APT Electronics, Inc. Advanced Packaging Technology

ISO & AS9100 Certified Company

APT Electronics, Inc. is a fully automated electronics contract manufacturer specializing in surface mount and through-hole assembly with ICT, functional and ESS test support. Material control utilizing an integrated MRP system supporting turnkey procurement of components to customer supplied AVL and allocation of customer consigned material. Top level integration assembly (box-build). Certified manufacturing process and Quality system in accordance with ISO 9001:2008 reference #: 10002384 QM08 and AS9100 reference #: 100002384 ASH09.

EQUIPMENT & CAPABILITIES Facility: 20k sq/ft

Staff:

• 3K sq/ft office space • 17k sq/ft production area

(2) shifts

(130) Employees (4) Program Managers (3) Senior Buyers with (2) Junior Buyers (6) Manufacturing Engineers (3) Certified Green Belt: Lean 6-Sigma Manufacturing (1) Senior Test Engineer with (2) Senior Test Technicians, (5) Test Operators (1) IPC 610 and J-STD-001 Certified Trainer (Quality Manager) (2) Quality Engineers (14) Quality Inspectors (Certified to IPC 610 & J-STD- 001) (1) IPC 7711 & 7721 Certified Trainer

MANUFACTURING Four (4) SMT Pick and Place lines One (1) Leaded Wave soldering line One (1) Lead Free Wave soldering line Water soluble, No clean and RMA Flux available {per customer requirements} Workmanship Standard: IPC-610C class 2 and 3 and J-STD 001 class 2 and 3 First Articles in compliance with AS9102 (when required) Rework & Repair Standard: IPC-7711 and IPC 7721

SOLDER AND FLUX SMT: Leaded Lead Free Water Soluble No Clean RMA ++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++

WAVE SOLDER: Leaded Lead Free Water Soluble No Clean ++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++

HAND SOLDER: Leaded Lead Free Water Soluble No Clean RMA APT Electronics, Inc. – 241 N. Crescent Way, Anaheim, CA 92801 — (714) 687-6760 — www.aptelectronics.com Updated 9/26/2013

APT Electronics, Inc. Advanced Packaging Technology

ISO & AS9100 Certified Company

SMT Board Size:

Max: 18.1” x 17.3” Min: 2” x 2” (without carrier)

Component range: 01005 (0201) to 54mm² and 45x100mm (BGA, µBGA, CSP, connector, odds). Mounting Accuracy: @ 3 sigma 50 micron for chips, 30 micron for QFP’s.

SMT EQUIPMENTS Pick & Place Machines All SMT pick and place equipment is manufactured by “ASSEMBLEON” (Phillips)

Topaz-X2 FNC (5) (DOM 2009) 1 head gantry with 8 automatic exchange nozzles. Nozzles: 71-74 and (76 for melf parts). (71 01005-0603, 72 0805-Tantalum case A, 73 Tantalum case B-SOIC, etc.). Feeder Capacity: 80 8mm, 48 12-16mm, 32 24-32mm, 24 44mm, 18 56mmm. Mfg. Max Rate: 20K CPH IPC 9850: 15.4K CPH Board Size: Min. 2” x 2” Max. 18.1” x 17.3” Component range: (0201) (0402) to 45x100 mm (BGA, µBGA, CSP, connector, odds). Mounting Accuracy: @ 3 sigma, 50 micron for chips, and 35 micron for QFPs.

Emerald-X (1) (DOM 2002) 1 head gantry with 2 automatic exchange nozzles. Nozzles: 61-65 and 66 for melf parts. (61 0201-0603, 62 0805-Tantalum case A, 63 Tantalum case B-SOIC32, 64 PLCC etc.) Feeder Capacity: 84 8mm, 41 12-16mm, 28 24mm, 20 32mm, 19 44mm. Mfg. Max Rate: 6,300 CPH IPC 9850: 5000 CPH Board size: Min. 2” x 2” Max. 18.1” x 17.3” Component range: (0201) (0402) to 54mm² and 45x100mm (BGA, µBGA, CSP, connector, odds). Mounting Accuracy: @ 3 sigma 50 micron for chips, 30 micron for QFPs.

MG1 (2) (DOM 2008) 1 head gantry with 8 automatic exchange nozzles. Nozzles: 211-215 and 216 nozzles for melf parts). (211 01005-0402, 212 0603-Tantalum case A, 213 Tantalum case B-SOIC, etc.) Feeder Capacity: 96 8mm, 48 12-16mm, 32 24-32mm, 24 44mm, 18 56mmm. Mfg. Max Rate: 24K CPH Real Time Rate: 17.4K CPH Board Size: Min. 2” x 2” Max. 18.1” x 17.3” Component range: 01005 (0402) to 45x100 mm (BGA, µBGA, CSP, connector, odds).. Mounting Accuracy: @ 3 sigma, 50 micron for chips, and 30 micron for QFPs.

