures a wide range of plastic packaging systems for single and multi-component assembly materials. Major users include formulators of adhesives, sealants, coatings and soldering materials for a variety of industry sectors including aerospace and electronics. ®

As a manufacturer, Panasonic understands the evolving demands of today’s electronics assembly manufacturing environment, and that uniquely enables us to provide scalable, integrated, and efficient solutions that help our customers remain viable in a competitive market. No matter if you’re high mix/low volume, low mix/high volume, or anything in between, Panasonic equipment, MES software, and other services can help improve throughput and efficiency while keeping quality reliably high.

Photo Etch Technology Booth No: 802

Kris Guidi 71 Willie Street Lowell, MA 01854 PHONE: 978-805-5000 EMAIL: [email protected] WEB: www.stencil.com Photo Etch Technology brings over 35 years of experience and industry excellence to the SMT industry.

Precision Placement Machines Booth No: 736

Sharon Breault 326 Main Street Unit 11 Fremont, NH 03044 PHONE: 603-895-5112 FAX: 603-895-5113 EMAIL: [email protected] WEB: www.goppm.com PPM is a full-service supplier of used and reconditioned automated PCB assembly equipment for the electronics industry. We focus on Quad Pick & Place, Camalot Paste Dispensers & MPM Screen Printers. We offer refurbished machines, parts & service.

Laser cut smt stencils, electroform smt stencils, precision metal etched parts, thick film screens, shadow mask’s Please visit www.stencil.com for more information.

Pillarhouse USA, Inc. Booth No: 139

Adrian De’Ath 635 Touhy Ave. Elk Grove, IL 60007 PHONE: 847-593-9080 FAX: 847-593-9084 EMAIL: [email protected] WEB: www.pillarhouseusa.com Pillarhouse are world leaders in selective solder solutions from hand load process to automated high speed lines. Pillarhouse manufacture modular and stand alone equipment to meet the needs of an ever changing market. The new low cost GEM can be configured for wave, rework or selective or the new dual pot inline MPR with board handling capability of 24 x 48. Our customer driven product line includesJade-Topaz E Orissa and the High speed Amethyst.

46 >> 2015 SMTA International SHOW DIRECTORY

Prototron Circuits, Inc. Booth No: 418

Russ Adams PO Box 875 Redmond, WA 98073 PHONE: 425-823-7000 FAX: 425-869-2515 EMAIL: [email protected] WEB: www.prototron.com “If it has to be right, and on time call Prototron.” Prototron has been in business over 20 years as a full service quick turn Printed Circuit Board manufacturer, currently with 2 facilities. One located in Redmond, WA (ISO Certified), and another located in Tucson, AZ (Mil 55110G Certified). Standard lead time on commercial spec boards is 5 days, with expedite service up to 24 Hrs. Services include but are not limited to: IPC 6012Class III builds, Specialty materials including Rogers, Arlon, Polymide, and Metal backed, Controlled impedance modeling, File analysis using Valor Genesis 2000, Blind and buried vias, Silver filled vias, Thin core processing, and RoHS compliant builds. Surface finishes include, ENIG, immersion Silver, White Tin, Full body electrolytic gold, Soft bondable gold, and HASL. Please visit us at Prototron. com for more information.

Purex

Booth No: 245 Scott Snell 2108 Swan Lane Rolling Meadows, IL 60008 PHONE: 866-360-5675 FAX: 630-876-9898 EMAIL: [email protected] WEB: www.purexus.com Years of cutting edge product development allow Purex to offer a complete line of fume extraction solutions unlike any in the industry. A world expert in its field, Purex is renowned for the quality and reliability of its technology and unrivaled customer support. Purex supplies machines to many industries and manufacturing companies worldwide with applications including: Laser Coding and Marking, Continuous Ink Jet Coding and Marking, Laser Engraving, Wide Format Printing, Dye Sublimation, Reflow and Wave Soldering, Manual Soldering, Laser and Robotic Soldering, Underfill and Conformal Coating, Cleanrooms and Laboratories, Education and Engineering.

Qualitek International, Inc.

Rehm Thermal Systems, LLC

RS Simmons Co., LLC

Debbie Liguori 315 Fairbanks Street Addison, IL 60101 PHONE: 630-628-8083 FAX: 630-628-6543 EMAIL: [email protected] WEB: www.qualitek.com

Paul Handler 3080 Northfield Place Suite 109 Roswell, GA 30076 PHONE: 770-442-8913 FAX: 770-442-8914 EMAIL: [email protected] WEB: www.rehm-group.com

Bob Simmons 818 Harmony Hill Road West Chester, PA 19380 PHONE: 610-547-7690 FAX: 610-458-0309 EMAIL: [email protected] WEB: www.rssimmons.com

Booth No: 538

Global soldering materials manufacturer founded in 1980 headquartered in Addison, IL. U.S.A.. Products include: RoHS lead free solders and leaded. Halogen Free Materials, Solder Paste, Wire, Flux, Bar, BGA Spheres, Dross Eliminators, Rework Materials, Wave Solder Oil. Sn100E Lead Free Replacement for SAC 305, 1% Low Silver Lead Free SAC 105 Solder, Low Temp. Lead-Free Sn42/Bi58 Solder. Metals Recycling Program includes: Silver & Thermally Conductive Epoxy Scrap, Solder Check-Up Program, Technical Support. ISO 9001:2008 Certified.

Quik-Tool

Booth No: 918 Jim Bernhard 10 Tanglewood Road Plainville, MA 02762 PHONE: 508-699-9077 EMAIL: [email protected] WEB: www.quik-tool.com Quik-Tool sets the “Gold Standard” in automatic compliant SMT Tooling for Printers, Pick and Place, and other SMT assembly equipment. The founders of QuikTool invented the entire concept over 13 years ago and now have made Quik-Tool the most cost effective and highest performing tooling in the industry, combining the highest reliability with lowest maintenance with industry leading ease of use. Ask about our Opti-Flow technology and our QT Plus vacuum assist system.

Booth No: 437

Rehm Thermal Systems produces energyefficient manufacturing equipment for the electronics and photovoltaics industry. As a manufacturer of reflow soldering systems (convection or condensation) and drying and coating systems, we are today a technological and innovation leader in the economically advantageous area of module production. In the field of solar power Rehm offers high-quality equipment for the metallisation of solar cells. For our clients we tailor-make applications related to soldering, coating and hardening for electronics modules for 25 years.

RPS Automation, LLC Booth No: 807

Reid Henry 3808 N. Sullivan Road Bldg. 14J Spokane Valley, WA 99216 PHONE: 509-891-1680 FAX: 509-891-1681 EMAIL: [email protected] WEB: www.rpsautomation.com RPS Automation designs and manufactures a complete line of high precision selective soldering, lead tinning and component test and steam aging equipment for electronics and circuit board manufacturing and assembly. RPS has over 20 years of automated soldering experience and more than 480 installations. All systems are built in the USA and feature precision robotics, easy to use software, extensive warranty coverage, and exceptional customer service.

Booth No: 936

SimCAD v1.0 - New Affordable CAD Conversion software. Converts gerber files and component lists (parts lists, bill of materials, XY locations) to files that will run on placement and similar machines. We are a Microsoft Windows based software development company. Visit us for any custom software solution. Specializing in CAD conversion and machine control applications.

Saki America, Inc. Booth No: 1025

Satoshi Ohtake 48016 Fremont Blvd. Fremont, CA 94538 PHONE: 510-623-7254 EMAIL: [email protected] WEB: www.sakicorp.com/en/ Saki is a leading global supplier of superior automated optical and X-ray inspection and measurement systems for the printed circuit board assembly industry, with over 20 years of providing market-leading solutions for 2D AOI, and 3D SPI, AOI, and AXI inspection needs.

Samsung C&T Automation, Inc. Booth No: 739

Jessica Kim 17835 Sky Park Circle Suite E Irvine, CA 92614 PHONE: 949-222-2201 FAX: 800-848-6467 EMAIL: [email protected] WEB: www.samsungsmt.com Samsung has developed advanced technology for electronic & mechanical design, process, and production with high speed and accuracy, leveraging the technical expertise of semiconductor equipment and industrial automation system. Based on these technologies, we provide high speed and high precision SMT machines to our valuable customers for them to reach their company production goal.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 47

Schoeller-Electronics GmbH

SEHO North America, Inc.

Seika Machinery, Inc. TT

Jules Limpens Marburger Strasse 65 Wetter D-35083 Germany PHONE: +49 171 315 7727 EMAIL: [email protected]

Gus Mavrou 1420 Jamike Drive Erlanger, KY 41018 PHONE: 859-371 7346 FAX: 859-282 6718 EMAIL: [email protected] WEB: www.sehona.com

Michelle Ogihara 3528 Torrance Blvd. Suite 100 Torrance, CA 90503 PHONE: 310-540-7310 FAX: 310-540-7930 EMAIL: [email protected] WEB: www.seikausa.com

Booth No: 935

Booth No: 635

Robert McGarry PHONE: +1 (234) 380-2523 EMAIL: [email protected] WEB: www.schoeller-electronics.com

Schoeller-Electronics GmbH A Leader in Precision Engineered Printed Circuit Board Solutions. Technology: Flex and Rigid-Flex, HDI/ Sequential Build- up, RF & Microwave, Thermal Management, Mixed Dielectrics Target Markets: Medical, Industrial, Civil Avionics, Automotive, Telecommunication • • • • • • • • •

QA ISO 9001 Automotive ISO TS16949 Avionics EN 9100 IPC-6011 class 3 and 3A Environment ISO 14001 Workplace Safety OHSAS18001 Energy Management DIN 16247-1 AEO certified UL File E51209

Scienscope Booth No: 544

Dan Kelsey 5751 Schaefer Ave. Chino, CA 91710 PHONE: 909-590-7273 FAX: 909-590-7020 EMAIL: [email protected] WEB: www.scienscope.com

SEHO is a world class manufacturer of selective, wave and reflow soldering machines that are ideally supplemented with creative handling solutions for automated production lines and automated optical inspection systems. At SEHO we combine innovative engineering and process know how to deliver equipment manufactured to the highest quality standards, ensuring a reliable and repeatable process.

Seica, Inc.

Booth No: 406 Crystal Meneses 50A Northwestern Drive Suite 10 Salem, NH 03079 PHONE: 603-890-6002 FAX: 603-890-6003 EMAIL: [email protected] WEB: www.seica-na.com Seica is a world leader in test & measurement equipment design and services. With offices worldwide, Seica can support you no matter where your NPI centers or production facilities are located. From bare board/substrate testing to traditional in-circuit and functional testing, Seica is the only ATE company that provides solutions to both the substrate and loaded board markets.

Scienscope International is a manufacturer of Micro-focus cabinet style X-Ray machines for NDT. The X-Scope X-Ray product line is designed for PCB inspection. Scienscope also manufactures Video inspection systems, video measurement systems, microscopes and magnifiers.

