AMBIENT LIGHT SENSOR IC Part Number: SEN-LSD631TS-33E Features z z z z z z z z
Close to the human eye’s response Infrared light wavelength cut off:430-640nm Good output linearity across wide illumination range Low sensitivity variation across various light sources Guaranteed temperature performance,-30℃to 85℃ Wide supply voltage range, 1.8V to 6.5V Size: 1.6mm(L)*0.8mm(W)*0.6mm(H) Pb free
Description LSD631TS-33E Ambient Light Sensor Device, consisting of a photodiode and a current amplification IC, is a good effective solution to the power saving of display backlighting of mobile appliances, such as the mobile phones and PDAs. Due to the high rejection ration of infrared radiation, the spectral response of the ambient light sensor is close to that of human eyes.
Applications z Detection of Ambient light to control display backlighting Mobile devices – mobile phones, PDAs Computing device – TFT LCD monitor for Notebook computer Consumer device – TFT LCD TV, plasma TV, video camera, digital still camera z Automatic residential and commercial lighting management z Automatic contrast enhancement for electronic signboard z Ambient light monitoring device for daylight and artificial light
z
Rev :
Date
Drawn by :
Checked by :
Approved by :
A
2007/12/29
Mark Suen
Jeff Chang
Edward Lin
This specification is preliminary. 9-1
AMBIENT LIGHT SENSOR IC Part Number: SEN-LSD631TS-33E Package outlines
RECOMMEND PAD LAYOUT
ITEM
MATERIALS
Resin (mold)
Epoxy
Bonding Wire
Ø 25 μm Au
Lens color
Water transparent
Printed circuit board
BT (white)
Dice
Silicon
ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES
NOTES: 1. All dimensions are in millimeters (inches); 2. Tolerances are ±0.1mm (0.004inch) unless otherwise noted. 9-2
AMBIENT LIGHT SENSOR IC Part Number: SEN-LSD631TS-33E Absolute maximum ratings Parameter
(TA=25℃) Symbol
Min.
Max.
Unit
Storage Temperature
TS
-40
100
℃
Operating Temperature
TA
-40
85
℃
Output Current
IPH
--
3
mA
Output Voltage
VOUT
0
VDD
V
--
2
--
KV
VDD
1.8
5.5
V
Electrostatic Discharge, HBM Supply Voltage (between VDD and OUT)
Electrical and Optical Characteristics (TA=25℃ Vcc=3.0V Rss=0Ω) Parameter
Symbol
Test condition
Peak Spectral Response
λPR
--
--
550
--
nm
Light Current
IPH1
VDD=3.0V, EV=10Lux[2][3]
--
7.0
--
μA
Light Current
IPH2
VDD=3.0V, EV=100Lux[2][3]
--
70
--
μA
Light Current
IPH3
VDD=3.0V, EV=100Lux[1][3]
--
70
--
μA
Dark Current
I-DARK
VDD=3.0V, EV=0Lux
--
0.05
0.1
μA
IPH3/IPH2
--
--
1.0
--
--
Gain Linearity
--
EV=100Lux~1000Lux
-5
--
5
%
Temperature Coefficient
TC
EV=100Lux[2]
--
-0.19
--
%/℃
Power Supply Rejection Ratio
PSRR
VDD=2V~4V, EV=100Lux[2]
--
1.1
--
%/V
Photocurrent Ratio
Min. Typ. Max. Unit
NOTE: 1. Illuminance by CIE standard illuminant-A / 2856K, incandescent lamp. 2. Fluorescent light is used as light source. White LED is substituted in mass production. 3. The actual photocurrent depends on the package and optical designs. 9-3
AMBIENT LIGHT SENSOR IC Part Number: SEN-LSD631TS-33E z Applications circuit
z Measurement circuit
9-4
AMBIENT LIGHT SENSOR IC Part Number: SEN-LSD631TS-33E OPTICAL CHARACTERISTIC CURVES
9-5
AMBIENT LIGHT SENSOR IC Reflow Profile Reflow Temp/Time
NOTES: 1. We recommend the reflow temperature 245℃(±5℃).the maximum soldering temperature should be limited to 260℃. 2. dont cause stress to the epoxy resin while it is exposed to high temperature. 3. Number of reflow process shall be 2 times or less. Soldering iron Basic spec is ≤ 5sec when 260℃. If temperature is higher, time should be shorter (+10℃Æ -1sec ).Power dissipation of iron should be smaller than 20W, and temperatures should be controllable .Surface temperature of the device should be under 230℃ . Rework 1. Customer must finish rework within 5 sec under 260℃. 2. The head of iron can not touch copper foil 3. Twin-head type is preferred.
Avoid rubbing or scraping the resin by any object, during high temperature, for example reflow 、solder etc. 9-6
AMBIENT LIGHT SENSOR IC 1. Converting photocurrent to voltage
2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜30% R.H. after the package is Opened, the products should be used within a week or they should be keeping to stored at ≦20 R.H. with zip-lock sealed.
3.Baking It is recommended to baking before soldering when the pack is unsealed after 72hrs. The Conditions are as followings: 3.1 60±3℃ x(12~24hrs) and ＜5%RH, taped reel type 3.2 100±3℃ x(45min~1hr), bulk type 3.3 130±3℃ x(15~30min), bulk type 9-7
PACKAGING SPECIFICATIONS GH-D631 Packaging Specifications z Dimensions of Reel (Unit: mm)
z Feeding Direction
Feeding Direction
z Dimensions of Tape (Unit: mm)
z Arrangement of Tape
NOTES 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing lamps is two; 3. The cathode is oriented towards the tape sprocket hole . 4. 4,000 pcs/Reel
9-8
PACKAGING SPECIFICATIONS SEN-D631 Packaging Specifications Packaging specifications
Drier
z
Drier
NOTES: Reeled products (numbers of products are 4,000pcs) packed in a seal off moisture-proof bag along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of products are 28,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the label on the cardboard box.) The number of the loading steps of outside box (cardboard box) has it to three steps.
9-9