OPAL (1) (DOM 2009) 8 head gantry with 8 automatic exchange nozzles. Nozzles: 71-74 and (76 for melf parts). (71 01005-0603, 72 0805-Tantalum case A, 73 Tantalum case B-SOIC, etc.). Feeder Capacity: 96 8mm, 45 12-16mm, 28 24-32mm, 20 44mm, 12 56mm. Mfg. Max Rate: 17.7k CPH IPC 9850: 13.9k CPH Board Size: Min. 2” x 2” Max. 18.1” x 17.3” Component range: (0201) (0402) to 45x100 mm (BGA, µBGA, CSP, connector, odds). Mounting Accuracy: @ 3 sigma, 50 micron for chips, and 35 micron for QFPs. APT Electronics, Inc. – 241 N. Crescent Way, Anaheim, CA 92801 — (714) 687-6760 — www.aptelectronics.com Updated 9/26/2013

APT Electronics, Inc. Advanced Packaging Technology

ISO & AS9100 Certified Company

Solder Paste Printers: DEK Horizon 02 (2) (DOM 2007) Fully automatic with fiducial recognition, under stencil cleaning system, and paste on pad verification system. Board Size: Min. 2” x 2” Max. 20” x 20” DEK Horizon 02i (1) (DOM 2009) Fully automatic with fiducial recognition, under stencil cleaning system, 25 micron +/- paste on pad verification system. Board Size: Min. 2” x 2” Max. 20” x 20” DEK Horizon 03iX (1) (DOM 2011) Fully automatic with fiducial recognition, under stencil cleaning system, 25 micron +/- paste on pad verification system. Board Size: Min. 2” x 2” Max. 20” x 20”

SMT Reflow Ovens: (4) Vitronics Soltec XPM3 1240 with 12 convection heating (top & bottom) zones and EC2 4 cooling zones. Temperature: Max. 350°C Board size: Min. 2” Max. 20”

Heller 1913 MK III with 13 convection heating (top & bottom) zones, 3 cooling zones. Temperature: Max. 300°C Board Size: Min. 2” Max. 18”

Heller 1800EXL with 8 convection heating (top & bottom) zones. Temperature: Max. 300°C Board size: Min. 2” Max. 20”

Heller 1809 MK III with 9 convection heating (top & bottom) zones, 2 cooling zones. Temperature: Max. 300°C Board Size: Min. 2” Max. 18”

Baking Ovens: Blue M Electric model SPX (1) (Used to pre-bake PCB and selected components prior to SMT process)

TPS-Blue M, model ESP400 (2) (Used to cure epoxies, potting compounds and preheat assemblies)

GRIEVE model TBH-500 200sq/ft chamber (1) (Used to cure epoxies, potting compounds and preheat assemblies)

Yamato model DVS 602 (3) (Used to cure epoxies, potting compounds, preheat assemblies)

QUALITY AOI Machine (4) (Automatic Optical Inspection) MVP Supra-E (x2) In Line Autoinspector Quad Color lighting, 2D Image process algorithm Board size: Min 2” x 2” Max 20” x 20” Telecentric look down lighting Large format camera for 01005 Inspection Orbotech VT-9000 Series (x2) with statistical modeling base image processing algorithms and sub-pixel accuracy Test Platform: X, Y, Z, table with high resolution glass scale encoders Board Size: Min. 2” x 2” Max. 24” x 18” APT Electronics, Inc. – 241 N. Crescent Way, Anaheim, CA 92801 — (714) 687-6760 — www.aptelectronics.com Updated 9/26/2013

APT Electronics, Inc. Advanced Packaging Technology

ISO & AS9100 Certified Company VISION Mantis scopes (22) 4X & 10X magnification Stereo microscopes (2) 2.5X to 25X

WAVE Leaded Wave Solder Machine Electrovert Electra (1) (DOM 2004) Fluxer: Ultrasonic spray fluxer Preheat: 3 convection preheat bottom, 1 IR preheat top Wave: SMT chip wave section and Lambda for through-hole components De-bridging: Accu-Knife hot air de-bridging tool Board Size: Min. 2” x 2” Max. 20” x 18” Standard solder: 63Sn/37Pb

Lead Free Wave Solder Machine Technical Devices Nu/Era CV (1) (DOM 2012) Fluxer: Ultrasonic spray fluxer Preheat: 2 convection preheat bottom/top, 1 IR preheater Wave: SMT chip wave section and Lambda for through-hole components Board Size: Min. 2” x 2” Max. 20” x 18” Standard solder: SAC305

Nitrogen Generator (DOM 2007) On-Site Model N-50 (1) Built in oxygen analyzer Produces up to 226 SCFH at a purity of 99.99% 120 gallon storage capacity

Solder Fountain (used to dip solder, pre tin, etc.) Lead Solder Hakko 485 (2) with automatic solder flow controller Component size: 9.9mm x 9.9mm to 89mm x 10mm Standard solder: 63Sn/37Pb Lead Free Solder Hakko 485 (2) with automatic solder flow controller Component size: 9.9mm x 9.9mm to 89mm x 10mm Standard solder: SAC 305

PCBA CLEANING Aquastorm model 100 (1) (DOM 2004) with wash heater tank, pre-wash, wash, rinse and 2 heater blowers sections with Resys Aqua-Loop Closed Loop Recycle System to provide deionized water at minimum 2 megohm resistance. Aqueous Technologies model SMT1000-LD (1), (DOM 2007) Low discharge batch cleaner used to clean assemblies manufactured with RMA flux. Utilizes “ATRON” AC300 as standard saponifier

Contamination Tester Aqueous technologies: model ZI-100A ZERO-ION (1) (DOM 2007) 18” X 18” test cell.

