ANSYS Multiphysics For Electronic and Electrical Simulation
Ankit Adhiya Lead Engineer (
[email protected]) 1
© 2011 ANSYS, Inc.
June 26, 2014
Content
• Multiscale Single Physics Simulation • Why Industry needs Multiphysics Solutions
• ANSYS Multiphysics Solutions • Summary
2
© 2011 ANSYS, Inc.
June 26, 2014
Content
• Multiscale Single Physics Simulation • Why Industry needs Multiphysics Solutions
• ANSYS Multiphysics Solutions • Summary
3
© 2011 ANSYS, Inc.
June 26, 2014
Multiscale Single Physics Simulations
Electromagnetics
Fluid Flow + Thermal
Number of sub components
Electromagnetics
System Reliability PCB Reliability
Structural Mechanics
IGBT Reliability
Thermal
Solder Reliability
Chip Level Analysis 4
nm
© 2011 ANSYS, Inc.
June 26, 2014
μm
mm
cm
m
Agenda
• Multiscale Single Physics Simulation • Why Industry needs Multi-physics Solutions
• ANSYS Multiphysics Solutions • Summary
5
© 2011 ANSYS, Inc.
June 26, 2014
Product Development Trends: Driving The Need For Multiphysics
Increasing Power Density
Advanced Materials
Need an image
Miniaturization 6
© 2011 ANSYS, Inc.
June 26, 2014
Environmental Sustainability
Multiphysics for Electronic Design • Real-world multiphysics environments impact – Proper operation of components – Integrity and life of components – Overall product reliability
• Product reliability of high performance electronic devices requires
– Multiphysics approach incorporating electromagnetic, thermal and mechanical simulation to simulate real world environments
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© 2011 ANSYS, Inc.
June 26, 2014
Fusing of an electronic trace on a printed circuit board from a current overload
Multiphysics Simulation • Multiphysics simulation delivers a deeper understanding of product performance by considering the interaction of multiple engineering disciplines. StructuralMechanics Electromagnetics Fluid Dynamics
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© 2011 ANSYS, Inc.
June 26, 2014
Systems and Embedded Software
Agenda
• Multi-scale Simulation • Why Industry needs Multiphysics Solutions
• ANSYS Multiphysics Solutions • Summary
9
© 2011 ANSYS, Inc.
June 26, 2014
Multiscale Multiphysics Simulations Structural Mechanics Fluid + Thermal
Number of sub components
Electromagnetics
System Reliability Structural Mechanics
Electromagnetics
PCB Reliability
Fluid + Thermal
Fluid + Thermal Electromagnetics
Fluid + Thermal
IGBT Reliability
Electromagnetics
Structural Mechanics Fluid + Thermal Structural Mechanics
Solder Reliability
Chip Level Analysis 10
nm
© 2011 ANSYS, Inc.
June 26, 2014
μm
mm
cm
m
Chip Package System Analysis
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© 2011 ANSYS, Inc.
June 26, 2014
3D IC Industry Trends and Challenges Trends
• Accommodates dies with mixed process technologies/ gate sizes • Various formats of multiple semiconductor dies and 3D-ICs • Gate sizes keep decreasing
3D IC stacked dies
Challenges • Increases interdependence between heat dissipation and temperature fields – Actual operating environment should be taken into account – The system temperature can affect die power due to change in leakage power
• Thermal run-away problems 12
© 2011 ANSYS, Inc.
June 26, 2014
Flipchip dies on single Interposer die with TSVs
ANSYS Multiphysics Solution for 3D IC Industry Electromagnetics
Fluid Dynamics
Sentinel-TI
RedHawk, Totem
Package Design
IC DESIGN
CTM Generation
IC Thermal Analysis
CTM Temperature
3D IC Power Budgeting © 2011 ANSYS, Inc.
3D IC Thermal Management June 26, 2014
System Design Converged Power Map
Power Library
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Icepak
System thermal BC
PCB/Pkg Temperature
System Thermal Tools
System level Thermal Management
Case Study : 3D IC Simulation Icepak
Sentinel-TI SiI
Mem
PLL Logic
Compact power Map
Dies assembly System Thermal BC
MCM Flipchip : Full Package
Sentinel TI Results: Scenario1 14
© 2011 ANSYS, Inc.