48 >> 2015 SMTA International SHOW DIRECTORY

Booth No: 707

Seika is exhibiting the latest advanced BGA/ SMT rework station, Den-On RD-500V, capable of reworking 01005 components and large platform PCBs and Hioki Flying Probe ICT with New Easy Gerber-Based Software Programming and Solder Joint Integrity Inspection System. Also showing Malcom RCX Reflow Monitoring Systems including O2 and wind velocity sensors, and profiler with Video Capture. Representing with full sales and technical support on top SMT and ATE solutions from Japan such as the Sawa Nozzle Cleaner; Sawa Low-VOC Fully Automatic Stencil Cleaner; McDry UltraLow Humidity Storage Cases - PCB and MSD Storage and Baking Cabinets; Sayaka PCB Routers introducing the New Twin-Table Model, Andes Multi-Point Soldering System and debuting the Eightech Tectron Vacuum Reflow Oven to the U.S. market

Senju Comtek Corporation Booth No: 412

Rafael Padilla 1999 S. Bascom Ave Suite 340 Campbell, CA 95008 PHONE: 408-963-5300 FAX: 408-963-5399 EMAIL: [email protected] WEB: www.senju.com Senju Metal Industry Co., Ltd. (SMIC) is a global leader in solder materials and related equipment. Solder alloys, available in paste, wire, bar, ball, and preform, are uniquely customized to accommodate various application needs such as low-silver, lowtemp, and high reliability. Wave and selective systems incorporate innovative pump technology for the highest and most stable wave pressure. With technical expertise and a world-class support, we deliver a cuttingedge soldering solution.

Shenzhen D.M. Electronic, Limited Booth No: 900

Ryan Wang 3F, No. 28, The 2nd Industrial Zone Heyi village, Shajing town, Bao’ an District Shenzhen, 518104 China PHONE: 86-755-27269685-801 MP: 86-13823305510 FAX: 86-755-27220690 EMAIL: [email protected] OR [email protected] WEB: www.5PCB.com D.M. Electric International Limited is a professional company dedicating to manufacturing various printed circuit boards. We can offer all kinds of electric products services from PCB design, quick PCB prototypes, small batches PCB productions and PCB assembly.

Simplimatic Automation Booth No: 1018

Kevin Welsch 1046 West London Park Drive Forest, VA 24551 PHONE: 434-386-7759 EMAIL: [email protected] WEB: www.simplimatic.com Simplimatic Automation designs, manufactures, and integrates material handling and automation systems for the electronics and semiconductor industries. Simplimatic SMT material handling systems have been globally adopted for their superior design and reliability. Simplimatic manufactures a complete line of edge belt conveyor systems including; manual assembly stations, line loaders and unloaders, aisleway systems, buffers, merge and turn units, elevators, board inverters, laser markers, PCB traceability systems, and much more. Simplimatic’s complete line of SMT conveyor is made in the USA and comes standard with 24/7 US based support. Visit Simplimatic.com to learn more about why Simplimatic is the world leader in SMT material handling.

SMT Today

SMTnet

Lin Ramsay 1 Dow Road Prestwick International Aerospace Park Prestwick, South Ayrshire KA9 2TU Scotland PHONE: 44-1292-834-009 EMAIL: [email protected] WEB: www.smttoday.com

Roland Girouard 98 Elm Street Portland, ME 04101 PHONE: 207-780-0887 EMAIL: [email protected] WEB: www.smtnet.com

Booth No: 446

Booth No: 132

SMT Today is a high quality publication created for the global electronics industry. This bi-monthly magazine includes technical features, interviews and the latest product announcements with contributions from many of the electronic industry’s leaders and technology experts. In addition, the team at SMT Today have also created a marketing agency which works exclusively within the electronics industry. This team of experienced and professional individuals work closely with their customers to deliver responsive websites, successful marketing campaigns and effective video productions.

SMTnet.com is an interactive website for electronics manufacturing professionals with over 500,000 unique visitors in the last year. SMTnet’s new Power Membership program promotes your company in front of these visitors for only $97/month!

SOMACIS

Booth No: 911 Michele Stampanoni Via Jesina 17 Castelfidardo, 60022 Italy PHONE: 41-79-4011715 EMAIL: [email protected] WEB: www.somacis.com For more than forty years, SOMACIS has been a dynamic company producing high-tech PCBs and delivering innovative solutions.

SMTA

Registration Lobby Krissy Ohnstad 5200 Willson Road Suite 215 Edina, MN 55424 PHONE: 952-920-7682 FAX: 952-926-1819 EMAIL: [email protected] WEB: www.smta.org

SOMACIS, headquartered in Italy, is one of the leading PCB manufacturers, with more than 800 employees and production plants in Italy, USA (Hallmark Circuits, Inc.) and China.

A not-for-profit international association of companies and individuals, involved in all aspects of the electronics assembly industry. We are dedicated to the advancement of the electronics industry through member education, training, networking and access to knowledge. Chapters are located in the U.S., Canada, Taiwan, Penang, India, Hong Kong, Mexico, South Brazil and Israel. Educational programs, symposiums, and seminars sponsored by SMTA Headquarters are held throughout the year across the US, Canada, China and Malaysia.

SOMACIS is a worldwide partner supplying HDI, rigid, rigid-flex and flex PCBs for time critical and mass production requirements.

Sonoscan, Inc. Booth No: 424

Janet Lykowski 2149 E. Pratt Blvd. Elk Grove Village, IL 60007 PHONE: 847-437-6400 EMAIL: [email protected] WEB: www.sonoscan.com Sonoscan® is a leader and innovator in Acoustic Micro Imaging (AMI) technology. Sonoscan manufactures acoustic microscope systems and provides laboratory services to nondestructively inspect and analyze products. Our C-SAM® microscopes provide unmatched accuracy for the inspection of products for hidden internal defects in SMT devices, such as ICs, ceramic capacitors and resistors, hybrids, MEMs, plus PCBs too. Industry standards provide guidelines for determining the reliability of your SMT devices and boards with acoustic microscopes.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 49

Sovella, Inc./The Daylight Company Booth No: 907

Carissa Harris 156 Bluffs Court Canton, GA 30114 PHONE: 800-437-6772 FAX: 770-720-6584 EMAIL: [email protected] WEB: www.sovella.us Sovella® is a leading manufacturer of industrial workstations, furniture and storage solutions, including work benches, shelving and cabinets, drawer units, and manual assembly lines for various industries. We consider the human factor within your workspace and have paid special attention to human physiology and individual operator requirements.

Specialty Coating Systems (Equipment) Booth No: 434

Brad Banfill 7645 Woodland Drive Indianapolis, IN 46278 PHONE: 317-244-1200 EMAIL: [email protected] WEB: www.scscoatings.com With over 40 years of coating and applications experience, SCS is an industry leader in conformal coating services and systems. At SMTAI 2015, SCS is pleased to exhibit its fully-automated Precisioncoat selective spray coating and dispense system, featuring motorized tilt and rotate functionality, fiducial recognition, needle calibration and offline programming, Additionally, SCS offers industry-leading ionic contamination test systems and laboratory coating systems, and is the leader in Parylene coating technologies.

Specialty Coating Systems (Parylene Service) Booth No: 941

Heidi Kolby 7645 Woodland Drive Indianapolis, IN 46278 PHONE: 317-244-1200 EMAIL: [email protected] WEB: www.scscoatings.com

Speedline Technologies

Stanley Supply & Services

Greg Calvo 1629 Old South Hwy 5 Camdenton, MO 65020 PHONE: 573-346-3341 FAX: 573-346-5554 EMAIL: [email protected] WEB: www.speedlinetech.com

Julie Giordano 335 Willow Street N. Andover, MA 01845 PHONE: 800-225-5370 FAX: 978-688-7532 EMAIL: [email protected] WEB: www.stanleysupplyservices.com

Speedline Technologies, a division of Illinois Tool Works, Inc. (NYSE: ITW), is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. Based in Franklin, Massachusetts and Camdenton Missouri, the company markets four bestin-class brands: MPM stencil and screen printing systems; CAMALOT dispensing systems; ELECTROVERT wave soldering, reflow soldering and curing, and cleaning equipment; and ACCEL microelectronics cleaning equipment.

Stanley Supply & Services is a leading supplier of products and services for assembling, repairing and testing electronic equipment. We are your one-stop- shop for test & measurement, soldering, lighting and magnification, and materials such as adhesives, solder, static protection, chemical solutions and materials for labs and clean rooms.

Booth No: 124

Speedprint Technology Booth No: 821

Mark Brawley 5804 Breckenbridge Park Drive Suite E Tampa, FL 33610 PHONE: 813-664-0686 FAX: 847-843-2750 EMAIL: [email protected] WEB: www.speedprint-tech.com The SP710 will be displayed configured with Advanced Dispense Unit (ADu+). The SP710 is the most reliable screen printer on the market backed by a 5 year parts and 2 year labor warranty. Equipped with a long list of standard features the ADu+ dispense option provides provides tremendous flexibility with the most accurate on board dispensing of adhesive, solder paste as well as other materials. Industry leading accuracy and common sense design means extremely low maintenance requirements and lowest cost of ownership.

Specialty Coating Systems Inc. (SCS) is a leader in Parylene conformal coating services and technologies, with 11 locations throughout the Americas, Europe, and Asia. Ultra-thin and pinhole-free, SCS Parylene coatings are biocompatible and biostable, and offer excellent moisture, chemical, and dielectric barrier properties to protect components in the electronics, automotive, military and medical device industries.

50 >> 2015 SMTA International SHOW DIRECTORY

Booth No: 1024

Our JENSEN® Tool Kits provide solutions for professional field service technicians in virtually any field including: military and commercial aviation, bio-medical device service, networking, and telecom. Each JENSEN® tool kit is carefully assembled at our kitting warehouse in Phoenix, Arizona and most JENSEN® tools are backed by a lifetime guarantee. We offer a full line of e-business tools, vendor managed inventory solutions, calibration services and equipment audits designed to enhance your productivity lower your procurement costs and improve your profitability. We offer best-in-class customer service, technical support and informed sales representatives all focused on you.

StenTech, Ltd. Booth No: 129

Sip Akbar 138 Anderson Drive Unit 6 Markham, ON l6E 1A4 Canada PHONE: 603-401-1082 FAX: 905-472-7774 EMAIL: [email protected] WEB: www.stentech.com StenTech provides a variety of quality driven products to support our customers in their Surface Mount Technology (SMT) requirements. Quality. Delivery. Service.

STI Electronics, Inc.

Super Dry

Technical Devices Company

Diana Bradford 261 Palmer Road Madison, AL 35758-1727 PHONE: 256-705-5504 FAX: 256-461-9566 EMAIL: [email protected] WEB: www.solderingtech.com

Richard Heimsch 235 Colovista Pkwy. Bastrop, TX 78602 PHONE: 312-513-3513 EMAIL: [email protected] WEB: www.superdry-totech.com

Julie Fields 560 Alaska Ave. Torrance, CA 90503 PHONE: 310-618-8437 EMAIL: [email protected] WEB: www.TechnicalDev.com

Booth No: 609

Booth No: 1034

Booth No: 807

Super Dry® is a Moisture Sensitive Device (MSD) handling specialist, supplying innovative dry storage and floor life reset solutions including desiccant dry cabinets, ovens,vacuum machines, automated handling systems and component tracking software.

STI Electronics offers a full service Microelectronics Lab as well as a stateof-the-art Analytical Lab. STI provides full materials, construction and failure analysis services as well as manufacture prototypes and specialty high- density assemblies for military, aerospace and industrial applications. In addition, STI is an Approved IPC Training Center with locations in Madison, AL, Houston, TX and Crane, IN but is also equipped to bring the training to any customer’s facility. STI also offers a full range of components and solder training kits including lead free.

Control of component and PCB conditions is more important than ever as lead free processing causes dangerous increases in vapor pressure – with disastrous results. All Super Dry® products exceed IPC/JEDEC J-Std-033C for moisture sensitivity, as well as EN 61340-5-1:2001 for ESD.

Stone Mountain Tool, Inc.