BGA X-Ray Scienscope Xscope 2000 (1) (DOM 2011) Real time imaging Board Size: Min. 2” x 2” Max. 24” x 18” APT Electronics, Inc. – 241 N. Crescent Way, Anaheim, CA 92801 — (714) 687-6760 — www.aptelectronics.com Updated 9/26/2013

APT Electronics, Inc. Advanced Packaging Technology

ISO & AS9100 Certified Company BGA Rework Station Airvac DRS24 semi-automatic with thermal smart tracking system (1) (DOM 2002) Rework Capability: BGA, Micro BGA smallest size in the market to 432mm or 1.72” Board Size: Min. 2” x 2” Max. 18” x 12” Airvac DRS25 BGA/SMD rework station high efficiency 16” X 16” preheated (5000 watts), programmable board cooling system. Rework Capability: Lead & Lead Free capable BGA, Micro BGA smallest size in the market to 43 2mm or 1.72” Board Size: Min. 2” x 2” Max. 18” x 12”

BGA Re-ball APT can perform reballing in house utilizing pre-form ball grid templates, on large qty’s APT may opt to outsource reballing.

TEST ICT In-Circuit Test Systems HP 3070 Series III (1) Capability: Currently testing up to 2304 nodes. Teradyne Z1820 (1) Capability: Currently testing up to 1060 nodes. DeltaScan with FrameScan GenRad 2286e (2) Capability: Currently testing up to 3840 nodes.

Temperature Cycle Testing Thermotron S-16 (1) Internal Volume (Cubic Ft): 16c/ft Temperature High Limit: 350°F, 177°C Temperature Low Limit: -100°F, -73.3°C, Method of Cooling: Cascade Mechanical Refrigeration SD-302 Mechanical Refrigeration Chamber Internal Volume 2 Cubic ft. Temperature High Limit: 350F, 177C Temperature Low Limit: -85F, -65C

IC Programming Chip Master 7000, 7100, and 6100/XP (2), XPRO-3000, PBM 1410-84 Program Capability: PLCC-24, 32, 44, QFP-44 and SO-16

Test Equipment Tonehom multilayer shorts locator Model 950 (1) Cable Scan Test Mate Model EXP (1) Oscilloscope: Tektronix TDS 3053 500MHZ DPO (1) BK Precision 889 Bench LCR/ESR Meter (1) 5 variable DC power supplies from 1VDC to 250VDC. Various DMM (standard test equipment)

MISCELLANEOUS De-paneling Equipment SAYAKA SAM-CT56NJ (SEIKA) (DOM 2008) High speed automatic router with CCD camera and state of the art image-processing software Routing area: 19.5” x 23.5” Max PCB thickness: 0.236” Repeatability: +/- 0.0004” APT Electronics, Inc. – 241 N. Crescent Way, Anaheim, CA 92801 — (714) 687-6760 — www.aptelectronics.com Updated 9/26/2013

APT Electronics, Inc. Advanced Packaging Technology

ISO & AS9100 Certified Company FKN SYSTEK Model: 01-01000R Semi Automatic router. Manual feed Max PCB thickness: 0.155” VDP3-IM manual de-paneling machine (3) Board Size: Min. 2” Max. 18” DJZ-NIR-1 pneumatic nibbler (1) Board Size: Min. 2” Max. 18”

Press-Fit Connector Installation 5 Ton Manual Press (1) 3 Ton Manual Press (2) 1 Ton precision press (1) ½ Ton Manual Press (2) Customized tooling provided to ensure proper engagement

Component Baking Oven Yamato model DVS-602 (1)(DOM 2009)

Vacuum Sealer with Optional Nitrogen Infusion Super Mighty Mutt Bag size min 2” max 18” at 26 hg vacuum

De-Humidity Cabinet (Dry Box) (DOM 2011) Mc Dry model DXU-1001  Compliant to ESD-IEC61340-5-1  Can maintain RH level of 1%RH

Pre-Heater (PCBA Rework Preparation) HAKKO model FR1012 (5) (DOM 2009)

Dispensing Loctite Dispensing Controllers (2) 98021 with digital timer control of duration from .01 to 30 seconds. Vacuum pull back feature. Oki Precision Dispensers DX-250 (4) with digital timer control of duration from .02 to 60 seconds. Vacuum pull back feature.

APT Electronics, Inc. – 241 N. Crescent Way, Anaheim, CA 92801 — (714) 687-6760 — www.aptelectronics.com Updated 9/26/2013