June 26, 2014
Scenario
Heat Sink
Blower
1
Yes
Yes
2
Yes
No
3
No
Yes
4
No
No
Logic Die Max Temperature in Sentinel TI 99.3⁰ C 112.3⁰ C 101.8⁰ C 124.3⁰ C
Multiphysics Benefits for 3D IC Design • Countermeasures for possible failure modes • Improve Battery Life • Reduced product development cycle significantly by optimizing IC, Package, and System performance,
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© 2011 ANSYS, Inc.
June 26, 2014
Solder Reliability in Reflow Process
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© 2011 ANSYS, Inc.
June 26, 2014
Solder Joint Reliability in Reflow Process • Joint made of components having different material properties • In Reflow Process the electronic assembly is subjected to controlled heat • Solder joint reliability issues in Reflow process
– Thermal stress developed due to abrupt temperature change
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© 2011 ANSYS, Inc.
June 26, 2014
ANSYS Solution for Reflow Analysis Fluid Dynamics
Structural Mechanics
Icepak/Fluent
Mechanical
Package and System Design
Thermal Analysis
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© 2011 ANSYS, Inc.
June 26, 2014
Solder Reliability Design
Temperature
Stress and Deformations
Case Study : Reflow Analysis Radiant Heat Source Air Inlet
Controlled Temperature Profile
package Outlet
Temperature
Convection and Radiative Heat transfer inside 19 oven © 2011 ANSYS, Inc.
June 26, 2014
Equivalent Plastic Strain on Solder Ball
Multiphysics Benefit for Solder Reliability in Reflow • Get and better insight of Reflow process • Optimizing reflow oven settings to enhanced performance, yield and reliability • Reduce test matrix, cost and time
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© 2011 ANSYS, Inc.
June 26, 2014
IGBT Reliability
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© 2011 ANSYS, Inc.
June 26, 2014
IGBT Reliability Trends
• Higher Switching Frequency • Higher Current withstand Capability • Higher power density
Challenges • Reduce Switching Losses • Increase system reliability – Increased thermal stresses – Higher Lorentz forces
• Better Performance at elevated temperature
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© 2011 ANSYS, Inc.
June 26, 2014
ANSYS Solution for Multiphysics IGBT Reliability Simulation Electromagnetics
Structural Mechanics
Mechanical
Maxwell
Simplorer Solve IGBT Circuit
Terminal Current
Fluid Dynamics
Magnetostatics
Current
Electromagnetic Simulation
Thermal
Ohmic Loss
Lorrentz Forces
Structural
Stress and Deformation
Switching Loss
Switching Loss
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© 2011 ANSYS, Inc.
Loss
June 26, 2014
Temperature Calculation
Temperature
Case Study : IGBT Reliability Simulation
Current Density in Maxwell 24
© 2011 ANSYS, Inc.
June 26, 2014
Temperature Distribution inside IGBT
Stress Distribution with enlarged deformation scale
Multiphysics Benefit for IGBT Reliability • Predict the reliability of bond wires • Robust design of the electric drive • Optimize the performance of the system, reducing maintenance costs and increasing the life cycle of the inverter
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© 2011 ANSYS, Inc.
June 26, 2014
PCB Reliability
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© 2011 ANSYS, Inc.
June 26, 2014
PCB Reliability Trends
• Electronic components with smaller footprint and higher power requirement Challenges • Increase in current density leads to Trace/Joule heating • Joule heating further affects the electric performance of PCB
Fusing of an electronic trace on a printed circuit board from a current overload 27
© 2011 ANSYS, Inc.
June 26, 2014
ANSYS Solution Electromagnetics
Fluid Dynamics
Structural Mechanics
Icepak
SIwave
Mechanical
Board Level Analysis
Board Level Analysis
Board Level Analysis
Power Loss
DC-IR Drop
Thermal Convergence
Temperature
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© 2011 ANSYS, Inc.
June 26, 2014
Thermal Analysis
Temperature
Stress and Deformations
Case Study : Power Supply Board • Objective: Use Multi-physics to model realistic conditions that improve PCB reliability 1. SIwave was used to obtain DC solution and resistive losses (Joule heating). 2. Icepak was used to compute full CFD solution. 3. Mechanical was used for thermal-stress analysis.