TAGARNO

Booth No: 607

Steven Hughes 480 Gees Mill Business Court Conyers, GA 30013 PHONE: 770-929-0166 EMAIL: [email protected] WEB: www.stonemountaintool.com Creating Custom Tools That Exceed ALL Expectations Every Time. Wave solder Pallets, Conformal coating fixtures, Reflow fixtures, and Selective solder fixtures are just a few of the electronic manufacturing products that we specialize in. Stone Mountain Tool stands out as one of the leaders in the industry. With over 30 years in supplying tooling for the electronic manufacturing industry, Stone Mountain Tool has the background and experience needed to provide a solution to most tooling problems.

Technical Devices is a US manufacturer of inline aqueous cleaning systems and soldering equipment. Technical Devices now offers the CV line of wave soldering and reflow soldering equipment. The CV line is engineered and designed by Technical Devices to offer our customers the most highly advanced equipment at very competitive price. Our extensive knowledge of production equipment and our customer service network make Technical Devices the smart choice for your production needs. www.TechnicalDev.com

Techni-Tool, Inc. Booth No: 1010

Scott Burroughs 1547 N. Trooper Road Worcester, PA 19490 PHONE: 440-725-7845 FAX: 440-543-2266 EMAIL: [email protected] WEB: www.techni-tool.com

Booth No: 224 Sam Armstrong 111 Runnymeade Greenwood, SC 29649 PHONE: 864-229-9769 FAX: 864-229-3710 EMAIL: [email protected] WEB: www.tagarno.com TAGARNO’s digital microscopes are used for visual inspection of printed circuit boards, using high-definition cameras and high-definition monitors combined with user-friendly interfaces, to create excellent image quality and an amazing ease of use. Experience magnification with outstanding live image quality without distortion and with a large field of view, digital auto-focus and auto- exposure functions. Viewing images on a monitor also gives you a great range of ergonomic advantages over traditional microscopes.

For more than 50 years Techni-Tool has served the electronics production industry with the finest tools, test equipment, production supplies and more, from top manufacturers around the globe. Headquartered in Worcester, PA, Techni-Tool serves customers in more than 100 countries with a unique combination of world- class customer service, unmatched product selection and added value that has made it the leading full-line distributor in the field.

Technimark, Inc. Booth No: 239

Rich Syphers 720 Industrial Drive Unit 111 Cary, IL 60013 PHONE: 847-639-4700 FAX: 847-639-4789 EMAIL: [email protected] WEB: www.e-technimark-inc.com Technimark is a full line distributor serving electronic, electrical, industrial, automotive and medical markets. Featuring the ECD SmartDRY Intelligent Dry Storage Cabinet and M.O.L.E. Temperature profiling technology. Technimark Vending and VMI solutionsDEK Magna Print high performance squeegee system. Alent-Alpha Metals Solder products.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 51

Teka Interconnection Systems Texmac Inc (Takaya) Booth No: 325

Doug Scott 100 Pioneer Ave. Warwick, RI 02888 PHONE: 401-785-4110 FAX: 401-781-5730 EMAIL: [email protected] WEB: www.tekais.com Self-Soldering Connectors- Reflow Solder with Standard SMT Equipment and Processes without Adding Any Solder, Solder Paste or Flux.

Teradyne, Inc. Booth No: 234

Jaclyn Wallace 700 Riverpark Drive M/S NR7001-1 North Reading, MA 01864 PHONE: 978-370-1322 EMAIL: [email protected] WEB: www.teradyne.com Teradyne is a leading supplier of Automatic Test Equipment used to test printed circuit board assemblies found in automotive, consumer, industrial and communications applications. Our TestStation Multi-Site ICT and Inline automation solutions help manufacturers ensure high coverage rates of defect detection without impacting productivity and throughput. Manufacturers can achieve a more lean and agile production test cell with our TestStation platform of in-circuit test systems.

Test Research, Inc. TT Booth No: 712

Steve Marks 1923 Hartog Drive San Jose, CA 95131 PHONE: 408-567-9898 EMAIL: [email protected] WEB: www.tri.com.tw Established in 1989, TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements.

Booth No: 320

John Oaf 3370 Montgomery Drive Santa Clara, CA 95054 PHONE: 408-970-9171 EMAIL: [email protected] WEB: www.texmac.com Takaya is the inventor and world leader in flying probe loaded printed circuit board test systems. Their systems offer unmatched reliability, accuracy, and ease of use for detection of manufacturing defects on loaded printed circuit boards utilizing fixtureless in-circuit test techniques as well as integrated optical inspection, power-on functional, and boundary scan capabilities. Takaya recently introduced its new highperformance Takaya APT-1400F Advanced Flying Probe test system complementing their market-leading Takaya APT-9411 Flying Probe series of test systems. The APT-1400F builds on Takaya’s 25-year history as leader in flying- probe test technology by providing unprecedented performance in speed, accuracy, and test coverage.

Texwipe

Booth No: 439 Terry Cranfill 1210 S. Park Drive Kernersville, NC 27284 PHONE: 336-993-7012 EMAIL: [email protected] WEB: www.texwipe.com Texwipe is committed to supplying the highest quality, most consistent cleanroom consumable products. We invest in technology, innovation and quality to create and maintain state-of-the-art systems. The results are new, improved cost-effective products. From Vectra® processed, sealedborder wipers to CleanPak® pre-wetted wipers to CleanTips® swabs, Texwipe achieves superior product quality and consistency by utilizing technological innovations, including quality analysis and intricate test methodologies.

The Test Connection, Inc. Booth No: 410

Bert Horner 11400 Cronridge Drive Suite H Owings Mills, MD 21117 PHONE: 410-526-2800 FAX: 410-526-3547 EMAIL: [email protected] WEB: www.ttci.com The Test Connection, Inc. (TTCI) has been supporting the electronics test arena for over 35 years by offering printed circuit test solutions. Our services range from: In-Circuit Test (ICT) development and board testing services for Agilent 3070 and Teradyne (Formerly GenRad) TestStation/228X test systems, Flying Probe development and board testing services on our Digitaltest MTS500 flying probe test system, Boundary-Scan Test Solutions with the XJTAG system and TTCI is the U.S. sales partner for Feasa LED Analyser and SMH Technologies FlashRunner. TTCI is International Traffic in Arms Regulations (ITAR) registered. Meeting ITAR Certification certifies that TTCI has met requirements pertaining to organization structure, documentation, corporate policy, training and procedures to permit it to handle, use and transfer information controlled by ITAR and the U.S. Munitions list.

Tintronics Industries Booth No: 341

Thomas Ott PO Box 18335 Huntsville, AL 35804 PHONE: 256-650-0220 FAX: 256-650-0230 EMAIL: [email protected] WEB: www.tintronics.com Component level value add services: Robotic Solder Dip, tin mitigation, gold removal, BGA repair/reball, marking, surface mount/axial/ adial - tape and reel, lead forming, XRF, Cleanliness, Solderability Testing Processes - AS9100 REV C/ISO9001:2008 - ITAR registered. Small, disabled Veteran owned.

TOPLINE

Booth No: 435 Jared Wilson 95 Highway 22 W. Milledgeville, GA 31061 PHONE: 1- 800-776-9888 EMAIL: [email protected] WEB: www.topline.tv CCGA Column Grid Array for military, aerospace and defense. Reduces stress from CTE mismatch of large ceramic modules mounted on PC boards.

52 >> 2015 SMTA International SHOW DIRECTORY

TT

TTnS, Inc.

US Tech

Viscom

Chris Kim 702 A-Building IT Twin Tower 442-17, Sangaewon, Jungwon-gu Seongnam-city, 462-120 Republic of Korea PHONE: 82-70-7090-9892 FAX: 82-31-736-3117 EMAIL: [email protected] WEB: www.ttns-group.com

Steve Leberstien 10 Gay Street Phoenixville, PA 19460 PHONE: 610-783-6100 FAX: 610-783-0317 EMAIL: [email protected] WEB: www.us-tech.com

Ed Moll 1775 Breckinridge Pkwy. Suite 500 Duluth, GA 30096 PHONE: 678-966-9835 FAX: 678-966-9828 EMAIL: [email protected] WEB: www.viscom.com

Booth No: 638

Booth No: 901

When it’s time to resolve your conformal and micro coating challenges, and when you need a “true” and “trusted” partner who is willing to share original ideas and experiences in coating technologies and solutions, you will need to invest in more than just equipment. At TTnS, an investment with us is a true investment in a valuable business partnership.

Universal Instruments Corporation Booth No: 306

Kristi Schilloff 33 Brome Corporate Pkwy. Conklin, NY 13748 PHONE: 607-779-5806 FAX: 607-772-1878 EMAIL: [email protected] WEB: www.uic.com Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. With a lineage of more than 50 years, Universal is the longest-standing company in the electronics assembly space. Universal Instruments delivers comprehensive solutions to a global customer base by leveraging exclusive process expertise combined with its innovative portfolio of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation.

Booth No: 506

U.S. Tech, an international hi-tech electronics publication, reaches over 350,000 engineers, buyers, product specifiers & manufacturing & corporate managers each month, on the web and in print & digital editions combined. The newspaper focuses on new innovations in components, distribution & PCB design, manufacturing, assembly & test, renewable energy, as well as the business and regulatory issues facing the electronics manufacturing and distribution sector.

Vi TECHNOLOGY TT Booth No: 807

Max Fabiano 903 N. Bowser Road Suite 202 Richardson, TX 75081 PHONE: 603-858-2300 FAX: 972-235-1171 EMAIL: [email protected] WEB: www.vitechnology.com In-line 3D Automated Solder Paste Inspection (SPI); Bench-top and in-line Automated Optical Inspection (AOI); Paperless repair, quality monitoring/feedback and SPC software; Professional consulting/ support services.

• The S3088 ultra 3D AOI satisfies both Production and Quality Engineers. For the Production Department, the S3088 ultra with the revolutionary vVision interface provides fast, intuitive program generation and the highest inspection speed utilizing the Viscom XM camera module. For the Quality Department, the S3088 ultra provides accurate and reliable inspection down to 03015, and complete fault coverage using 9 views plus 3D, offering height measurement of components up to 25 mm height. • TrueYield — the most comprehensive toolset for optimal line performanceViscom introduces its unique approach to maximize yields with best defect detection and lowest false alarms. With the combination of integrated verification to check programs with verified known defects, known good sample data, process uplink with process data analysis from several test gates and TCM, the automatic machine health check tool provides superior true yield improvement capabilities.

Vitronics Soltec Booth No: 913

Mick Austin 45054 Corte Valle Temecula, CA 92592 PHONE: 603-502-1792 EMAIL: [email protected] WEB: www.vitronics-soltec.com Vitronics Soltec specializes in the design and manufacturing of mass soldering equipment for the global circuit board assembly market. Products are covering the Reflow, Wave and Selective Soldering markets. Vitronics Soltec is designing and manufacturing equipment in three factories; Camdenton, MO in the USA, Oosterhout in The Netherlands and Suzhou in China. Direct sales and support centers are located in the United States, Holland, Germany, Singapore, Malaysia, Korea and Shanghai.

TT designates Tech Tour Participant | SMTAssociation

@SMTAorg #SMTAI

designates Inspection Experience Participant

2015 SMTA International

SHOW DIRECTORY >> 53

Weller - Apex Tool Group Booth No: 806

Tom Krisulewicz 1000 Lufkin Road Apex, NC 27539 PHONE: 919-387-2449 FAX: 919-387-2579 EMAIL: [email protected] WEB: www.weller-tools.com Soldering, desoldering, rework, fume extraction, dispensing and hand tools.

XJTAG

Booth No: 1020 Simon Payne St. John’s Innovation Centre Cowley Road Cambridge, AA CB4 0DS United Kingdom PHONE: 44-0-1223-223007 FAX: 44-0-1223-223009 EMAIL: [email protected] WEB: www.xjtag.com XJTAG is a worldwide leading supplier of IEEE Std.1149.x compliant boundary scan tools, which enable you to debug, test and program electronic circuits quickly and easily. XJTAG’s software tools can help you speed up the design process and improve your debug and testing from early prototypes to mass production. Contact us for a demonstration or free board set up and evaluation.

