CLEARED For Open Publication Oct 25, 2017 Department of Defense

OFFICE OF PREPUBLICATION AND SECURITY REVIEW

Assuring Microelectronics Innovation for National Security & Economic Competitiveness (MINSEC) Jeremy Muldavin, Ph.D. Office of the Deputy Assistant Secretary of Defense for Systems Engineering TAME Forum Gainesville, FL | November 29, 2017 Distribution Statement A – Approved for public release by DOPSR. Case # 18-S-0185 applies. Distribution is unlimited.

Summary BLUF: Congress, OMB, and NSC directed DoD to develop a strategy for microelectronics access for the whole of government and national interests. Background: • Means of producing advanced microelectronics for USG and commercial national security and national interest applications within the U.S. is fragile and threatened. • Significant barriers to bringing innovative ideas to capability (10-1000x performance) demonstrations and products are hindering development of DoD/DOE weapon systems and hardware in the domestic commercial marketplace. • USG investment in disruptive material, device, architecture, and manufacturing capabilities severely lags investments by other nations ($150B in China, $100B by Saudi Arabia). Microelectronics Innovation for National Security and Economic Competitiveness: • Provides assured access and enhancement to U.S.-based design, foundries, and packaging ecosystem to generate/protect intellectual property and U.S. competiveness. • Invests in disruptive R&D to develop materials, devices, architectures, and design tools for complex next generation computing, strategic applications, and enhanced fabrication.

MINSEC Nov 29, 2017 Page-2

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Future Warfighting Systems Advanced Microelectronics Needs

Autonomous and Collaborative

System of Systems

Miniature and Swarming

Human and Robot Collaboration Cyber and Social

Big Data and AI Systems

Decentralized Systems

Human and Robot Systems

Diverse Protected Links

Global Tech and Infrastructure

Artificial Intelligence (AI) and Graph Processors

Open and Distributed Architecture & Processing

Vision, Semantic and Navigation Processing

Frequency and Antenna Diversity Signal Proc.

Leverage & Assure Access to the best Technology

• High performance imagers & local processing circuits • Robust Navigation & local semantic processing

• Multi-antenna & frequencies • Adaptive processing (Trillion Ops/sec/watt) for robust comm. & radar systems

• 100B-1T node graphs • Need 1000x performance and efficiency for real-time MINSEC Nov 29, 2017 Page-3

• Local processing raw data • Rapid tech. insertion & upgrades using SotA

• Use best global tech where it exists • Assure domestic sources for state-of-art

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

The Threat of Loss of Microelectronics Leadership Current Global Microelectronics Leadership U.S. Ecosystem

Asia

• Strong domestic fabless semiconductor industry –Apple, Qualcomm, others dominate profits –Hardware startups falling behind foreigners • Integrated Device Manufacturers at risk • R&D from top universities migrates to Europe & Asia

R&D escape

• Significant increase in # of fabless firms

Supply Risk

– 3,000 new in 2017 • Multiple Joint Ventures and acquisitions • Investments of $150B+ in advanced microelectronics and $60B+ in STEM and universities • TSMC offers $200M a year in free silicon to universities

Current 14-nm foundries

Possible Future Global Microelectronics Leadership U.S. Ecosystem • Strong global fabless semiconductor industry –U.S. companies invest in Asian production • Integrated Device Manufacturers diversify • Overproduction globally forces domestic fabrication closure • Best R&D from Asia MINSEC Nov 29, 2017 Page-4

Asia

Domestic Sources 4 4

R&D escape

1

Supply Risk

Current 14-nm foundries New advanced foundries

7

22 6

, 5

• Leading world-class microelectronics design Supply and production capability Risk –7 new (≤14nm) foundries • Trade policies: –Increase domestic market share –Acquisitions and startups funded by government

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Past and Current Analogous Situations 1970

1980

1990

2000

2010

2020

? Japan • Trade and industrial actions in ‘70s & ’80s to increase semiconductor market share –Largely successful, U.S. lost significant market share and fab capacity.

