AUTOFOCUS SENSORS & MICROSCOPY AUTOMATION IR LASER SCANNING CONFOCAL MICROSCOPE

IRLC DEEP SEE

Now See Deeper than ever before

Review and inspection of non visible subsurface defects Non visible and subsurface defects, such as microcracks and microvoids, as well as defects associated with manufacturing often go undetected. Heavy doping during the manufacturing process can make non destructive review and inspection of wafer and chip packages very difficult. Standard wide field inspection tools are available using Near Infrared (NIR) or Infrared (IR) illumination sources. However, these systems are not able to penetrate deep nor are they able to selectively image at a specific plane of focus.

2.5mm Square Grid, 0.75mm Spacing, 5μm Line Width imaged with 20X at surface

2.5mm Square Grid, 0.75mm Spacing, 5μm Line Width imaged with 20X through 700μm thick silicon wafer

20X Image of 200 LPM Ronchi Ruling imaged at

20X Image of 200 LPM Ronchi Ruling imaged

surface

through 700μm thick silicon wafer

A Near-Infrared Confocal Microscope capable of subsurface through silicon interior inspection The combination of a powerful Near-Infrared Laser and a Scanning Confocal Microscope offers several unique advantages over conventional wide-field IR microscopy systems. First and foremost is the ability to in image high resolution sub surface thin sections or optically slice within transparent and semi-opaque samples. This combination also results in deeper penetration of the target, greater resolution and faster image collection.

10X Image of wafer pattern imaged at surface

10X Image of wafer pattern imaged through 700μm wafer from backside

20X Image of wafer pattern imaged at surface

20X Image of wafer pattern imaged through 700μm wafer from backside

Nondestructive imaging of, IC chips, MEMS, and various other semiconductor devices

Unlike conventional inspection systems, the IRLC DEEP SEE utilizes a Near-IR laser and IR optics ideal for non-destructive subsurface interior investigation of silicon wafers, IC chips, MEMS, Solar Panels, and other devices. By taking advantage of the IR transmission characteristics of silicon, the IRLC DEEP SEE is able to conduct high resolution subsurface inspection of features that cannot be seen any other way.

Typical applications include integrity inspection after bonding, Sacrificial Oxide Layer Inspection after etching, inspection for chipping and cracks after grinding or dicing or inspecting SIP (System In Package), 3D Mounting or CSP (Chip Scale Package).

Fully motorized hardware and Near-IR optics make confocal imaging easy The IRLC includes a full automation package including precision motorization of the XY stage, objective lens turret, illumination, ND filter selection and Z position. To ensure the clearest and sharpest images during subsurface inspection, the system includes a complete set of Olympus Near-IR Long Working Distance Objectives. Designed for optimal transmission of Near-IR wavelengths, the objectives are ideal for inspecting internal structures of silicon wafers and include correction collars to adjust for varying thickness of surface glass or silicon.

One Click dual observation continually in focus The IRLC includes a colour CMOS camera and LED illumination system for bright field imaging allowing operators to quickly locate areas of interest. For subsurface inspection the system features a Near-Infrared laser and scanning confocal microscope. This combination permits deeper imaging into the sample, up to 800μm below the surface. Switching between these observation methods is a one click process. Because the IRLC uses WDI’s Autofocus 6 Sensor (ATF6), Optical Offset Adjuster (OOA) and fast Z Axis Actuator (ZAA) technologies it remains in constant focus regardless of changes in observation method or surface metrology.

20X brightfield surface Image of Thin Film Transistor (TFT) array with transistors hidden under the black matrix

20X NIR Confocal image of Thin Film Transistor array revealing the transistor structure beneath the black matrix

Intuitive software means less time learning and more time imaging The IRLC includes powerful yet intuitive software, designed to increase the effectiveness and efficiency of the inspection and review process. Basic operation of the system, including parameter adjustments for illumination, magnification, XYZ stage position and focus offset is easily achieved. XY stage navigation can be carried out using either the software, the joystick or simply by clicking on the live image.

Linear XY measurement capability & advanced image acquisition Linear XY “point to point” and “point to multipoint” measurements are available through the measurements tab within the software. Measurements are recorded and populated in tabular form within the software and may be exported as .csv for further analysis. The system also features advanced image acquisition options allowing frame averaging, Averaged Image, maximum Z projection Delta Z Overlay and the capture of a sequence of images in between two points Image Sequence Capture.