Yamaha - Trans Tec America TT Booth No: 813

Michael Foster 7301 W. Boston Street Chandler, AZ 85226 PHONE: 877-987-2678 FAX: 480-772-4344 EMAIL: [email protected] WEB: www.trans-tec-america.com As the leading distributor of Yamaha SMT equipment solutions in North America, Trans-Tec America is one of the longeststanding global partners for integrated modular assembly lines worldwide. With dedicated industry experience spanning from its inception in 1988, Trans-Tec has developed an excellent reputation for delivering exceptional products and services.

YINCAE Advanced Materials, LLC Booth No: 237

19 Walker Way Albany, NY 12205 PHONE: 518-452-2880 FAX: 518-452-2779 EMAIL: [email protected] WEB: www.yincae.com Founded & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives. Products: • Solder Joint Encapsulants • Underfill Materials • Die Attach Adhesives • Conformal Coatings • TIM • Optical Adhesive • Board Level Assembly • Anti-Warpage Materials • Nanofilm

Yole Développement Booth No: 1031

Clotilde Fabre Le Quartz 75 Cours Emile Zola 69100 Villeurbanne, Lyon France PHONE: 33-472-83-01-09 EMAIL: [email protected] WEB: www.yole.fr Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Développement group has expanded to include more than 50 associates worldwide covering: • MEMS & Sensors, Imaging, Medical Technologies, Compound Semiconductors, LED, Photonics, Power Electronics, Photovoltaics, Advanced Packaging, and Semiconductor Manufacturing.

TT designates Tech Tour Participant |

designates Inspection Experience Participant

54 >> 2015 SMTA International SHOW DIRECTORY

YXLON FeinFocus TT Booth No: 128

Sheri Martin 5675 Hudson Industrial Pkwy. Hudson, OH 44236 PHONE: 234-284-7881 FAX: 234- 284-7886 EMAIL: [email protected] WEB: www.yxlon.com YXLON is a leading supplier of industrial X-Ray inspection and CT solutions for the nondestructive testing of materials and electronics. YXLON product portfolio includes the Y.Cheetah and Y.Cougar which offer effortless high-quality X-Ray imaging for a wide range of continuous inspection tasks. The Y.Cheetah and Y.Cougar are equipped with our new Win 7™OS FGUI release including upgraded reliability, repeatability and traceability for standard and customized automated inspection. With advanced ultra-high-speed flat panel detector technologies, the systems adapt between inspection tasks including failure analysis, research and development, process control and product testing. The standard 2D inspection systems have an upgrade path to 3D Quick Scan µ CT mode.

ZESTRON Americas Booth No: 616

Sal Sparacino 11285 Assett Loop Manassas, VA 20109 PHONE: 703-393-9880 EMAIL: [email protected] WEB: www.zestron.com Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing and semiconductor industry. With six worldwide technical centers and the largest team of engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. For more information, visit www.zestron.com.

Zymet, Inc.

Booth No: 441 Jennifer Gupta 7A Great Meadow Lane East Hanover, NJ 07936 PHONE: 973-428-5245 FAX: 973-428-5244 EMAIL: [email protected] WEB: www.zymet.com Adhesives and encapsulants for electronics and optoelectronics assembly. Products include electrically conductive and thermally conductive adhesives, ultra-low stress adhesives, ACP’s and NCP’s, UV curable glob top encapsulants, and underfill and reworkable underfill encapsulants for flip chips, WLP’s, CSP’s, BGA’s, and POP’s.

Exhibitors by Classification Adhesives and Sealants 5N Plus Micro Powders . . . . . . . . . . . . . 327 Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 Alpha Recycling Services . . . . . . . . . . . 1006 ELANTAS PDG . . . . . . . . . . . . . . . . . . . . 318 Henkel Corporation . . . . . . . . . . . . . . . . 701 Heraeus Electronics . . . . . . . . . . . . . . . . 845 KOKI Solder America . . . . . . . . . . . . . . . 135 Krayden Inc. . . . . . . . . . . . . . . . . . . . . . . 931 MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 Northern Electronics Automation . . . . . . 708 PPG Industries, Semco Packaging & Application Systems . . . . . . . . . . . . . 641 Precision Placement Machines . . . . . . . 736 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 YINCAE Advanced Materials, LLC . . . . . 237 Zymet, Inc. . . . . . . . . . . . . . . . . . . . . . . . 441

Analytical and Laboratory Akrometrix, LLC . . . . . . . . . . . . . . . . . . . 134 Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 Conecsus, LLC. . . . . . . . . . . . . . . . . . . . 110 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 Hi-Rel Laboratories . . . . . . . . . . . . . . . . 909 Materials Evaluation and Engineering, Inc. . . . . . . . . . . . . . . . 1023 National Technical Systems . . . . . . . . . 1035 Oxford Instruments. . . . . . . . . . . . . . . . . 537 RPS Automation, LLC . . . . . . . . . . . . . . 807 Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544 STI Electronics, Inc. . . . . . . . . . . . . . . . . 609 Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034 Texwipe . . . . . . . . . . . . . . . . . . . . . . . . . 439 Universal Instruments Corporation. . . . . 306 YXLON FeinFocus . . . . . . . . . . . . . . . . . 128 ZESTRON Americas . . . . . . . . . . . . . . . . 616

Associations and Organizations IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 744 SMTA . . . . . . . . . . . . . . . . . . . . . . . . . Lobby

Barcode, Scanning, RFID

Alltemated Inc. . . . . . . . . . . . . . . . . . . . . 940 ASM Assembly Systems (SIPLACE & DEK) . . . . . . . . . . . . . . . 225 Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038 Europlacer Americas’ . . . . . . . . . . . . . . . 637 IDENTCO . . . . . . . . . . . . . . . . . . . . . . . 1030 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825 Omron Inspection Systems . . . . . . . . . . 436 RPS Automation, LLC . . . . . . . . . . . . . . 807 Seika Machinery, Inc. . . . . . . . . . . . . . . . 707 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 Universal Instruments Corporation. . . . . 306

CAD, CAM, CIM, EDA Europlacer Americas’ . . . . . . . . . . . . . . . 637 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 Infinite Graphics . . . . . . . . . . . . . . . . . . . 925

SMTAssociation

@SMTAorg #SMTAI

iTAC Software, AG . . . . . . . . . . . . . . . . 1027 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 Mentor Graphics Corporation, Valor Division. . . . . . . . . . . . . . . . . . . 634 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825

Chemicals and Treatment 5N Plus Micro Powders . . . . . . . . . . . . . 327 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927 National Technical Systems . . . . . . . . . 1035 PPG Industries, Semco Packaging & Application Systems . . . . . . . . . . . . . 641 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 YINCAE Advanced Materials, LLC . . . . . 237

Circuit Board Handling Apex Factory Automation. . . . . . . . . . . . 735 Conductive Containers, Inc.. . . . . . . . . . 317 Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 Europlacer Americas’ . . . . . . . . . . . . . . . 637 FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933 FlexLink Systems, Inc. . . . . . . . . . . . . . . 107 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Kulicke & Soffa Industries, Inc.. . . . . . . . 136 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825 National Technical Systems . . . . . . . . . 1035 Northern Electronics Automation . . . . . . 708 Precision Placement Machines . . . . . . . 736 SEHO North America, Inc. . . . . . . . . . . . 635 Shenzhen D.M. Electronic, Limited . . . . 900 Simplimatic Automation . . . . . . . . . . . . 1018 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 Universal Instruments Corporation. . . . . 306

Cleaning and Solvents ACL, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . 331 Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 Alpha Recycling Services . . . . . . . . . . . 1006 Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319 Henkel Corporation . . . . . . . . . . . . . . . . 701 Inventec Performance Chemicals . . . . . 230 KYZEN Corporation . . . . . . . . . . . . . . . . 117 MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927 Northern Electronics Automation . . . . . . 708 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Qualitek International Inc.. . . . . . . . . . . . 538 Seika Machinery, Inc. . . . . . . . . . . . . . . . 707 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Technical Devices Company . . . . . . . . . 807 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 ZESTRON Americas . . . . . . . . . . . . . . . . 616

Coating, Dispensing and Masking Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 Conductive Containers, Inc.. . . . . . . . . . 317 ELANTAS PDG . . . . . . . . . . . . . . . . . . . . 318 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 Europlacer Americas’ . . . . . . . . . . . . . . . 637 GPD Global . . . . . . . . . . . . . . . . . . . . . . 305 Henkel Corporation . . . . . . . . . . . . . . . . 701 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Inventec Performance Chemicals . . . . . 230 Krayden, Inc. . . . . . . . . . . . . . . . . . . . . . 931 MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 Nordson DAGE . . . . . . . . . . . . . . . . . . . . 606 Northern Electronics Automation . . . . . . 708 O.C. White Company . . . . . . . . . . . . . . 1001 Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139 PPG Industries, Semco Packaging & Application Systems . . . . . . . . . . . . . 641 Precision Placement Machines . . . . . . . 736 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Rehm Thermal Systems, LLC. . . . . . . . . 437 Specialty Coating Systems (Equipment). . . . . . . . . . . . . . . . . . . . 434 Specialty Coating Systems (Parylene Service) . . . . . . . . . . . . . . . 941 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 TTnS, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 638 Viscom . . . . . . . . . . . . . . . . . . . . . . . . . . 506 Weller - Apex Tool Group . . . . . . . . . . . . 806 YINCAE Advanced Materials, LLC . . . . . 237

Component Insertion Apex Factory Automation. . . . . . . . . . . . 735 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 Europlacer Americas’ . . . . . . . . . . . . . . . 637 Finetech/Martin . . . . . . . . . . . . . . . . . . . 417 Fuji America Corporation . . . . . . . . . . . . 107 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 Juki Automation Systems. . . . . . . . . . . . 716 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 Mid-America Taping & Reeling . . . . . . . . 540 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825 Northern Electronics Automation . . . . . . 708 Panasonic Factory Solutions of America. . . . . . . . . . . . . . . . . . . . . 213 Simplimatic Automation . . . . . . . . . . . . 1018 Universal Instruments Corporation. . . . . 306

Component Prep and Counting Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Europlacer Americas’ . . . . . . . . . . . . . . . 637 GPD Global . . . . . . . . . . . . . . . . . . . . . . 305 HEPCO, Inc. . . . . . . . . . . . . . . . . . . . . . . 416 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 Mid-America Taping & Reeling . . . . . . . . 540 RPS Automation, LLC . . . . . . . . . . . . . . 807 Stanley Supply & Services . . . . . . . . . . 1024 Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 Tintronics Industries . . . . . . . . . . . . . . . . 341

2015 SMTA International

SHOW DIRECTORY >> 55

Components and Hardware

Seika Machinery, Inc. . . . . . . . . . . . . . . . 707

Europlacer Americas’ . . . . . . . . . . . . . . . 637 FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933 Infinite Graphics . . . . . . . . . . . . . . . . . . . 925 Omron Inspection Systems . . . . . . . . . . 436 Teka Interconnection Systems . . . . . . . . 325 TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435

Electronics Manufacturing Services

Consulting and Market Research Metro SMT Ltd. . . . . . . . . . . . . . . . . . . . 344 North Dakota Department of Commerce . . . . . . . . . . . . . . . . . 1028

