A.N.C. KOREA COMPANY. the world's best Technological company

www.anckorea.kr 146, (Seunggicheon-ro)Gojan-dong, Namdong-gu, Incheon, Korea TEL. +82-32-818-3226 / www.anckorea.kr 중소기업청 문학경기장 A.N.C. KOREA COMPA...
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www.anckorea.kr

146, (Seunggicheon-ro)Gojan-dong, Namdong-gu, Incheon, Korea TEL. +82-32-818-3226 / www.anckorea.kr

중소기업청

문학경기장

A.N.C. KOREA COMPANY

남동IC

금단본부

경찰서

연수구청

하천

연수동 E마트

LNG기지

(주)에이엔씨코리아

충도신도시 동춘역

the world's best Technological company

Printed in August , 2014

www.anckorea.kr

Creative and challenging

A.N.C.KOREA

CEO Message

Company history 2000 12

Established A.N.C KOREA

2002 06

Foundation of building

2002 10

ISO 9001 : 2000 Certification

2002 11

Registered Trading Business

2004 09

Established A.N.C KOREA Co., Ltd.

2004 10

Transfer of plant location & Extension

2009 09

Samsung Electromechanics Co., Ltd. Registered Partners

2010 06

Established R&D Center.

2010 07

Transfer of plant location & Extension

2010 08

KOREA Venture Corp. Certification

Reliable and top-quality technological capacity

2011 01

ACID TIN PLATING SOLUTION FOR CHIP-PLATED MATERIALS. REGISTERED PATENT

2011 09

R&D Center Extension

ANC Korea precisely understands our customers’ needs. We also have a good grasp of the latest market trends. Thus, we are continuously devoted to our R & D in order to supply the market with new, reliable, and high quality technologies. We promise to work hard and give our best effort in ceaselessly developing our systems to provide our customers with a distinct service.

2012 02

NON-CYANIDE SILVER PLATING SOLUTION & SILVER LAYER FORMING METHOD. REGISTERED PATENT

2012 08

LEAD FREE SOLDER TIN-SILVER PLATING METHOD. REGISTERED PATENT

2014 07

How to make high purity methane sulfonic acid copper (2+) salts, and copper plating liquids to gilt circuit wire that contains high purity methane sulfonic acid copper (2+) salts.

ANC Korea will fully support you, our beloved customers, with our youthful yet bold and creative spirit. Specialized in additives for the processing of electronic parts’ surfaces ANC Korea has developed our own unique technology for the production of tinning additives, which are used for semiconductors and chips as well as agents for the pretreatment and post treatment of PCBs.



www.anckorea.kr

With

Global business partners in it.

Organization Chart

Certificate CEO

Production

R&D Center

General Affairs

Manufacturing

R&D

Staff

Quality Control

Q.A

Q.C

www.anckorea.kr

the world's best Technological company

Product Line

Electronic Device

PCB Products

Process

Application

Product name

Information

Sweller

Sweller - 100

Etch Back Sensitizer

Etching

Epoxy Etchant

Sodium permanganate type

Neutralizer

Neutralizer - 300

Etch Back Neutralizer

Conditioner

CP - 902

Clean / Conditioner

Soft Etching

Etch - 770

Copper Soft Etchant

Pre-dip

Pd - 101

Pre - Dip

Activator

CAT - 1000

Ion Catalyst

Reducer

RD - 201

DMAB type

Electroless Copper plating

Cu - 880

Light Copper

Post-treatment

Anti-tarnish agent

FC - 660

Cu Anti - Tarnish

Catalyst

Catalyst

Catalyst 6.7

PdCl2 type , 6.7 g/L

AC - 006

Sulfuric acid type

AC - 007

Organic Acid type

PC - 900

1 Solution type

PC - 500

3 Solution type

ET - 50

Immersion Tin

Desmear

Electroless Copper plating

PCB Process

Acid Cleaner ElectroPlating

Copper ElectroPlating

Products

Process

Pretreatment

Application

Product name

Information

Deflash

DF - 100

Copper , Alloy42

ES - 110

Copper , Alloy42

DS - 420

Alloy42

Cu Etch 100

Copper Etch

SUS Etch 100

Sus Etchant

AK - 500

"MLCC , CI , CR , Varistor"

HM - 30

" Matt High Speed Reel to Reel"

HM - 50

"Matt High Speed Reel to Reel"

BH - 501

"High Speed Bright Reel to Reel"

SA - 10

Matt / Rack , Barrel

MSA base Sn/Bi

PF - 500

High Speed

MSA base Sn/Pb

BH - 30

High Speed Bright Reel to Reel

Stannous Sulfate base Sn

Sn - 1

"Bright High Speed Rack , Barrel"

Ni - MAX

Nickel Sulfuric acid plating solution

Ni - 700

Nickel sulfamate plating solution

Sn Anti-tarnish agent

Tin - 1

Chip , Connector , Lead frame

Cu Anti-tarnish agent

AT - 2000

Descale and Etch SUS Etch

Electronic components process

MSA base Pure Tin

Plating

Nickel

Post-treatment

ANOX - 100

Electronic parts

www.anckorea.kr

the world's best Technological company

Product Line

GMF Products

Semiconductor Process Electroless Nickel plating

General Metal Finishing Process and

Application

Product name

Information

Activator

CAT - 450

For E/L Nickel

Catalyst

Catalyst8

PdCl2 type , 8 g/L

Electroless Nickel plating

FNP - 1000

E/L Nickel for Electric parts

EN - 960

ABS / EMI

Electroless Copper plating

Electroless Copper plating

Cu - 500

Heavy Copper ABS / EMI

Remover

Rack Remover

ED- 910

Rack Stripper

Sn Chip Stripper

Strip - 300

Sn/Ag Remover for Chip

BS - 100

Sulfuric acid type

BS - 200

Nitric acid type

Bi Strip - 100

Sulfuric acid type

Bi Strip - 500

Nitric acid type

NSC - 300

Ni Stripper or Copper

MS - Acid

MSA 70%

MS - Tin

Tin 300 g/L

MS - Ag

Ag 100 g/L

MS - Cu

Cu 100 g/L

MS - Bi

Bi 200 g/L

MS - Lead

Pb 500 g/L

Sn Stripper Stripper Bi Stripper

Metal Solution

Ni Stripper

Metal Solution

MSA base

Products

Process

Application

Product name

Information

Copper Pillar

PC - 1000

Copper Oxide type matt

Solder Bump (Sn/Ag)

MTS - 60

Wafer Solder Bump MSA type

MSA base Cu

PC - 3000

Bright High Speed Copper Oxide type FCCL , CCL

Re-work Stripper

Re-work Stripper

Au Strip - 100

"Re-work Stripper Iodine-based"

Etchant

Gold Etchant

Au Etch - 1000

Gold Etchant Iodine-based

Plating

Semiconductor Process

www.anckorea.kr

Major Customers R&D equipment

Major Customers

R&D equipment possession status

AA

SEM

XRF

Perkin Elmer / AAnalyst 200

SEC / SNE-4500M

Fischer / X-Ray XDL

UV – VIS

CVS

Microscope

Mecasys / Optizen 2120UV

ECI / QL-10

Olympus / BX 51