www.anckorea.kr
146, (Seunggicheon-ro)Gojan-dong, Namdong-gu, Incheon, Korea TEL. +82-32-818-3226 / www.anckorea.kr
중소기업청
문학경기장
A.N.C. KOREA COMPANY
남동IC
금단본부
경찰서
연수구청
하천
연수동 E마트
LNG기지
(주)에이엔씨코리아
충도신도시 동춘역
the world's best Technological company
Printed in August , 2014
www.anckorea.kr
Creative and challenging
A.N.C.KOREA
CEO Message
Company history 2000 12
Established A.N.C KOREA
2002 06
Foundation of building
2002 10
ISO 9001 : 2000 Certification
2002 11
Registered Trading Business
2004 09
Established A.N.C KOREA Co., Ltd.
2004 10
Transfer of plant location & Extension
2009 09
Samsung Electromechanics Co., Ltd. Registered Partners
2010 06
Established R&D Center.
2010 07
Transfer of plant location & Extension
2010 08
KOREA Venture Corp. Certification
Reliable and top-quality technological capacity
2011 01
ACID TIN PLATING SOLUTION FOR CHIP-PLATED MATERIALS. REGISTERED PATENT
2011 09
R&D Center Extension
ANC Korea precisely understands our customers’ needs. We also have a good grasp of the latest market trends. Thus, we are continuously devoted to our R & D in order to supply the market with new, reliable, and high quality technologies. We promise to work hard and give our best effort in ceaselessly developing our systems to provide our customers with a distinct service.
2012 02
NON-CYANIDE SILVER PLATING SOLUTION & SILVER LAYER FORMING METHOD. REGISTERED PATENT
2012 08
LEAD FREE SOLDER TIN-SILVER PLATING METHOD. REGISTERED PATENT
2014 07
How to make high purity methane sulfonic acid copper (2+) salts, and copper plating liquids to gilt circuit wire that contains high purity methane sulfonic acid copper (2+) salts.
ANC Korea will fully support you, our beloved customers, with our youthful yet bold and creative spirit. Specialized in additives for the processing of electronic parts’ surfaces ANC Korea has developed our own unique technology for the production of tinning additives, which are used for semiconductors and chips as well as agents for the pretreatment and post treatment of PCBs.
www.anckorea.kr
With
Global business partners in it.
Organization Chart
Certificate CEO
Production
R&D Center
General Affairs
Manufacturing
R&D
Staff
Quality Control
Q.A
Q.C
www.anckorea.kr
the world's best Technological company
Product Line
Electronic Device
PCB Products
Process
Application
Product name
Information
Sweller
Sweller - 100
Etch Back Sensitizer
Etching
Epoxy Etchant
Sodium permanganate type
Neutralizer
Neutralizer - 300
Etch Back Neutralizer
Conditioner
CP - 902
Clean / Conditioner
Soft Etching
Etch - 770
Copper Soft Etchant
Pre-dip
Pd - 101
Pre - Dip
Activator
CAT - 1000
Ion Catalyst
Reducer
RD - 201
DMAB type
Electroless Copper plating
Cu - 880
Light Copper
Post-treatment
Anti-tarnish agent
FC - 660
Cu Anti - Tarnish
Catalyst
Catalyst
Catalyst 6.7
PdCl2 type , 6.7 g/L
AC - 006
Sulfuric acid type
AC - 007
Organic Acid type
PC - 900
1 Solution type
PC - 500
3 Solution type
ET - 50
Immersion Tin
Desmear
Electroless Copper plating
PCB Process
Acid Cleaner ElectroPlating
Copper ElectroPlating
Products
Process
Pretreatment
Application
Product name
Information
Deflash
DF - 100
Copper , Alloy42
ES - 110
Copper , Alloy42
DS - 420
Alloy42
Cu Etch 100
Copper Etch
SUS Etch 100
Sus Etchant
AK - 500
"MLCC , CI , CR , Varistor"
HM - 30
" Matt High Speed Reel to Reel"
HM - 50
"Matt High Speed Reel to Reel"
BH - 501
"High Speed Bright Reel to Reel"
SA - 10
Matt / Rack , Barrel
MSA base Sn/Bi
PF - 500
High Speed
MSA base Sn/Pb
BH - 30
High Speed Bright Reel to Reel
Stannous Sulfate base Sn
Sn - 1
"Bright High Speed Rack , Barrel"
Ni - MAX
Nickel Sulfuric acid plating solution
Ni - 700
Nickel sulfamate plating solution
Sn Anti-tarnish agent
Tin - 1
Chip , Connector , Lead frame
Cu Anti-tarnish agent
AT - 2000
Descale and Etch SUS Etch
Electronic components process
MSA base Pure Tin
Plating
Nickel
Post-treatment
ANOX - 100
Electronic parts
www.anckorea.kr
the world's best Technological company
Product Line
GMF Products
Semiconductor Process Electroless Nickel plating
General Metal Finishing Process and
Application
Product name
Information
Activator
CAT - 450
For E/L Nickel
Catalyst
Catalyst8
PdCl2 type , 8 g/L
Electroless Nickel plating
FNP - 1000
E/L Nickel for Electric parts
EN - 960
ABS / EMI
Electroless Copper plating
Electroless Copper plating
Cu - 500
Heavy Copper ABS / EMI
Remover
Rack Remover
ED- 910
Rack Stripper
Sn Chip Stripper
Strip - 300
Sn/Ag Remover for Chip
BS - 100
Sulfuric acid type
BS - 200
Nitric acid type
Bi Strip - 100
Sulfuric acid type
Bi Strip - 500
Nitric acid type
NSC - 300
Ni Stripper or Copper
MS - Acid
MSA 70%
MS - Tin
Tin 300 g/L
MS - Ag
Ag 100 g/L
MS - Cu
Cu 100 g/L
MS - Bi
Bi 200 g/L
MS - Lead
Pb 500 g/L
Sn Stripper Stripper Bi Stripper
Metal Solution
Ni Stripper
Metal Solution
MSA base
Products
Process
Application
Product name
Information
Copper Pillar
PC - 1000
Copper Oxide type matt
Solder Bump (Sn/Ag)
MTS - 60
Wafer Solder Bump MSA type
MSA base Cu
PC - 3000
Bright High Speed Copper Oxide type FCCL , CCL
Re-work Stripper
Re-work Stripper
Au Strip - 100
"Re-work Stripper Iodine-based"
Etchant
Gold Etchant
Au Etch - 1000
Gold Etchant Iodine-based
Plating
Semiconductor Process
www.anckorea.kr
Major Customers R&D equipment
Major Customers
R&D equipment possession status
AA
SEM
XRF
Perkin Elmer / AAnalyst 200
SEC / SNE-4500M
Fischer / X-Ray XDL
UV – VIS
CVS
Microscope
Mecasys / Optizen 2120UV
ECI / QL-10
Olympus / BX 51