Data Acquisition Akrometrix, LLC . . . . . . . . . . . . . . . . . . . 134 ASC International . . . . . . . . . . . . . . . . . . 518 Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038 Heller Industries . . . . . . . . . . . . . . . . . . . 107 iTAC Software, AG . . . . . . . . . . . . . . . . 1027 KIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 Speedline Technologies . . . . . . . . . . . . . 124 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010

Die and Wire Bonding Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 Alpha Recycling Services . . . . . . . . . . . 1006 ASM Assembly Systems (SIPLACE and DEK) . . . . . . . . . . . . . 225 Finetech/Martin . . . . . . . . . . . . . . . . . . . 417 Henkel Corporation . . . . . . . . . . . . . . . . 701 Heraeus Electronics . . . . . . . . . . . . . . . . 845 Inventec Performance Chemicals . . . . . 230 Kulicke & Soffa Industries, Inc.. . . . . . . . 136 Nihon Superior Company, Ltd.. . . . . . . . 419 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 Panasonic Factory Solutions of America. . . . . . . . . . . . . . . . . . . . . 213 Speedline Technologies . . . . . . . . . . . . . 124 TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435 Universal Instruments Corporation. . . . . 306 YINCAE Advanced Materials, LLC . . . . . 237

Distributor/Manufacturer’s Representative Alltemated Inc. . . . . . . . . . . . . . . . . . . . . 940 Apex Factory Automation. . . . . . . . . . . . 735 Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 Krayden, Inc. . . . . . . . . . . . . . . . . . . . . . 931 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139 Seika Machinery, Inc. . . . . . . . . . . . . . . . 707 Stanley Supply & Services . . . . . . . . . . 1024 TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 Texwipe . . . . . . . . . . . . . . . . . . . . . . . . . 439 The Test Connection, Inc.. . . . . . . . . . . . 410

Drilling, Routing and Dicing Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 ASYS Group Americas, Inc. . . . . . . . . . . 835 ATV Technologie GmbH . . . . . . . . . . . . . 841 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 Panasonic Factory Solutions of America 213 Precision Placement Machines . . . . . . . 736

Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Amitron Corporation. . . . . . . . . . . . . . . . 536 Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038 Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938 Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 DIVSYS International . . . . . . . . . . . . . . 1008 Europlacer Americas’ . . . . . . . . . . . . . . . 637 Geib Refining Corp. . . . . . . . . . . . . . . . 1033 Ironwood Electronics . . . . . . . . . . . . . . . 818 Mid-America Taping & Reeling . . . . . . . . 540 Nitto Kohki U.S.A., Inc.. . . . . . . . . . . . . . 917 Northern Electronics Automation . . . . . . 708 Shenzhen D.M. Electronic, Limited . . . . 900 STI Electronics, Inc. . . . . . . . . . . . . . . . . 609

ESD and EOS ACL, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . 331 Conductive Containers, Inc.. . . . . . . . . . 317 Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319 Electronic Assembly Products, Ltd. . . . . 807 IKEUCHI USA, INC. . . . . . . . . . . . . . . . . 902 Mid-America Taping & Reeling . . . . . . . . 540 Nitto Kohki U.S.A., Inc.. . . . . . . . . . . . . . 917 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 O.C. White Company . . . . . . . . . . . . . . 1001 Sovella Inc/The Daylight Company . . . . 907 STI Electronics, Inc. . . . . . . . . . . . . . . . . 609 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239

Feeders Apex Factory Automation. . . . . . . . . . . . 735 ASM Assembly Systems . . . . . . . . . . . . 225 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 Europlacer Americas’ . . . . . . . . . . . . . . . 637 IDENTCO . . . . . . . . . . . . . . . . . . . . . . . 1030 Juki Automation Systems. . . . . . . . . . . . 716 Kulicke & Soffa Industries, Inc.. . . . . . . . 136 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 Northern Electronics Automation . . . . . . 708 Panasonic Factory Solutions of America. . . . . . . . . . . . . . . . . . . . . 213 Precision Placement Machines . . . . . . . 736 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 Universal Instruments Corporation. . . . . 306

Flexible Circuits American Standard Circuits, Inc. . . . . . . 801 CMK America Corporation . . . . . . . . . . . 745 Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938 ELTEK, Ltd.. . . . . . . . . . . . . . . . . . . . . . . 140 Europlacer Americas’ . . . . . . . . . . . . . . . 637 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Kulicke & Soffa Industries, Inc.. . . . . . . . 136 RPS Automation, LLC . . . . . . . . . . . . . . 807 Schoeller-Electronics GmbH . . . . . . . . . 935 Shenzhen D.M. Electronic, Limited . . . . 900 SOMACIS . . . . . . . . . . . . . . . . . . . . . . . . 911 Speedline Technologies . . . . . . . . . . . . . 124

Flip Chip and Multichip ASM Assembly Systems (SIPLACE and DEK) . . . . . . . . . . . . . 225 Europlacer Americas’ . . . . . . . . . . . . . . . 637 Finetech/Martin . . . . . . . . . . . . . . . . . . . 417

56 >> 2015 SMTA International SHOW DIRECTORY

Fuji America Corporation . . . . . . . . . . . . 107 GPD Global . . . . . . . . . . . . . . . . . . . . . . 305 Henkel Corporation . . . . . . . . . . . . . . . . 701 Inventec Performance Chemicals . . . . . 230 Kulicke & Soffa Industries, Inc.. . . . . . . . 136 Panasonic Factory Solutions of America 213 Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424 Speedline Technologies . . . . . . . . . . . . . 124 Universal Instruments Corporation. . . . . 306

Foils, Laminates and Lamination National Technical Systems . . . . . . . . . 1035 Shenzhen D.M. Electronic, Limited . . . . 900

Hand Tools and Shop Supplies American Hakko Products . . . . . . . . . . . 534 Aven, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 235 FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 Mid-America Taping & Reeling . . . . . . . . 540 Nitto Kohki U.S.A., Inc.. . . . . . . . . . . . . . 917 O.C. White Company . . . . . . . . . . . . . . 1001 PACE Incorporated. . . . . . . . . . . . . . . . . 945 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Sovella Inc/The Daylight Company . . . . 907 Stanley Supply & Services . . . . . . . . . . 1024 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 Weller - Apex Tool Group . . . . . . . . . . . . 806

Inspection and Measurement Acculogic, Inc. . . . . . . . . . . . . . . . . . . . . 800 Akrometrix, LLC . . . . . . . . . . . . . . . . . . . 134 Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 AOI Systems. . . . . . . . . . . . . . . . . . . . . . 444 ASC International . . . . . . . . . . . . . . . . . . 518 Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 Aven, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 235 Creative Electron, Inc. . . . . . . . . . . . . . . 516 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 CyberOptics Corporation . . . . . . . . . . . . 814 ERSA North America . . . . . . . . . . . . . . . 539 Europlacer Americas’ . . . . . . . . . . . . . . . 637 FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933 FlexLink Systems, Inc. . . . . . . . . . . . . . . 107 FSInspection . . . . . . . . . . . . . . . . . . . . . 946 Heller Industries . . . . . . . . . . . . . . . . . . . 107 JTAG Technologies. . . . . . . . . . . . . . . . . 939 Juki Automation Systems. . . . . . . . . . . . 716 KIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338 Koh Young America, Inc. . . . . . . . . . . . . 307 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 Mek. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1040 Mirtec Corporation . . . . . . . . . . . . . . . . . 407 National Technical Systems . . . . . . . . . 1035 Nikon Metrology . . . . . . . . . . . . . . . . . . . 340 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 Nordson DAGE . . . . . . . . . . . . . . . . . . . . 606 Nordson YESTECH . . . . . . . . . . . . . . . . 606 Northern Electronics Automation . . . . . . 708 O.C. White Company . . . . . . . . . . . . . . 1001 Omron Inspection Systems . . . . . . . . . . 436 Oxford Instruments. . . . . . . . . . . . . . . . . 537 RS Simmons Co., LLC . . . . . . . . . . . . . . 936 Saki America, Inc.. . . . . . . . . . . . . . . . . 1025 Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544 SEHO North America, Inc. . . . . . . . . . . . 635 Seika Machinery, Inc. . . . . . . . . . . . . . . . 707 Simplimatic Automation . . . . . . . . . . . . 1018 Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424 Stanley Supply & Services . . . . . . . . . . 1024 STI Electronics, Inc. . . . . . . . . . . . . . . . . 609

TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Test Research, Inc. . . . . . . . . . . . . . . . . . 712 Texmac Inc (Takaya) . . . . . . . . . . . . . . . . 320 Vi TECHNOLOGY . . . . . . . . . . . . . . . . . . 807 Viscom . . . . . . . . . . . . . . . . . . . . . . . . . . 506 Yamaha-Trans Tec America . . . . . . . . . . 813 YXLON FeinFocus . . . . . . . . . . . . . . . . . 128

Labeling, Ink and Marking Alltemated Inc. . . . . . . . . . . . . . . . . . . . . 940 ASYS Group Americas, Inc. . . . . . . . . . . 835 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 Europlacer Americas’ . . . . . . . . . . . . . . . 637 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 FlexLink Systems, Inc. . . . . . . . . . . . . . . 107 IDENTCO . . . . . . . . . . . . . . . . . . . . . . . 1030 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Simplimatic Automation . . . . . . . . . . . . 1018 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 Universal Instruments Corporation. . . . . 306

Laser Systems Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 ASC International . . . . . . . . . . . . . . . . . . 518 ASYS Group Americas, Inc. . . . . . . . . . . 835 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 Electronic Assembly Products, Ltd. . . . . 807 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 FlexLink Systems, Inc. . . . . . . . . . . . . . . 107 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 MET Stencil . . . . . . . . . . . . . . . . . . . . . . 329 Nikon Metrology . . . . . . . . . . . . . . . . . . . 340 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Simplimatic Automation . . . . . . . . . . . . 1018

Lease, Refurbishment and Resale ASC International. . . . . . . . . . . . . . . . . . . Europlacer Americas’. . . . . . . . . . . . . . . . Metro SMT, Ltd.. . . . . . . . . . . . . . . . . . . . Northern Electronics Automation . . . . . . . Speedline Technologies . . . . . . . . . . . . . .