Taiwan • Created ITRI in ‘70s, a government funded R&D Institute. Spun off multiple companies, including TSMC • Today, 4th in global market share • TSMC is world’s largest pure-play foundry

U.S. Government Response • VHISC ($918M) was DoD program to develop two new generations of IC tech • MIMIC ($570M) was DoD program to accelerate GaAs technology

US Gov. & Industry Response • SEMATECH ($870M + industry match) partnership of 14 U.S. companies –Transitioned from government to private funding only and international partners joined

China • In 2015, stated plan to reach “advanced world-level in all major semiconductor industry segments by 2030.” –Subsidies: ($150B over 10 years), direct funding by state-owned companies, & foreign company and IP purchase –Zero-sum trade policies • Current status: –Foundries now 2-3 generations behind –Seven (7) state-of-the-art fabrication starts planned –No domestically owned memory, but major memory investments –Significant increase in # of fabless firms

Technology slow down due to scaling physical limitations could result in leadership transition MINSEC Nov 29, 2017 Page-5

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

NDAA FY 2017 S231 Strategy Request Summary* 1. 2. 3. 4. 5. 6. 7. 8.

9.

Define the various levels of trust required by DoD systems Identify means of classifying DoD systems based on the required level of trust for microelectronics within the system Identify means by which trust in microelectronics can be assured Identify a means to increase the supplier base for assured microelectronics to ensure multiple supply pathways Provide an assessment of the microelectronics needs of the DoD in future years, including the need for trusted, radiation-hardened microelectronics Provide an assessment of the microelectronics needs of the DoD that may not be fulfilled by entities outside the DoD Identify the resources required to assure access to trusted microelectronics, including infrastructure workforce, and investments in science and technology Develop a research and development strategy to ensure the DoD can, to the maximum extent practicable, use state of the art commercial microelectronics capabilities or their equivalent, while satisfying the needs for trust Develop recommendations for changes in authorities, regulations, and practices, including acquisition policies, financial management, public-private partnership policies, or in any other relevant areas, that would support the achievement of goals of the strategy (* DoD currently addressing 1-6, MINSEC funding will address 7, 8, & 9)

MINSEC Nov 29, 2017 Page-6

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Microelectronics (ME) Assurance Process Flow CONOPS

Capabilities

Needs

Process

DSB Program Criticality Category

Program Criticality Mapping

1 2 3

Process

Mitigations Designer

Assurance Level for IP

Manufacture

Supplier

1 2 3

Assurance Intensity Depends on ME Type/Criticality MINSEC Nov 29, 2017 Page-7

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Systems of Systems Systems Boards Components

ME Assurance Process Flow Details

1 2 3

YES

Can I protect IP myself?

Will Ind. make it? NO

Build Capability

IP Confidential?

NO

YES

YES

DMEA Trusted Flow V&V

Can I protect IP myself?

IP Integrity Critical YES NO

NO

NO

Availability

Assured ME Parts

Capabilities & IP

Program Categories

YES NO

Will Ind. make it? YES

NO

Will Ind. make it?

Access

YES

Cooperative Commercial

Pure Commercial

Process Assurance

V&V

V&V

Product Assurance

Microelectronic Part

MINSEC Nov 29, 2017 Page-8

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

ME Assurance Process Flow Paths

5 2

4

1 3

MINSEC Nov 29, 2017 Page-9

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

A Potential New Approach for Achieving ME Assurance Current Approach

MINSEC Nov 29, 2017 Page-10

Cyber-Physical Approach

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Electronics as a Strategic Issue Current Tactical Issue

DoD Trusted Electronics Issue •

Options for domestic trusted manufacture of custom DoD electronics are diminishing

COTS Electronics Trust (DoD & Beyond†)

Larger Strategic Issue

•

Most COTS electronics used in DoD systems are fabricated overseas; significant risk from tamper

•

Risks similar for the broader national security community, banking, critical infrastructure, etc.

Access to Electronics / Electronics based economic growth •

Shift in electronics fabrication creates potential for overseas control

•

End of Moore’s Law potential carries economic impacts

Significant electronics challenges represent a strategic level national issue †

MINSEC Nov 29, 2017 Page-11

Including the broader national security community, banking, critical infrastructure, commercial industry, etc. Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

FY03-16 Trusted Foundry Program

PB 17: Trusted & Assured Microelectronics

POM 1923: Microelectronics Innovation for National Security

Create Microelectronics Innovation Throughout the United States Fabrication Center Strategic Alliances Awareness & Security

R&D Capture Innovation Hub

R&D Capture

Design Center Incentives and Mkt Growth

Strategic Alliances

Design Center

Proactive Awareness & Security MINSEC Nov 29, 2017 Page-12

Access & Assurance

Enhanced Manufacturing

Incentives & Market Growth

Strategic Alliances

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Microelectronics Strategy Challenges & Investments Enabling Manufacturing