Example of point to multipoint measurements on a captured image. Also shown are Averaged Image, Delta Z and Image Sequence Capture tool interface.

Completely automated inspection routines By combining the IRLCs integrated motorization and autofocus with its automation control software it can be configured to conduct completely automated inspection routines. Through the simple and intuitive user interface various individual location parameters such as ROI, magnification, depth and illumination intensity settings can be defined. These routines can be run for multiple samples, permitting the complete automation of the inspection process.

Example of Unit routine creation detailing various imaging ROIs and their associated magnifications and imaging parameters. Also shown is an overview map indicating the relative position of each ROI and its associated magnification.

Recipe creation for high throughput inspection The IRLC also features the ability to create and execute complete inspection recipes for wafers and both IC strip and tray packages. Defining wafer, tray or strip and IC parameters is made simple through a graphic interface. The corner detection feature automates IC location registration, regardless of alignment. Once created, these recipes can be executed against other individual samples, or entire trays or strips of devices, ensuring accurate and repeatable inspection and greater overall efficiency.

Shown left an example of Tray/Strip editor where details associated with format and size of a particular recipe can be entered. Selection and deselection of a particular IC is a simple click. Once unit and tray/strip recipes have been created they can be run together as a completely automated process

IRLC System Specifications System Class Observation Methods

Class 1   Scanning Laser Confocal Conventional Bright Field

Lens Changer

Motorized Turret

6 Lens Capacity

Objectives

5X, 10X, 20X, 50X, 100X

20X, 50X, 100X with Correction Collar

Manual Z Stage Jack

Stroke

75mm

Type

1/32 Stepper Motor

Travel

10mm

Resolution

0.157μm

Maximum Speed

10mm/sec

Maximum Load

3.5kg

Type

XY Linear Encoder Stepper Motor

Travel

305mm X 305mm

Resolution

0.1μm

Maximum Speed

120mm/sec

Accuracy

6μm/300mm

Repeatability

1μm

Maximum Load

750g

Structured Light Pattern

Line Segment

Sensor Wavelength

658nm

Image Detector

Area Scan CMOS

Motorized OOA

Depth Range

0 to 800μm

Brightfield Illumination

Type

Super Bright White LED

Size

1/2 Inch 2MP CMOS

Resolution

1600 X 1200

Frame Rate

10 FPS Full Resolution

Bit depth

10 Bits

Pixel Size

4.2μm X 4.2μm

Type

Single Mode Laser Diode

Maximum Laser Power

300mW

Wavelength

1100nm ~ 1350nm

Typical Spectral Width

5nm

Spectral Response Range

900nm ~ 1700nm

Resolution

950 X 950

Bit depth

10 Bits

Pixel Size

7.5μm

Electrical Requirements

3 Separate AC

100-240V, 50/60Hz, Single Phase

Ampere Requirements

13.0A

Total System

Operating Temperature

10°C ~ 30°C

Ambient

Operating Humidity

< 70%

Non Condensing

Weight

182kg

Main Unit

Motorized Z Actuator

Motorized XY Stage

Autofocus

Brightfield CMOS Camera

Confocal Illumination

Confocal Photodetector

5X Numerical Aperture Working Distance Field Number Correction Collar

10X

20X

50X

100X

0.1

0.3

0.45

0.65

0.85

23mm

18mm

8.3mm

4.5mm

1.2mm

22

22

22

22

22

Y

Y

Y

Glass Thickness Correction

0~1.2mm

0~1.2mm

0~0.7mm

Silicon Thickness Correction

0~1.2mm

0~1.2 mm

0~1.0mm

IRLC System Dimensions

© 2014 WDI Wise Device Inc., All rights reserved. Design, features and specifications are subject to change without notice.

is a world leader in the manufacturing and integration of industrial autofocus sensors and microscopy automation solutions for theAUTOFOCUS biomedical, metrology, semiconductor and laser markets.  WDI’s success lies in an innovative culture and SENSORS electronics, & MICROSCOPY AUTOMATION ability to optimize and adapt our technology to a customers’ specific requirements by listening to their needs and gaining a deep understanding of their processes, applications and goals. WDI employs over 20 optical, electrical, mechanical and software engineers as well as scientists who are dedicated to servicing our customers. We have locations in Canada and Poland, as well as service centers in Taiwan and South Korea. Contact WDI today to see how we can help solve your microscopy automation needs.

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