518 637 344 708 124

Materials Handling Equipment/ Automation Systems ACE Production Technologies . . . . . . . . 426 Apex Factory Automation. . . . . . . . . . . . 735 ASYS Group Americas, Inc. . . . . . . . . . . 835 Conductive Containers, Inc.. . . . . . . . . . 317 Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 Europlacer Americas’ . . . . . . . . . . . . . . . 637 FlexLink Systems Inc. . . . . . . . . . . . . . . 107 Inovaxe Corporation. . . . . . . . . . . . . . . . 713 Juki Automation Systems. . . . . . . . . . . . 718 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 National Technical Systems . . . . . . . . . 1035 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 Northern Electronics Automation . . . . . . 708 PPG Industries, Semco Packaging & Application Systems . . . . . . . . . . . . . 641 Precision Placement Machines . . . . . . . 736 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 RPS Automation, LLC . . . . . . . . . . . . . . 807 SEHO North America, Inc. . . . . . . . . . . . 635

SMTAssociation

@SMTAorg #SMTAI

Seika Machinery, Inc. . . . . . . . . . . . . . . . 707 Simplimatic Automation . . . . . . . . . . . . 1018 Sovella Inc/The Daylight Company . . . . 907 Speedline Technologies . . . . . . . . . . . . . 124 Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034 Teradyne, Inc. . . . . . . . . . . . . . . . . . . . . . 234 Universal Instruments Corporation. . . . . 306

Odd Form Placement Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Apex Factory Automation. . . . . . . . . . . . 735 ASM Assembly Systems (SIPLACE and DEK) . . . . . . . . . . . . . 225 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 Europlacer Americas’ . . . . . . . . . . . . . . . 637 Fuji America Corporation . . . . . . . . . . . . 107 Juki Automation Systems. . . . . . . . . . . . 716 Kulicke & Soffa Industries, Inc.. . . . . . . . 136 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 Mid-America Taping & Reeling . . . . . . . . 540 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825 Northern Electronics Automation . . . . . . 708 Panasonic Factory Solutions of America 213 Precision Placement Machines . . . . . . . 736 Simplimatic Automation . . . . . . . . . . . . 1018 Universal Instruments Corporation. . . . . 306 Yamaha - Trans Tec America . . . . . . . . . 813

Ovens, Curing and Drying Alltemated Inc. . . . . . . . . . . . . . . . . . . . . 940 Apex Factory Automation. . . . . . . . . . . . 735 ATV Technologie GmbH . . . . . . . . . . . . . 841 BTU International . . . . . . . . . . . . . . . . . . 734 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 ERSA North America . . . . . . . . . . . . . . . 539 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 Heller Industries . . . . . . . . . . . . . . . . . . . 107 Juki Automation Systems. . . . . . . . . . . . 716 KIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 National Technical Systems . . . . . . . . . 1035 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 Northern Electronics Automation . . . . . . 708 Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139 Rehm Thermal Systems, LLC. . . . . . . . . 437 SEHO North America, Inc. . . . . . . . . . . . 635 Seika Machinery, Inc. . . . . . . . . . . . . . . . 707 Senju Comtek Corporation. . . . . . . . . . . 412 Specialty Coating Systems (Equipment). . . . . . . . . . . . . . . . . . . . 434 Specialty Coating Systems (Parylene Service) . . . . . . . . . . . . . . . 941 Speedline Technologies . . . . . . . . . . . . . 124 Super Dry . . . . . . . . . . . . . . . . . . . . . . . 1034 TTnS, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 638 Universal Instruments Corporation. . . . . 306 Vitronics Soltec. . . . . . . . . . . . . . . . . . . . 913

Packaging and Encapsulating 5N Plus Micro Powders . . . . . . . . . . . . . 327 Accurate Carriers USA . . . . . . . . . . . . . . 717 Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 ATV Technologie GmbH . . . . . . . . . . . . . 841 BTU International . . . . . . . . . . . . . . . . . . 734 Conductive Containers, Inc.. . . . . . . . . . 317 GPD Global . . . . . . . . . . . . . . . . . . . . . . 305 Inventec Performance Chemicals . . . . . 230 Mid-America Taping & Reeling . . . . . . . . 540 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 PPG Industries, Semco Packaging & Application Systems . . . . . . . . . . . . . 641

Simplimatic Automation . . . . . . . . . . . . 1018 TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435 YINCAE Advanced Materials, LLC . . . . . 237 Zymet, Inc. . . . . . . . . . . . . . . . . . . . . . . . 441

PCB Fabrication Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 American Standard Circuits, Inc. . . . . . . 801 Amitron Corporation. . . . . . . . . . . . . . . . 536 CMK America Corporation . . . . . . . . . . . 745 DIVSYS International . . . . . . . . . . . . . . 1008 Electrotek Corporation . . . . . . . . . . . . . . 420 ELTEK, Ltd.. . . . . . . . . . . . . . . . . . . . . . . 140 Prototron Circuits Inc. . . . . . . . . . . . . . . 418 RPS Automation, LLC . . . . . . . . . . . . . . 807 Schoeller-Electronics GmbH . . . . . . . . . 935 Shenzhen D.M. Electronic, Limited . . . . 900 SOMACIS . . . . . . . . . . . . . . . . . . . . . . . . 911 Speedline Technologies . . . . . . . . . . . . . 124

Pick and Place Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Apex Factory Automation. . . . . . . . . . . . 735 ASM Assembly Systems . . . . . . . . . . . . 225 ATV Technologie GmbH . . . . . . . . . . . . . 841 Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038 Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 Europlacer Americas’ . . . . . . . . . . . . . . . 637 Fuji America Corporation . . . . . . . . . . . . 107 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Juki Automation Systems. . . . . . . . . . . . 716 Kulicke & Soffa Industries, Inc.. . . . . . . . 136 Metro SMT ,Ltd. . . . . . . . . . . . . . . . . . . . 344 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825 Northern Electronics Automation . . . . . . 708 Panasonic Factory Solutions of America. . . . . . . . . . . . . . . . . . . . . 213 Precision Placement Machines . . . . . . . 736 Quik-Tool . . . . . . . . . . . . . . . . . . . . . . . . 918 Samsung C&T Automation, Inc. . . . . . . . 739 Simplimatic Automation . . . . . . . . . . . . 1018 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 Universal Instruments Corporation. . . . . 306 Yamaha - Trans Tec America . . . . . . . . . 813

Publications and Marketing CIRCUITS ASSEMBLY . . . . . . . . . . . . . . 601 Electronics World Publishing . . . . . . . . . 929 Global SMT & Packaging . . . . . . . . . . . . 919 I-Connect007 . . . . . . . . . . . . . . . . . . . . . 104 SMT Today . . . . . . . . . . . . . . . . . . . . . . . 446 SMTA . . . . . . . . . . . . . . . . . . . . . . . . . Lobby SMTnet . . . . . . . . . . . . . . . . . . . . . . . . . . 132 US Tech . . . . . . . . . . . . . . . . . . . . . . . . . 901

Recycling Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 Alpha Recycling Services . . . . . . . . . . . 1006 Conecsus, LLC. . . . . . . . . . . . . . . . . . . . 110 EVS International Sales, Limited . . . . . . 142 Geib Refining Corp. . . . . . . . . . . . . . . . 1033 Qualitek International, Inc. . . . . . . . . . . . 538 Senju Comtek Corporation. . . . . . . . . . . 412 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239

Repair & Rework ACE Production Technologies . . . . . . . . 426 ACL, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . 331 AGI Corporation . . . . . . . . . . . . . . . . . . . 738

2015 SMTA International

SHOW DIRECTORY >> 57

Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 Alpha Recycling Services . . . . . . . . . . . 1006 American Hakko Products . . . . . . . . . . . 534 ASC International . . . . . . . . . . . . . . . . . . 518 ATV Technologie GmbH . . . . . . . . . . . . . 841 BEST, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 127 Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938 Conductive Containers, Inc.. . . . . . . . . . 317 Creative Electron, Inc. . . . . . . . . . . . . . . 516 Crystal Mark, Inc. . . . . . . . . . . . . . . . . . . 319 ERSA North America . . . . . . . . . . . . . . . 539 Europlacer Americas’ . . . . . . . . . . . . . . . 637 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 Finetech/Martin . . . . . . . . . . . . . . . . . . . 417 HEPCO, Inc. . . . . . . . . . . . . . . . . . . . . . . 416 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 Indium Corporation . . . . . . . . . . . . . . . . 430 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Inventec Performance Chemicals . . . . . 230 JBC Tools USA, Inc. . . . . . . . . . . . . . . . . 636 Jovy Systems, Limited . . . . . . . . . . . . . . 646 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 LaserJob, Inc.. . . . . . . . . . . . . . . . . . . . . 125 MET Stencil . . . . . . . . . . . . . . . . . . . . . . 329 Metcal. . . . . . . . . . . . . . . . . . . . . . . . . . . 816 Mid-America Taping & Reeling . . . . . . . . 540 Nihon Superior Company, Ltd.. . . . . . . . 419 Nitto Kohki U.S.A., Inc.. . . . . . . . . . . . . . 917 Northern Electronics Automation . . . . . . 708 O.C. White Company . . . . . . . . . . . . . . 1001 PACE Incorporated. . . . . . . . . . . . . . . . . 945 Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139 RPS Automation, LLC . . . . . . . . . . . . . . 807 SEHO North America, Inc. . . . . . . . . . . . 635 Seika Machinery, Inc. . . . . . . . . . . . . . . . 707 Sovella Inc/The Daylight Company . . . . 907 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 STI Electronics, Inc. . . . . . . . . . . . . . . . . 609 TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Tintronics Industries . . . . . . . . . . . . . . . . 341 TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435 Weller - Apex Tool Group . . . . . . . . . . . . 806

Semiconductor Materials 5N Plus Micro Powders . . . . . . . . . . . . . 327 Henkel Corporation . . . . . . . . . . . . . . . . 701 Heraeus Electronics . . . . . . . . . . . . . . . . 845 Indium Corporation . . . . . . . . . . . . . . . . 430 Infinite Graphics . . . . . . . . . . . . . . . . . . . 925 Inventec Performance Chemicals . . . . . 230 Kester . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 MacDermid. . . . . . . . . . . . . . . . . . . . . . . 927 National Technical Systems . . . . . . . . . 1035 Nihon Superior Company, Ltd.. . . . . . . . 419 Senju Comtek Corporation. . . . . . . . . . . 412 Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424 Speedline Technologies . . . . . . . . . . . . . 124 TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435

Software and Programming Aegis Industrial Software Corporation . . 440 Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 ASC International . . . . . . . . . . . . . . . . . . 518 ASM Assembly Systems (SIPLACE and DEK) . . . . . . . . . . . . . 225 CalcuQuote . . . . . . . . . . . . . . . . . . . . . 1046 Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 Europlacer Americas’ . . . . . . . . . . . . . . . 637

iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 Infinite Graphics . . . . . . . . . . . . . . . . . . . 925 Inovaxe Corporation. . . . . . . . . . . . . . . . 713 iTAC Software, AG . . . . . . . . . . . . . . . . 1027 Kulicke & Soffa Industries, Inc.. . . . . . . . 136 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 MANEX ERP, Inc. . . . . . . . . . . . . . . . . . . 339 Mentor Graphics Corporation, Valor Division. . . . . . . . . . . . . . . . . . . 634 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825 Nikon Metrology . . . . . . . . . . . . . . . . . . . 340 Northern Electronics Automation . . . . . . 708 Omron Inspection Systems . . . . . . . . . . 436 Panasonic Factory Solutions of America. . . . . . . . . . . . . . . . . . . . . 213 Speedline Technologies . . . . . . . . . . . . . 124 The Test Connection, Inc.. . . . . . . . . . . . 410

Solder and Fluxes 5N Plus Micro Powders . . . . . . . . . . . . . 327 AIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 413 Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 Alpha Recycling Services . . . . . . . . . . . 1006 Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 Conecsus, LLC. . . . . . . . . . . . . . . . . . . . 110 ERSA North America . . . . . . . . . . . . . . . 539 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 Geib Refining Corp. . . . . . . . . . . . . . . . 1033 Henkel Corporation . . . . . . . . . . . . . . . . 701 Heraeus Electronics . . . . . . . . . . . . . . . . 845 Indium Corporation . . . . . . . . . . . . . . . . 430 Inventec Performance Chemicals . . . . . 230 Jovy Systems, Limited . . . . . . . . . . . . . . 646 Kester . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 KOKI Solder America . . . . . . . . . . . . . . . 135 Krayden, Inc. . . . . . . . . . . . . . . . . . . . . . 931 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825 National Technical Systems . . . . . . . . . 1035 Nihon Superior Company, Ltd.. . . . . . . . 419 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 Northern Electronics Automation . . . . . . 708 O.C. White Company . . . . . . . . . . . . . . 1001 Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139 Qualitek International, Inc. . . . . . . . . . . . 538 SEHO North America, Inc. . . . . . . . . . . . 635 Senju Comtek Corporation. . . . . . . . . . . 412 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 YINCAE Advanced Materials, LLC . . . . . 237