Preserving US Government Partnerships in SOTP

Access to Assured SOTA in US

State-of-the Practice Legacy & Boutique

Science & Technology

State-ofthe-Art

Preserve & Enhance Government Unique Capabilities

Enhance and Bridge Disruptive R&D to Domestic Production

Access & Assurance

MINSEC Nov 29, 2017 Page-13

 Commercial Access  Commercial & Assured Gov. Line  Government dual use  R&D facilities

Disruptive R&D

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

New Capability Development Operational View Innovation Ecosystem Government Expert Designers

Innovators & Developers

Industry

Supercomputer Emulators

Secure Enclaves

Academia

RFP

Domestic Ecosystem

Integrate & Demonstrate

EDA Tools IP Library SW Assurance & Validation Tools

Industry & Academic Designers

End-user Experts Government

Administrators, Business Managers & Architects

Software & Test V&V Analysts

Research & Development

Fabricate & Package

Architectures Design Design ToolsTools Architectures

Modernized Systems

State-of-Art State-ofPractice

Materials Devices

Materials

MINSEC Nov 29, 2017 Page-14

Devices

High-Mix Fabs

Package & Test

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Rebuilding U.S. Microelectronics Leadership and Dominance Strategic National Security Applications

Financial & Data Analytics

Secure IoT

Autonomous Systems + AI

Robust + Agile Communicators

Biomedical

Commercial Space

Strategic National Economic Competitiveness Applications Proactive Awareness & Security

• Supply Chain track • Proactive Authorities • Intelligence & CI • Standards

Access & Assurance • Secure Design • IP, EDA, experts • Foundry assured Access • Prototype Demonstrations

Enhanced Manufacturing • SOTP Back-end parity with SOTA • SOTA on 200mm tools at SOTP • High-mix low vol. fabrication

Incentives & Market Growth • Acquisition reform and incentives • Tax, policy, regulation reform • R&D and domestic fab incentives

Strategic Alliances • Cooperative R&D • Trade and Foreign Military Sales (FMS) • Americas • Europe • Asia partners

Disruptive Research & Development Materials, Devices, Circuits Experts, Infrastructure, Venture Capital MINSEC Nov 29, 2017 Page-15

Architectures

Design Tools for Complexity Innovation, Science & Technology, R&D

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Systems Engineering: Critical to Defense Acquisition

Defense Innovation Marketplace

DASD, Systems Engineering

http://www.defenseinnovationmarketplace.mil

http://www.acq.osd.mil/se

MINSEC Nov 29, 2017 Page-16

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

For Additional Information

Dr. Jeremy Muldavin ODASD, Systems Engineering 571-372-6690 [email protected]

MINSEC Nov 29, 2017 Page-17

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Backup

MINSEC Nov 29, 2017 Page-18

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Disrupting Innovation for National Security and Interests Prototype Demonstrations

Enhanced Manufacturing and SOTP 90nm to 65nm & Copper

SotA at SoP & Ebeam litho

•Bring Gov. & merchant SoP to 65nm feature size with wet 193 litho •Copper back end parity with SotA

•Multi-beam ebeam direct write litho for low-volume •200mm tools for near SotA/split fab at SoP foundries

Flexible Fabs •Plethora of fabs for highmix lowvolume production •Market for fab recipes & low-cost fabs

Disruptive Research and Development Materials & Devices

Science & Technology R&D Defense and commercial R&D, FFRDCs, University researchers, etc. MINSEC Nov 29, 2017 Page-19

• Novel materials systems for next generation logic, memory, and interconnects • Integrate novel devices with advanced SOTA microelectronics • Demonstrate new circuits applications

Architectures • Combine memory and processing on a single part • Stackable, 3-D logic and memory • Combine nonsilicon and silicon components • Calculations with new type of logic devices

Complex Design • Robust Software Development tools • EDA tools to design complex systems with small agile teams

Innovators and Prototype Developers Small Business, Individuals, defense and commercial R&D, FFRDCs, University researchers, etc.

Distribution Statement A – Approved for public release by DOPSR Case # 18-S-0185 applies. Distribution is unlimited.

Microelectronics Trends

MINSEC Nov 29, 2017 Page-20

State-of-the-art Devices

Increasing Cost and Complexity

Globalization and Commercial Dominance

New Applications

•Deeply-Scaled Silicon ICs (10nm) •2.5 & 3D ICs •Heterogeneous System-on-Chip (SoC) ICs •Flexible and miniature packaging •Accelerator and SoC architectures

•$5-15B for a modern fabrication facility •>$500M for a new commercial smart phone SoC development •Reliance on thirdparty Intellectual Property (IP) •No-one can do it alone

•State-of-the-art fabrication consolidation •Commercially-driven (DoD