Courtesy: Toshiba Corporation, ANSYS Advantage 29
© 2011 ANSYS, Inc.
June 26, 2014
Case Study : Power Supply Board • Difference between Icepak / SIwave + Icepak coupling Hotspot off by 2.3 C vs experiments
Hotspot off by 10.3 C vs experiments
Icepak
SIwave + Icepak
• Difference between Icepak + Mechanical / SIwave + Icepak + Mechanical coupling Shift of max stress quantity and location
Icepak + Mechanical 30
© 2011 ANSYS, Inc.
June 26, 2014
Siwave + Icepak + Mechanical
Courtesy: Toshiba Corporation, ANSYS Advantage
Multiphysics Benefit for PCB Reliability • Deeper insight into the effect Joule heating on PCB and package design. • Predict accurate temperature and electrical performance • Improve reliability and reduce warranty period
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© 2011 ANSYS, Inc.
June 26, 2014
System (Electric Drive) Reliability
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© 2011 ANSYS, Inc.
June 26, 2014
Electric Drive Reliability Trends
• Reduce machine size and weight • Increase machine efficiency Challenges
• Maintain efficiency and durability over a wide range of operating conditions
• Reduce machine noise • Increase PM Reliability
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© 2011 ANSYS, Inc.
June 26, 2014
Case Study Electromagnetics
Fluid Dynamics
Torque
213.75
2D_cooling_inside Curve Info Moving1.Torque Setup1 : Transient
200.00
16% drop in predicted performance
Y1 [NewtonMeter]
Torque (N)
180.00
Maxwell avg
156.4067
Moving1.Torque_22_deg Imported
181.9289
Moving1.Torque_2eme_it_52deg Imported
157.3518
Moving1.Torque_3eme_it_53deg Imported
156.4067
Structural Mechanics
Fluent
Mechanical
160.00
140.00
123.75 2.00
3.00
4.00
5.00
6.00 Time [ms]
Time (ms)
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© 2011 ANSYS, Inc.
June 26, 2014
7.00
8.00
9.00
Single physics simulation, assuming a magnet temperature of 22C 10.00
3-way Multiphysics simulation shows that the actual magnet temperature: 53C
Multiphysics Benefit: Provide Accurate Performance Predictions When predicting the performance (torque) of an electric motor, multiphysics simulation captures the strongly coupled interactions between the hot electromagnetic material and surrounding cooling fluid. Single Physics Simulation
Performance
Assumption
Torque: 186 N Motor Performance
Metal Temperature
Multiphysics Simulation Heat Generation
Coolant Temperature
Motor Performance
Metal Temperature
ANSYS Maxwell
Torque: 158 N ANSYS Fluent
Single-physics simulation over-predicts system performance by 18% 35
© 2011 ANSYS, Inc.
June 26, 2014
Performance
Summary
36
© 2011 ANSYS, Inc.
June 26, 2014
Summary • Multiphysics Simulation helps to – Optimize performance considering all physical phenomena – Ensure product performance across and beyond performance envelope – Early insight to failure mode due to different physics interaction – Accelerate the design process and increase design accuracy
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© 2011 ANSYS, Inc.
June 26, 2014
ANSYS Advantage
38
© 2011 ANSYS, Inc.
June 26, 2014
Multiphysics Setup In Workbench
Now, let’s add a Structural
Select Static Structural There are multiple “drop targets” simulation with loads transferred with of the result. Draga preview it from into your CFD.project
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© 2011 ANSYS, Inc.
June 26, 2014
ANSYS Advantage • Multiphysics Made Easy – Automated setup and workflows • Flexible & Open Solutions – 1-way coupling – 2-way coupling – Single solve solutions – Combine ANSYS with 3rd party tools • Performance & Advanced Modeling – Best-in-class physics modeling – Highly scalable parallel processing
FLUID DYNAMICS
STRUCTURAL MECHANICS
ELECTROMAGNETICS
SYSTEMS & MULTIPHYSICS 40
© 2011 ANSYS, Inc.
June 26, 2014