Soldering, Automated ACE Production Technologies . . . . . . . . 426 AGI Corporation . . . . . . . . . . . . . . . . . . . 738 Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . 411 ATV Technologie GmbH . . . . . . . . . . . . . 841 Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 Electronic Assembly Products, Ltd. . . . . 807 ERSA North America . . . . . . . . . . . . . . . 539 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 EVS International Sales, Limited . . . . . . 142 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 Finetech/Martin . . . . . . . . . . . . . . . . . . . 417 Heller Industries . . . . . . . . . . . . . . . . . . . 107 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Inventec Performance Chemicals . . . . . 230 Juki Automation Systems. . . . . . . . . . . . 716

58 >> 2015 SMTA International SHOW DIRECTORY

KIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 Northern Electronics Automation . . . . . . 708 PACE Incorporated. . . . . . . . . . . . . . . . . 945 Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Rehm Thermal Systems, LLC. . . . . . . . . 437 RPS Automation, LLC . . . . . . . . . . . . . . 807 SEHO North America, Inc. . . . . . . . . . . . 635 Seica, Inc.. . . . . . . . . . . . . . . . . . . . . . . . 406 Seika Machinery, Inc. . . . . . . . . . . . . . . . 707 Senju Comtek Corporation. . . . . . . . . . . 412 Speedline Technologies . . . . . . . . . . . . . 124 STI Electronics, Inc. . . . . . . . . . . . . . . . . 609 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Vitronics Soltec. . . . . . . . . . . . . . . . . . . . 913

Soldering, Manual AGI Corporation . . . . . . . . . . . . . . . . . . . 738 Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 American Hakko Products . . . . . . . . . . . 534 Apollo Seiko . . . . . . . . . . . . . . . . . . . . . . 411 BEST, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 127 Computrol Inc. . . . . . . . . . . . . . . . . . . . . 938 ERSA North America . . . . . . . . . . . . . . . 539 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 Finetech/Martin . . . . . . . . . . . . . . . . . . . 417 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Inventec Performance Chemicals . . . . . 230 JBC Tools USA, Inc. . . . . . . . . . . . . . . . . 636 Jovy Systems, Limited . . . . . . . . . . . . . . 646 Metcal. . . . . . . . . . . . . . . . . . . . . . . . . . . 816 O.C. White Company . . . . . . . . . . . . . . 1001 PACE Incorporated. . . . . . . . . . . . . . . . . 945 Pillarhouse USA, Inc. . . . . . . . . . . . . . . . 139 Purex . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Qualitek International, Inc. . . . . . . . . . . . 538 Senju Comtek Corporation. . . . . . . . . . . 412 Stanley Supply & Services . . . . . . . . . . 1024 STI Electronics, Inc. . . . . . . . . . . . . . . . . 609 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 Weller - Apex Tool Group . . . . . . . . . . . . 806

Stencil and Screen Printing 5N Plus Micro Powders . . . . . . . . . . . . . 327 AGI Corporation . . . . . . . . . . . . . . . . . . . 738 Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 Alpha Recycling Services . . . . . . . . . . . 1006 Apex Factory Automation. . . . . . . . . . . . 735 ASC International . . . . . . . . . . . . . . . . . . 518 Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 ASM Assembly Systems . . . . . . . . . . . . 225 ASYS Group Americas, Inc. . . . . . . . . . . 835 BEST, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 127 ERSA North America . . . . . . . . . . . . . . . 539 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 Europlacer Americas’ . . . . . . . . . . . . . . . 637 FCT Assembly . . . . . . . . . . . . . . . . . . . . 313 Fuji America Corporation . . . . . . . . . . . . 107 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Jovy Systems, Limited . . . . . . . . . . . . . . 646 Juki Automation Systems. . . . . . . . . . . . 718 Krayden, Inc. . . . . . . . . . . . . . . . . . . . . . 931 LaserJob, Inc.. . . . . . . . . . . . . . . . . . . . . 125 MET Stencil . . . . . . . . . . . . . . . . . . . . . . 329 MicroScreen . . . . . . . . . . . . . . . . . . . . . . 535 MYCRONIC, Inc. . . . . . . . . . . . . . . . . . . 825 Northern Electronics Automation . . . . . . 708

Panasonic Factory Solutions of America. . . . . . . . . . . . . . . . . . . . . 213 Photo Etch Technology . . . . . . . . . . . . . 802 Precision Placement Machines . . . . . . . 736 Quik-Tool . . . . . . . . . . . . . . . . . . . . . . . . 918 Speedline Technologies . . . . . . . . . . . . . 124 Speedprint Technology. . . . . . . . . . . . . . 821 Stanley Supply & Services . . . . . . . . . . 1024 StenTech, Ltd. . . . . . . . . . . . . . . . . . . . . 129 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 Universal Instruments Corporation. . . . . 306 Yamaha-Trans Tec America . . . . . . . . . . 813

Tape and Reel

Accurate Carriers USA . . . . . . . . . . . . . . 717 Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 Alpha . . . . . . . . . . . . . . . . . . . . . . . . . . . 321 Alpha Recycling Services . . . . . . . . . . . 1006 Conductive Containers, Inc.. . . . . . . . . . 317 Europlacer Americas’ . . . . . . . . . . . . . . . 637 GPD Global . . . . . . . . . . . . . . . . . . . . . . 305 Mid-America Taping & Reeling . . . . . . . . 540 Northern Electronics Automation . . . . . . 708

Test & Measurement Equipment — Other Acculogic, Inc. . . . . . . . . . . . . . . . . . . . . 800 Akrometrix, LLC . . . . . . . . . . . . . . . . . . . 134 ASC International . . . . . . . . . . . . . . . . . . 518 Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 Aven, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 235 Creative Electron, Inc. . . . . . . . . . . . . . . 516 CyberOptics Corporation . . . . . . . . . . . . 814 FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933 GPD Global . . . . . . . . . . . . . . . . . . . . . . 305 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Ironwood Electronics . . . . . . . . . . . . . . . 818 JTAG Technologies. . . . . . . . . . . . . . . . . 939 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 Mirtec Corporation . . . . . . . . . . . . . . . . . 407 National Technical Systems . . . . . . . . . 1035 Nikon Metrology . . . . . . . . . . . . . . . . . . . 340 Nordson DAGE . . . . . . . . . . . . . . . . . . . . 606 Nordson YESTECH . . . . . . . . . . . . . . . . 606 Northern Electronics Automation . . . . . . 708 O.C. White Company . . . . . . . . . . . . . . 1001 Omron Inspection Systems . . . . . . . . . . 436 RPS Automation, LLC . . . . . . . . . . . . . . 807 Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544 Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424 Specialty Coating Systems (Equipment). . . . . . . . . . . . . . . . . . . . 434 Specialty Coating Systems (Parylene Service) . . . . . . . . . . . . . . . 941 Stanley Supply & Services . . . . . . . . . . 1024 TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Teradyne, Inc. . . . . . . . . . . . . . . . . . . . . . 234 Test Research, Inc. . . . . . . . . . . . . . . . . . 712 Texmac, Inc (Takaya) . . . . . . . . . . . . . . . 320 The Test Connection, Inc.. . . . . . . . . . . . 410 XJTAG. . . . . . . . . . . . . . . . . . . . . . . . . . 1020

Test, Automated Acculogic Inc.. . . . . . . . . . . . . . . . . . . . . 800 AGI Corporation . . . . . . . . . . . . . . . . . . . 738 ASC International . . . . . . . . . . . . . . . . . . 518 Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 Cogiscan . . . . . . . . . . . . . . . . . . . . . . . 1038 Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938 Creative Electron, Inc. . . . . . . . . . . . . . . 516 SMTAssociation

@SMTAorg #SMTAI

CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 CyberOptics Corporation . . . . . . . . . . . . 814 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 JTAG Technologies. . . . . . . . . . . . . . . . . 939 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 Mentor Graphics Corporation, Valor Division. . . . . . . . . . . . . . . . . . . 634 National Technical Systems . . . . . . . . . 1035 Nikon Metrology . . . . . . . . . . . . . . . . . . . 340 Northern Electronics Automation . . . . . . 708 Omron Inspection Systems . . . . . . . . . . 436 Quik-Tool . . . . . . . . . . . . . . . . . . . . . . . . 918 RPS Automation, LLC . . . . . . . . . . . . . . 807 Seica, Inc.. . . . . . . . . . . . . . . . . . . . . . . . 406 Seika Machinery, Inc. . . . . . . . . . . . . . . . 707 Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424 Teradyne, Inc. . . . . . . . . . . . . . . . . . . . . . 234 Test Research, Inc. . . . . . . . . . . . . . . . . . 712 Texmac, Inc (Takaya) . . . . . . . . . . . . . . . 320 The Test Connection, Inc.. . . . . . . . . . . . 410 Vi TECHNOLOGY . . . . . . . . . . . . . . . . . . 807 YXLON FeinFocus . . . . . . . . . . . . . . . . . 128

Test, Manual AGI Corporation . . . . . . . . . . . . . . . . . . . 738 Ascentech, LLC . . . . . . . . . . . . . . . . . . . 219 Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938 Creative Electron, Inc. . . . . . . . . . . . . . . 516 Ironwood Electronics . . . . . . . . . . . . . . . 818 KwikTic, Ltd.. . . . . . . . . . . . . . . . . . . . . . 445 Mid-America Taping & Reeling . . . . . . . . 540 National Technical Systems . . . . . . . . . 1035 Omron Inspection Systems . . . . . . . . . . 436 Sonoscan, Inc. . . . . . . . . . . . . . . . . . . . . 424 Teradyne, Inc. . . . . . . . . . . . . . . . . . . . . . 234 Test Research, Inc. . . . . . . . . . . . . . . . . . 712 The Test Connection, Inc.. . . . . . . . . . . . 410 YXLON FeinFocus . . . . . . . . . . . . . . . . . 128

Tooling and Fixtures Accurate Carriers USA . . . . . . . . . . . . . . 717 AGI Corporation . . . . . . . . . . . . . . . . . . . 738 Alltemated, Inc. . . . . . . . . . . . . . . . . . . . 940 CMK America Corporation . . . . . . . . . . . 745 Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938 Europlacer Americas’ . . . . . . . . . . . . . . . 637 FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Ironwood Electronics . . . . . . . . . . . . . . . 818 Mid-America Taping & Reeling . . . . . . . . 540 Precision Placement Machines . . . . . . . 736 Quik-Tool . . . . . . . . . . . . . . . . . . . . . . . . 918 RPS Automation, LLC . . . . . . . . . . . . . . 807 Sovella Inc/The Daylight Company . . . . 907 Speedline Technologies . . . . . . . . . . . . . 124 StenTech, Ltd. . . . . . . . . . . . . . . . . . . . . 129 Stone Mountain Tool, Inc.. . . . . . . . . . . . 607 Technimark, Inc . . . . . . . . . . . . . . . . . . . 239 The Test Connection, Inc.. . . . . . . . . . . . 410

Tooling Equipment & Supplies AGI Corporation . . . . . . . . . . . . . . . . . . . 738 Europlacer Americas’ . . . . . . . . . . . . . . . 637 FKN Systek. . . . . . . . . . . . . . . . . . . . . . . 933 InsulFab PCB Tooling . . . . . . . . . . . . . . . 512 Metro SMT, Ltd. . . . . . . . . . . . . . . . . . . . 344 O.C. White Company . . . . . . . . . . . . . . 1001 Sovella Inc/The Daylight Company . . . . 907 Speedline Technologies . . . . . . . . . . . . . 124 Stanley Supply & Services . . . . . . . . . . 1024 Stone Mountain Tool, Inc.. . . . . . . . . . . . 607

Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 TOPLINE. . . . . . . . . . . . . . . . . . . . . . . . . 435

Training, Education, and Compliance American Hakko Products . . . . . . . . . . . 534 BEST, Inc. . . . . . . . . . . . . . . . . . . . . . . . . 127 CIRCUITS ASSEMBLY . . . . . . . . . . . . . . 601 EPTAC Corporation . . . . . . . . . . . . . . . . 746 Europlacer Americas’ . . . . . . . . . . . . . . . 637 IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 744 iTAC Software, AG . . . . . . . . . . . . . . . . 1027 Mentor Graphics Corporation, Valor Division. . . . . . . . . . . . . . . . . . . 634 National Technical Systems . . . . . . . . . 1035 Northern Electronics Automation . . . . . . 708 PACE Incorporated. . . . . . . . . . . . . . . . . 945 RPS Automation, LLC . . . . . . . . . . . . . . 807 SEHO North America, Inc. . . . . . . . . . . . 635 SMT Today . . . . . . . . . . . . . . . . . . . . . . . 446 SMTA . . . . . . . . . . . . . . . . . . . . . . . . . Lobby Speedline Technologies . . . . . . . . . . . . . 124 STI Electronics, Inc. . . . . . . . . . . . . . . . . 609 Texwipe . . . . . . . . . . . . . . . . . . . . . . . . . 439 The Test Connection, Inc.. . . . . . . . . . . . 410 Weller - Apex Tool Group . . . . . . . . . . . . 806

Vision Systems AOI Systems. . . . . . . . . . . . . . . . . . . . . . 444 Apex Factory Automation. . . . . . . . . . . . 735 ASC International . . . . . . . . . . . . . . . . . . 518 CTI Systems . . . . . . . . . . . . . . . . . . . . . . 226 ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . 335 FSInspection . . . . . . . . . . . . . . . . . . . . . 946 iLink Electronics, Inc. . . . . . . . . . . . . . . 1041 Juki Automation Systems. . . . . . . . . . . . 716 Mek. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1040 National Technical Systems . . . . . . . . . 1035 Nikon Metrology . . . . . . . . . . . . . . . . . . . 340 Northern Electronics Automation . . . . . . 708 O.C. White Company . . . . . . . . . . . . . . 1001 Omron Inspection Systems . . . . . . . . . . 436 RS Simmons Co., LLC . . . . . . . . . . . . . . 936 Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544 SEHO North America, Inc. . . . . . . . . . . . 635 Simplimatic Automation . . . . . . . . . . . . 1018 Stanley Supply & Services . . . . . . . . . . 1024 TAGARNO. . . . . . . . . . . . . . . . . . . . . . . . 224 Techni-Tool, Inc. . . . . . . . . . . . . . . . . . . 1010 Vi TECHNOLOGY . . . . . . . . . . . . . . . . . . 807 Viscom . . . . . . . . . . . . . . . . . . . . . . . . . . 506

X-Ray and XRF Apex Factory Automation. . . . . . . . . . . . 735 Computrol, Inc.. . . . . . . . . . . . . . . . . . . . 938 Creative Electron, Inc. . . . . . . . . . . . . . . 516 Glenbrook Technologies, Inc. . . . . . . . . . 819 iLink Electronics Inc. . . . . . . . . . . . . . . 1041 National Technical Systems . . . . . . . . . 1035 Nikon Metrology . . . . . . . . . . . . . . . . . . . 340 Nordson ASYMTEK . . . . . . . . . . . . . . . . 706 Nordson DAGE . . . . . . . . . . . . . . . . . . . . 606 Northern Electronics Automation . . . . . . 708 Omron Inspection Systems . . . . . . . . . . 436 Oxford Instruments. . . . . . . . . . . . . . . . . 537 PACE Incorporated. . . . . . . . . . . . . . . . . 945 Saki America, Inc.. . . . . . . . . . . . . . . . . 1025 Scienscope. . . . . . . . . . . . . . . . . . . . . . . 544 STI Electronics, Inc. . . . . . . . . . . . . . . . . 609 Viscom . . . . . . . . . . . . . . . . . . . . . . . . . . 506 YXLON FeinFocus . . . . . . . . . . . . . . . . . 128

2015 SMTA International

SHOW DIRECTORY >> 59

Exhibitors Index Exhibitor

Booth

327 5N Plus, Inc. .................................. 327 Acculogic, Inc. ..................................... 800 Accurate Carriers USA ......................... 717 ACE Production Technologies ............. 426 ACL Staticide, Inc. ............................... 331 Aegis Industrial Software Corporation .................................... 440 AGI Corporation .................................. 738 AIM Solder ........................................... 413 Akrometrix, LLC ................................... 134 Alltemated Inc. .................................... 940 Alpha ................................................... 321 Alpha Recycling Services .................. 1006 American Hakko Products, Inc. ........... 534 American Standard Circuits, Inc. ......... 801 Amitron Corporation ............................ 536 AOI Systems ........................................ 444 Apex Factory Automation .................... 735 Apollo Seiko ........................................ 411 ASC International, Inc. ......................... 518 Ascentech, LLC ................................... 219 ASM Assembly Systems (SIPLACE & DEK) ............................ 225 ASYS Group Americas ........................ 835 ATV Technologies ................................ 841 Aven Inc. .............................................. 235 BEST Inc. ............................................. 127 BOFA Americas ................................. 1000 BTU International ................................. 734 CalcuQuote ....................................... 1046 Circuits Assembly ................................ 601 CMK America Corporation .................. 745 Cogiscan ........................................... 1038 Computrol, Inc. .................................... 938 Conductive Containers, Inc. ................ 317 Conecsus, LLC .................................... 110 Creative Electron ................................. 516 Crystal Mark, Inc. ................................ 319 CTI Systems ........................................ 226 CyberOptics Corporation .................... 814 Dimation, Inc. ...................................... 934 DIVSYS, International, LLC ............... 1008 ELANTAS PDG, Inc. ............................. 318 Electronic Assembly Products, Ltd ..... 807 Electronics World Publishing ............... 929 Electrotek Corporation ......................... 420 Eltek USA, Inc. .................................... 140 EPTAC Corporation ............................. 746 ERSA North America ........................... 539 ESSEMTEC USA ................................. 335 Europlacer Americas’ .......................... 637 EVS International ................................. 142 FCT Assembly ..................................... 313 Finetech ............................................... 417 FKN Systek .......................................... 933 FlexLink Systems, Inc. ........................ 107 FSInspection ....................................... 946 Fuji America Corporation ..................... 107 Geib Refining Corporation ................. 1033 Glenbrook Technologies ...................... 819 Global SMT .......................................... 919 GPD Global, Inc. .................................. 305 Heller ................................................... 107

Exhibitor

Booth

Henkel Electronic Materials, LLC ........ 701 HEPCO Inc. ......................................... 416 Heraeus Electronics ............................ 845 Hi-Rel Laboratories ............................. 909 I-Connect ............................................. 104 IDENTCO ........................................... 1030 IKEUCHI USA, INC. ............................. 902 iLink Electronics Inc. ......................... 1041 Indium Corporation ............................. 430 Infinite Graphics Incorporated ............. 925 Inovaxe Corporation ............................ 713 Inspection Feature Area .................... 1050 InsulFab PCB Tooling .......................... 512 INVENTEC Performance Chemicals .... 230 IPC ....................................................... 744 Ironwood Electronics ........................... 818 iTAC Software, AG ............................. 1027 JBC Tools ............................................ 636 Jovy Systems ...................................... 646 JTAG .................................................... 939 Juki Automation Systems .................... 716 Kester .................................................. 131 KIC ....................................................... 338 Koh Young America, Inc. ...................... 307 Koki Solder America ............................ 135 Krayden ............................................... 931 Kulicke & Soffa Industries, Inc. ............ 136 KwikTic ................................................ 445 KYZEN Corporation ............................. 117 LaserJo,b Inc. ...................................... 125 MacDermid Electronics Solutions ....... 927 MANEX ERP ........................................ 339 Materials Evaluation and Engineering, Inc. ........................... 1023 Mek Americas .................................... 1040 Mentor Graphics Corporation ............. 634 MET Stencil ......................................... 329 Metro SMT ........................................... 344 MicroScreen ........................................ 535 Mid America Taping & Reeling, Inc. ..... 540 MIRTEC Corporation ........................... 407 MYCRONIC ......................................... 825 National Technical Systems .............. 1035 Nihon Superior Co. Ltd. ....................... 419 Nikon Metrology .................................. 340 Nitto Kohki USA Inc. ............................ 917 Nordson ASYMTEK ............................. 706 Nordson DAGE .................................... 606 Nordson YESTECH ............................. 606 North Dakota Department of Commerce .................................. 1028 Northern Electronics Automation ........ 708 O.C. White Company ........................ 1001 Metcal .................................................. 816 Omron Inspection Systems ................. 436 Oxford Instruments .............................. 537 PACE Incorporated .............................. 945 Panasonic Factory Solutions Company of America ....................... 213 Photo Etch Technology ....................... 802 Pillarhouse ........................................... 139 PPG Industries, Semco® Packaging & Application Systems ....................... 641

60 >> 2015 SMTA International SHOW DIRECTORY

Exhibitor

Booth

Precision Placement Machines ........... 736 Prototron Circuits ................................ 418 Purex ................................................... 245 Qualltek International, Inc. ................... 538 Quik-Tool, LLC ..................................... 918 Rehm Thermal Systems, LLC .............. 437 RPS Automation, LLC ......................... 807 RS Simmons ........................................ 936 Saki America, Inc. .............................. 1025 Samsung C&T Automation, Inc. .......... 739 Schoeller-Electronics GmbH ............... 935 Scienscope .......................................... 544 SEHO North America, Inc. ................... 635 Seica .................................................... 406 Seika Machinery .................................. 707 Senju Comtek Corporation .................. 412 Shenzhen D.M. Electronic Limited ...... 900 Simplimatic Automation .................... 1018 SMTA ............................................... Lobby SMT Net .............................................. 132 SMT Today .......................................... 446 SOMACIS SpA .................................... 911 Sonoscan, Inc. ..................................... 424 Sovella/Daylight ................................... 907 Specialty Coating Systems (Equipment) ..................................... 434 Specialty Coating Systems (Parylene Service) ........................... 941 Speedline Technologies ....................... 124 Speedprint Technology ........................ 821 Stanley Supply & Services ................ 1024 StenTech .............................................. 129 STI Electronics .................................... 609 Stone Mountain Tool, Inc. .................... 607 Super Dry .......................................... 1034 TAGARNO ............................................ 224 Technical Devices Company ............... 807 Technimark, Inc. .................................. 239 Techni-Tool ........................................ 1010 Teka Interconnection Systems ............ 325 Teradyne, Inc. ...................................... 234 Test Research, Inc. .............................. 712 Texmac/Takaya Inc. ............................. 320 Texwipe ............................................... 439 The Test Connection, Inc. .................... 410 Tintronics Industries ............................ 341 TOPLINE .............................................. 435 TTnS, Inc. ............................................ 638 Universal Instruments Corporation ...... 306 US Tech ............................................... 901 Vi Technology ...................................... 807 Viscom, Inc. ......................................... 506 Vitronics Soltec .................................... 913 Weller - Apex Tool Group .................... 806 XJTAG ................................................ 1020 Yamaha - Trans-Tec America ............... 813 YINCAE Advanced Materials, LLC ...... 237 Yole Développement ......................... 1031 YXLON FeinFocus ............................... 128 ZESTRON ............................................ 616 Zymet .................................................. 441

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@SMTAorg #SMTAI

2015 SMTA International

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SMTAssociation

SHOW DIRECTORY >> 61

Donald E. Stephens Convention Center Floor Plan

62 >> 2015 SMTA International SHOW DIRECTORY

SMTAssociation

@SMTAorg #SMTAI